2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

FEATURES

Low dissipation due to switching from Single-Ended
(SE) to Bridge-Tied Load (BTL) mode

Differential inputs with high Common Mode Rejection
Ratio (CMRR)

Mute/standby/operating (mode select pin)

Load dump protection circuit

Short-circuit safe to ground, to supply voltage and
across load

Loudspeaker protection circuit

Offset detection for each channel

Device switches to single-ended operation at excessive
junction temperatures

Thermal protection at high junction temperature (170

Clip detection at THD = 2.5 %

Diagnostic information
(clip/protection/prewarning/offset).

GENERAL DESCRIPTION

The TDA1564 is a monolithic power amplifier in a 17-lead
single-in-line (SIL) plastic power package. It contains two
identical 25 W amplifiers. The dissipation is minimized by
switching from SE to BTL mode, only when a higher output
voltage swing is needed. The device is primarily
developed for car radio applications.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

DC biased

6.0

14.4

non-operating

load dump

ORM

repetitive peak output current

q(tot)

total quiescent current

150

stb

standby current

input impedance

120

150

output power

= 4

; EIAJ

= 4

; THD = 10 %

= 4

; THD = 2.5 %

voltage gain

= 1 W

CMRR

common mode rejection ratio

f = 1 kHz; R

= 0

SVRR

supply voltage ripple rejection

f = 1 kHz; R

= 0

DC output offset voltage

100

channel separation

= 0

; P

= 15 W

channel unbalance

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA1564TH

HSOP20

plastic, heatsink small outline package; 20 leads; low stand-off height

SOT418-3

TDA1564J

DBS17P

plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)

SOT243-1

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

PINNING

SYMBOL

PIN

DESCRIPTION

TDA1564TH

TDA1564J

n.c.

not connected

MODE

mute/standby/operating

OUT1

inverting output 1

OUT1+

non-inverting output 1

GND1

ground 1

GND

ground

GND2

ground 2

OUT2

inverting output 2

OUT2+

non-inverting output 2

OC2

offset capacitor 2

n.c.

not connected

supply voltage 2

OC1

offset capacitor 1

IN2

inverting input 2

IN2+

non-inverting input 2

DIAG

diagnostic

CSE

electrolytic capacitor for single-ended (SE) mode

IN1+

non-inverting input 1

IN1

inverting input 1

CIN

common input

supply voltage 1

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

TDA1564TH

n.c.

CIN

MODE

IN1

OUT1

IN1

OUT1

CSE

GND1

DIAG

GND2

IN2

OUT2

IN2

OUT2

OC1

OC2

n.c.

001aaa307

Fig.3 Pin configuration (TDA1564TH).

handbook, halfpage

TDA1564J

MGW245

IN1

CIN

CSE

VP1

MODE

OUT1

GND

OUT2

OC2

VP2

OC1

DIAG

IN2

Fig.4 Pin configuration (TDA1564J).

FUNCTIONAL DESCRIPTION

The TDA1564 contains two identical amplifiers with
differential inputs. At low output power [up to output
amplitudes of 3 V (RMS) at V

= 14.4 V], the device

operates as a normal SE amplifier. When a larger output
voltage swing is needed, the circuit switches internally to
BTL operation.

With a sine wave input signal, the dissipation of a
conventional BTL amplifier (up to 2 W output power) is
more than twice the dissipation of the TDA1564 (see
Fig.12).

In normal use, when the amplifier is driven with music-like
signals, the high (BTL) output power is only needed for a
small percentage of time. Assuming that a music signal
has a normal (Gaussian) amplitude distribution, the
dissipation of a conventional BTL amplifier with the same
output power is approximately 70 % higher (see Figs 13
and 14.

The heatsink has to be designed for use with music
signals. With such a heatsink, the thermal protection will
disable the BTL mode when the junction temperature
exceeds 150

C. In this case, the output power is limited to

5 W per amplifier.

The gain of each amplifier is internally fixed at 26 dB. The
device can be switched to the following modes via the
MODE pin:

Standby with low standby current (< 50

Mute condition, DC adjusted

On, operation.

The device is fully protected against a short-circuit of the
output pins to ground and to the supply voltage. It is also
protected against a short-circuit of the loudspeaker and
against high junction temperatures. In the event of a
permanent short-circuit condition to ground or the supply
voltage, the output stage will be switched off, causing low
dissipation. With a permanent short-circuit of the

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

loudspeaker, the output stage will be repeatedly switched
on and off. The duty cycle in the `on' condition is low
enough to prevent excessive dissipation.

The device also has two independent DC offset detection
circuits that can detect DC output voltages across the
speakers. With a DC offset greater than 2 V, a warning is
given on the diagnostic pin. There will be no internal
shutdown with DC offsets.

When the supply voltage drops below 6 V (e.g. engine
start), the circuit mutes immediately, avoiding clicks from
the electronic circuit preceding the power amplifier.

The voltage of the SE electrolytic capacitor (pin 4) is kept
at 0.5V

by means of a voltage buffer (see Fig.2). The

value of this capacitor has an important influence on the
output power in SE mode, especially at low signal
frequencies. A high value is recommended to minimize
dissipation at low frequencies.

The diagnostic output is an open-collector output and
requires a pull-up resistor. It gives the following outputs:

Clip detection at THD = 2.5 %

Short-circuit protection:

When a short-circuit occurs (for at least 10 ms) at the

outputs to ground or the supply voltage, the output
stages are switched off to prevent excessive
dissipation; the outputs are switched on again
approximately 500 ms after the short-circuit is
removed, during this short-circuit condition the
protection pin is LOW

When a short-circuit occurs across the load (for at

least 10 ms), the output stages are switched off for
approximately 500 ms; after this time, a check is
made to see whether the short-circuit is still present

The power dissipation in any short-circuit condition is

very low.

During start-up/shutdown, when the product is internally
muted

Temperature prewarning:

A prewarning (junction temperature > 145

indicates that the temperature protection will become
active. The prewarning can be used to reduce the
input signal and thus reduce the power dissipation.

Offset detection:

One of the channels has a DC output voltage greater

than 2 V.

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).

THERMAL CHARACTERISTICS

Note

1. The value of R

th(c-h)

depends on the application (see Fig.5).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

operating

non-operating

load dump; t

2.5 ms

P(sc)

short-circuit safe voltage

reverse polarity voltage

ORM

repetitive peak output current

tot

total power dissipation

stg

storage temperature

+150

virtual junction temperature

150

amb

ambient temperature

+85

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-c)

thermal resistance from junction to case

note 1

1.3

K/W

th(j-a)

thermal resistance from junction to ambient

in free air

K/W

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

Heatsink design

There are two parameters that determine the size of the
heatsink. The first is the rating for the virtual junction
temperature and the second is the ambient temperature at
which the amplifier must still deliver its full power in the
BTL mode.

With a conventional BTL amplifier, the maximum power
dissipation with a music-like signal (at each amplifier) will
be approximately two times 6.5 W. At a virtual junction
temperature of 150

C and a maximum ambient

temperature of 65

C, R

th(vj-c)

= 1.3 K/W and

th(c-h)

= 0.2 K/W, the thermal resistance of the heatsink

should be:

Compared to a conventional BTL amplifier, the TDA1564
has a higher efficiency. The thermal resistance of the
heatsink should be:

150

6.5

----------------------

1.3

0.2

5 K/W

1.7

145

6.5

----------------------

1.3

0.2

9 K/W

Fig.5 Thermal equivalent resistance network.

handbook, halfpage

3.6 K/W

0.6 K/W

3.6 K/W

virtual junction

OUT 1

case

3.6 K/W

0.6 K/W

3.6 K/W

OUT 2

MGC424

0.1 K/W

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

DC CHARACTERISTICS
V

= 14.4 V; T

amb

= 25

C; measured in Fig.9; unless otherwise specified.

Notes

1. The circuit is DC biased at V

= 6 to 18 V and AC operating at V

= 8 to 18 V.

2. If the junction temperature exceeds 150

C, the output power is limited to 5 W per channel.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

supply voltage

note 1; Fig.17

6.0

14.4

18.0

q(tot)

total quiescent current

; Fig.16

150

stb

standby current

CSE

average electrolytic capacitor
voltage at pin 4

7.1

DC output offset voltage

on state

100

mute state

100

Mode select switch; see Fig.6

MODE

voltage at mode select pin

standby condition

mute condition

on condition

MODE(sw)

switch current through pin 6

MODE

= 5 V

Diagnostic

DIAG

output voltage at the
diagnostic output pin

DIAG

= 2 mA; during any fault

condition or clip detect

0.5

DIAG

current through the diagnostic
pin

during any fault condition or
clip detect

O(DC)

DC output voltage detection
levels

1.4

2.5

Protection

pre

prewarning temperature

145

dis(BTL)

BTL disable temperature

note 2

150

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

AC CHARACTERISTICS
V

= 14.4 V; R

= 4

; C

CSE

= 1000

F; f = 1 kHz; T

amb

= 25

C; measured in Fig.9; unless otherwise specified.

Notes

1. The distortion is measured with a bandwidth of 10 Hz to 30 kHz.

2. Frequency response externally fixed (input capacitors determine the low frequency roll-off).

3. The SE to BTL switch voltage level depends on the value of V

4. Noise output voltage measured with a bandwidth of 20 Hz to 20 kHz.

5. Noise output voltage is independent of R

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

output power

THD = 0.5 %; Fig.18

THD = 10 %; Fig.18

EIAJ

= 13.2 V; THD = 0.5 %

= 13.2 V; THD = 10 %

THD

total harmonic distortion

= 1 W; note 1; Fig.19

0.1

power dissipation

see Figs 12 and 13

power bandwidth

THD = 1 %; P

1 dB with

respect to 15 W

20 to
15000

ro(l)

low frequency roll-off

1 dB; note 2

ro(h)

high frequency roll-off

1 dB

130

kHz

closed-loop voltage gain

= 1 W; Fig.21

SVRR

supply voltage ripple rejection

= 0

; V

ripple

= 2 V (p-p); Fig.22

on/mute

standby; f = 100 Hz to 10 kHz

CMRR

common mode rejection ratio

= 0

input impedance

120

150

mismatch in input impedance

SE-BTL

SE to BTL switch voltage level

note 3

out

output voltage mute (RMS value)

= 1 V (RMS)

100

150

n(o)

noise output voltage

on; R

= 0

; note 4

100

150

on; R

= 10 k

; note 4

105

mute; note 5

100

150

channel separation

= 0

; P

= 15 W; Fig.23

channel unbalance

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

Fig.16 Quiescent current as a function of supply

voltage.

MODE

= 5 V; R

handbook, halfpage

150

100

MGW253

VP (V)

(mA)

handbook, halfpage

200

100

150

MGW254

4
VMODE (V)

(mA)

Fig.17 Supply current as a function of V

MODE

= 14.4 V

(1) Standby.

(2) Mute.

(3) Operating.

handbook, halfpage

MGW255

VP (V)

(1)

(2)

(3)

(W)

Fig.18 Output power as a function of supply

voltage.

(1) TDH + N = 10 %.

(2) TDH + N = 2.5 %.

(3) TDH + N = 0.5 %.

handbook, halfpage

MGW256

Po (W)

THD

(%)

(2)

(3)

(1)

Fig.19 THD + noise as a function of output power.

(1) f = 10 kHz.

(2) f = 1 kHz.

(3) f = 100 kHz.

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

handbook, halfpage

MGW257

THD

(%)

f (Hz)

(1)

(2)

Fig.20 THD + noise as a function of frequency.

(1) P

= 10 W.

(2) P

= 1 W.

handbook, halfpage

MGW258

(dB)

f (Hz)

Fig.21 Voltage gain as a function of frequency.

handbook, halfpage

120

100

MGW259

f (Hz)

SVRR

(dB)

(1)

(2)

Fig.22 SVRR as a function of frequency.

(1) On/Mute.

(2) Standby.

handbook, halfpage

120

100

MGW260

f (Hz)

(dB)

(1)

(2)

Fig.23 Channel separation as a function of

frequency.

(1) P

= 10 W.

(2) P

= 1 W.

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

APPLICATION NOTES

Advantages of high efficiency

1. Power conversion improvement (power supply):

Usually, the fact that the reduction of dissipation is
directly related to supply current reduction, is
neglected. One advantage is less voltage drop in the
whole supply chain. Another advantage is less stress
for the coil in the supply line. Even the adapter or
supply circuit remains cooler than before due to the
reduced heat dissipation in the whole chain because
more supply current will be converted into output
power.

2. Power dissipation reduction: This is the best known

advantage of high efficiency amplifiers.

3. Heatsink size reduction: The heatsink size of a

conventional amplifier may be reduced with
approximately 50 % at V

= 14.4 V when the TDA1564

will be used. In that case, the maximum heatsink
temperature will remain the same.

4. Heatsink temperature reduction: The power

dissipation and the thermal resistance of the heatsink
determine the heatsink temperature rise.

When the same heatsink size is used from a conventional
amplifier, the maximum heatsink temperature decreases
and also the maximum junction temperature, which
extends the life of this semiconductor device. The
maximum dissipation with music-like input signals
decreases by 40 %.

It is clear that the use of the TDA1564 saves a significant
amount of energy. The maximum supply current
decreases by approximately 32 %, that reduces the
dissipation in the amplifier as well as in the whole supply
chain. The TDA1564 allows a heatsink size reduction of
approximately 50 % or the heatsink temperature
decreases by 40 % when the heatsink size hasn't been
changed.

Advantage of the concept used by TDA1564

The TDA1564 is highly efficient under all conditions,
because it uses a single-ended capacitor to create a
non-dissipating half supply voltage. Other concepts rely on
the fact that both input signals are the same in amplitude
and phase. With the concept of a SE capacitor it means
that it doesn't matter what kind of signal processing is done
on the input signals. For example, amplitude difference,
phase shift or delays between both input signals, or other
DSP processing, have no impact on the efficiency.

handbook, halfpage

MGS824

Supply
current

reduction of

32%

Heatsink

size

reduction of

50%

Same heatsink

size

Same junction

temperature

Heatsink

temperature

reduction of

40%

Power

dissipation

reduction of 40%

at Po = 1.6 W

VP = 14.4 V

choice

Fig.25 Heatsink design.

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

PACKAGE OUTLINES

UNIT

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.08

0.04

3.5

0.35

DIMENSIONS (mm are the original dimensions)

Notes

1. Limits per individual lead.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT418-3

10 mm

scale

HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height

SOT418-3

max.

detail X

3.5
3.2

1.1
0.9

14.5
13.9

1.1
0.8

1.7
1.5

2.5
2.0

0.25

0.07

0.03

13.0
12.6

6.2
5.8

2.9
2.5

0.32
0.23

1.27

(2)

16.0
15.8

(2)

11.1
10.9

0.53
0.40

(A3)

pin 1 index

02-02-12
03-07-23

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

SOT243-1

10 mm

scale

non-concave

99-12-17
03-03-12

DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 12 mm)

SOT243-1

view B: mounting base side

UNIT

(1)

17.0
15.5

4.6
4.4

0.75
0.60

0.48
0.38

24.0
23.6

20.0
19.6

2.54

0.8

12.2
11.8

1.27

5.08

2.4
1.6

2.00
1.45

2.1
1.8

3.4
3.1

4.3

12.4
11.0

0.4

0.03

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

SOLDERING

Introduction

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.

Through-hole mount packages

OLDERING BY DIPPING OR BY SOLDER WAVE

Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250

C or 265

C, depending on solder

material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

ANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

Surface mount packages

EFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 270

C depending on solder paste material. The

top-surface temperature of the packages should
preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free

process)

for all the BGA, HTSSON..T and SSOP-T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a

volume

350 mm

so called thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free

process) for packages with a thickness < 2.5 mm and a
volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.

AVE SOLDERING

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250

C or 265

C, depending on solder material

applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

ANUAL SOLDERING

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron
applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300

C. When using a dedicated

tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

"(LF)BGA Application Note" (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

4. Hot bar soldering or manual soldering is suitable for PMFP packages.

5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217

C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

7. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

MOUNTING

PACKAGE

(1)

SOLDERING METHOD

WAVE

REFLOW

(2)

DIPPING

Through-hole mount CPGA, HCPGA

suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL

suitable

(3)

Through-hole-
surface mount

PMFP

(4)

not suitable

Surface mount

BGA, HTSSON..T

(5)

, LBGA, LFBGA, SQFP,

SSOP-T

(5)

, TFBGA, USON, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS

not suitable

(6)

suitable

PLCC

(7)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(7)(8)

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

(9)

suitable

CWQCCN..L

(11)

, PMFP

(10)

, WQCCN32L

(11)

not suitable

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

10. Hot bar or manual soldering is suitable for PMFP packages.

11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.

2004 Jan 27

Philips Semiconductors

Preliminary specification

High efficiency 2

25 W/4

stereo car radio power amplifier

TDA1564

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

SCA76

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

R32/04/pp

Date of release:

2004 Jan 27

Document order number:

9397 750 12613

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA1564J

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA1564J