Document Outline
- FEATURES
- GENERAL DESCRIPTION
- ORDERING INFORMATION
- QUICK REFERENCE DATA
- BLOCK DIAGRAM
- PINNING
- FUNCTIONAL DESCRIPTION
- LIMITING VALUES
- THERMAL CHARACTERISTICS
- CHARACTERISTICS
- TEST AND APPLICATION INFORMATION
- PACKAGE OUTLINES
- SOLDERING
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
Supersedes data of 2001 Jun 29
2003 Nov 28
INTEGRATED CIRCUITS
TDA3608Q; TDA3608TH
Multiple voltage regulators with
switch
2003 Nov 28
2
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
FEATURES
General
Two V
P
-state controlled regulators (regulator 1 and
regulator 3) and a power switch
Regulator 2 and reset circuit operate during load dump
and thermal shutdown
Separate control pins for switching regulator 1,
regulator 3 and power switch
Supply voltage range from
-
18 to +50 V
Low reverse current of regulator 2
Low quiescent current (when regulator 1, regulator 3
and power switch are switched off)
Hold output circuit for regulator 1 (only valid when
regulator 3 output voltage >1.3 V)
Reset and hold outputs (open-collector outputs)
Adjustable reset delay time
High ripple rejection
Backup capacitor connection to supply regulator 2 and
reset circuit up to 25 V.
Protections
Reverse polarity safe (down to
-
18 V without high
reverse current)
Able to withstand voltages up to 18 V at the outputs
(supply line may be short circuited)
ESD protection on all pins
Thermal protection
Load dump protection
Foldback current limit protection for regulator 1,
regulator 2 and regulator 3
Delayed foldback current limit protection for power
switch (at short-circuit); delay time fixed by reset delay
capacitor
All regulator outputs and power switch are
DC short-circuited safe to ground and V
P
.
GENERAL DESCRIPTION
The TDA3608 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. It contains:
Two fixed output voltage regulators with a foldback
current protection (regulator 1 and regulator 3) and one
fixed output voltage regulator (regulator 2) intended to
supply a microcontroller, which also operates during
load dump and thermal shutdown
A power switch with protections, operated by an enable
input
Reset and hold outputs that can be used to interface
with the microcontroller; the reset output can be used to
call up the microcontroller and the hold output indicates
that the regulator 1 output voltage is available and within
the range
A supply pin which can withstand load dump pulses and
negative supply voltages
Regulator 2 which is switched on at a backup voltage
higher than 6.5 V and switched off when the regulator 2
output drops below 1.9 V
A provision for the use of a reserve (backup) supply
capacitor that will hold enough energy for regulator 2
(5 V continuous) to allow a microcontroller to prepare for
loss of voltage.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA3608Q
DBS13P
plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
TDA3608TH
HSOP20
plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
2003 Nov 28
3
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
operating
9.5
14.4
18
V
regulator 2 on
2.4
14.4
18
V
reverse polarity; non-operating
-
-
-
18
V
jump start for t
10 minutes
-
-
30
V
load dump protection for
t
50 ms and t
r
2.5 ms
-
-
50
V
I
q
quiescent supply current
standby mode; V
P
= 12.4 V
-
500
600
A
T
j
junction temperature
-
40
-
+150
C
Voltage regulators
V
REG1
output voltage of regulator 1
1 mA
I
REG1
600 mA
8.15
8.5
8.85
V
V
REG2
output voltage of regulator 2
0.5 mA
I
REG2
150 mA
4.75
5.0
5.25
V
V
REG3
output voltage of regulator 3
1 mA
I
REG3
400 mA
4.75
5.0
5.25
V
Power switch
V
drop
dropout voltage
I
SW
= 1 A
-
0.45
0.7
V
I
SW
= 1.8 A
-
1.0
1.8
V
I
M
peak current
2
-
-
A
2003 Nov 28
4
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
BLOCK DIAGRAM
handbook, full pagewidth
MGK602
REGULATOR 2
REGULATOR 3
REGULATOR 1
(17) 13
(16) 12
(8) 5
TEMPERATURE
AND LOAD DUMP
PROTECTION
1 (3)
7 (10)
4 (6)
6 (9)
9 (12)
10 (14)
POWER SWITCH
BACKUP SWITCH
BACKUP CONTROL
&
&
&
GND
n.c.
(1, 2, 7, 13, 18, 19, 20)
(14.4 V)
TDA3608Q
(TDA3608TH)
RES
REG2
REG3
REG1
(14.2 V/1.8 A)
(14.2 V/100 mA)
(5 V/150 mA)
(5 V/400 mA)
(8.5 V/600 mA)
SW
VP
ENSW
EN3
EN1
CRES
BU
HOLD
hold enable
(11) 8
(4) 2
(5) 3
(15) 11
Fig.1 Block diagram.
Numbers in parenthesis refer to type number TDA3608TH.
2003 Nov 28
5
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
PINNING
SYMBOL
PIN
DESCRIPTION
TDA3608Q
TDA3608TH
V
P
1
3
supply voltage
REG1
2
4
regulator 1 output
REG3
3
5
regulator 3 output
EN3
4
6
regulator 3 enable input
RES
5
8
reset output
EN1
6
9
regulator 1 enable input
ENSW
7
10
power switch enable input
HOLD
8
11
hold output
C
RES
9
12
reset delay capacitor connection
GND
10
14
ground
REG2
11
15
regulator 2 output
BU
12
16
backup capacitor connection
SW
13
17
power switch output
n.c.
-
1, 2, 7, 13, 18,19
and 20
not connected
handbook, halfpage
TDA3608Q
MGK601
1
2
3
4
5
6
7
8
9
10
11
12
13
VP
REG1
REG3
EN3
EN1
ENSW
HOLD
REG2
RES
SW
BU
CRES
GND
Fig.2 Pin configuration of TDA3608Q.
handbook, halfpage
n.c.
n.c.
VP
REG1
REG3
EN3
n.c.
RES
EN1
ENSW
n.c.
n.c.
n.c.
SW
REG2
GND
BU
n.c.
CRES
HOLD
TDA3608TH
MGT566
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
Fig.3 Pin configuration of TDA3608TH.
2003 Nov 28
6
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
FUNCTIONAL DESCRIPTION
The TDA3608 is a multiple output voltage regulator with a
power switch, intended for use in car radios with or without
a microcontroller. Because of low-voltage operation of the
car radio, low-voltage drop regulators are used in the
TDA3608.
Backup supply
The charge of the backup capacitor connected to pin BU
can be used to supply regulator 2 for a short period when
the supply voltage V
P
drops to 0 V (the time depends on
the value of the capacitor).
Regulator 1
When the output voltage of regulator 2 and the supply
voltage (V
P
> 4.5 V) are both available, regulator 1 can be
operated by means of enable pin EN1 (see Fig.4).
Regulator 2
Regulator 2 switches on (see Fig.5) when the backup
voltage exceeds 6.5 V for the first time and switches off
when the output voltage of regulator 2 drops below 1.9 V
(this is far below an engine start).
Regulator 3
When the output voltage of regulator 2 and the supply
voltage (V
P
> 4.5 V) are both available, regulator 3 can be
operated by means of enable pin EN3 (see Fig.4).
Reset
When regulator 2 is switched on and the output voltage of
this regulator is within its voltage range, the reset output
(see Fig.5) will be enabled (pin RES goes HIGH through
an external pull-up resistor) to generate a reset to the
microcontroller.
The reset cycles can be extended by means of an external
capacitor connected to pin C
RES
. This start-up feature is
included to secure a smooth start-up of the microcontroller
at first connection, without uncontrolled switching of
regulator 2 during the start-up sequence.
Hold
Regulator 1 has an open-collector hold output (see Fig.4)
indicating that the output voltage is settled at 8.5 V.
Pin HOLD is held HIGH by an external pull-up resistor.
When the supply voltage V
P
drops or during high load, the
output voltage drops out-of-regulation and pin HOLD goes
LOW.
The hold output is only activated when V
REG3
> 1.3 V.
When pin HOLD is connected via a pull-up resistor to the
output of regulator 3 spikes will be minimized to 1.3 V
(maximum value) because the hold output is only disabled
when V
REG3
< 1.3 V.
Pin HOLD will be forced LOW when the load dump
protection is activated and also in the standby mode.
Power switch
The power switch can be controlled by means of enable
pin ENSW (see Fig.6).
Protections
All output pins are fully protected.
The regulators are protected against load dump
(regulator 1 and regulator 3 switch off at V
P
> 18 V) and
short-circuit (foldback current protection).
The power switch contains a foldback current protection,
but this protection is delayed at a short-circuit condition by
the reset delay capacitor. During this time the output
current is limited to at least 2 A (peak value) and
1.8 A (continuous value) at V
P
18 V. During the foldback
mode the current is limited to 0.5 A (typical value).
The timing diagram is shown in Fig.7.
The foldback protection is activated when V
SW
< 4 V.
When regulator 2 is out-of-regulation and generates a
reset, the power switch is in the foldback mode
immediately when V
SW
< 4 V.
In the standby mode the voltage on the reset delay
capacitor is about 4 V and the voltage on the power switch
output is V
P
-
0.45 V (typical value) at I
SW
= 1 A. During
an overload condition or short-circuit the reset delay
capacitor will be charged to a higher voltage. The power
switch is in the high current mode while the capacitor is
charged, after this the switch is in the foldback mode
(V
SW
< 4 V). While the reset delay capacitor is charged the
power switch output can reach its correct output voltage.
Now the voltage on the reset delay capacitor is decreased
rapidly to 4 V. The reset output voltage is not influenced by
this change of voltages. The time of the high current mode
depends on the value of the reset delay capacitor.
At V
P
> 18 V the power switch is clamped at maximum
17.2 V (to avoid that external connected circuitry is being
damaged by an overvoltage) and the power switch will
switch off at load dump.
2003 Nov 28
7
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
handbook, full pagewidth
VP
enable
regulator 1
regulator 1
hold output
regulator 3
enable
regulator 3
18.0 V
9.5 V
4.5 V
4.0 V
2.2 V
8.5 V
0 V
load dump
5.0 V
0 V
2.0 V
2.2 V
2.0 V
MGT568
Fig.4 Timing diagram of regulator 1, regulator 3 and hold output.
handbook, full pagewidth
VP
backup
regulator 2
reset
delay
capacitor
reset
output
td(res)
6.5 V
5.4 V
5.0 V
1.9 V
0 V
5.0 V
18.0 V
4.0 V
0 V
3.0 V
5.0 V
load dump
MGT567
Fig.5 Timing diagram of backup, regulator 2 and reset output.
2003 Nov 28
8
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
handbook, full pagewidth
VP
enable
power
switch
power
switch
output
18.0 V
16.2 V
4.5 V
4.0 V
0 V
2.2 V
2.0 V
load dump
MGT569
Fig.6 Timing diagram of power switch output.
handbook, full pagewidth
enable
power
switch
power
switch
current
power
switch
voltage
reset
delay
voltage
reset
output
regulator 2
0.5 A
0 A
2 A
0 V
0 V
3 V
4 V
td(sw)
6.4 V
<2.0 V
>2.2 V
4 V
14 V
MGT570
0 V
5 V
5 V
foldback mode
foldback mode
current limit mode
td(res)
Fig.7 Timing diagram of current protection of power switch.
2003 Nov 28
9
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25
C; measured in test circuit of Fig.12; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
operating
-
18
V
reverse polarity; non-operating
-
-
18
V
jump start for t
10 minutes
-
30
V
load dump protection for t
50 ms and
t
r
2.5 ms
-
50
V
P
tot
total power
dissipation
-
62
W
T
stg
storage temperature
non-operating
-
55
+150
C
T
amb
ambient temperature
operating
-
40
+85
C
T
j
junction temperature
operating
-
40
+150
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-c)
thermal resistance from junction to case
TDA3608Q
2
K/W
TDA3608TH
3.5
K/W
R
th(j-a)
thermal resistance from junction to ambient
in free air
50
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
operating
9.5
14.4
18
V
regulator 2 on; note 1
2.4
14.4
18
V
jump start for t
10 minutes
-
-
30
V
load dump protection for
t
50 ms and t
r
2.5 ms
-
-
50
V
I
q
quiescent supply
current
standby mode; note 2
V
P
= 12.4 V
-
500
600
A
V
P
= 14.4 V
-
520
-
A
Schmitt trigger supply voltage for regulator 1, regulator 3 and power switch
V
thr
rising threshold
voltage
4.0
4.5
5.0
V
V
thf
falling threshold
voltage
3.5
4.0
4.5
V
V
hys
hysteresis voltage
-
0.5
-
V
Schmitt trigger supply voltage for regulator 2
V
thr
rising threshold
voltage
6.0
6.5
7.1
V
2003 Nov 28
10
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
V
thf
falling threshold
voltage
1.7
1.9
2.2
V
V
hys
hysteresis voltage
-
4.6
-
V
Schmitt trigger voltage for enable input (regulator 1, regulator 3 and power switch)
V
thr
rising threshold
voltage
1.7
2.2
2.7
V
V
thf
falling threshold
voltage
1.5
2.0
2.5
V
V
hys
hysteresis voltage
I
REG
= I
SW
= 1 mA
0.1
0.2
0.5
V
I
LI
input leakage current
V
EN
= 5 V
1
5
10
A
Schmitt trigger voltage for reset
V
thr
rising threshold
voltage of regulator 2
V
P
rising; I
REG2
= 50 mA; note 3
-
V
REG2
-
0.15
V
REG2
-
0.075 V
V
thf
falling threshold
voltage of regulator 2
V
P
falling; I
REG2
= 50 mA; note 3 4.3
V
REG2
-
0.35
-
V
V
hys
hysteresis voltage
0.1
0.2
0.3
V
Schmitt trigger voltage for hold
V
thr
rising threshold
voltage of regulator 1
V
P
rising; note 3
-
V
REG1
-
0.15
V
REG1
-
0.075 V
V
thf
falling threshold
voltage of regulator 1
V
P
falling; note 3
7.7
V
REG1
-
0.35
-
V
V
hys
hysteresis voltage
0.1
0.2
0.3
V
Reset and hold output
I
sinkL
LOW-level sink
current
V
o
0.8 V
2
-
-
mA
I
LO
output leakage
current
V
o
= 5 V; V
P
= 14.4 V
-
-
2
A
t
r
rise time
note 4
-
7
50
s
t
f
fall time
note 4
-
1
50
s
Reset delay capacitor circuit
I
ch
charge current
2
3
4
A
I
dch
discharge current
500
800
-
A
V
thr(res)
rising threshold
voltage for delayed
reset pulse
2.8
3.0
3.2
V
V
thr(sw)
rising threshold
voltage for delayed
power switch foldback
mode
note 5
-
6.4
-
V
t
d(res)
reset delay time
C7 = 47 nF; note 6
32
47
70
ms
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2003 Nov 28
11
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Regulator 1; I
REG1
= 5 mA; unless otherwise specified
V
REG1(off)
output voltage with
regulator off
-
1
400
mV
V
REG1
output voltage
1 mA
I
REG1
600 mA
8.15
8.5
8.85
V
9.5 V
V
P
18 V
8.15
8.5
8.85
V
V
line
line regulation
9.5 V
V
P
18 V
-
2
75
mV
V
load
load regulation
1 mA
I
REG1
600 mA
-
20
50
mV
I
q
quiescent current
I
REG1
= 600 mA
-
25
60
mA
SVRR
supply voltage ripple
rejection
f
i
= 3 kHz; V
i
= 2 V (p-p)
60
70
-
dB
V
drop
dropout voltage
V
P
= 8.5 V; I
REG1
= 550 mA;
note 7
-
0.4
0.7
V
I
m
current limit
V
REG1
> 7.5 V; see Fig.8; note 8 0.65
1.2
-
A
I
sc
short-circuit current
R
L
0.5
; see Fig.8; note 9
250
800
-
mA
Regulator 2; I
REG2
= 5 mA; unless otherwise specified
V
REG2
output voltage
0.5 mA
I
REG2
150 mA
4.75
5.0
5.25
V
I
REG2
= 300 mA; note 10
4.75
5.0
5.25
V
7 V
V
P
18 V
4.75
5.0
5.25
V
18 V
V
P
50 V;
I
REG2
150 mA
4.75
5.0
5.25
V
V
line
line regulation
6 V
V
P
18 V
-
2
50
mV
18 V
V
P
50 V
-
15
75
mV
V
load
load regulation
1 mA
I
REG2
150 mA
-
20
50
mV
1 mA
I
REG2
300 mA
-
-
100
mV
SVRR
supply voltage ripple
rejection
f
i
= 3 kHz; V
i
= 2 V (p-p)
60
70
-
dB
V
drop
dropout voltage
normal supply; note 7
V
P
= 4.75 V; I
REG2
= 100 mA
-
0.4
0.6
V
V
P
= 5.75 V; I
REG2
= 200 mA
-
0.8
1.2
V
backup supply; note 11
V
BU
= 4.75 V; I
REG2
= 100 mA
-
0.2
0.5
V
V
BU
= 5.75 V; I
REG2
= 200 mA
-
0.8
1.0
V
I
m
current limit
V
REG2
> 4.5 V; see Fig.9; note 8 0.32
0.37
-
A
I
sc
short-circuit current
R
L
0.5
; see Fig.9; note 9
20
100
-
mA
Regulator 3; I
REG3
= 5 mA; unless otherwise specified
V
REG3(off)
output voltage with
regulator off
-
1
400
mV
V
REG3
output voltage
1 mA
I
REG3
400 mA
4.75
5.0
5.25
V
7 V
V
P
18 V
4.75
5.0
5.25
V
V
line
line regulation
7 V
V
P
18 V
-
2
50
mV
V
load
load regulation
1 mA
I
REG3
400 mA
-
20
50
mV
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2003 Nov 28
12
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Notes
1. The minimum value is the minimum operating voltage, only if V
P
has exceeded 6.5 V.
2. The quiescent current is measured in the standby mode. Therefore, the enable inputs of regulator 1, regulator 3 and
the power switch are grounded and R
L(REG2)
=
.
3. The voltage of the regulator drops as a result of a V
P
drop.
4. The rise and fall time is measured with a 10 k
pull-up resistor and C
L
= 50 pF.
5. This is the threshold voltage for the delay time of the power switch. The voltage on the reset delay capacitor increases
only at low output voltage of the power switch (for example at short circuit). When the voltage on this capacitor
exceeds this threshold voltage, the power switch is set to the foldback mode. The power switch is also protected by
the temperature protection.
6. Delay time calculation:
a) Reset pulse delay:
The delay time is 47 ms for C = 47 nF.
b) Power switch delay:
The delay time is 23.5 ms for C = 47 nF.
7. The dropout voltage of regulator 1, regulator 2 and regulator 3 is measured between pin V
P
and pins REG1, REG2
or REG3 respectively.
8. During current limit, current I
m
is held constant.
9. The foldback current protection limits the dissipated power at short-circuit.
I
q
quiescent current
I
REG3
= 400 mA
-
15
40
mA
SVRR
supply voltage ripple
rejection
f
i
= 3 kHz; V
i
= 2 V (p-p)
60
70
-
dB
V
drop
dropout voltage
V
P
= 5.75 V; I
REG3
= 400 mA;
note 7
-
1
1.5
V
I
m
current limit
V
REG3
> 4.5 V; see Fig.10;
note 8
0.45
0.70
-
A
I
sc
short-circuit current
R
L
0.5
; see Fig.10; note 9
100
400
-
mA
Power switch
V
drop
dropout voltage
I
SW
= 1 A; note 12
-
0.45
0.7
V
I
SW
= 1.8 A; note 12
-
1.0
1.8
V
V
cl
clamping voltage
V
P
18 V
15
16.2
17.2
V
V
fb
flyback voltage
behaviour
I
SW
=
-
100 mA
-
V
P
+ 3
22
V
I
dc
continuous current
V
P
= 16 V; V
SW
= 13.5 V
1.8
2.0
-
A
I
M
peak current
V
P
= 17 V; see Fig.11; note 13
2
-
-
A
I
sc
short-circuit current
V
P
= 14.4 V; V
SW
< 3.5 V;
see Fig.11; note 14
-
0.5
-
A
Backup switch
I
dc
continuous current
0.3
0.35
-
A
V
cl
clamping voltage
V
P
16.7 V
-
-
16
V
I
r
reverse current
V
P
= 0; V
BU
= 12.4 V; note 15
-
-
900
mA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
t
d(res)
C
I
ch
------
V
C(th1)
C
1000
10
3
=
=
[sec]
t
d(sw)
C
I
ch
------
V
C(th2)
C
500
10
3
[sec]
=
=
2003 Nov 28
13
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
10. The peak current of 300 mA can only be applied for short periods (t < 100 ms).
11. The dropout voltage is measured between pins BU and REG2.
12. The dropout voltage of the power switch is measured between pins V
P
and SW.
13. The maximum output current of the power switch is limited to 1.8 A when V
P
> 18 V.
14. During short-circuit, current I
sc
of the power switch is held constant to a lower value than the continuous current after
a delay of at least 10 ms. Furthermore, a foldback function is activated after the delay. When V
SW
< 3.5 V, the
short-circuit current is reduced to 0.5 A (typical value). The short-circuit protection of the power switch functions best
when C1 = 220
F and C2 = 10
F.
15. The reverse current of the backup switch is the current which is flowing out of pin V
P
at V
P
= 0 V.
handbook, halfpage
300
MGT571
8.5
2
VREG1
(V)
Isc
IREG1 (mA)
Im
Fig.8 Foldback current protection of regulator 1.
handbook, halfpage
50
MGT572
5.0
1
Isc
Im
VREG2
(V)
IREG2 (mA)
Fig.9 Foldback current protection of regulator 2.
handbook, halfpage
200
MGT573
5.0
1
Isc
Im
VREG3
(V)
IREG3 (mA)
Fig.10 Foldback current protection of regulator 3.
handbook, halfpage
MGT574
14.2
3
VSW
(V)
0.5
ISW (A)
2
(1)
Fig.11 Current protection of power switch.
(1) Delayed; time depends on value of capacitor C7.
2003 Nov 28
14
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
TEST AND APPLICATION INFORMATION
Test information
mgk605
ENSW
EN3
BU
C
RES
C3
10
F
C9
(2)
>
10
F
C2
220 nF
R4
2.2
C1
220 nF
C4
10
F
HOLD
RES
REG3
REG1
REG2
1 k
R1
R3
10 k
R2
10 k
1 k
1 k
5 V
5 V
8.5 V
14.2 V
C5
10
F
C8
220 nF
C10
50 pF
C6
50 pF
C7
47 nF
R
L(SW)
R
L(REG2)
1 k
R
L(REG1)
1 k
R
L(REG3)
SW
(17) 13
(15) 11
(4) 2
(11) 8
(8) 5
(5) 3
4 (6)
12 (16)
9 (12)
7 (10)
1 (3)
10
TDA3608Q
(TDA3608TH)
GND
V
P
V
P
V
ENSW
V
EN3
EN1
6 (9)
V
EN1
V
bu
(1)
Fig.12 Test circuit.
Numbers in parenthesis refer to type number TDA3608TH.
(1) Capacitor not required for stability.
(2) Value depends on application.
2003 Nov 28
15
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Application information
N
OISE
The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (the
output noise of the regulators is translated into a current
noise by means of the output capacitors). Table 1 shows
the noise figure with the corresponding output capacitor C
o
for each regulator. The noise is minimal when a high
frequency capacitor of 220 nF in parallel with an
electrolytic capacitor of 100
F is connected directly to
pins V
P
and GND.
Table 1
Noise figure; note 1
Note
1. Measured at a bandwidth of 200 kHz.
S
TABILITY
The regulators are made stable with the externally
connected output capacitors. The output capacitors can be
selected using the graphs of Figs 13 and 14. When an
electrolytic capacitor is used, the temperature behaviour of
this output capacitor can cause oscillations at low
temperature. The next two examples show how an output
capacitor value is selected.
Example 1
The regulator 1 is made stable with an electrolytic output
capacitor of 220
F with ESR = 0.15
. At T
amb
=
-
30
C
the capacitor value is decreased to 73
F and the ESR is
increased to 1.1
. The regulator remains stable at
T
amb
=
-
30
C (see Fig.13).
Example 2
The regulator 2 is made stable with an electrolytic
capacitor of 10
F with ESR = 3
. At T
amb
=
-
30
C the
capacitor value is decreased to 3
F and the ESR is
increased to 23.1
. The regulator will be instable at
T
amb
=
-
30
C (see Fig.14).
Solution
Use a tantalum capacitor of 10
F or a larger electrolytic
capacitor. The use of tantalum capacitors is recommended
to avoid problems with stability at low temperatures.
REGULATOR
NOISE FIGURE (
V)
C
o
= 10
F
C
o
= 47
F
C
o
= 100
F
1
225
150
135
2
225
150
135
3
255
200
180
handbook, halfpage
1
0
1
10
C (
F)
MBK100
2
3
4
stable region
maximum ESR
minimum ESR
100
R
(
)
Fig.13 Curves for selecting value of output
capacitor for regulator 1 and regulator 3.
handbook, halfpage
2
0
0.22
1
10
C (
F)
MBK099
4
6
8
10
12
stable region
maximum ESR
minimum ESR
100
R
(
)
14
Fig.14 Curves for selecting value of output
capacitor for regulator 2.
2003 Nov 28
16
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
PACKAGE OUTLINES
UNIT
A
e
1
A
2
b
p
c
D
(1)
E
(1)
Z
(1)
d
e
D
h
L
L
3
m
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
17.0
15.5
4.6
4.4
0.75
0.60
0.48
0.38
24.0
23.6
20.0
19.6
10
3.4
v
0.8
12.2
11.8
1.7
e
2
5.08
2.4
1.6
E
h
6
2.00
1.45
2.1
1.8
3.4
3.1
4.3
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
12.4
11.0
SOT141-6
0
5
10 mm
scale
Q
j
0.25
w
0.03
x
D
L
E
A
c
A
2
m
L
3
Q
w
M
b
p
1
d
D
Z
e
2
e
e
x
h
1
13
j
Eh
non-concave
view B: mounting base side
99-12-17
03-03-12
DBS13P: plastic DIL-bent-SIL power package; 13 leads (lead length 12 mm)
SOT141-6
v
M
B
2003 Nov 28
17
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
UNIT
A4
(1)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
+
0.08
-
0.04
3.5
0.35
DIMENSIONS (mm are the original dimensions)
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT418-3
0
5
10 mm
scale
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
A
max.
detail X
A2
3.5
3.2
D2
1.1
0.9
HE
14.5
13.9
Lp
1.1
0.8
Q
1.7
1.5
2.5
2.0
v
0.25
w
0.25
y
Z
8
0
0.07
x
0.03
D1
13.0
12.6
E1
6.2
5.8
E2
2.9
2.5
bp
c
0.32
0.23
e
1.27
D
(2)
16.0
15.8
E
(2)
11.1
10.9
0.53
0.40
A3
A4
A2
(A3)
Lp
A
Q
D
y
x
HE
E
c
v
M
A
X
A
bp
w
M
Z
D1
D2
E2
E1
e
20
11
1
10
pin 1 index
02-02-12
03-07-23
2003 Nov 28
18
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
SOLDERING
Introduction
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended. Driven by legislation and environmental
forces the worldwide use of lead-free solder pastes is
increasing.
Through-hole mount packages
S
OLDERING BY DIPPING OR BY SOLDER WAVE
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
C or 265
C, depending on solder
material applied, SnPb or Pb-free respectively.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg(max)
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
M
ANUAL SOLDERING
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
C, contact may be up to 5 seconds.
Surface mount packages
R
EFLOW SOLDERING
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 270
C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
below 225
C (SnPb process) or below 245
C (Pb-free
process)
for all the BGA, HTSSON..T and SSOP-T packages
for packages with a thickness
2.5 mm
for packages with a thickness < 2.5 mm and a
volume
350 mm
3
so called thick/large packages.
below 240
C (SnPb process) or below 260
C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
W
AVE SOLDERING
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
2003 Nov 28
19
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250
C or 265
C, depending on solder
material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
M
ANUAL SOLDERING
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C. When using a dedicated tool, all other leads can
be soldered in one operation within 2 to 5 seconds
between 270 and 320
C.
2003 Nov 28
20
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
"(LF)BGA Application Note" (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
3. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
4. Hot bar soldering or manual soldering is suitable for PMFP packages.
5. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217
C
10
C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
6. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
7. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
8. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
9. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
10. Hot bar or manual soldering is suitable for PMFP packages.
11. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
MOUNTING
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
DIPPING
Through-hole mount CPGA, HCPGA
suitable
-
suitable
DBS, DIP, HDIP, RDBS, SDIP, SIL
suitable
(3)
-
-
Through-hole-
surface mount
PMFP
(4)
not suitable
not suitable
-
Surface mount
BGA, HTSSON..T
(5)
, LBGA, LFBGA, SQFP,
SSOP-T
(5)
, TFBGA, USON, VFBGA
not suitable
suitable
-
DHVQFN, HBCC, HBGA, HLQFP, HSO,
HSOP, HSQFP, HSSON, HTQFP, HTSSOP,
HVQFN, HVSON, SMS
not suitable
(6)
suitable
-
PLCC
(7)
, SO, SOJ
suitable
suitable
-
LQFP, QFP, TQFP
not recommended
(7)(8)
suitable
-
SSOP, TSSOP, VSO, VSSOP
not recommended
(9)
suitable
-
CWQCCN..L
(11)
, PMFP
(10)
, WQCCN32L
(11)
not suitable
not suitable
-
2003 Nov 28
21
Philips Semiconductors
Product specification
Multiple voltage regulators with switch
TDA3608Q; TDA3608TH
DATA SHEET STATUS
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
LEVEL
DATA SHEET
STATUS
(1)
PRODUCT
STATUS
(2)(3)
DEFINITION
I
Objective data
Development
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Philips Semiconductors a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Printed in The Netherlands
R32/04/pp
22
Date of release:
2003 Nov 28
Document order number:
9397 750 12339
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