1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

FEATURES

General

Extremely low noise behaviour and good stability with
very small output capacitors

Two V

-state controlled regulators (regulators 1 and 3)

and a power switch

Regulator 2, reset and ignition buffer operate during
load dump and thermal shutdown

Separate control pins for switching regulators
(regulators 1 and 3) and the power switch

Supply voltage range of

18 to +50 V

Low reverse current of regulator 2

Low quiescent current (when regulator 1, regulator 3
and power switch are switched off)

Hold output for low V

(regulators 1 and 3 off)

Hold output for regulators 1 and 3

Hold output for foldback mode switch

Hold output for load dump and temperature protection

Reset and hold outputs (open collector outputs)

Adjustable reset delay time

High ripple rejection

backup capacitor for regulator 2

Two independent ignition buffers (one inverted and with
open collector output).

Protections

Reverse polarity safe (down to

18 V without high

reverse current)

Able to withstand voltages up to 18 V at the outputs
(supply line may be short circuited)

ESD protected on all pins

Thermal protections with hysteresis

Load dump protection

Foldback current limit protection for
regulators 1, 2 and 3

Delayed second current limit protection for the power
switch (at short circuit)

The regulator outputs and the power switch are DC
short circuited safe to ground and V

GENERAL DESCRIPTION

The TDA3618JR is a multiple output voltage regulator with
a power switch and ignition buffers, intended for use in car
radios with or without a microcontroller. It contains:

Two fixed voltage regulators with a foldback current
protection (regulators 1 and 3) and one fixed voltage
regulator (regulator 2), intended to supply a
microcontroller, which also operates during load dump
and thermal shutdown

A power switch with protections, operated by an enable
input

Reset and hold outputs that can be used to interface
with the microcontroller. The reset signal can be used to
call up the microcontroller.

A supply pin which can withstand load dump pulses and
negative supply voltages

Regulator 2, which is switched on at a backup voltage
greater than 6.5 V and off when the output voltage of
regulator 2 drops below 1.9 V

A provision for the use of a reserve supply capacitor that
will hold enough energy for regulator 2 (5 V continuous)
to allow a microcontroller to prepare for loss of voltage

An inverted ignition 1 input with open collector output
stage

An ignition 2 input Schmitt trigger with push-pull output
stage.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA3618JR

DBS17P

plastic DIL-bent-SIL (specially bent) power package;
17 leads (lead length 12 mm)

SOT475-1

1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

FUNCTIONAL DESCRIPTION

The TDA3618JR is a multiple output voltage regulator with
a power switch, intended for use in car radios with or
without a microcontroller. Because of the low-voltage
operation of the car radio, low-voltage drop regulators are
used in the TDA3618JR.

Regulator 2 switches on when the backup voltage
exceeds 6.5 V for the first time and switches off again
when the output voltage of regulator 2 falls below 1.9 V
(this is far below an engine start). When regulator 2 is
switched on and its output voltage is within its voltage
range, the reset output is enabled (RES goes HIGH
through a pull-up resistor) to generate a reset to the
microcontroller. The reset cycles can be extended by an
external capacitor at pin 13. This start-up feature is
included to secure a smooth start-up of the microcontroller
at first connection, without uncontrolled switching of
regulator 2 during the start-up sequence.

The charge of the backup capacitor can be used to supply
regulator 2 for a short period when the supply drops to 0 V
(the time depends on the value of the storage capacitor).
The output stages (regulators 1 and 3) of this regulator
have an extremely low noise behaviour and good stability.
Regulators 1 and 3 are stabilized by using small output
capacitors.

When both regulator 2 and the supply voltage (V

> 4.5 V)

are available, regulators 1 and 3 can be operated by
means of enable inputs (pins 10 and 4 respectively).

The HOLD output pin is normally HIGH and is active LOW.
The HOLD output pin is connected to an open collector
NPN transistor and must have an external pull-up resistor
to operate. The HOLD output is controlled by a LOW
detection circuit which, when activated, pulls the warning
output LOW (enabled). The hold outputs of the regulators
are connected to an OR gate inside the IC such that the
hold is activated (goes LOW) when the regulator voltages
of regulator 1 and/or regulator 3 are out of regulation for
any reason. Each regulator enable input controls its own
hold circuit, such that if a regulator is disabled or switched
off, the hold circuit for that regulator is disabled.

The hold is also controlled by the temperature and load
dump protection. Activating the temperature or load dump
protection causes a hold (LOW) during the time the
protection is activated. When all regulators are switched
off, the HOLD output is controlled by the battery line
(pin 1), temperature protection and load dump protection.

The hold is enabled (LOW) at low battery voltages. This
indicates that it is not possible to get regulator 1 into
regulation when switching it on. The hold function includes
hysteresis to avoid oscillations when the regulator voltage
crosses the hold threshold. The HOLD output becomes
also active (LOW) when the switch is in foldback protection
mode, see Fig.4 for a timing diagram. The block diagram
is given in Fig.3.

The power switch can also be controlled by means of a
separate enable input (pin 11).

All output pins are fully protected. The regulators are
protected against load dump (regulators 1 and 3 switch off
at supply voltages >18 V) and short circuit (foldback
current protection).

The switch contains a current protection. However, this
protection is delayed at short circuit by the reset delay
capacitor. During this time, the output current is limited to
a peak value of at least 3 and 2 A continuous (V

18 V).

In the normal situation, the voltage on the reset delay
capacitor is about 3.5 V (depending on the temperature).
The switch output is about V

0.4 V. At operational

temperature, the switch can deliver at least 3 A. At high
temperature, the switch can deliver about 2 A. During an
overload condition or short circuit (V

< V

3.7 V), the

voltage on the reset delay capacitor rises 0.6 V above the
voltage of regulator 2. This rise time depends on the
capacitor connected on the C

RES

(pin 13). During this time,

the switch can deliver more than 3 A. The charge current
of the reset delay capacitor is typically 4

A and the

voltage swing about 1.5 V. When regulator 2 is out of
regulation and generates a reset, the switch can only
deliver 2 A and will go in the foldback protection without
delay. At supply voltages >17 V, the switch is clamped at
16 V maximum (to avoid externally connected circuits
being damaged by an overvoltage) and the switch will
switch off at load dump.

Interfacing with the microcontroller (simple full/semi on/off
logic applications) can be realized with two independent
ignition Schmitt triggers and ignition output buffers (one
open collector and one push-pull output). Ignition 1 output
is inverted.

The total timing diagrams are shown in Figs 4 and 5.

1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

CHARACTERISTICS
V

= 14.4 V; T

amb

= 25

C; see Fig.8; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

supply voltage

operating

14.4

regulator 2 on

note 1

2.4

14.4

jump start

10 minutes

load dump protection

50 ms; t

2.5 ms

quiescent supply current

= 12.4 V; note 2;

REG2

= 0.1 mA

310

400

= 14.4 V; note 2;

REG2

= 0.1 mA

315

Schmitt trigger for power supply of switch, regulators 1 and 3

thr

rising threshold voltage

6.5

7.0

7.5

thf

falling threshold voltage

4.0

4.5

5.0

hys

hysteresis voltage

2.5

Schmitt trigger for regulator 2

thr

rising threshold voltage

6.0

6.5

7.1

thf

falling threshold voltage

1.7

1.9

2.3

hys

hysteresis voltage

4.6

Schmitt trigger for enable input (regulators 1, 3 and switch)

thr

rising threshold voltage

1.4

1.8

2.4

thf

falling threshold voltage

0.9

1.3

1.9

hys

hysteresis voltage

REG

= I

= 1 mA

0.5

input leakage current

= 5 V

Reset trigger level of regulator 2

thr

rising threshold voltage

rising; I

REG1

= 50 mA;

note 3

4.5

REG2

0.15

REG2

0.1

Schmitt triggers for HOLD output

thr1

rising threshold voltage of
regulator 1

rising; note 3

REG1

0.15

REG1

0.075

thf1

falling threshold voltage of
regulator 1

falling; note 3

8.1

REG1

0.35

hys1

hysteresis voltage due to
regulator 1

0.2

thr3

rising threshold voltage of
regulator 3

rising; note 3

REG3

0.15

REG3

0.075

thf3

falling threshold voltage of
regulator 3

falling; note 3

4.1

REG3

0.35

hys3

hysteresis voltage due to
regulator 3

0.2

1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

thr(VP)

rising threshold voltage of
supply voltage

= 0 V

9.1

9.7

10.3

thf(VP)

falling threshold voltage of
supply voltage

= 0 V

9.0

9.4

9.8

hys

hysteresis voltage of
supply voltage

= 0 V

0.3

Reset and hold buffer

sinkL

LOW-level sink current

RES/HOLD

0.8 V

output leakage current

= 14.4 V;

RES/HOLD

= 5 V

0.1

rise time

note 4

fall time

note 4

Reset delay

charge current

dch

discharge current

500

800

thr(RES)

rising voltage threshold
reset signal

2.5

3.0

3.5

d(RES)

delay time reset signal

C = 47 nF; note 5

thr(SW)

rising voltage threshold
switch foldback protection

REG2

d(SW)

delay time switch foldback
protection

C = 47 nF; note 6

17.6

Regulator 1 (I

REG1

= 5 mA; unless otherwise specified)

O(off)

output voltage off

400

O(REG1)

output voltage

1 mA

REG1

600 mA

8.5

9.0

9.5

12 V

18 V

8.5

9.0

9.5

line regulation

12 V

18 V

load regulation

1 mA

REG1

600 mA

100

quiescent current

= 600 mA

SVRR

supply voltage ripple
rejection

= 3 kHz; V

i(p-p)

= 2 V

drop-out voltage

REG1

= 550 mA;

= 9.5 V; note 7

0.4

0.7

REG1m

current limit

REG1

> 8.5 V; note 8

0.65

1.2

REG1sc

short-circuit current

0.5

; note 9

250

800

Regulator 2 (I

REG2

= 5 mA; unless otherwise specified)

O(REG2)

output voltage

0.5 mA

REG2

300 mA

4.75

5.0

5.25

8 V

18 V

4.75

5.0

5.25

18 V

50 V;

REG2

150 mA

4.75

5.0

5.25

line regulation

6 V

18 V

6 V

50 V

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

load regulation

1 mA

REG2

150 mA

1 mA

REG2

300 mA

100

SVRR

supply voltage ripple
rejection

f = 3 kHz; V

i(p-p)

= 2 V

drop-out voltage

REG2

= 100 mA;

= 4.75 V; note 7

0.4

0.6

REG2

= 200 mA;

= 5.75 V; note 7

0.8

1.2

REG2

= 100 mA;

= 4.75 V; note 10

0.2

0.5

REG2

= 200 mA;

= 5.75 V; note 10

0.8

1.0

REG2m

current limit

REG2

> 4.5 V; note 8

0.32

0.37

REG2sc

short-circuit current

0.5

; note 9

100

Regulator 3 (I

REG3

= 5 mA; unless otherwise specified)

O(off)

output voltage off

400

O(REG3)

output voltage

1 mA

REG3

750 mA

4.75

5.0

5.25

7 V

18 V

4.75

5.0

5.25

line regulation

7 V

18 V

load regulation

1 mA

REG3

750 mA

100

quiescent current

= 750 mA

SVRR

supply voltage ripple
rejection

= 3 kHz; V

i(p-p)

= 2 V

drop-out voltage

REG3

= 500 mA;

= 5.75 V; note 7

1.5

REG3m

current limit

REG3

> 4.5 V; note 8

0.80

0.90

REG3sc

short-circuit current

0.5

; note 9

100

400

Power switch

drop-out voltage

= 1 A; V

= 13.5 V;

note 11

0.45

0.70

= 1.8 A; V

= 13.5 V;

note 11

1.0

1.8

continuous current

= 16 V; V

= 13.5 V

1.8

2.0

clamp

clamping voltage

17 V

13.5

15.0

16.0

peak current

= 17 V; notes 6, 12, 13

fly back voltage behaviour I

100 mA

+ 3

short-circuit current

= 14.4 V; V

< 1.2 V;

note 13

0.8

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

backup switch

continuous current

0.3

0.35

clamp

clamping voltage

16.7 V

reverse current

= 0 V; V

= 12.4 V

900

Schmitt trigger for enable input of ignition 1

thr

rising threshold voltage of
ignition 1 input

2.75

3.25

3.75

thf

falling threshold voltage of
ignition 1 input

0.8

1.3

hys

hysteresis voltage

1.5

input leakage current

IGN1IN

= 5 V

1.0

I(clamp)

input clamping current

IGN1IN

> 50 V

IH(clamp)

HIGH-level input clamping
voltage

IL(clamp)

LOW-level input clamping
voltage

0.6

Schmitt trigger for power supply of ignition 1

thr

rising threshold voltage

6.5

7.0

7.5

thf

falling threshold voltage

note 14

4.0

4.5

5.0

Ignition 1 buffer

LOW-level output voltage

IGN1OUT

= 0 mA

0.2

0.8

LOW-level output current

IGN1OUT

0.8 V

0.45

0.8

output leakage current

IGN1OUT

= 5 V;

IGN1IN

= 0 V

1.0

PLH

LOW-to-HIGH
propagation time

IGN1IN

rising from

0.8 to 3.75 V

500

PHL

HIGH-to-LOW
propagation time

IGN1IN

falling from

3.75 to 0.8 V

500

Schmitt trigger for enable input of ignition 2

thr

rising threshold voltage of
ignition 2 input

> 3.5 V

1.9

2.2

2.5

thf

falling threshold voltage of
ignition 2 input

> 3.5 V

1.7

2.0

2.3

hys

hysteresis voltage

> 3.5 V

0.1

0.2

0.5

input leakage current

IGN2IN

= 5 V

1.0

I(clamp)

input clamp current

IGN2IN

> 50 V

IH(clamp)

HIGH-level input clamping
voltage

IL(clamp)

LOW-level input clamping
voltage

0.6

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

Notes

1. Minimum operating voltage, only if V

has exceeded 6.5 V.

2. The quiescent current is measured in the standby mode. Therefore, the enable inputs of regulators 1, 3 and the

power switch are grounded and R

L(REG2)

(see Fig.8).

3. The voltage of the regulator drops as a result of a V

drop.

4. The rise and fall times are measured with a 10 k

pull-up resistor and a 50 pF load capacitor.

5. The delay time depends on the value of the capacitor:

6. The delay time depends on the value of the reset delay capacitor:

7. The drop-out voltage of regulators 1, 2 and 3 is measured between V

and REGn.

8. At current limit, I

REGmn

is held constant (see Fig.6 for the behaviour of I

REGmn

9. The foldback current protection limits the dissipated power at short circuit (see Fig.6).

10. The drop-out voltage measured between BU and REG2.

11. The drop-out voltage of the power switch is measured between V

and SW.

12. The maximum output current of the switch is limited to 1.8 A when the supply voltage exceeds 18 V. A test mode is

built in. The delay time of the switch is disabled when a voltage of V

+ 1 V is applied to the switch-enable input.

13. At short circuit, I

of the power switch is held constant to a lower value than the continuous current after a delay of

at least 10 ms. A test-mode is built in. The delay time of the switch is disabled when a voltage of V

+ 1 V is applied

to the switch-enable input.

14. V

IGN1OUT

= LOW for V

IGN1OUT

> 1.2 V or V

EN1

> 1.3 V or V

EN3

> 1.3 V or V

ENSW

> 1.3 V.

Ignition 2 buffer

LOW-level output voltage

IGN2OUT

= 0 mA

0.2

0.8

HIGH-level output voltage

IGN2OUT

= 0 mA

4.5

5.0

5.25

LOW-level output current

IGN2OUT

0.8 V

0.45

0.8

HIGH-level output current

IGN2OUT

4.5 V

0.45

2.0

output leakage current
(source)

IGN2OUT

= 5 V;

IGN2IN

= 0 V

1.0

PLH

LOW-to-HIGH
propagation time

IGN2IN

rising from

1.7 to 2.5 V

500

PHL

HIGH-to-LOW
propagation time

IGN2IN

falling from

2.5 to 1.7 V

500

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

------

C(th)

750

(

)

[ ]

d_high current

-------

C th

( )

375

(

)

[ ]

1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

Application information

OISE

Table 1

Noise figures

Note

1. Measured at a bandwidth of 200 kHz.

The noise on the supply line depends on the value of the
supply capacitor and is caused by a current noise (the
output noise of the regulators is translated to a current
noise by the output capacitors). When a high frequency
capacitor of 220 nF in parallel with an electrolytic capacitor
of 100

F is connected directly to pins 1 and 14 (supply

and ground), the noise is minimal.

TABILITY

The regulators are stabilized with the externally connected
output capacitors.

The output capacitors can be selected by using the graphs
of Figs 9 and 10. When an electrolytic capacitor is used,
the temperature behaviour of this output capacitor can
cause oscillations at a low temperature. The two examples
below show how an output capacitor value is selected.

Example 1

Regulators 1 and 3 are stabilized with an electrolytic
output capacitor of 220

F (ESR = 0.15

). At

C, the

capacitor value is decreased to 73

F and the ESR is

increased to 1.1

. The regulator remains stable at

Example 2

Regulator 2 is stabilized with a 10

F electrolytic capacitor

(ESR = 3

). At

C, the capacitor value is decreased

to 3

F and the ESR is increased to 23.1

. Using Fig.10,

the regulator will be instable at

Solution

To avoid problems with stability at low temperatures, the
use of tantalum capacitors is recommended. Use a
tantalum capacitor of 10

F or a larger electrolytic

capacitor.

REGULATOR

NOISE FIGURE (

(1)

= 10

= 47

= 100

tbf

150

tbf

150

tbf

200

tbf

Fig.9

Curve for selecting the value of output
capacitor for regulators 1 and 3.

handbook, halfpage

0.1

C (

MGK612

stable region

maximum ESR

100

(

)

Fig.10 Curve for selecting the value of output

capacitor for regulator 2.

handbook, halfpage

0.22

C (

MGK613

stable region

maximum ESR

minimum ESR

100

(

)

1999 Sep 01

Philips Semiconductors

Preliminary specification

Multiple voltage regulator with switch and
ignition buffers

TDA3618JR

SOLDERING

Introduction to soldering through-hole mount
packages

This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our

"Data Handbook IC26; Integrated Circuit

Packages" (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joints for more than 5 seconds.

The total contact time of successive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PACKAGE

SOLDERING METHOD

DIPPING

WAVE

DBS, DIP, HDIP, SDIP, SIL

suitable

(1)

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

Philips Semiconductors a worldwide company

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

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Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

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220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
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Tel. +359 2 68 9211, Fax. +359 2 68 9102

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Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,
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Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands

545002/02/pp

Date of release:

1999 Sep 01

Document order number:

9397 750 06265

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ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA3618JR