Preliminary specification
File under Integrated Circuits, IC01
2000 Apr 26
INTEGRATED CIRCUITS
TDA3672
Very low dropout voltage/quiescent
current 3.0 V voltage regulator with
enable
DATA SHEET
2000 Apr 26
2
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
FEATURES
Fixed 3.0 V, 100 mA regulator with enable function
Supply voltage range up to 33 V (45 V)
Very low quiescent current of 15
A (typical value)
Very low dropout voltage
High ripple rejection
Very high stability:
Electrolytic capacitors: Equivalent Series Resistance
(ESR) < 30
at I
REG
25 mA (see Fig.6)
Other capacitors: 100 nF at 200
A
I
REG
100 mA.
Pin compatible family TDA3672 to TDA3676
Protections:
Reverse polarity safe (down to
-
25 V without high
reverse current)
Negative transient of 50 V (R
S
= 10
and
t < 100 ms)
Able to withstand voltages up to 18 V at the output
(supply line may be short-circuited)
ESD protection on all pins
DC short-circuit safe to ground and V
P
of the
regulator output
Temperature protection (at T
j
> 150
C).
GENERAL DESCRIPTION
The TDA3672 is a fixed 3.0 V voltage regulator with very
low dropout voltage and quiescent current, which operates
over a wide supply voltage range.
The IC is available as:
TDA3672AT: V
P
45 V;
-
40
C
T
amb
+125
C and
SO8 package (automotive).
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
P
supply voltage
regulator on
3
14.4
45
V
I
q
quiescent supply current
V
P
= 14.4 V; I
REG
= 0 mA;
V
I(EN)
= 5 V
-
15
30
A
Voltage regulator
V
REG
output voltage
7.5
V
P
22 V; I
REG
= 0.5 mA
2.84
3.0
3.16
V
5.5 V
V
P
45 V; I
REG
= 0.5 mA
2.81
3.0
3.19
V
V
P
= 14.4 V; 0.5 mA
I
REG
100 mA 2.81
3.0
3.19
V
V
REG(drop)
dropout voltage
V
P
= 2.8 V; I
REG
= 50 mA;
T
amb
85
C
-
0.18
0.3
V
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA3672AT
SO8
plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
2000 Apr 26
3
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
BLOCK DIAGRAM
handbook, halfpage
MBL122
REGULATOR
2, 3, 6, 7
1
GND
8
REG
VP
5
EN
BAND GAP
TDA3672
THERMAL
PROTECTION
Fig.1 Block diagram.
PINNING
Note
1. All pins GND are connected to the lead frame and can
also be used to reduce the total thermal resistance
R
th(j-a)
by soldering these pins to a ground plane.
The ground plane on the top side of the PCB acts like
a heat spreader.
SYMBOL
PIN
DESCRIPTION
REG
1
regulator output
GND
2, 3, 6 and 7
ground; note 1
n.c.
4
not connected
EN
5
enable input
V
P
8
supply voltage
handbook, halfpage
1
2
3
4
8
7
6
5
MBL123
TDA3672
VP
GND
GND
GND
EN
n.c.
GND
REG
Fig.2 Pin configuration.
2000 Apr 26
4
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
FUNCTIONAL DESCRIPTION
The TDA3672 is a fixed 3.0 V regulator which can deliver
output currents up to 100 mA. The regulator is available in
an SO8 package with fused centre pins connected to the
lead frame. The regulator is intended for portable, mains,
telephone and automotive applications. To increase the
lifetime of batteries, a specially built-in clamp circuit keeps
the quiescent current of this regulator very low, also in
dropout and full load conditions.
The regulator remains operating down to very low supply
voltages and below this voltage it switches off.
A temperature protection circuit is included, which
switches off the regulator output at a junction temperature
above 150
C.
A new output circuit guarantees the stability of the
regulator for a capacitor output circuit with an ESR up
to 20
(see Fig.5). If only a 100 nF capacitor is used, the
regulator is fully stable when I
REG
> 200
A. This is very
attractive as the ESR of an electrolytic capacitor increases
strongly at low temperatures (no expensive tantalum
capacitor is required).
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with
"SNW-FQ-611E".
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage
-
45
V
V
P(rp)
reverse polarity supply voltage
non-operating
-
-
25
V
P
tot
total power dissipation
temperature of copper area
is 25
C
-
4.1
W
T
stg
storage temperature
non-operating
-
55
+150
C
T
amb
ambient temperature
operating
-
40
+125
C
T
j
junction temperature
operating
-
40
+150
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air; soldered in
125
K/W
R
th(j-c)
thermal resistance from junction to case
to centre pins; soldered in
30
K/W
2000 Apr 26
5
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
CHARACTERISTICS
V
P
= 14.4 V; T
amb
= 25
C; measured in test circuit (see Fig.3); unless otherwise specified.
Notes
1. The regulator output will follow V
P
if V
P
< V
REG
+ V
REG(drop)
.
2. Limiting values as applicable for device type TDA3672AT: V
P
45 V and
-
40
C
T
amb
+125
C.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply voltage: pin V
P
V
P
supply voltage
regulator operating; note 1
3
14.4
45
V
I
q
quiescent current
V
P
= 14.4 V; I
REG
= 0 mA;
V
I(EN)
= 0 V
-
4
15
A
V
P
= 14.4 V; I
REG
= 0 mA;
V
I(EN)
= 5 V
-
15
30
A
5.5 V
V
P
22 V; I
REG
= 10 mA
-
0.2
0.5
mA
5.5 V
V
P
22 V; I
REG
= 50 mA
-
1.4
2.5
mA
Enable input: pin EN
V
I(EN)
enable input voltage
enable off; V
REG
0.8 V
-
1
-
+1.0
V
enable on; V
REG
2.7 V
3.0
-
18
V
I
I(EN)
enable input current
V
I(EN)
= 5 V
-
0.3
-
A
Regulator output: pin REG; note 2
V
REG
output voltage
7.5 V
V
P
22 V; I
REG
= 0.5 mA
2.84
3.0
3.16
V
0.5 mA
I
REG
100 mA;
T
amb
125
C
2.81
3.0
3.19
V
5.5 V
V
P
45 V; I
REG
= 0.5 mA;
T
amb
125
C
2.81
3.0
3.19
V
V
REG(drop)
dropout voltage
V
P
= 2.8 V; I
REG
= 50 mA;
T
amb
85
C
-
0.18
0.3
V
V
REG(stab)
long-term output voltage
stability
-
20
-
mV/1000 h
V
REG(line)
line regulation voltage
6.5 V
V
P
22 V; I
REG
= 0.5 mA
-
1
30
mV
6.5 V
V
P
45 V; I
REG
= 0.5 mA
-
1
50
mV
V
REG(load)
load output regulation voltage
0.5 mA
I
REG
50 mA
-
10
50
mV
SVRR
supply voltage ripple rejection
f
i
= 120 Hz; V
i(ripple)
= 1 V (RMS);
I
REG
= 0.5 mA
50
60
-
dB
I
REG(crl)
current limit
V
REG
> 2.5 V
0.17
0.25
-
A
I
LO(rp)
output leakage current at
reverse polarity input
V
P
=
-
15 V; V
REG
0.3 V
-
1
500
A
2000 Apr 26
6
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
TEST AND APPLICATION INFORMATION
ndbook, halfpage
MBL125
VP
8
1
2, 3, 6, 7
C2
VI(EN)
5
TDA3672
10
F
C1
1
F
VREG = 3.0 V
Fig.3 Test circuit.
V
I(EN)
= 5 V.
C1 is optional (to minimize supply noise only).
handbook, halfpage
MDA961
ESR
(
)
C2 (
F)
10
2
10
1
10
-
1
10
-
1
1
10
10
2
stable region
(2)
(1)
Fig.4
Graph for selecting the value of the output
capacitor.
(1) Maximum ESR at 200
A
I
REG
100 mA.
(2) Minimum ESR only when I
REG
200
A.
Noise
The output noise is determined by the value of the output
capacitor. The noise figure is measured at a bandwidth of
10 Hz to 100 kHz (see Table 1).
Table 1
Noise figures
Stability
The regulator is stabilized with an external capacitor
connected to the output. The value of this capacitor can be
selected using the diagrams shown in Figs 4 and 5.
The following four examples show the effects of the
stabilization circuit using different values for the output
capacitor.
OUTPUT
CURRENT
I
REG
(mA)
NOISE FIGURE (
V)
C2 = 10
F
C2 = 47
F
C2 = 100
F
0.5
550
320
300
50
650
400
400
handbook, halfpage
MDA962
ESR
(
)
IREG (mA)
10
3
10
2
10
22
1
10
-
1
1
10
10
3
10
2
stable region
Fig.5
ESR as a function of I
REG
for selecting the
value of the output capacitor.
2000 Apr 26
7
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
E
XAMPLE
1
The regulator is stabilized with an electrolytic capacitor of
68
F (ESR = 0.5
). At T
amb
=
-
40
C, the capacitor
value is decreased to 22
F and the ESR is increased
to 3.5
. The regulator will remain stable at a temperature
of T
amb
=
-
40
C.
E
XAMPLE
2
The regulator is stabilized with an electrolytic capacitor of
10
F (ESR = 3.3
). At T
amb
=
-
40
C, the capacitor
value is decreased to 3
F and the ESR is increased
to 20
. The regulator will remain stable at a temperature
of T
amb
=
-
40
C.
E
XAMPLE
3
The regulator is stabilized with a 100 nF MKT capacitor
connected to the output. Full stability is guaranteed when
the output current is larger then 200
A.
Because the thermal influence on this capacitor value is
almost zero, the regulator will remain stable at a
temperature of T
amb
=
-
40
C.
E
XAMPLE
4
The regulator is stabilized with a 100 nF capacitor in
parallel with a electrolytic capacitor of 10
F connected to
the output.
The regulator is now stable under all conditions and
independent of:
The ESR of the electrolytic capacitor
The value of the electrolytic capacitor
The output current.
Application circuits
The maximum output current of the regulator equals:
When T
amb
= 21
C and V
P
= 14 V the maximum output
current equals 117 mA.
For successful operation of the IC (maximum output
current capability) special attention has to be given to the
copper area required as heatsink (connected to all
GND pins), the thermal capacity of the heatsink and its
ability to transfer heat to the external environment.
It is possible to reduce the total thermal resistance from
120 to 50 K/W.
Application circuit with backup function
Sometimes a backup function is needed to supply, for
example, a microcontroller for a short period of time when
the supply voltage spikes to 0 V (or even
-
1 V).
This function can be easily built with the TDA3672 by using
a large output capacitor. When the supply voltage is 0 V
(or
-
1 V), only a small current will flow into pin REG from
this output capacitor (a few
A).
The application circuit is given in Fig.6.
I
REG max
(
)
150
T
amb
R
th j
a
(
)
V
P
V
REG
(
)
-----------------------------------------------------------
=
150
T
amb
100
V
P
3.0
(
)
------------------------------------------ mA
(
)
=
ndbook, halfpage
MBL124
VP
8
1
2, 3, 6, 7
C2
VI(EN)
5
TDA3672
C1
1
F
VREG = 3.0 V
Fig.6 Application circuit with backup function.
V
I(EN)
= 5 V.
C1 is optional (to minimize supply noise only).
C2
4700
F.
2000 Apr 26
8
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
Additional application information
This section gives typical curves for various parameters measured on the TDA3672AT. Standard test conditions are:
V
P
= 14.4 V; T
amb
= 25
C.
handbook, halfpage
0
10
VP (V)
Iq
(
A)
20
30
25
0
20
15
10
5
MDA947
Fig.7
Quiescent current as a function of the
supply voltage.
I
REG
= 0 mA.
handbook, halfpage
0
10
50
4
3
1
0
2
20
30
VP (V)
Iq
(mA)
40
MDA949
Fig.8
Quiescent current as a function of high
supply voltage.
handbook, halfpage
-
40
0
(1)
(2)
160
2
1.5
0.5
0
1
40
80
Tj (
C)
Iq
(mA)
120
MDA951
Fig.9
Quiescent current as a function of the
junction temperature.
(1) I
q
at 50 mA load.
(2) I
q
at 10 mA load.
handbook, halfpage
5
0.36
0.40
0.44
0.48
10
15
VP (V)
Iq
(mA)
25
20
MDA948
Fig.10 Quiescent current as a function of the
supply voltage.
I
REG
= 10 mA.
2000 Apr 26
9
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
handbook, halfpage
5
1.4
1.6
1.8
2
10
15
VP (V)
Iq
(mA)
25
20
MDA950
Fig.11 Quiescent current as a function of the
supply voltage.
I
REG
= 50 mA.
handbook, halfpage
0
20
100
4
3
1
0
2
40
60
IREG (mA)
Iq
(mA)
80
MDA952
Fig.12 Quiescent current as a function of the
output current.
handbook, halfpage
-
50
200
3.10
2.95
3.00
3.05
0
50
Tj (
C)
VREG
(V)
100
150
MGU155
Fig.13 Output voltage as a function of the junction
temperature.
I
REG
= 0 mA.
handbook, halfpage
-
50
200
4
0
1
3
2
0
50
Tj (
C)
VREG
(V)
100
150
MGU156
Fig.14 Output voltage thermal protection as a
function of the junction temperature.
I
REG
= 0 mA.
2000 Apr 26
10
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
handbook, halfpage
0
40
IREG (mA)
VREG(drop)
(mV)
80
120
500
400
200
100
300
MDA957
Fig.15 Dropout voltage as a function of the output
current.
handbook, halfpage
0
4
3
2
1
0
100
VREG
(V)
IREG (mA)
200
300
MGU157
Fig.16 Foldback protection mode.
V
P
= 8 V with pulsed load.
handbook, halfpage
-
70
-
60
-
50
-
40
-
30
MDA956
10
SVRR
(dB)
f (Hz)
10
2
10
3
10
4
10
5
(1)
(1)
(2)
(2)
(3)
(3)
Fig.17 SVRR as a function of the ripple frequency.
C2 = 10
F.
(1) SVRR at R
L
= 10 k
.
(2) SVRR at R
L
= 500
.
(3) SVRR at R
L
= 100
.
2000 Apr 26
11
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(2)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
1.27
6.2
5.8
1.05
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.4
SOT96-1
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
4
5
pin 1 index
1
8
y
076E03
MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.20
0.19
0.16
0.15
0.050
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.01
0.041
0.004
0.039
0.016
0
2.5
5 mm
scale
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
97-05-22
99-12-27
2000 Apr 26
12
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 230
C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2000 Apr 26
13
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
not suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS
not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
2000 Apr 26
14
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS
(1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2000 Apr 26
15
Philips Semiconductors
Preliminary specification
Very low dropout voltage/quiescent current
3.0 V voltage regulator with enable
TDA3672
NOTES
Philips Electronics N.V.
SCA
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Internet: http://www.semiconductors.philips.com
2000
69
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Printed in The Netherlands
753503/25/01/pp
16
Date of release:
2000 Apr 26
Document order number:
9397 750 06704
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