2000 Aug 17

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4863J; TDA4863AJ

FEATURES

Power amplifier with differential inputs

Output current up to 3 A (p-p)

High vertical deflection frequency up to 200 Hz

High linear sawtooth signal amplification

Flyback generator:

TDA4863J: separate adjustable flyback supply

voltage up to 60 V

TDA4863AJ: internally doubled supply voltage

(two supply voltages only for DC-coupled outputs).

GENERAL DESCRIPTION

The TDA4863J and TDA4863AJ are deflection boosters
for use in vertical deflection systems for frame frequencies
up to 200 Hz.

The TDA4863J needs a separate flyback supply voltage,
so the supply voltages are independently adjustable to
optimize power consumption and flyback time.

For the TDA4863AJ the flyback supply voltage will be
generated internally by doubling the supply voltage and
therefore a separate flyback supply voltage is not needed.

Both circuits provide differential input stages and fit well
with the TDA485X monitor deflection controller family.

QUICK REFERENCE DATA
Measurements referenced to ground (pin GND).

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage 1 (pin 1)

supply voltage 2 for vertical output
(pin 3)

flyback supply voltage of TDA4863J
(pin 2)

flyback generator output voltage of
TDA4863AJ (pin 2)

1.5 A

+ 2.2 V

5(p-p)

vertical output current (pin 5)
(peak-to-peak value)

supply current 1 (pin 1)

during scan

quiescent supply current 2 (pin 3)

= 0

INP

input voltage (pin 7)

1.6

0.5 V

INN

input voltage (pin 6)

1.6

0.5 V

amb

ambient temperature

+75

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA4863J

DBS7P

plastic DIL-bent-SIL power package; 7 leads
(lead length 12/11 mm); exposed die pad

SOT524-1

TDA4863AJ

2000 Aug 17

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4863J; TDA4863AJ

FUNCTIONAL DESCRIPTION

Both the TDA4863J and TDA4863AJ consist of a
differential input stage, a vertical output stage, a flyback
generator, a reference circuit and a thermal protection
circuit.

The TDA4863J operates with a separate flyback supply
voltage (see Fig.1) while the TDA4863AJ generates the
flyback voltage internally by doubling the supply voltage
(see Fig.2).

Differential input stage

The differential sawtooth input signal (e.g. coming from the
deflection controller family TDA485X) is connected to the
inputs (inverted signal to pin 6 and non-inverted signal to
pin 7). The vertical feedback signal is superimposed on
the inverted signal on pin 6.

Vertical output and thermal protection

The vertical output stage is a quasi-complementary
class-B amplifier with a high linearity.

The output stage is protected against thermal overshoots.
For a junction temperature T

> 150

C this protection will

be activated and will reduce then the deflection current (I

Flyback generator

The flyback generator supplies the vertical output stage
during flyback.

The TDA4863J is used with separate flyback supply
voltage to achieve a short flyback time with minimized
power dissipation.

The TDA4863AJ needs a capacitor C

between

pins 2 and 3 (see Fig.2). Capacitor C

is charged during

scan, using the external diode D1 and resistor R5. During
flyback the cathode of capacitor C

is connected to the

positive supply voltage and the flyback voltage is then
twice the supply voltage. For the TDA4863AJ the
resistor R6 in the positive supply line can be used to
reduce the power consumption.

In parallel with the deflection coil a damping resistor R

and an RC combination (R

= 5.6

and C

= 100 nF)

are needed. Furthermore, another additional
RC combination (R

= 5.6

and C

= 47 to 150 nF)

can be used to minimize the noise effect and the flyback
time (see Figs 9 and 10).

2000 Aug 17

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4863J; TDA4863AJ

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); voltages referenced to ground (pin 4); unless
otherwise specified.

Notes

1. Internally limited by thermal protection; will be activated for T

150

2. Equivalent to discharging a 200 pF capacitor through a 0

series resistor.

THERMAL CHARACTERISTICS

Note

1. To minimize the thermal resistance from mounting base to heatsink [R

th(mb-h)

] follow the recommended mounting

instruction: screw mounting preferred; torque = 40 Ncm; use heatsink compound; isolation plate increases R

th(mb-h)

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage 1 (pin 1)

supply voltage 2 (pin 3)

flyback supply voltage of TDA4863J (pin 2)

flyback generator output voltage of TDA4863AJ (pin 2)

+ 3

i(6,7)

input voltage on pins 6 and 7

o(5)

output voltage on pin 5

supply current 2 (pin 3)

1.8

o(5)

output current (pin 5)

note 1

1.8

flyback current on pin 2

1.8

stg

storage temperature

+150

amb

ambient temperature

+75

junction temperature

note 1

150

electrostatic discharge voltage on all pins

note 2

300

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-mb)

thermal resistance from junction to mounting base

note 1

K/W

2000 Aug 17

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4863J; TDA4863AJ

CHARACTERISTICS
V

= 25 V; V

= 0 V; T

amb

= 25

C; voltages referenced to ground (pin 4); unless otherwise specified.

Note

1. Deviation of the output slope at a constant input slope.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supplies

supply voltage 1 (pin 1)

supply voltage 2 (pin 3)

flyback supply voltage of TDA4863J
(pin 2)

flyback generator output voltage of
TDA4863AJ (pin 2)

1.5 A

+ 2.2 V

supply current 1 (pin 1)

during scan

quiescent supply current 2 (pin 3)

= 0

Differential input stage

INP

input voltage (pin 7)

1.6

0.5 V

INN

input voltage (pin 6)

1.6

0.5 V

INP

input quiescent current (pin 7)

100

500

INN

input quiescent current (pin 6)

100

500

Flyback generator

current during flyback

1.5

3-2

voltage drop during flyback of
TDA4863J

reverse

1 A

1.5

1.5 A

forward

= 1 A

2.2

= 1.5 A

2.5

2-1

voltage drop during flyback of
TDA4863AJ

reverse

1 A

1.5

1.5 A

forward

= 1 A

2.2

= 1.5 A

2.5

Vertical output stage; see Fig.5

vertical deflection output current

1.5

5(p-p)

vertical deflection output current on
pin 5 (peak-to-peak value)

5-4

output saturation voltage to ground

= 1 A

1.4

1.7

= 1.5 A

1.8

2.3

5-3

output saturation voltage to V

= 1 A

2.3

= 1.5 A

2.8

2.3

LIN

non-linearity of output signal

note 1

2000 Aug 17

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4863J; TDA4863AJ

Example for both TDA4863J and TDA4863AJ

Table 1

Values given from application

Note

1. For TDA4863J only.

Table 2

Calculated values

, V

and V

are referenced to ground of application;

voltages are calculated with +10% tolerances.

Calculation formulae for supply voltages:

5-3

+ (R1 + R

deflcoil

)

defl(max)

+ U

= V

5-4

+ (R1 + R

deflcoil

)

defl(max)

+ U'

where

= L

deflcoil

defl(max)

= vertical deflection frequency

= forward voltage drop across D1.

Calculation formulae for power consumption:

where

= power dissipation of the IC

tot

= total power dissipation

defl

= power dissipation of the deflection coil.

Calculation formulae for maximum required thermal
resistance for the heatsink at T

j(max)

= 110

Table 3

flb

as a function of V

for TDA4863J

Table 4

flb

as a function of V

and V

for TDA4863AJ

SYMBOL

VALUE

UNIT

defl(max)

0.71

deflcoil

270

1.8

(1)

amb

deflcoil

th(j-mb)

K/W

th(mb-amb)

K/W

SYMBOL

VALUE

UNIT

TDA4863J

TDA4863AJ

12.5

tot

3.2

4.4

defl

1.2

3.2

th(tot)

K/W

j(max)

105

flb

(

(V)

350

250

210

flb

(

(V)

(W)

R6 (

)

360

2.5

290

12.5

3.2

3.9

240

3.9

6.8

tot

defl

tot

(

)

defl(max)

--------------------

defl(max)

--------------------

(

)

0.01 A

0.2 W

defl

deflcoil

--------------------------------

defl(max)

th(mb-amb)

j(max)

amb

-----------------------------------

th(j-mb)

19 K/W (max.)

2000 Aug 17

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4863J; TDA4863AJ

SOLDERING

Introduction to soldering through-hole mount
packages

This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our

"Data Handbook IC26; Integrated Circuit

Packages" (document order number 9398 652 90011).

Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.

Soldering by dipping or by solder wave

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joints for more than 5 seconds.

The total contact time of successive solder waves must not
exceed 5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods

Note

1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

PACKAGE

SOLDERING METHOD

DIPPING

WAVE

DBS, DIP, HDIP, SDIP, SIL

suitable

(1)

2000 Aug 17

Philips Semiconductors

Product specification

Vertical deflection booster

TDA4863J; TDA4863AJ

DATA SHEET STATUS

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DATA SHEET STATUS

PRODUCT

STATUS

DEFINITIONS

(1)

Objective specification

Development

This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.

Preliminary specification

Qualification

This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification

Production

This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000

Philips Semiconductors a worldwide company

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Printed in The Netherlands

753504/01/pp

Date of release:

2000 Aug 17

Document order number:

9397 750 07125

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA4863A

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA4863A