2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

CONTENTS

FEATURES

APPLICATIONS

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

C-BUS DATA FORMAT

8.1

C-bus address selection

8.2

Write mode

8.3

Read mode

8.4

Power-on reset

LIMITING VALUES

HANDLING

THERMAL CHARACTERISTICS

CHARACTERISTICS

TEST AND APPLICATION INFORMATION

13.1

Measurement circuit

INTERNAL PIN CONFIGURATION

PACKAGE OUTLINES

SOLDERING

16.1

Introduction to soldering surface mount
packages

16.2

Reflow soldering

16.3

Wave soldering

16.4

Manual soldering

16.5

Suitability of surface mount IC packages for
wave and reflow soldering methods

DATA SHEET STATUS

DEFINITIONS

DISCLAIMERS

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

FEATURES

Single-chip 5 V mixer / oscillator and synthesizer for TV,
VCR tuners, DVD-R and PC TV.

C bus protocol compatible with 3.3 V and 5 V

microcontrollers

Address with 4 data bytes transmission (I

C-bus

`write' mode)

Address with 1 status byte (I

C-bus `read' mode)

4 independent I

C-bus addresses.

5 Positive-channel Metal Oxide Semiconductor (PMOS)
output ports

3 buffers for band selection (20 mA)

2 buffers for general purpose, e.g. FM sound trap

(5 mA).

33 V tuning voltage output

In-lock flag

5-step analog-to-digital converter (3 bits in I

C-bus

mode)

15-bit programmable divider

Programmable reference divider ratio (64, 80 or 128)

Programmable charge-pump current (20 or 100

Balanced mixer with a common emitter input for LOW
band (single input)

Balanced mixer with a common emitter input for MID
band (balanced input)

Balanced mixer with a common base input for HIGH
band (balanced input)

2-pin asymmetrical oscillator for LOW band

2-pin symmetrical oscillator for MID band

2-pin symmetrical oscillator for HIGH band

External 4-pin IF filter between mixer output (medium
impedance) and IF amplifier input (high impedance)

Weak signal booster (I

C controlled switchable gain

amplifier)

Low power

Low radiation

Small size

TDA6508; TDA6509: symmetrical IF amplifier output to
drive a SAW filter (1.25 k

)

TDA6508A; TDA6509A: single-ended IF amplifier to
drive low ohmic load (75

APPLICATIONS

3-band tuner for terrestrial TV, DVD-R, VCR and PC TV.

GENERAL DESCRIPTION

This device is a programmable 3-band mixer oscillator and
synthesizer intended for LOW, MID and HIGH band TV
and VCR tuners. It has three double balanced mixers and
three oscillators for the LOW, MID and HIGH band
respectively, a PLL synthesizer, and an IF amplifier. There
are four package variants: TDA6508, TDA6509,
TDA6508A and TDA6509A. Versions TDA6508; TDA6509
have a symmetrical IF amplifier; versions TDA6508A;
TDA6509A have an asymmetrical IF amplifier, (see Fig.1).

The common output of all three mixers can be connected,
via two output pins, to an external IF filter to enable
shunted IF bandpass and/or serial filtering for improved
signal handling. Two input pins are available for
connecting the output of the external filter to the input of
the IF amplifier. The mixer output has an impedance
of 300

. The IF amplifier input has an impedance

of 2.5 k

(5 pF).

The overall gain of the tuner can be increased at low signal
amplitude conditions to improve TV reception by activating
a weak signal booster via the I

C-bus.

There are five open-drain PMOS output ports; each port
has a different drive capability. I

C-bus bit P0 enables

port P0 (20 mA drain current) and the LOW band mixer
oscillator. Bit P1 enables port P1 (20 mA drain current)
and the MID band mixer oscillator. When ports P0 and P1
are both disabled, the HIGH band mixer oscillator is
enabled. Bit P2 enables port P2 (20 mA drain current).
Bit P3 enables port P3 (5 mA drain current) for general
use, and bit P4 enables port P4 (5 mA drain current) for
general use, and is also combined with the ADC input.
When the ports are used, the sum of the drain currents
must be limited to 30 mA.

The PLL synthesizer comprises a 15-bit programmable
divider, a crystal oscillator, programmable reference
divider, phase comparator (phase/frequency detector)
combined with a charge-pump which drives an internal
tuning amplifier and an output at pin CP. The CP signal
current can be integrated by connecting an external RC

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

loop filter between pin CP and pin VTUNE as shown in
Fig.27. The tuning amplifier can supply up to 33 V (max.)
at pin VT for controlling any of the internal oscillators via
external tank circuits. The phase comparator can operate
at 62.5, 50 or 31.25 kHz with a 4 MHz crystal, depending
on the reference divider ratio of either 64, 80 or 128; see
Table 4. An externally sourced signal having a frequency
between 3.58 MHz and 4.43 MHz can be used as a
reference frequency for the internal crystal oscillator at any
of the reference divider ratios.

In test mode, port P3 will output either half the crystal
reference frequency (

ref

) or half the reference divider

frequency (

div

); see Table 5.

The device can be controlled according to the I

C-bus

format; see Table 1. The in-lock flag bit FL is set to logic 1
when the PLL is locked. This flag is read from the status
byte on pin SDA during a READ operation; see Table 6
and Table 7.

Automatic frequency control is provided using an internal
Analog-to-Digital Converter controlled by the voltage on
pin ADC. The ADC code is read during a READ operation;
see Table 8.

The device requires to be addressed by five sequential
serial bytes (including the address byte) via the I

C-bus to

set the crystal oscillator frequency, program the five ports
and to set the charge-pump current; see Table 1. The
address byte can have one of four possible device
addresses which are selected by applying a specific
voltage to pin AS; see Table 3.

QUICK REFERENCE DATA

Measured over full voltage and temperature ranges.

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

4.5

5.5

supply current

= 5 V; all ports off

xtal

crystal oscillator frequency

xtal

= 25

to 300

3.58

4.0

4.43

MHz

tot

total power dissipation

290

385

stg

IC storage temperature

150

amb

ambient temperature

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA6508TT

TSSOP32

plastic thin shrink small outline package; 32 leads body width 6.1 mm

SOT487-1

TDA6508ATT

TDA6509TT

TSSOP32

plastic thin shrink small outline package; 32 leads body width 6.1 mm

SOT487-1

TDA6509ATT

TDA6509HN

HVQFN32

plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5

0.85 mm

SOT617-1

TDA6509AHN

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

BLOCK DIAGRAM

mdb250

REFERENCE

DIVIDER

64, 80, 128

CRYSTAL

OSCILLATOR

4 MHz

15-BIT

PROGRAMMABLE

DIVIDER

15-BIT

FREQUENCY

PHASE

COMPARATOR

IN-LOCK

DETECTOR

CHARGE

PUMP

TUNE

AMP

T0
T1
T2

T0 RSA RSB WSB

CONTROL

I2C-BUS / 3-WIRE BUS

TRANSCEIVER

3-BIT ADC

PORT

ref

1/2f

div

GATE

RF INPUT

VHF

LOW BAND

VHF

LOW BAND

MIXER

VHF

LOW BAND

OSCILLATOR

RF INPUT

VHF

HIGH BAND

VHF

HIGH BAND

MIXER

VHF

HIGH BAND

OSCILLATOR

T0, T1, T2

RSA

RSB

LOW_RFIN

RF_GND

MID_RFIN1

MID_RFIN2

XTAL_REF

SCL

SDA

LOW_OSCOUT

LOW_OSCIN

OSC_GND

MID_OSCIN1

MID_OSCIN2

PLL_GND

ADC/P4

5 (28)

6 (27)

3 (30)

4 (29)

17
(16)

16 (17)

15 (18)

21 (12)

18 (15)

14 (19)

11 (22) 12 (21) 13 (20)

29 (4)

28 (5)

30 (3)

32 (1)

31 (2)

25 (8)

TDA6508

TDA6508A
(TDA6509)

(TDA6509A)

RF INPUT

UHF

BAND

UHF

MIXER

UHF

OSCILLATOR

HIGH_RFIN1

HIGH_RFIN2

HIGH_OSCIN1

HIGH_OSCIN2

IFAMP_OUT1

IFAMP_OUT2/
IF_GND

IFAMP_IN1
IFAMP_IN2
MIX_OUT1
MIX_OUT2

1 (32)

2 (31)

27 (6)

23 (10)

24 (9)

9 (24)

10 (23)

7 (26)
8 (25)

19 (14)

20 (13)

22 (11)

26 (7)

FILTER BUFFER

SYMMETRICAL/ASYMMETRICAL IFAMPLIFIER

PLL SYNTHESIZER

WEAK SIGNAL BOOSTER

SAW DRIVER

WSB

Fig.1 Block diagram.

(1) `A' versions only.

The pin numbers in parenthesis refer to versions TDA6509 and TDA6509A.

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

PINNING

SYMBOL

PIN

DESCRIPTION

TDA6508;

TDA6508A

TDA6509;

TDA6509A

HIGH_RFIN1

HIGH band RF input 1

HIGH_RFIN2

HIGH band RF input 2

MID_RFIN1

MID band RF input 1

MID_RFIN2

MID band RF input 2

LOW_RFIN

LOW band RF input

RF_GND

RF ground

MIX_OUT1

mixer output 1 (to external IF filter)

MIX_OUT2

mixer IF output 2 (to external IF filter)

IFAMP_IN1

IF amplifier input 1 (from external IF filter)

IFAMP_IN2

IF amplifier input 2 (from external IF filter)

HIGH band port output

MID band port output

LOW band port output

general purpose port - test mode output

SDA

serial data input/output

SCL

serial clock input

XTAL_REF

crystal oscillator reference signal input

ADC/P4

ADC input/general purpose port output

charge-pump output

tuning voltage output

address selection input

PLL_GND

PLL ground

IFAMP_OUT1

IF amplifier output 1

IFAMP_OUT2

IF amplifier output 2 (TDA6508 and TDA6509 only)

IF_GND

IF ground (TDA6508A and TDA6509A only)

supply voltage

HIGH_OSCIN1

HIGH band oscillator input 1

HIGH_OSCIN2

HIGH band oscillator input 2

MID_OSCIN1

MID band oscillator input 1

MID_OSCIN2

MID band oscillator input 2

OSC_GND

oscillator ground

LOW_OSCOUT

LOW band oscillator output

LOW_OSCIN

LOW band oscillator input

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, halfpage

TDA6508

TDA6508A

MDB226

HIGH_RFIN1

HIGH_RFIN2

MID_RFIN1

MID_RFIN2

LOW_RFIN

RF_GND

MIX_OUT1

MIX_OUT2

IFAMP_IN1

IFAMP_IN2

SDA

SCL

LOW_OSCIN

LOW_OSCOUT

OSC_GND

MID_OSCIN2

MID_OSCIN1

HIGH_OSCIN2

HIGH_OSCIN1

VCC

IFAMP_OUT2/IF_GND

IFAMP_OUT1

PLL_GND

ADC/P4

XTAL_REF

Fig.2

Pin configuration for TDA6508 and
TDA6508A (TSSOP32).

handbook, halfpage

TDA6509

TDA6509A

MDB227

LOW_OSCIN

LOW_OSCOUT

OSC_GND

MID_OSCIN2

MID_OSCIN1

HIGH_OSCIN2

HIGH_OSCIN1

VCC

IF_GND/IFAMP_OUT2

IFAMP_OUT1

PLL_GND

ADC/P4

XTAL_REF

HIGH_RFIN1

HIGH_RFIN2

MID_RFIN1

MID_RFIN2

LOW_RFIN

RF_GND

MIX_OUT1

MIX_OUT2

IFAMP_IN1

IFAMP_IN2

SDA

SCL

Fig.3 Pin configuration for TDA6509 and TDA6509A

(TSSOP32).

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, halfpage

IF_GND/IFAMP_OUT2

PLL_GND

IFAMP_OUT1

XTAL_REF

ADC/P4

HIGH_RFIN1

LOW_RFIN

MID_RFIN1

MID_RFIN2

HIGH_RFIN2

RF_GND

MIX_OUT2

MIX_OUT1

TDA6509

TDA6509A

VCC

HIGH_OSCIN2

HIGH_OSCIN1

MID_OSCIN1

MID_OSCIN2

OSC_GND

LOW_OSCOUT

LOW_OSCIN

MDB225

SDA

SCL

IFAMP_IN2

IFAMP_IN1

Fig.4 Pin configuration for TDA6509 and TDA6509A (HVQFN32).

C-BUS DATA FORMAT

8.1

C-bus address selection

The address byte ADB contains programmable module
address bits MA1 and MA0 which allow up to four
synthesizers to be used in the same system, and are
configured by applying one of four possible voltages on
pin AS; see Tables 1 and 2. For each voltage on pin AS,
the resultant values of bits MA1 and MA0 are shown in
Table 3.

8.2

Write mode

The write mode is defined by setting bit R/W to logic 0 in
address byte ADB; see Table 1.

Data bytes can be sent to the device after sending the first
address byte. Four data bytes are required to fully program
the device.

The bus transceiver has an auto-increment facility which
allows the device to be programmed by one transmission
(address byte with 4 data bytes). The device can be
partially programmed provided that the first data byte
following the address byte is divider byte DB1 or control
byte CB.

The MSB of the first data byte DB1 indicates whether
frequency data (MSB = 0) or control and band switch data
will follow. Additional data bytes can be entered without the
need to re-address the device until an I

C-bus STOP

command is sent by the controller.

The frequency divider register is loaded after the 8th clock
pulse of byte DB2. The control register is loaded after the
8th clock pulse of byte CB, and the band switch register is
loaded after the 8th clock pulse of byte BB.

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

Table 1

C-bus data format for write mode

Note

1. X = don't care.

Table 2

Function of write mode bits used in Table 1

Table 3

Module address selection bits

NAME

BYTE

BITS

(1)

MSB

LSB

Address byte

ADB

MA1

MA0

R/W = 0

Divider byte 1

DB1

N14

N13

N12

N11

N10

Divider byte 2

DB2

Control byte

RSA

RSB

WSB

Band switch byte

BIT

FUNCTION

MA1 and MA0

module address; see Table 3

R/W

read/write mode; 0 = write mode

N14 to N0

programmable divider bits: N = N14

N13

...

charge-pump current control:

0: charge-pump current is 20

1: charge-pump current is 100

T2, T1 and T0

test mode; see Table 5

RSA and RSB

reference divider ratio; see Table 4

WSB

Weak Signal Booster control:

0: normal mode - no gain increase: external IF filter used

1: Weak Signal Booster activated: IF filter by-passed

P0, P1, P2, P3, P4

port P0 to P4 control:

0: corresponding port is off; high impedance state (default)

1: corresponding port is on.

MA1

MA0

VOLTAGE APPLIED TO PIN AS

0 V to 0.1V

0.2V

to 0.3V

or open-circuit

0.4V

to 0.6V

0.9V

to 1.0V

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

Table 4

Reference divider ratio selection bits

Note

1. Crystal oscillator frequency or externally sourced reference frequency of 4 MHz at pin XTAL_REF.

Table 5

Test mode selection bits

Notes

1. This is the default mode at power-on reset.

div

is output from port P3 when the charge-pump is off.

3. Port P3 cannot be used when these test modes are active.

RSA

RSB

REFERENCE DIVIDER RATIO

FREQUENCY STEP (kHz)

(1)

128

31.25

62.5

TEST MODE

normal mode (read and write mode bytes allowed)

(1)

charge-pump is off

(2)

byte BB ignored

charge-pump sinks current

charge-pump sources current

ref

is output from port P3

(3)

div

is output from port P3

(3)

8.3

Read mode

The read mode is defined by setting bit R/W to logic 1 in
address byte ADB; see Table 6.

After the slave address has been recognized, the device
generates an acknowledge pulse, and status byte SB is
transferred on the SDA line (MSB first). Data is valid on the
SDA line when pin SCL is HIGH. A second data byte can
be read from the device if the microcontroller generates an
acknowledge on the SDA line (master acknowledge).

End of transmission will occur if no master acknowledge is
asserted. The device will then release the data line to allow
the microcontroller to generate a STOP condition.

Bit POR is set to logic 1 at power-on. This bit is reset when
an end-of-data is detected by the device at the end of a
read sequence. Bit FL controls the PLL by indicating when
the loop is locked (bit FL = 1).

The internal ADC can be used to apply AFC information to
a microcontroller in the IF section of the television via
status byte bits A0, A1 and A2. Up to five voltage levels
can be applied to the ADC input pin ADC; the resultant
values of bits A2, A1 and A0 are shown in Table 8.

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

Table 6

Read data format

Note

1. MSB is transmitted first.

Table 7

Description of the bits used in Table 6

Table 8

Digital outputs for analog to digital converter (note 1)

Note

1. Accuracy is

0.03

8.4

Power-on reset

The threshold level for the power-on reset supply voltage V

POR

is set to 3.2 V at room temperature. Below this threshold,

the device is reset to the power-on state.

The following actions take place In the power-on state:

The charge-pump current is set to 100

Test bits T2, T1 and T0 are set to logic 001; the charge-pump can either sink or source current

The Weak signal booster is disabled

All ports are off and the HIGH band is selected by default.

NAME

BYTE

BIT

MSB

(1)

LSB

Address byte

ADB

MA1

MA0

R/W = 1

Status byte

POR

BIT

DESCRIPTION

MA1 and MA0

programmable address bits; see Table 3

R/W

read/write mode selection; 1 = read mode

POR

Power-on reset flag:

0: after end of the first read sequence

1: at Power-on

in-lock flag:

0: loop is not locked

1: loop is locked

A2, A1 and A0

digital outputs of the 5-level ADC; see Table 8

VOLTAGE APPLIED TO PIN ADC

0 V

to 0.15 V

0.15 V

to 0.3 V

0.3 V

to 0.45 V

0.45 V

to 0.6 V

0.6 V

to 1 V

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

Table 9

Default setting of the bits at power-on reset

Note

1. X = don't care.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.

Note

1. Maximum ratings can not be exceeded, not even momentarily without causing irreversible IC damage. Maximum

ratings can not be accumulated.

10 HANDLING

Human Body Model: C = 100 pF and R = 1500

. All pins withstand 2000 V in accordance with specification

EIA/JESD22-A114-A.

Machine model: C = 200 pF and R = 0

. All pins withstand 200 V in accordance with specification

EIA/JESD22-A115-A.

NAME

BYTE

BITS

(1)

MSB

LSB

Address byte

ADB

MA1

MA0

Divider byte 1

DB1

Divider byte 2

DB2

Control byte

Band switch byte

SYMBOL

PIN

PARAMETER

MIN.

MAX.

UNIT

TDA6508;

TDA6508A

TDA6509;

TDA6509A

DC supply voltage

0.3

operating supply

4.5

5.5

11, 12, 13, 14, 18

22, 21, 20, 19, 15

PMOS port output voltage

0.3

11, 12, 13

22, 21, 20

PMOS port output current

14, 18

19, 15

tuning voltage output

0.3

SCL

serial clock input voltage

0.3

SDA

serial data input or output voltage

0.3

SDA

serial data output current

address selection input voltage

0.3

xtal

crystal input voltage

0.3

+ 0.3

sc(max)

maximum short-circuit time (all pins to
V

and all pins to all grounds)

stg

storage temperature

150

amb

ambient temperature

junction temperature

150

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

11 THERMAL CHARACTERISTICS

Note

1. JEDEC conditions apply to single layer PCB.

12 CHARACTERISTICS
V

= 5 V, T

amb

= 25

C; TDA6508 and TDA6509 values measured with R

= 1.25 k

and TDA6508A and TDA6509A

values measured with R

= 75

; Weak signal booster off; measured using the PAL application circuit shown in

Figure 27; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

TYP.

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air - SOT487-5

(1)

115

K/W

in free air - SOT487-4

(1)

125

K/W

in free air - SOT617-1

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply voltage

4.5

5.0

5.5

supply current

at V

= 5 V; all ports off

UNCTIONAL RANGE

POR

power-on reset supply
voltage

power-on reset activates below this
voltage

3.2

divider ratio

15-bit frequency word

32767

xtal

crystal oscillator frequency

xtal

= 25

to 300

3.58

4.0

4.43

MHz

xtal

input impedance
(absolute value)

xtal

= 4 MHz

1000

1200

PMOS

PORTS

PINS

P0, P1, P2, P3, P4

L(Pn)

leakage current

= 5.5 V; V

= 0 V or 5.5 V

120

Pn(sat)

output saturation voltage

Pn(sat)

= V

one buffer output is on and
sourcing 5 mA

0.25

0.4

one buffer output is on and
sourcing 20 mA

0.25

0.4

ADC

INPUT

ADC (

BUS MODE

)

ADC

ADC input voltage

see Table 8

ADC(H)

HIGH level input current

ADC

= V

100

ADC(L)

LOW level input current

ADC

= 0 V

ADDRESS SELECTION INPUT

AS(H)

HIGH level input current

= 5 V

AS(L)

LOW level input current

= 0 V

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

LOCK AND DATA INPUTS

PINS

SCL

AND

SDA

SCL(L)

SDA(L)

LOW level input voltage

1.5

SCL(H)

SDA(H)

HIGH level input voltage

2.3

5.5

SCL(H)

SDA(H)

HIGH level input current

bus

= 5.5 V; V

= 0 V

bus

= 5.5 V; V

= 5.5 V

SCL(L)

SDA(L)

LOW level input current

bus

= 1.5 V; V

= 0 V

bus

= 0 V; V

= 5.5 V

ATA OUTPUT

SDA

L(SDA)

leakage current

SDA

= 5.5 V

SDA(H)

HIGH level output voltage

SDA

= 3 mA (sink current)

0.4

LOCK FREQUENCY

C-

BUS MODE

)

clk

clock frequency

400

kHz

HARGE

PUMP OUTPUT

CP(H)

HIGH level input current
(absolute value)

CP = 1

100

115

CP(L)

LOW level input current
(absolute value)

CP = 0

L(CP)

off-state leakage current

T2 = 0; T1 = 1; T0 = 0

UNING VOLTAGE OUTPUT

tune(off)

leakage current when
switched-off

T2 = 1; T1 = 1; T0 = 0; tuning
supply is 33 V

o(tune)

output voltage when loop is
closed

T2 = 0; T1 = 0; T0 = 1; R

= 33 k

;

tuning supply is 33 V

0.3

32.7

LOW

MIXER

NCLUDING

PREAMPLIFIER

)

RF(o)

RF operational frequency

800

MHz

RF frequency

; note 1

43.25

161.25

MHz

voltage gain

TDA6508; TDA6509; IF output
loaded with 1.25 k

= 46 MHz; see Fig.10

= 164 MHz; see Fig.10

TDA6508A; TDA6509A; IF output
loaded with 75

= 46 MHz; see Fig.11

= 164 MHz; see Fig.11

noise figure

= 50 MHz; see Figs 12 and 13

= 150 MHz; see Fig.13

SYMBOL

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2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

output voltage (causing 1%
cross-modulation in channel)

TDA6508; TDA6509

= 43.25 MHz; see Fig.15

114

117

= 161.25 MHz; see Fig.15

114

117

TDA6508A; TDA6509A

= 43.25 MHz; see Fig.16

106

109

= 161.25 MHz; see Fig.16

106

109

input voltage (causing
pulling in channel at 750 Hz)

= 161.25 MHz; note 2

optimum source
conductance for noise figure

= 50 MHz

0.7

input conductance

= 43.25 MHz; see Fig.5

0.3

= 161.25 MHz; see Fig.5

0.3

input capacitance

= 43.25 to 161.25 MHz;

see Fig.5

LOW

OSCILLATOR

osc(o)

oscillator operational
frequency

600

MHz

osc

oscillator frequency

note 3

82.15

200.15

MHz

osc(V)

oscillator frequency variation
with supply voltage

= 5%; note 4

kHz

= 10%; note 4

kHz

osc(T)

oscillator frequency variation
with temperature

T =

C; with compensation;

note 5

900

kHz

T = 35

C; without compensation;

note 5

1700

kHz

osc

phase noise, carrier-to-noise
sideband

worst case in the frequency range

100 kHz frequency offset

110

107

dBc/Hz

10 kHz frequency offset

dBc/Hz

RSC

(p-p)

ripple susceptibility of V

(peak-to-peak value)

4.75 V <V

<5.25 V; worst case in

the frequency range; ripple
frequency 500 kHz; note 6

mod

FM modulation caused by
I

C communication

worst case; note 7

2.12

kHz

MID

MIXER

(

INCLUDING

PREAMPLIFIER

)

O(RF)

RF operational frequency

800

MHz

RF frequency

; note 1

154.25

447.25

MHz

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

voltage gain

TDA6508; TDA6509; IF output
loaded with 1.25 k

= 157 MHz; see Fig.17

= 450 MHz; see Fig.17

TDA6508A; TDA6509A; IF output
loaded with 75

= 157 MHz; see Fig.18

= 450 MHz; see Fig.18

noise figure

= 150 MHz; see Figs 12 and 13

= 300 MHz; see Figs 12 and 13

output voltage (causing 1%
cross-modulation in channel)

TDA6508; TDA6509

= 154.25 MHz; see Fig.19

114

117

= 447.25 MHz; see Fig.19

114

117

TDA6508; TDA6509A

= 154.25 MHz; see Fig.20

106

109

= 447.25 MHz; see Fig.20

106

109

input voltage (causing
pulling in channel at 750 Hz)

= 447.25 MHz; note 2

optimum source
conductance for noise figure

= 150 MHz

0.9

= 300 MHz

1.5

input conductance

= 154.25 MHz

0.21

= 447.25 MHz

1.8

input capacitance

= 154.25 to 447.25 MHz

0.6

MID

OSCILLATOR

osc(o)

oscillator operational
frequency

600

MHz

osc

oscillator frequency

note 3

193.15

486.15

MHz

osc(V)

oscillator frequency variation
with supply voltage

= 5%; note 4

kHz

= 10%; note 4

kHz

osc(T)

oscillator frequency variation
with temperature

T =

C; with compensation;

note 5

1200

kHz

T = 35

C; without compensation;

note 5

2000

kHz

osc

phase noise, carrier-to-noise
sideband

worst case in the frequency range

100 kHz frequency offset

109

106

dBc/Hz

10 kHz frequency offset

dBc/Hz

RSC

(p-p)

ripple susceptibility of V

(peak-to-peak value)

4.75 V <V

<5.25 V; worst case in

the frequency range; ripple
frequency 500 kHz; note 6

mod

FM modulation caused by
I

C communication

worst case; note 7

2.12

kHz

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

HIGH

MIXER

(

INCLUDING

PREAMPLIFIER

)

O(RF)

RF operational frequency

200

900

MHz

RF frequency

; note 1

439.25

863.25

MHz

voltage gain

TDA6508; TDA6509; IF output
loaded with 1.25 k

= 442 MHz; see Fig.21

= 866 MHz; see Fig.21

TDA6508A; TDA6509A; IF output
loaded with 75

= 442 MHz; see Fig.22

= 866 MHz; see Fig.22

noise figure (not corrected
for image)

= 439.25 MHz; see Fig.23

= 863.25 MHz; see Fig.23

output voltage (causing 1%
cross-modulation in channel)

TDA6508; TDA6509

= 439.25 MHz; Fig.25

114

117

= 863.25 MHz; Fig.25

114

117

TDA6508A; TDA6509A

= 439.25 MHz; Fig.26

106

109

= 863.25 MHz; Fig.26

106

109

input voltage (causing
pulling in channel at 750 Hz)

= 863.25 MHz; note 2

input impedance (R

)

at f

= 439.25 MHz

at f

= 863.25 MHz

at f

= 439.25 MHz

at f

= 863.25 MHz

HIGH

OSCILLATOR

osc(o)

oscillator operational
frequency

300

1000

MHz

osc

oscillator frequency

note 3

478.15

902.15

MHz

osc(V)

oscillator frequency variation
with supply voltage

= 5%; note 4

kHz

= 10%; note 4

kHz

osc(T)

oscillator frequency variation
with temperature

T =

C; with compensation;

note 5

2700

kHz

T = 35

C; without compensation;

note 5

4100

kHz

osc

phase noise, carrier-to-noise
sideband

worst case in the frequency range

100 kHz frequency offset

105

102

dBc/Hz

10 kHz frequency offset

dBc/Hz

RSC

(p-p)

ripple susceptibility of V

(peak-to-peak value)

4.75 V <V

<5.25 V; worst case in

the frequency range; ripple
frequency 500 kHz; note 6

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

Notes

1. The range of f

is defined by the range of f

osc

and I; f

= picture carrier frequency.

2. V

is the level of f

(100% amplitude modulated with 11.89 kHz) that causes the frequency of the oscillator signal to

deviate by 750 Hz; it produces sidebands 30 dB below the level of the oscillator signal.

3. Limits are related to the tank circuits used in Fig.27; frequency bands may be adjusted by the choice of external

components.

4. The oscillator frequency shift is defined as a change in oscillator frequency when the supply voltage varies from

= 5 V to 4.75 V (or 5 V to 4.5 V) or from V

= 5 V to 5.25 V (or 5 V to 5.5 V). The oscillator is free running

during this measurement.

5. The oscillator frequency drift is defined as a change in oscillator frequency when the ambient temperature varies from

amb

= 25

C to 50

C (60

C max.) or from T

amb

= 25

C to 0

C. The oscillator is free running during this

measurement. For

T =

C measurements, the tank circuit has temperature compensated values;

for

T = 35

C measurements, the tank circuit has non-temperature compensated values.

6. The ripple susceptibility is measured with a 500 kHz ripple signal applied to the supply voltage. The level of the ripple

signal is increased until a difference of 53.5 dB occurs between the level of the IF carrier, fixed at 110 dB

V for

TDA6508; TDA6509 or 100 dB

V for TDA6508A; TDA6509A, and the sideband components.

7. FM modulation of the local oscillator resulting from I

C-bus communication is measured at the IF output using a

modulation analyzer with a peak-to-peak detector and a post detection filter of 20 Hz to 100 kHz. I

C-bus messages

sent to the tuner address the tuner without changing the contents of the PLL registers. The maximum I

C-bus clock

rate is 400 kHz. The I

C-bus pull-up resistor values are 1.5 k

mod

FM modulation caused by
I

C communication

worst case; note 7

3.0

kHz

EAK SIGNAL BOOSTER

v(WSB)

gain increase when the
weak signal booster mode is
activated

TDA6508; TDA6509;
IF = 36.15 MHz

TDA6508A; TDA6509A;
IF = 36.15 MHz

PREAMPLIFIER

O(IF)

IF operational frequency

MHz

output impedance
(R

)

TDA6508; TDA6509

at 36.15 MHz

100

at 36.15 MHz

TDA6508A; TDA6509A

at 36.15 MHz

EJECTION AT THE

OUTPUT

INT

div

level of divider interferences
in the IF signal

worst case; note 8

xtal

crystal oscillator
interferences rejection

worst case in the frequency range;
note 9

dBc

ref

reference frequency
rejection

worst case in the frequency range;
f

ref

= 62.5 kHz; note 10

dBc

INT

SO2

channel SO2 beat

= 80 dB

V; note 11

dBc

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

8. This is the level of signals close to the IF frequency which can interfere with the dividers. Typical interference signals

are channel S3: f

osc

= 256.15 MHz,

osc

= 40.02 MHz. The LOW and MID RF inputs must not be connected to

any load or cable; the HIGH RF inputs are connected to a hybrid (balun).

9. Crystal oscillator interference is the 4 MHz sidebands produced by the crystal oscillator. The rejection must be

greater than 60 dB for an IF output signal of 110 dB

V for versions TDA6508; TDA6509 or 100 dB

V for versions

TDA6508A; TDA6509A.

10. Reference frequency rejection measures the level of reference frequency sidebands with respect to the sound

sub-carrier f

ssc

11. Channel SO2 beat is the interfering product of the picture carrier frequency f

pc,

and f

OSC

in channel SO2:

BEAT

= f

osc

= 37.35 MHz. Another possible mechanism is: 2

osc

. For the measurement,

= 80 dB

handbook, full pagewidth

MDB220

0.5

43.25 MHz

161.25 MHz

0.5

Fig.5 Input admittance (S

) of the LOW band mixer (43.25 to 161.25 MHz); Y

= 20 mS.

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

13 TEST AND APPLICATION INFORMATION

mdb265

signal
source

i(meas)

D.U.T.

LOW_RFIN

GND

IFAMP_OUT1

IFAMP_OUT2

o(meas)

2 x 5

turns

2
turns

RMS

voltmeter

spectrum

analyzer

N1/N2 = 5

Fig.10 Gain measurement in the LOW-band of the TDA6508; TDA6509.

>> 50

= 2

i(meas)

= 80 dB

= V

i(meas)

+ 6 dB = 80 dB

= V

o(meas)

+ 15 dB (transformer ratio N1/N2 and transformer loss).

= 20 log

PAL f

= 36.15 MHz.

------

handbook, full pagewidth

MDB266

LOW_RFIN

IFAMP_OUT1

Vi(meas)

RMS

voltmeter

spectrum
analyzer

Vo(meas)

D.U.T.

signal
source

Fig.11 Gain measurement in the LOW-band of the TDA6508A; TDA6509A.

>> 50

= 2

i(meas)

= 80 dB

= V

i(meas)

+ 6 dB = 80 dB

= V

o(meas)

+ 3.75 dB.

= 20 log

PAL f

= 36.15 MHz.

------

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, full pagewidth

FCE578

PCB

plug

BNC

RIM-RIM

PCB

RIM-RIM

(a)

(b)

Fig.12 Input circuit for optimum noise figure in LOW and MID-bands.

(a) f

= 50 MHz:

LOW band mixer frequency response measured = 57 MHz, loss = 0 dB.

image suppression = 16 dB.

C1 = 9 pF.

C2 = 15 pF.

L1 = 7 turns (

5.5 mm, wire

= 0.5 mm).

l1 = semi-rigid (RIM) cable, length = 5 cm (33 dB/100 m,
50

and 96 pF/m).

(b) For f

= 150 MHz:

MID band mixer frequency response measured = 150.3 MHz,
loss = 0 dB.

image suppression = 13 dB.

C3 = 5 pF.

C4 = 25 pF.

l2 = semi-rigid (RIM) cable, length = 30 cm.

l3 = semi-rigid (RIM) cable, length = 5 cm (33 dB/100 m,
50

and 96 pF/m).

mdb263

D.U.T.

INPUT

CIRCUIT

LOW_RFIN or
MID_RFIN

GND

IFAMP_OUT1

IFAMP_OUT2

BNC

RIM

NOISE

METER

NOISE

SOURCE

2 x 5

turns

2
turns

N1/N2 = 5

Fig.13 Noise figure measurement in the LOW and MID-bands of the TDA6508; TDA6509.

NF = NF

meas

input circuit loss (dB).

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, full pagewidth

MDB264

LOW_RFIN or
MID_RFIN

IFAMP_OUT1

D.U.T.

NOISE

SOURCE

NOISE

FIGURE

METER

BNC

RIM

INPUT

CIRCUIT

Fig.14 Noise figure measurement in the LOW and MID-bands of the TDA6508A; TDA6509A.

NF = f

meas

input circuit loss (dB).

handbook, full pagewidth

unwanted

signal

source

wanted

signal

source

MDB261

D.U.T.

LOW_RFIN

IFAMP_OUT1

IFAMP_OUT2

18 dB

attenuator

N1/N2 = 5

2 x 5

turns

2
turns

FILTER

38.9 MHz

modulation
analyzer

HYBRID

RMS

voltmeter

AM = 30%

Vo(meas)

Fig.15 Cross-modulation measurement in the LOW-band of the TDA6508; TDA6509.

= V

o(meas)

+ 15 dB (transformer ratio N1/N2 and transformer loss).

Wanted output signal at picture carrier frequency f

RF(w)

; V

o(w)

= 110 dB

Unwanted output signal at sound sub-carrier frequency f

RF(u)

; AM = 30%; AF = 2 kHz.

Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.

RF(w)

= 43.25 MHz (min); 161.25 MHz (max).

RF(u)

= 48.75 MHz (min); 166.75 MHz (max).

osc

= 82.15 MHz (min); 200.15 MHz (max.).

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, full pagewidth

MDB262

38.9 MHz

LOW_RFIN

IFAMP_OUT1

HYBRID

18 dB

attenuator

Vo(meas)

RMS

voltmeter

modulation
analyzer

unwanted

signal

source

wanted

signal

source

AM = 30%

FILTER

D.U.T.

Fig.16 Cross-modulation measurement in the LOW-band of the TDA6508A; TDA6509A.

= V

o(meas)

+ 3.75 dB (transformer ratio N1/N2 and transformer loss).

Wanted output signal at picture carrier frequency f

RF(w)

; V

o(w)

= 100 dB

Unwanted output signal at sound sub-carrier frequency f

RF(u)

; AM = 30%; AF = 2 kHz.

Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.

RF(w)

= 43.25 MHz (min.); 161.25 MHz (max.).

RF(u)

= 48.75 MHz (min.); 166.75 MHz (max.).

osc

= 82.15 MHz (min.); 200.15 MHz (max.).

mdb259

D.U.T.

MID_RFIN1

MID_RFIN2

IFAMP_OUT1

IFAMP_OUT2

2 x 5

turns

2
turns

o(meas)

spectrum

analyzer

signal
source

HYBRID

N1/N2 = 5

i(meas)

RMS

voltmeter

Fig.17 Gain measurement in the MID-band of the TDA6508; TDA6509.

>> 50

, symmetrical input.

Hybrid loss = 1 dB.

= V

i(meas)

loss + 6 + 3 = 80 dB

= V

o(meas)

+ 15 dB (transformer ratio N1/N2 and transformer loss).

= 20 log

PAL f

= 36.15 MHz.

------

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, full pagewidth

MDB260

MID_RFIN2

MID_RFIN1

IFAMP_OUT1

Vi(meas)

RMS

voltmeter

spectrum
analyzer

D.U.T.

Vo(meas)

signal
source

HYBRID

Fig.18 Gain measurement in the MID-band of the TDA6508A; TDA6509A.

>> 50

symmetrical input.

Hybrid loss = 1 dB.

= V

i(meas)

loss + 6 + 3 = 80 dB

= V

o(meas)

+ 3.75 dB.

= 20 log

PAL f

= 36.15 MHz.

------

handbook, full pagewidth

unwanted

signal

source

wanted

signal

source

MDB253

D.U.T.

MID_RFIN1

MID_RFIN2

IFAMP_OUT1

IFAMP_OUT2

18 dB

attenuator

N1/N2 = 5

2 x 5

turns

2
turns

FILTER

38.9 MHz

modulation
analyzer

HYBRID

RMS

voltmeter

Vo(meas)

AM = 30%

Fig.19 Cross-modulation measurement in the MID-band of the TDA6508; TDA6509.

= V

o(meas)

+ 15 dB (transformer ratio N1/N2 and transformer loss).

Wanted output signal at picture carrier frequency f

RF(w)

; V

o(w)

= 110 dB

Unwanted output signal at sound sub-carrier frequency f

RF(u)

; AM = 30%; AF = 2 kHz.

Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.

RF(w)

= 154.25 MHz (min.); 447.25 MHz (max.).

RF(u)

= 159.75 MHz (min.); 452.75 MHz (max.).

osc

= 193.15 MHz (min.); 486.15 MHz (max.).

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, full pagewidth

unwanted

signal

source

wanted

signal

source

AM = 30%

MDB254

38.9 MHz

MID_RFIN1

MID_RFIN2

IFAMP_OUT1

HYBRID

18 dB

attenuator

Vo(meas)

RMS

voltmeter

modulation
analyzer

FILTER

D.U.T.

Fig.20 Cross-modulation measurement in the MID-band of the TDA6508A; TDA6509A.

= V

o(meas)

+ 3.75 dB.

Wanted output signal at fpix; V

o(w)

= 100 dB

Unwanted output signal at fsnd; AM = 30%; AF = 2 kHz.

Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.

RF(w)

= 154.25 MHz (min.); 447.25 MHz (max.).

RF(u)

= 159.75 MHz (min.); 452.75 MHz (max.).

osc

= 193.15 MHz (min.); 486.15 MHz (max.).

mdb257

D.U.T.

HIGH_RFIN1

HIGH_RFIN2

IFAMP_OUT1

IFAMP_OUT2

2 x 5

turns

2
turns

o(meas)

spectrum

analyzer

signal
source

HYBRID

N1/N2 = 5

i(meas)

RMS

voltmeter

Fig.21 Gain measurement in the HIGH-band of the TDA6508; TDA6509.

Hybrid loss = 1 dB.

= V

i(meas)

loss = 70 dB

= V

o(meas)

+ 15 dB (transformer ratio N1/N2 and transformer loss).

= 20 log

PAL f

= 36.15 MHz.

------

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, full pagewidth

MDB258

HIGH_RFIN2

HIGH_RFIN1

IFAMP_OUT1

Vi(meas)

RMS

voltmeter

spectrum
analyzer

D.U.T.

Vo(meas)

signal
source

HYBRID

Fig.22 Gain measurement in the HIGH-band of the TDA6508A; TDA6509A.

Hybrid loss = 1 dB.

= V

i(meas)

loss = 70 dB

= V

o(meas)

+ 3.75 dB.

= 20 log

PAL f

= 36.15 MHz.

------

mdb255

D.U.T.

IFAMP_OUT1

IFAMP_OUT2

NOISE

METER

NOISE

SOURCE

2 x 5

turns

2
turns

N1/N2 = 5

HYBRID

HIGH_RFIN1

HIGH_RFIN2

Fig.23 Noise figure measurement in the HIGH-band of the TDA6508; TDA6509.

Hybrid loss = 1 dB.

NF = NF

meas

hybrid loss.

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, full pagewidth

MDB256

HIGH_RFIN1

HIGH_RFIN2

IFAMP_OUT1

D.U.T.

NOISE

SOURCE

NOISE

FIGURE

METER

HYBRID

Fig.24 Noise figure measurement in the HIGH-band of the TDA6508A; 6509A.

Hybrid loss = 1 dB.

NF = NF

meas

hybrid loss.

handbook, full pagewidth

unwanted

signal

source

wanted

signal

source

MDB251

D.U.T.

HIGH_RFIN1

HIGH_RFIN2

IFAMP_OUT1

IFAMP_OUT2

18 dB

attenuator

N1/N2 = 5

2 x 5

turns

2
turns

FILTER

38.9 MHz

modulation
analyzer

HYBRID

RMS

voltmeter

Vo(meas)

AM = 30%

Fig.25 Cross-modulation measurement in the HIGH-band of the TDA6508; TDA6509.

= V

o(meas)

+ 15 dB (transformer ratio N1/N2 and transformer loss).

Wanted output signal at picture carrier frequency f

RF(w)

; V

o(w)

= 110 dB

Unwanted output signal at sound sub-carrier frequency f

RF(u)

; AM = 30%; AF = 2 kHz.

Measuring the level of unwanted signal causing 0.3% AM in the wanted signal.

RF(w)

= 439.25 MHz (min.); 863.25 MHz (max.).

RF(u)

= 444.75 MHz (min.); 868.75 MHz (max.).

osc

= 478.15 MHz (min.); 902.15 MHz (max.).

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

handbook, full pagewidth

unwanted

signal

source

wanted

signal

source

AM = 30%

MDB252

38.9 MHz

HIGH_RFIN1

HIGH_RFIN2

IFAMP_OUT1

HYBRID

18 dB

attenuator

Vo(meas)

RMS

voltmeter

modulation
analyzer

FILTER

D.U.T.

Fig.26 Cross-modulation measurement in the HIGH-band of the TDA6508A; TDA6509A.

= V

o(meas)

+ 3.75 dB.

Wanted output signal at picture carrier frequency f

RF(w)

; V

o(w)

= 100 dB

Unwanted output signal at sound sub-carrier frequency f

RF(u)

; AM = 30%; AF = 2 kHz.

We measure the level of unwanted signal causing 0.3% AM modulation in the wanted signal

RF(w)

= 439.25 MHz (min.); 863.25 MHz (max.).

RF(u)

= 444.75 MHz (min.); 868.75 MHz (max.).

osc

= 478.15 MHz (min.); 902.15 MHz (max.).

2005

Mar

Philips Semiconductors

Product specification

3-band mix

er/oscillator and PLL f

terrestr

ial tuners

TD
A6508; TD

A6508A;

TD
A6509; TD

A6509A

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13.1

Measurement cir

cuit

mdb249

HIGH_RFIN1

HIGH_RFIN2

MID_RFIN1

MID_RFIN2

LOW_RFIN

RF_GND

MIX_OUT1

MIX_OUT2

IFAMP_IN1

IFAMP_IN2

ADC/P4

PLL_GND

IFAMP_OUT1

IFAMP_OUT2/IF_GND

SDA

SCL

(1) 32

(2) 31

(3) 30

(4) 29

(5) 28

(6) 27

(7) 26

(8) 25

(9) 24

(10) 23

(12) 21

(13) 20

(14) 19

(15) 18

(16) 17

(11) 22

1 (32)

2 (31)

3 (30)

4 (29)

5 (28)

6 (27)

7 (26)

8 (25)

9 (24)

10 (23)

12 (21)

13 (20)

14 (19)

15 (18)

16 (17)

11 (22)

TDA6508

TDA6508A
(TDA6509)

(TDA6509A)

XTAL_REF

HIGH_OSCIN2

HIGH_OSCIN1

MID_OSCIN2

LOW_OSCOUT

OSC_GND

LOW_OSCIN

MID_OSCIN1

VCC

C15
4.7 nF

LOW_RFIN

MID_RFIN2

MID_RFIN1

HIGH_RFIN2

HIGH_RFIN1

C27
4.7 nF

C13
4.7 nF

C12

18 pF

C11
18 pF

R16
1 k

R13
1 k

5 V

R14
1 k

R15
1 k

R17
330

R18

330

4.7 k

10 uF

(50 V)

J11

TEST

C9
4.7 nF

C21

4.7 nF

C22

4.7 nF

C29
100 pF

C28
100 pF

R27
33

82 pF

C32

100 pF

C33

100 pF

C34

39 pF

C35

C10

4.7 nF

C26
12 pF

C16

4.7 nF

C31

4.7 nF

R19

R11

R1
33 k

VCC

30 V

C3
10 uF
(50 V)

C2
10 uF
(50 V)

C23

18 pF

4 MHz

J12

1 k

6.8 nF

C17

68 nF

39 k

C18

2.2 nF

39 pF

R20

5.6 k

1.8 pF

C6
1 pF

R26
12

1
2
3
4
5
6

1
2
3
4

Vtune

VCC

IFAMP_OUT
for test purposes only

IFAMP_OUT1

5 V

XTAL_REF

ADC

R12
1 k

BB187

BB179

Fig.27 Measurement circuit for TDA6508; TDA6509; TDA6508A; TDA6509A: PAL application.

The pin numbers in parenthesis refer to the TDA6509 and TDA6509A.

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

15 PACKAGE OUTLINES

UNIT

(1)

(2)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15
0.05

0.95
0.85

0.30
0.19

0.20
0.09

11.1
10.9

6.2
6.0

0.65

8.3
7.9

0.78
0.48

8
0

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75
0.50

SOT487-1

MO-153

99-12-27
03-02-18

0.25

detail X

(A )

2.5

5 mm

scale

TSSOP32: plastic thin shrink small outline package; 32 leads; body width 6.1 mm;
lead pitch 0.65 mm

SOT487-1

max.

1.1

pin 1 index

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

0.5

UNIT

0.2

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

5.1
4.9

3.25
2.95

5.1
4.9

3.25
2.95

3.5

0.30
0.18

0.05
0.00

0.05

0.1

DIMENSIONS (mm are the original dimensions)

SOT617-1

MO-220

- - -

0.5
0.3

0.1

0.05

2.5

5 mm

scale

SOT617-1

HVQFN32: plastic thermal enhanced very thin quad flat package; no leads;
32 terminals; body 5 x 5 x 0.85 mm

(1)

max.

detail X

y1 C

terminal 1
index area

01-08-08
02-10-18

1/2

(1)

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

(1)

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

16 SOLDERING

16.1

Introduction to soldering surface mount
packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

16.2

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 seconds and 200 seconds
depending on heating method.

Typical reflow peak temperatures range from
215

C to 270

C depending on solder paste material. The

top-surface temperature of the packages should
preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free

process)

for all BGA, HTSSON..T and SSOP..T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a

volume

350 mm

so called thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free

process) for packages with a thickness < 2.5 mm and a
volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.

16.3

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250

C or 265

C, depending

on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

16.4

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 seconds to 5 seconds
between 270

C and 320

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

16.5

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

"(LF)BGA Application Note" (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217

C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.

9. Hot bar soldering or manual soldering is suitable for PMFP packages.

PACKAGE

(1)

SOLDERING METHOD

WAVE

REFLOW

(2)

BGA, HTSSON..T

(3)

, LBGA, LFBGA, SQFP, SSOP..T

(3)

, TFBGA,

VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS

not suitable

(4)

suitable

PLCC

(5)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(5)(6)

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

(7)

suitable

CWQCCN..L

(8)

, PMFP

(9)

, WQCCN..L

(8)

not suitable

2005 Mar 25

Philips Semiconductors

Product specification

3-band mixer/oscillator and PLL for
terrestrial tuners

TDA6508; TDA6508A;

TDA6509; TDA6509A

17 DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL

DATA SHEET

STATUS

(1)

PRODUCT

STATUS

(2)(3)

DEFINITION

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

III

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).

18 DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

19 DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status `Production'), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.

SCA76

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

R25/03/pp

Date of release:

2005 Mar 25

Document order number:

9397 750 14909

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA6508TT

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA6508TT