1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

FEATURES

Flexibility in use

Few external components

Low saturation voltage of output stage

Gain can be fixed with external resistors

Standby mode controlled by CMOS compatible levels

Low standby current

No switch-on/switch-off plops

High supply voltage ripple rejection

Protected against electrostatic discharge

Outputs short-circuit safe to ground, V

and across the

load

Thermally protected.

GENERAL DESCRIPTION

The TDA8542TS is a two channel audio power amplifier
for an output power of 2

0.7 W with a 16

load at a 5 V

supply. At a low supply voltage of 3.3 V an output power of
0.6 W with an 8

load can be obtained. The circuit

contains two Bridge-Tied Load (BTL) amplifiers with a
complementary PNP-NPN output stage and standby/mute
logic. The TDA8542TS is available in a SSOP20 package.

APPLICATIONS

Portable consumer products

Personal computers

Motor-driver (servo).

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

2.2

quiescent current

= 5 V

stb

standby current

output power

THD = 10%; R

= 8

; V

= 3.3 V 0.45

0.55

THD = 10%; R

= 16

; V

= 5 V

0.6

0.7

THD

total harmonic distortion

= 0.4 W

0.15

SVRR

supply voltage ripple rejection

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA8542TS

SSOP20

plastic shrink small outline package; 20 leads; body width 4.4 mm

SOT266-1

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

PINNING

SYMBOL

PIN

DESCRIPTION

LGND

ground, left channel

n.c.

not connected

OUTL+

positive loudspeaker terminal,
left channel

MODE

operating mode select (standby,
mute, operating)

SVR

half supply voltage, decoupling
ripple rejection

BTL/SE

BTL loudspeaker or SE
headphone operation

n.c.

not connected

OUTR+

positive loudspeaker terminal,
right channel

n.c.

not connected

RGND

ground, right channel

CCR

supply voltage, right channel

n.c.

not connected

OUTR

negative loudspeaker terminal,
right channel

INR

negative input, right channel

INR+

positive input, right channel

INL+

positive input, left channel

INL

negative input, left channel

OUTL

negative loudspeaker terminal,
left channel

n.c.

not connected

CCL

supply voltage, left channel

Fig.2 Pin configuration.

handbook, halfpage

TDA8542TS

MBK453

LGND

n.c.

OUTL

MODE

SVR

BTL/SE

n.c.

OUTR

n.c.

RGND

VCCL

n.c.

OUTL

INL

INR

OUTR

n.c.

VCCR

FUNCTIONAL DESCRIPTION

The TDA8542TS is a 2

0.7 W BTL audio power amplifier

capable of delivering 2

0.7 W output power to a 16

load at THD = 10% using a 5 V power supply. Using the
MODE pin the device can be switched to standby and
mute condition. The device is protected by an internal
thermal shutdown protection mechanism. The gain can be
set within a range from 6 to 30 dB by external feedback
resistors.

Power amplifier

The power amplifier is a Bridge-Tied Load (BTL) amplifier
with a complementary PNP-NPN output stage.
The voltage loss on the positive supply line is the
saturation voltage of a PNP power transistor, on the

negative side the saturation voltage of a NPN power
transistor. The total voltage loss is <1 V and with a 5 V
supply voltage and with a 16

loudspeaker an output

power of 0.7 W can be delivered.

Mode select pin

The device is in the standby mode (with a very low current
consumption) if the voltage at the MODE pin is
>(V

0.5 V), or if this pin is floating. At a MODE voltage

level of less than 0.5 V the amplifier is fully operational.
In the range between 1.5 V and V

1.5 V the amplifier

is in mute condition. The mute condition is useful to
suppress plop noise at the output caused by charging of
the input capacitor.

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

Headphone connection

A headphone can be connected to the amplifier using two
coupling capacitors for each channel. The common
GND pin of the headphone is connected to the ground of
the amplifier (see Fig.13). In this case the BTL/SE pin must
be either at a logic HIGH level or not connected at all.

The two coupling capacitors can be omitted if it is allowed
to connect the common GND pin of the headphone jack

not to ground, but to a voltage level of

. See Fig.4 for

the application diagram. In this case the BTL/SE pin must
be either at a logic LOW level or connected to ground.
If the BTL/SE pin is at a LOW level, the power amplifier for
the positive loudspeaker terminal is always in mute
condition.

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

QUALITY SPECIFICATION

In accordance with

"SNW-FQ-611-E".

THERMAL CHARACTERISTICS

Note

1. See Section "Thermal design considerations".

Table 1

Maximum ambient temperature at different conditions

Note

1. See Section "Thermal design considerations".

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

operating

0.3

+18

input voltage

0.3

+ 0.3

ORM

repetitive peak output current

stg

storage temperature

non-operating

+150

amb

operating ambient temperature

+85

AC and DC short-circuit safe voltage

tot

total power dissipation

1.12

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air

110

(1)

K/W

(V)

(

)

(W)

CONTINUOUS SINE WAVE DRIVEN

max

(W)

amb(max)

(

3.3

0.65

1.12

(1)

3.3

0.55

0.60

1.2

1.33

(1)

0.70

0.80

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

DC CHARACTERISTICS

= 5 V; T

amb

= 25

C; R

= 8

; V

MODE

= 0 V; measured in test circuit Fig.3; unless otherwise specified.

Notes

1. With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal

to the DC output offset voltage divided by R

2. The DC output voltage with respect to ground is approximately

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

operating

2.2

quiescent current

; note 1

stb

standby current

MODE

= V

DC output voltage

note 2

2.2

OUT+

OUT

differential output voltage offset

IN+

, I

input bias current

500

MODE

input voltage mode select

operating

0.5

mute

1.5

1.5 V

standby

0.5

MODE

input current mode select

0 < V

MODE

< V

BTL/SE

input voltage BTL/SE pin

single-ended

0.6

BTL

BTL/SE

input current BTL/SE pin

BTL/SE

= 0

100

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

AC CHARACTERISTICS

= 5 V; T

amb

= 25

C; R

= 8

; f = 1 kHz; V

MODE

= 0 V; measured in test circuit Fig.3; unless otherwise specified.

Notes

1. Gain of the amplifier is

in test circuit of Fig.3.

2. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a

source impedance of R

= 0

at the input.

3. Supply voltage ripple rejection is measured at the output, with a source impedance of R

= 0

at the input.

The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to
the positive supply rail.

4. Supply voltage ripple rejection is measured at the output, with a source impedance of R

= 0

at the input.

The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS),
which is applied to the positive supply rail.

5. Output voltage in mute position is measured with a 1 V (RMS) input voltage in a bandwidth of 20 kHz, so including

noise.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

output power

at V

= 5 V

THD = 10%; R

= 8

1.2

THD = 10%; R

= 16

0.70

THD = 0.5%; R

= 8

0.9

THD = 0.5%; R

= 16

0.5

at V

= 3.3 V

THD = 10%; R

= 4

0.65

THD = 10%; R

= 8

0.55

THD = 0.5%; R

= 4

0.45

THD = 0.5%; R

= 8

0.38

THD

total harmonic distortion

= 0.4 W

0.15

0.3

v(cl)

closed-loop voltage gain

note 1

i(dif)

differential input impedance

100

n(o)

noise output voltage

note 2

100

SVRR

supply voltage ripple rejection

note 3

note 4

o(mute)

output voltage in mute condition

note 5

200

channel separation

R2
R1

-------

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

TEST AND APPLICATION INFORMATION

Test conditions

Because the application can be either Bridge-Tied Load
(BTL) or Single-Ended (SE), the curves of each application
are shown separately.

The thermal resistance = 110 K/W for the SSOP20; the
maximum sine wave power dissipation for T

amb

= 25

C is:

For T

amb

= 60

C the maximum total power dissipation is:

Thermal design considerations

The `measured' thermal resistance of the IC package is
highly dependent on the configuration and size of the
application board. Data may not be comparable between
different semiconductor manufacturers because the
application boards and test methods are not (yet)
standardized. Also, the thermal performance of packages
for a specific application may be different than presented
here, because the configuration of the application boards
(copper area) may be different. Philips Semiconductors
uses FR-4 type application boards with 1 oz copper traces
with solder coating.

The SSOP package has improved thermal conductivity
which reduces the thermal resistance. Using a practical
PCB layout (see Fig.22) with wider copper tracks to the
corner pins and just under the IC, the thermal resistance
from junction to ambient can be reduced to approximately
80 K/W. For T

amb

= 60

C the maximum total power

dissipation for this PCB layout is:

BTL application

amb

= 25

C if not specially mentioned, V

= 5 V,

f = 1 kHz, R

= 8

, G

= 20 dB, audio band-pass

22 Hz to 22 kHz.

The BTL application diagram is illustrated in Fig.3.

The quiescent current has been measured without any
load impedance. The total harmonic distortion as a

150

110

----------------------

1.14 W

150

110

----------------------

0.82 W

150

----------------------

1.12 W

function of frequency was measured with a low-pass filter
of 80 kHz. The value of capacitor C3 influences the
behaviour of the SVRR at low frequencies, increasing the
value of C3 increases the performance of the SVRR.
The figure of the mode select voltage (V

) as a function

of the supply voltage shows three areas; operating, mute
and standby. It shows, that the DC-switching levels of the
mute and standby respectively depends on the supply
voltage level.

SE application

amb

= 25

C if not specially mentioned, V

= 7.5 V,

f = 1 kHz, R

= 4

, G

= 20 dB, audio band-pass

22 Hz to 22 kHz.

The SE application diagram is illustrated in Fig.14.

If the BTL/SE pin (pin 6) is connected to ground, the
positive outputs (pins 3 and 8) will be in mute condition
with a DC level of

. When a headphone is used

) the SE headphone application can be used

without output coupling capacitors; load between negative
output and one of the positive outputs (e.g. pin 3) as
common pin. The channel separation will be less in
comparison with the application using a coupling capacitor
connected to ground.

Increasing the value of electrolytic capacitor C3 will result
in a better channel separation. Because the positive output
is not designed for high output current (2

) at low load

impedance (

), the SE application with output

capacitors connected to ground is advised. The capacitor
value of C4/C5 in combination with the load impedance
determines the low frequency behaviour. The THD as a
function of frequency was measured using a low-pass filter
of 80 kHz. The value of capacitor C3 influences the
behaviour of the SVRR at low frequencies, increasing the
value of C3 increases the performance of the SVRR.

General remark

The frequency characteristic can be adapted by
connecting a small capacitor across the feedback resistor.
To improve the immunity of HF radiation in radio circuit
applications, a small capacitor can be connected in
parallel with the feedback resistor (56 k

); this creates a

low-pass filter.

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

SE APPLICATION

handbook, full pagewidth

MBK444

VCC

ViL

OUTL

INL

OUTL

100 nF

470

100

TDA8542TS

OUTR

GND

RL = 8

INR

SVR

MODE

BTL/SE

OUTR

10 k

100 k

ViR

Fig.14 Single-ended application.

Pins 2, 7, 9, 12 and 19 are not connected.

Gain left

R2
R1

--------

Gain right

R4
R3

--------

Fig.15 THD as a function of P

f = 1 kHz, G

= 20 dB.

(1) V

= 7.5 V, R

= 4

(2) V

= 9 V, R

= 8

(3) V

= 12 V, R

= 16

handbook, halfpage

Po (W)

THD

(%)

MGD899

(1)

(2)

(3)

Fig.16 THD as a function of frequency.

= 0.5 W, G

= 20 dB.

(1) V

= 7.5 V, R

= 4

(2) V

= 9 V, R

= 8

(3) V

= 12 V, R

= 16

handbook, halfpage

THD

(%)

f (Hz)

MGD900

(1)

(2)

(3)

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

Fig.17 Channel separation as a function of

frequency.

= 1 V, G

= 20 dB.

(1) V

= 5 V, R

= 32

, to buffer.

(2) V

= 7.5 V, R

= 4

(3) V

= 9 V, R

= 8

(4) V

= 12 V, R

= 16

(5) V

= 5 V, R

= 32

handbook, halfpage

100

MGD901

(2)

f (Hz)

(4)
(5)

(1)

(3)

(dB)

Fig.18 SVRR as a function of frequency.

= 0

, V

ripple

= 100 mV.

(1) G

= 24 dB.

(2) G

= 20 dB.

(3) G

= 0 dB.

handbook, halfpage

MGD902

SVRR

(dB)

f (Hz)

(1)

(2)

(3)

Fig.19 P

as a function of V

THD = 10%.

(1) R

= 4

(2) R

= 8

(3) R

= 16

handbook, halfpage

(1)

(2)

(3)

(W)

VCC (V)

1.6

1.2

0.8

0.4

MBK451

Fig.20 Worst case power dissipation as a function

of V

THD = 10%.

(1) R

= 4

(2) R

= 8

(3) R

= 16

handbook, halfpage

VCC (V)

(1)

(2)

(3)

MBK452

(W)

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SSOP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1998 Mar 25

Philips Semiconductors

Product specification

0.7 W BTL audio amplifier

TDA8542TS

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.8

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA56

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Printed in The Netherlands

545102/25/02/pp20

Date of release: 1998 Mar 25

Document order number:

9397 750 03351

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8542TS

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8542TS