ChipFind - документация

Электронный компонент: TDA8754H

Скачать:  PDF   ZIP
DATA SHEET
Objective specification
File under Integrated Circuits, IC02
1998 Sep 30
INTEGRATED CIRCUITS
TDA8754
Triple high speed ADC for LCD
drive
1998 Sep 30
2
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
TDA8754
FEATURES
Triple 8-bit Analog-to-Digital Converter (ADC)
Sampling rate up to 170 MHz
IC controllable via a serial interface, which can be either
I
2
C-bus or 3-wire, selected via a TTL input pin
IC analog input 0.5 to 1.1 V (peak-to-peak value) to
have full-scale ADC input
Clamps for programming a clamp level through a
clamping code between
-
63 and +64 by steps of 1 LSB
Controllable gain stages: gain controlled independently
on the 3 channels via the serial interface to have a
full-scale resolution to 1%
Low gain variation at different temperatures
Analog bandwidth of 400 MHz
Controllable PLL via the serial interface generates the
ADC clock. It can be locked on line frequencies from
15 kHz up to 280 kHz.
Integrated PLL divider
Integrated clamp pulse and H and V LCD control pulses
generation (independently adjustable in position and
duration). Also a data enable signal can be generated,
independently adjustable in position and duration with
respect to HSYNC.
The pixel clock is available at half the clock frequency
Programmable phase clock adjustment cells
Internal voltage regulators
TTL compatible digital inputs
3.3 V CMOS compatible digital outputs
Outputs: one port output up to 140 MHz or 2-port
demultiplexed outputs on the full speed range.
Operating mode selectable through the serial interface.
Chip enable: high-impedance ADC output
Power-down mode.
GENERAL DESCRIPTION
The TDA8754 is a triple 8-bit ADC with controllable gain
and clamps for the digitizing of large bandwidth
R, G, B signals. Clamp level, gain, and all the other
settings are controlled via a serial interface (either I
2
C-bus
or 3-wire, selected through a logic input). The gain is
optimized for stability versus temperature variations.
The IC also includes a PLL that generates the ADC clock
which can be locked to the horizontal line frequency.
The PLL jitter is minimized for high resolution PC graphics
applications. An external clock can also be used to clock
the ADC.
The clamp pulse is generated on-chip, it can be adjusted
in position (with respect to HSYNC) and duration through
the serial interface.
The horizontal and vertical control pulses for the LCD can
be adjusted in duration through the serial interface. Also a
data enable signal can be generated, independently
adjustable in position (with respect to HSYNC) and
duration through the serial interface.
Outputs: one port output up to 140 MHz or demultiplexed
2-port outputs on the full speed range. Operating mode
selectable through the serial interface.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8754H
LQFP144
plastic low profile quad flat package; 144 leads; body 20
20
1.4 mm
SOT486-1
1998 Sep 30
3
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
TDA8754
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CCA
analog supply voltage for
R, G, B channels
4.75
5.0
5.25
V
V
DD
logic supply voltage for I
2
C-bus and
3-wire interface
3.0
5.0
5.25
V
V
CCD
digital supply voltage
4.75
5.0
5.25
V
V
CC(O)
output stages supply voltage for
R, G, B channels
3.0
3.3
3.6
V
V
CCA(PLL)
analog PLL supply voltage
4.75
5.0
5.25
V
V
CC(O)(PLL)
output PLL supply voltage
4.75
5.0
5.25
V
I
CCA
analog supply current for
R, G, B channels
-
tbf
-
mA
I
DD
logic supply current for I
2
C-bus and
3-wire interface
-
tbf
-
mA
I
CCD
digital supply current
-
tbf
-
mA
I
CC(O)
output stages supply current for
R, G, B channels
-
tbf
-
mA
I
CCA(PLL)
analog PLL supply current
-
tbf
-
mA
I
CC(O)(PLL)
output PLL supply current
-
tbf
-
mA
INL
DC integral non-linearity
-
1
1.5
LSB
DNL
DC differential non-linearity
-
0.5
0.8
LSB
G
amp
gain stability versus temperature
V
ref
= 2.5 V with
100 ppm/K variation
-
-
200
ppm/K
t
set
setting time of the block ADC + AGC
input signal setting time
<1 ns; setting to 1%;
f
i
= 85 MHz
-
2.5
3.5
ns
f
clk(max)
maximum conversion rate
170
-
-
MHz
f
ref
PLL reference clock frequency
15
-
120
kHz
f
PLL
output clock frequency
12
-
170
MHz
j
PLL(rms)
maximum PLL phase jitter
(RMS value)
-
0.2
-
ns
D/D
PLL
PLL divider ratio
512
-
4095
P
tot
total power consumption
f
clk
= 170 MHz; ramp input
-
tbf
1.2
W
1998 Sep 30
4
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
TDA8754
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
GA0 to GA7
and GOR
GBOT
GB0 to GB7
RA0 to RA7
and ROR
RB0 to RB7
OEN
RED CHANNEL
BA0 to BA7
and BOR
BBOT
BCLP
BB0 to BB7
CKADCO
CKBO
CKAO
DEN
CKEXT
SEN
BDEC
BIN
BGAINC
GGAINC
RGAINC
SCL
SDA
I
2
C-3W
GDEC
GIN
RIN
RBOT
RDEC
Vref
CZ
CP
HSYNCO
VSYNCO
FCE045
REGULATOR
MUX
OUTPUTS
CLAMP
ADC
SERIAL
INTERFACE
I
2
C-BUS
AND 3-WIRE
PLL
CLP
CLP
DEC1
I
2
C:1-bit
(Hlevel)
HSYNC
I
2
C:1-bit
(Hlevel) VSYNC
DEC2
PWOFF
CKA/2, CKA/2
GREEN CHANNEL
TDA8754
BLUE CHANNEL
8
9
8
9
8
9
1998 Sep 30
5
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
TDA8754
PACKAGE OUTLINE
UNIT
A
1
A
2
A
3
b
p
c
E
(1)
e
H
E
L
L
p
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
0.50
22.15
21.85
1.40
1.10
7
0
o
o
0.1
0.2
0.1
1.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT486-1
97-08-04
D
(1)
(1)
(1)
20.1
19.9
H
D
22.15
21.85
E
Z
1.40
1.10
D
0
5
10 mm
scale
b
p
e
E
A
1
A
L
p
detail X
L
(A )
3
B
c
b
p
E
H
A
2
D
H
v
M
B
D
Z D
A
Z E
e
v
M
A
X
y
w
M
w
M
A
max.
1.6
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
SOT486-1
108
109
pin 1 index
73
72
37
1
144
36
1998 Sep 30
6
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
TDA8754
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all LQFP
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 50 and 300 seconds depending on heating
method. Typical reflow peak temperatures range from
215 to 250
C.
Wave soldering
Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
CAUTION
Wave soldering is NOT applicable for all LQFP
packages with a pitch (e) equal or less than 0.5 mm.
If wave soldering cannot be avoided, for LQFP
packages with a pitch (e) larger than 0.5 mm, the
following conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1998 Sep 30
7
Philips Semiconductors
Objective specification
Triple high speed ADC for LCD drive
TDA8754
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
2
C COMPONENTS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I
2
C components conveys a license under the Philips' I
2
C patent to use the
components in the I
2
C system provided the system conforms to the I
2
C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010,
Fax. +43 160 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 0044
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Printed in The Netherlands
545104/750/01/pp8
Date of release: 1998 Sep 30
Document order number:
9397 750 04134