Document Outline
- FEATURES
- APPLICATIONS
- GENERAL DESCRIPTION
- ORDERING INFORMATION
- QUICK REFERENCE DATA
- BLOCK DIAGRAM
- PINNING
- LIMITING VALUES
- HANDLING
- THERMAL CHARACTERISTICS
- CHARACTERISTICS
- INTERNAL PIN CONFIGURATIONS
- APPLICATION INFORMATION
- PACKAGE OUTLINES
- SOLDERING
- DATA SHEET STATUS
- DEFINITIONS
- DISCLAIMERS
DATA SHEET
Product specification
File under Integrated Circuits, IC11
2000 Jul 03
INTEGRATED CIRCUITS
TDA8764A
10-bit high-speed low-power ADC
2000 Jul 03
2
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
FEATURES
10-bit resolution (binary or gray code)
Sampling rate up to 60 MHz
DC sampling allowed
One clock cycle conversion only
High signal-to-noise ratio over a large analog input
frequency range (9.3 effective bits at 5 MHz full-scale
input at f
clk
= 60 MHz)
No missing codes guaranteed
In Range (IR) CMOS output
TTL and CMOS levels compatible digital inputs
2.7 to 3.6 V CMOS digital outputs
Low-level AC clock input signal allowed
Power dissipation only 312 mW
Low analog input capacitance, no buffer amplifier
required
No sample-and-hold circuit required.
APPLICATIONS
High-speed analog-to-digital conversion for:
Video data digitizing
Radar pulse analysis
High energy physics research
Transient signal analysis
modulators
Medical imaging.
GENERAL DESCRIPTION
The TDA8764A is a 10-bit high-speed low-power
Analog-to-Digital Converter (ADC) for professional video
and other applications. It converts the analog input signal
into 10-bit binary or gray coded digital words at a maximum
sampling rate of 60 MHz. All digital inputs and outputs are
TTL and CMOS compatible, although a low-level sine
wave clock input signal is allowed.
The device requires an external source to drive its
reference ladder.
ORDERING INFORMATION
QUICK REFERENCE DATA
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8764ATS/6
SSOP28
plastic shrink small outline package; 28 leads; body width 5.3 mm
SOT341-1
TDA8764AHL/6
LQFP32
plastic low profile quad flat package; 32 leads; body 5
5
1.4 mm
SOT401-1
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CCA
analog supply voltage
4.75
5.0
5.25
V
V
CCD
digital supply voltage
4.75
5.0
5.25
V
V
CCO
output stages supply voltage
2.7
3.3
3.6
V
I
CCA
analog supply current
-
29
37
mA
I
CCD
digital supply current
-
33
40
mA
I
CCO
output stages supply current
f
clk
= 60 MHz; ramp input
-
0.5
2.0
mA
INL
integral non-linearity
f
clk
= 60 MHz; ramp input
-
0.8
2
LSB
DNL
differential non-linearity
f
clk
= 60 MHz; ramp input
-
0.35
0.9
LSB
f
clk(max)
maximum clock frequency
TDA8764ATS and
TDA8764AHL
60
-
-
MHz
P
tot
total power dissipation
f
clk
= 60 MHz; ramp input
-
312
411
mW
2000 Jul 03
3
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
BLOCK DIAGRAM
handbook, full pagewidth
DGND
n.c.
RLAD
VRB
VRM
VRT
VI
VCCD
VCCA
D4
D5
D6
D7
D8
D3
D2
D1
D0
D9
IN-RANGE LATCH
CMOS
OUTPUTS
LATCHES
ANALOG-TO-DIGITAL
CONVERTER
CLOCK DRIVER
FCE253
CMOS
OUTPUT
CLK
GRAY
TC
OE
TDA8764A
VCCO
AGND
9 (15)
3 (7)
1 (5)
10
(16)
15 (21)
11 (17)
OGND
analog
voltage input
data outputs
LSB
MSB
IR output
7 (13)
6 (12)
4 (8)
12 (18)
5, 27, 28
(9, 1, 3, 4, 10, 11, 32)
14 (20)
(2) 26
(19) 13
(22) 16
(23) 17
(24) 18
(25) 19
(26) 20
(27) 21
(28) 22
(29) 23
(30) 24
(31) 25
(6) 2
8 (14)
Fig.1 Block diagram.
The pin numbers given in parenthesis refer to the TDA8764AHL.
2000 Jul 03
4
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
PINNING
SYMBOL
PIN
DESCRIPTION
TDA8764ATS
TDA8764AHL
CLK
1
5
clock input
TC
2
6
twos complement input (active LOW)
V
CCA
3
7
analog supply voltage (5 V)
AGND
4
8
analog ground
n.c.
5
9
not connected
V
RB
6
12
reference voltage BOTTOM input
V
RM
7
13
reference voltage MIDDLE input
V
I
8
14
analog input voltage
V
RT
9
15
reference voltage TOP input
OE
10
16
output enable input (active LOW)
V
CCD
11
17
digital supply voltage (5 V)
DGND
12
18
digital ground
V
CCO
13
19
supply voltage for output stages (2.7 to 3.6 V)
OGND
14
20
output ground
GRAY
15
21
gray code input (active HIGH)
D0
16
22
data output; bit 0 (LSB)
D1
17
23
data output; bit 1
D2
18
24
data output; bit 2
D3
19
25
data output; bit 3
D4
20
26
data output; bit 4
D5
21
27
data output; bit 5
D6
22
28
data output; bit 6
D7
23
29
data output; bit 7
D8
24
30
data output; bit 8
D9
25
31
data output; bit 9 (MSB)
IR
26
2
in range data output
n.c.
27
1
not connected
n.c.
28
3
not connected
n.c.
-
4
not connected
n.c.
-
10
not connected
n.c.
-
11
not connected
n.c.
-
32
not connected
2000 Jul 03
5
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
handbook, halfpage
1
2
3
4
5
6
7
8
9
10
11
12
13
28
27
26
25
24
23
22
21
20
19
18
17
16
15
14
CLK
TC
CCA
AGND
n.c.
n.c.
n.c.
RB
RM
I
RT
OE
CCD
DGND
CCO
OGND
IR
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
GRAY
V
V
V
V
V
V
V
TDA8764ATS
FCE254
Fig.2 Pin configuration (SSOP28).
handbook, full pagewidth
TDA8764AHL
FCE255
1
2
3
4
5
6
7
8
24
23
22
21
20
19
18
17
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
AGND
IR
V
CLK
TC
CCA
DGND
VCCO
OGND
GRAY
n.c.
n.c.
n.c.
D2
D1
D0
n.c.
D9
D8
D7
D6
D5
D4
D3
n.c.
OE
n.c.
RB
V
I
V
RT
V
VCCD
RM
V
n.c.
Fig.3 Pin configuration (LQFP32).
2000 Jul 03
6
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. The supply voltages V
CCA
, V
CCD
and V
CCO
may have any value between
-
0.3 and +7.0 V provided that the supply
voltage differences
V
CC
are respected.
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
CCA
analog supply voltage
note 1
-
0.3
+7.0
V
V
CCD
digital supply voltage
note 1
-
0.3
+7.0
V
V
CCO
output stages supply voltage
note 1
-
0.3
+7.0
V
V
CC
supply voltage difference between
V
CCA
-
V
CCD
-
1.0
+1.0
V
V
CCA
-
V
CCO
-
1.0
+4.0
V
V
CCD
-
V
CCO
-
1.0
+4.0
V
V
I
input voltage
referenced to AGND
-
0.3
+7.0
V
V
i(sw)(p-p)
AC input voltage for switching (peak-to-peak value) referenced to DGND
-
V
CCD
V
I
O
output current
-
10
mA
T
stg
storage temperature
-
55
+150
C
T
amb
ambient temperature
-
40
+85
C
T
j
junction temperature
-
150
C
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
SSOP28
110
K/W
LQFP32
90
K/W
2000 Jul 03
7
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
CHARACTERISTICS
V
CCA
= 4.75 to 5.25 V; V
CCD
= 4.75 to 5.25 V; V
CCO
= 2.7 to 3.6 V; AGND and DGND shorted together;
T
amb
= 0 to 70
C; typical values measured at V
CCA
= V
CCD
= 5 V; V
CCO
= 3.3 V; V
RB
= 1.3 V; V
RT
= 3.7 V; C
L
= 10 pF
and T
amb
= 25
C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
V
CCA
analog supply voltage
4.75
5.0
5.25
V
V
CCD
digital supply voltage
4.75
5.0
5.25
V
V
CCO
output stages supply voltage
2.7
3.3
3.6
V
V
CC
supply voltage difference
between
V
CCA
-
V
CCD
-
0.20
-
+
0.20
V
V
CCA
-
V
CCO
-
0.20
-
+2.55
V
V
CCD
-
V
CCO
-
0.20
-
+2.55
V
I
CCA
analog supply current
-
29
37
mA
I
CCD
digital supply current
-
33
40
mA
I
CCO
output stages supply current
f
clk
= 60 MHz; ramp input
-
0.5
2.0
mA
Inputs
P
IN
CLK (
REFERENCED TO
DGND); note 1
V
IL
LOW-level input voltage
0
-
0.8
V
V
IH
HIGH-level input voltage
2
-
V
CCD
V
I
IL
LOW-level input current
V
CLK
= 0.8 V
-
1
0
+1
A
I
IH
HIGH-level input current
V
CLK
= 2 V
-
2
10
A
C
i
input capacitance
-
2
-
pF
P
INS
OE; TC
AND
GRAY (
REFERENCED TO
DGND); see Tables 3 and 4
V
IL
LOW-level input voltage
0
-
0.8
V
V
IH
HIGH-level input voltage
2
-
V
CCD
V
I
IL
LOW-level input current
V
IL
= 0.8 V
-
1
-
-
A
I
IH
HIGH-level input current
V
IH
= 2 V
-
-
1
A
P
IN
V
I
(
ANALOG INPUT VOLTAGE REFERENCED TO
AGND)
I
IL
LOW-level input current
V
I
= V
RB
= 1.3 V
-
0
-
A
I
IH
HIGH-level input current
V
I
= V
RT
= 3.7 V
-
55
-
A
Y
i
input admittance
f
i
= 5 MHz; note 2
R
i
input resistance
-
45
-
k
C
i
input capacitance
3
5
7
pF
2000 Jul 03
8
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
Reference voltages for the resistor ladder; see Table 1
V
RB
reference voltage BOTTOM
1.2
1.3
2.2
V
V
RT
reference voltage TOP
3.4
3.7
V
CCA
-
0.8
V
V
diff(ref)
differential reference voltage
V
RT
-
V
RB
2.2
2.4
3.2
V
I
ref
reference current
V
diff
= 2.4 V
-
17.6
-
mA
R
LAD
resistor ladder
-
136
-
TC
RLAD
temperature coefficient of the
resistor ladder
-
1860
-
ppm
-
253
-
m
/K
V
offset(B)
offset voltage BOTTOM
V
diff
= 2.4 V; note 3
-
200
-
mV
V
offset(T)
offset voltage TOP
V
diff
= 2.4 V; note 3
-
190
-
mV
V
I(p-p)
analog input voltage
(peak-to-peak value)
V
diff
= 2.4 V; note 4
1.95
2.01
2.10
V
Outputs
P
INS
D9
TO
D0
AND
IR (
REFERENCED TO
OGND)
V
OL
LOW-level output voltage
I
OL
= 1 mA
0
-
0.5
V
V
OH
HIGH-level output voltage
I
OH
=
-
1 mA
V
CCO
-
0.5
-
V
CCO
V
I
OZ
output current in 3-state mode
0.5 V < V
O
< V
CCO
-
20
-
+20
A
Switching characteristics
P
IN
CLK; see Fig.5; note 1
f
clk(max)
maximum clock frequency
60
-
-
MHz
t
CPH
clock pulse width HIGH
T
amb
= 25
C
7.0
-
-
ns
t
CPL
clock pulse width LOW
T
amb
= 25
C
3.5
-
-
ns
Analog signal processing
L
INEARITY
INL
integral non-linearity
f
clk
= 60 MHz; ramp input
-
0.8
2
LSB
DNL
differential non-linearity
f
clk
= 60 MHz; ramp input;
no missing code
-
0.35
0.9
LSB
E
offset
offset error
middle code
-
1
-
LSB
E
G
gain error (from device to device) note 5
-
0.5
-
%
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2000 Jul 03
9
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
B
ANDWIDTH
(f
CLK
= 60 MH
Z
)
B
analog bandwidth
full-scale sine wave;
note 6
-
30
-
MHz
75% full-scale sine wave;
note 6
-
45
-
MHz
small signal at mid-scale;
V
I
=
10 LSB at
code 512; note 6
-
700
-
MHz
t
stLH
analog input settling time
LOW-to-HIGH
full-scale square wave;
see Fig.7; note 7
-
5
-
ns
t
stHL
analog input settling time
HIGH-to-LOW
full-scale square wave;
see Fig.7; note 7
-
5
-
ns
H
ARMONICS
(f
CLK
= 60 MH
Z
)
H
all(FS)
harmonics (full-scale);
all components
f
i
= 5 MHz
second harmonic
-
-
68
-
dB
third harmonic
-
-
67
-
dB
SFDR
spurious free dynamic range
f
i
= 5 MHz
-
72
-
dB
THD
total harmonic distortion
f
i
= 5 MHz
-
-
64
-
dB
f
i
= 15 MHz
-
-
57
-
dB
S
IGNAL
-
TO
-
NOISE RATIO
; note 8
SNR
FS
signal-to-noise ratio (full-scale)
without harmonics;
f
clk
= 60 MHz; f
i
= 5 MHz
-
58
-
dB
without harmonics;
f
clk
= 60 MHz; f
i
= 15 MHz
53
57
-
dB
E
FFECTIVE BITS
; note 8
EB
effective bits
f
clk
= 60 MHz
f
i
= 5 MHz
-
9.3
-
bits
f
i
= 10 MHz
-
8.9
-
bits
f
i
= 15 MHz
-
8.8
-
bits
f
i
= 20 MHz
-
8.6
-
bits
T
WO
-
TONE
; note 9
TTID
two-tone intermodulation
distortion
f
clk
= 60 MHz
-
-
67
-
dB
B
IT ERROR RATE
BER
bit error rate
f
clk
= 60 MHz; f
i
= 5 MHz;
V
I
=
16 LSB at code 512
-
10
-
13
-
times/
sample
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
2000 Jul 03
10
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
Notes
1. The rise and fall times of the clock signal must not be less than 0.5 ns.
2. The input admittance is
3. Analog input voltages producing code 0 up to and including code 1023:
a) V
offset(B)
(offset voltage BOTTOM) is the difference between the analog input which produces data equal to 00
and the reference voltage BOTTOM (V
RB
) at T
amb
= 25
C.
b) V
offset(T)
(offset voltage TOP) is the difference between V
RT
(reference voltage TOP) and the analog input which
produces data outputs equal to code 1023 at T
amb
= 25
C.
4. In order to ensure the optimum linearity performance of such converter architecture the lower and upper extremities
of the converter reference resistor ladder (corresponding to output codes 0 and 1023 respectively) are connected to
pins V
RB
and V
RT
via offset resistors R
OB
and R
OT
as shown in Fig.4.
a) The current flowing into the resistor ladder is
and the full-scale input range at the converter,
to cover code 0 to 1023, is
b) Since R
L
, R
OB
and R
OT
have similar behaviour with respect to process and temperature variation, the ratio
will be kept reasonably constant from device to device. Consequently variation of the output
codes at a given input voltage depends mainly on the difference V
RT
-
V
RB
and its variation with temperature and
supply voltage. When several ADCs are connected in parallel and fed with the same reference source, the
matching between each of them is then optimized.
5.
6. The analog bandwidth is defined as the maximum input sine wave frequency which can be applied to the device.
No glitches greater than 2 LSBs, nor any significant attenuation are observed in the reconstructed signal.
Timing (f
clk
= 60 MHz; C
L
= 10 pF); see Fig.5 and note 10
t
ds
sampling delay time
-
0.7
2
ns
t
h
output hold time
4
-
-
ns
t
d
output delay time TDA8764ATS
V
CCO
= 2.7 V
-
10
14
ns
V
CCO
= 3.3 V
-
9
13
ns
t
d
output delay time TDA8764AHL
V
CCO
= 2.7 V
-
13
17
ns
V
CCO
= 3.3 V
-
12
16
ns
C
L
digital output load capacitance
-
-
10
pF
SR
slew rate
V
CCO
= 2.7 V
0.2
0.3
-
V/ns
3-state output delay times (f
clk
= 60 MHz); see Fig.6
t
dZH
enable HIGH
V
CCO
= 3.3 V
-
16
20
ns
t
dZL
enable LOW
V
CCO
= 3.3 V
-
30
34
ns
t
dHZ
disable HIGH
V
CCO
= 3.3 V
-
25
30
ns
t
dLZ
disable LOW
V
CCO
= 3.3 V
-
23
27
ns
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Y
i
1
R
i
-----
j
Ci
+
=
I
L
V
RT
V
RB
R
OB
R
L
R
OT
+
+
------------------------------------------
=
V
I
R
L
I
L
R
L
R
OB
R
L
R
OT
+
+
------------------------------------------
=
=
V
(
RT
V
RB
)
0.
8375
V
(
RT
V
RB
)
=
R
L
R
OB
R
L
R
OT
+
+
------------------------------------------
E
G
V
1023
V
0
(
)
V
i(p-p)
V
i(p-p)
----------------------------------------------------
100
=
2000 Jul 03
11
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
7. The analog input settling time is the minimum time required for the input signal to be stabilized after a sharp full-scale
input (square wave signal) in order to sample the signal and obtain correct output data.
8. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 8K acquisition points per equivalent
fundamental period. The calculation takes into account all harmonics and noise up to half of the clock frequency
(Nyquist frequency). Conversion to signal-to-noise ratio: S/N = EB
6.02 + 1.76 dB.
9. Intermodulation measured relative to either tone with analog input frequencies of 4.5 and 4.3 MHz. The two input
signals have the same amplitude and the total amplitude of both signals provides full-scale to the converter.
10. Output data acquisition: the output data is available after the maximum delay time of t
d
. It is recommended to have
the lowest possible output load. These parameters are guaranteed by characterization and not by production test.
handbook, halfpage
RLAD
ROT
VRT
VRM
VRB
ROB
code 1023
code 0
FCE256
IL
RL
Fig.4 Explanation of note 4.
2000 Jul 03
12
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
Table 1
Output coding and input voltage (typical values; referenced to AGND; V
RB
= 1.3 V; V
RT
= 3.7 V; binary/gray
codes
Table 2
Output coding and input voltage (typical values; referenced to AGND; binary/twos complement codes
Table 3
TC mode selection
Table 4
Gray mode selection
STEP
V
I
IR
BINARY OUTPUT BITS
GRAY OUTPUT BITS
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
U/F
<1.5
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1.5
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
:
1
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
1
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
1022
:
1
1
1
1
1
1
1
1
1
1
0
1
0
0
0
0
0
0
0
0
1
1023
3.51
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
O/F
>3.51
0
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
STEP
V
I
IR
BINARY OUTPUT BITS
TWOS COMPLEMENT OUTPUT BITS
D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0
U/F
<1.5
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1.5
1
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
1
:
1
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
1
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
1022
:
1
1
1
1
1
1
1
1
1
1
0
0
1
1
1
1
1
1
1
1
0
1023
3.51
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
O/F
>3.51
0
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
TC
OE
D9 to D0
IR
X
1
high-impedance
high-impedance
0
0
active; twos complement
active
1
0
active; binary
active
GRAY
OE
D9 to D0
IR
X
1
high-impedance
high-impedance
0
0
active; binary
active
1
0
active; gray
active
2000 Jul 03
13
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
handbook, full pagewidth
ds
t
sample N + 1
sample N
CLK
FCE257
sample N + 2
VIL
50%
VIH
LOW
50%
HIGH
V
l
DATA
D0 to D9
t d
t h
CPH
t
CPL
t
DATA
N + 1
DATA
N
DATA
N - 1
DATA
N - 2
Fig.5 Timing diagram.
handbook, full pagewidth
50%
50%
50%
10%
90%
LOW
LOW
HIGH
HIGH
OE
tdZH
tdZL
tdHZ
VCCD
output
data LOW
output
data HIGH
tdLZ
TDA8764A
3.3 k
S1
OE
VCCD
10 pF
FCE258
tdLZ
TEST
S1
tdZL
tdHZ
tdZH
VCCD
VCCD
DGND
DGND
Fig.6 Timing diagram and test conditions of 3-state output delay time.
f
OE
= 100 kHz.
Fig.6 Timing diagram and test conditions of 3-state output delay time.
2000 Jul 03
14
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
handbook, full pagewidth
FCE259
50%
stLH
t
2 ns
code 0
code 1023
I
50%
0.5 ns
50%
2 ns
stHL
t
50%
0.5 ns
CLK
V
Fig.7 Analog input settling-time diagram.
2000 Jul 03
15
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
INTERNAL PIN CONFIGURATIONS
handbook, halfpage
FCE260
VCCO
OGND
D9 to D0
IR
Fig.8 CMOS data and in range outputs.
handbook, halfpage
FCE261
AGND
V CCA
V I
Fig.9 Analog input.
handbook, halfpage
FCE262
VCCO
OGND
OE
TC
GRAY
Fig.10 OE, GRAY and TC inputs.
handbook, halfpage
R
FCE263
VRB
VRM
VCCA
AGND
VRT
LAD
Fig.11 V
RB
, V
RM
and V
RT
inputs.
2000 Jul 03
16
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
handbook, halfpage
1.5V
VCCD
DGND
CLK
FCE264
Fig.12 CLK input.
2000 Jul 03
17
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
APPLICATION INFORMATION
handbook, halfpage
28
27
26
25
24
23
22
21
20
19
18
17
TDA8764ATS
VCCO
D3
D4
D5
D6
D7
D8
D9
D2
D1
D0
GRAY
VCCD
VCCA
1
2
3
4
5
6
7
8
9
10
11
12
CLK
AGND
n.c.
n.c.
n.c.
VRB
VRM
VRT
FCE265
16
15
13
14
100 nF
100 nF
100 nF
DGND
OGND
IR
OE
TC
AGND
AGND
AGND
100 nF
V I
(1)
(1)
(1)
100 nF
100 nF
(2)
(3)
(2)
(2)
33
The analog and digital supplies should be separated and well decoupled.
An application note is available and describes the design and the realization of a demoboard that uses TDA8764ATS with an application environment.
(1) V
RB
, V
RM
and V
RT
are decoupled to AGND.
(2) Decoupling capacitor for supplies must be placed close to the device.
(3) This resistor is mandatory (33
is its minimum value) and must be near the clock source.
Fig.13 Application diagram (SSOP28).
2000 Jul 03
18
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
handbook, full pagewidth
TDA8764AHL
FCE266
1
2
3
4
24
23
22
21
20
19
18
17
9
D2
IR
V
CLK
CCA
VCCO
GRAY
AGND
D1
D0
5
6
7
8
10
VRB
11
VRM
12
13
14
VI
15
VRT
16
OE
n.c.
(1)
n.c.
n.c.
n.c.
100 nF
32
31
30
29
28
27
26
25
D6
D5
D4
n.c.
D3
D9
D8
D7
TC
n.c.
n.c.
OGND
DGND
VCCD
(2)
100 nF
(2)
100 nF
(2)
(3)
100 nF
(1)
100 nF
(1)
100 nF
AGND
AGND
AGND
33
Fig.14 Application diagram (LQFP32).
The analog and digital supplies should be separated and well decoupled.
An application note is available and describes the design and the realization of a demoboard that uses TDA8764AHL with an
application environment.
(1) V
RB
, V
RM
and V
RT
are decoupled to AGND.
(2) Decoupling capacitor for supplies must be placed close to the device.
(3) This resistor is mandatory (33
is its minimum value) and must be near the clock source.
2000 Jul 03
19
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
PACKAGE OUTLINES
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
10.4
10.0
5.4
5.2
0.65
1.25
7.9
7.6
0.9
0.7
1.1
0.7
8
0
o
o
0.13
0.1
0.2
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
1.03
0.63
SOT341-1
MO-150
95-02-04
99-12-27
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
1
14
28
15
0.25
y
pin 1 index
0
2.5
5 mm
scale
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
SOT341-1
A
max.
2.0
2000 Jul 03
20
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
0.2
UNIT
A
max.
A
1
A
2
A
3
b
p
c
E
(1)
e
H
E
L
L
p
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
1.60
0.15
0.05
1.5
1.3
0.25
0.27
0.17
0.18
0.12
5.1
4.9
0.5
7.15
6.85
1.0
0.95
0.55
7
0
o
o
0.12
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT401-1
136E01
MS-026
99-12-27
00-01-19
D
(1)
(1)
(1)
5.1
4.9
H
D
7.15
6.85
E
Z
0.95
0.55
D
b
p
e
E
B
8
D
H
b
p
E
H
v
M
B
D
ZD
A
Z E
e
v
M
A
X
1
32
25
24
17
16
9
A
1
A
L
p
detail X
L
(A )
3
A
2
y
w
M
w
M
0
2.5
5 mm
scale
LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
SOT401-1
c
pin 1 index
2000 Jul 03
21
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"Data Handbook IC26; Integrated Circuit Packages"
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
C. The top-surface temperature of the
packages should preferable be kept below 230
C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45
angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
C.
2000 Jul 03
22
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable
(2)
suitable
PLCC
(3)
, SO, SOJ
suitable
suitable
LQFP, QFP, TQFP
not recommended
(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended
(5)
suitable
2000 Jul 03
23
Philips Semiconductors
Product specification
10-bit high-speed low-power ADC
TDA8764A
DATA SHEET STATUS
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
DATA SHEET STATUS
PRODUCT
STATUS
DEFINITIONS
(1)
Objective specification
Development
This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
DEFINITIONS
Short-form specification
The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition
Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications
These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Philips Electronics N.V.
SCA
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Internet: http://www.semiconductors.philips.com
2000
70
Philips Semiconductors a worldwide company
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
Printed in The Netherlands
613502/01/pp
24
Date of release:
2000 Jul 03
Document order number:
9397 750 06996
PDF 
ZIP