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Электронный компонент: TDA8771AH/C1/R2

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DATA SHEET
Product specification
File under Integrated Circuits, IC02
1996 Jan 25
INTEGRATED CIRCUITS
TDA8771A
Triple 8-bit video Digital-to-Analog
Converter (DAC)
1996 Jan 25
2
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
FEATURES
8-bit resolution
Sampling rate up to 35 MHz
Internal reference voltage regulator
No deglitching circuit required
Large output voltage range
1 k
output load
Power dissipation only 200 mW
Single 5 V power supply
44-pin QFP package.
APPLICATIONS
General purpose high-speed digital-to-analog
conversion
Digital TV
Graphic display
Desktop video processing.
GENERAL DESCRIPTION
The TDA8771A is a triple 8-bit video Digital-to-Analog
Converter (DAC). It converts the digital input signals into
analog voltage outputs at a maximum conversion rate of
35 MHz.
The DACs are based on resistor-string architecture with
integrated output buffers. The output voltage range is
determined by a built-in reference source.
The device is fabricated in a 5 V, CMOS process that
ensures high functionality with low power dissipation.
QUICK REFERENCE DATA
Note
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for
minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DDA
analog supply voltage
4.5
5.0
5.5
V
V
DDD
digital supply voltage
4.5
5.0
5.5
V
I
DDA
analog supply current
R
L
= 1 k
; note 1
10
33
45
mA
I
DDD
digital supply current
f
clk
= 35 MHz
-
7
20
mA
INL
integral non-linearity
f
clk
= 35 MHz; ramp input
-
0.5
1
LSB
DNL
differential non-linearity
f
clk
= 35 MHz; ramp input
-
0.25
0.5
LSB
f
clk(max)
maximum clock frequency
35
-
-
MHz
P
tot
total power dissipation
R
L
= 1 k
; f
clk
= 35 MHz; note 1 45
200
360
mW
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8771AH
QFP44 plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10
10
1.75 mm
SOT307-2
1996 Jan 25
3
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MBH039
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
31
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
30,29
26,25
4
24 to 21
4
BANDGAP
REFERENCE
16 to 13
4
20 to 17
4
5 to 3
4
12 to 9
4
8
34, 37, 38,41
33
36
2,42
6,28
40
44
1
clock input
7,27
32,35,39,43
V DDA
DDD
V
reference
current input
RED
analog output
GREEN
analog output
BLUE
analog output
VSSA
SSD
V
reference voltage
decoupling input
not
connected
BLUE
digital inputs
(bits B4 to B7)
BLUE
digital inputs
(bits B0 to B3)
GREEN
digital inputs
(bits G4 to G7)
GREEN
digital inputs
(bits G0 to G3)
RED
digital inputs
(bits R4 to R7)
RED
digital inputs
(bits R0 to R3)
TDA8771A
(I )
REF
(V )
REF
1996 Jan 25
4
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
PINNING
SYMBOL
PIN
DESCRIPTION
I
REF
1
reference current input for output buffers
V
SSA1
2
analog supply ground 1
R7
3
RED digital input data; bit 7 (MSB)
R6
4
RED digital input data; bit 6
R5
5
RED digital input data; bit 5
V
SSD1
6
digital supply ground 1
V
DDD1
7
digital supply voltage 1
R4
8
RED digital input data; bit 4
R3
9
RED digital input data; bit 3
R2
10
RED digital input data; bit 2
R1
11
RED digital input data; bit 1
R0
12
RED digital input data; bit 0 (LSB)
G7
13
GREEN digital input data; bit 7 (MSB)
G6
14
GREEN digital input data; bit 6
G5
15
GREEN digital input data; bit 5
G4
16
GREEN digital input data; bit 4
G3
17
GREEN digital input data; bit 3
G2
18
GREEN digital input data; bit 2
G1
19
GREEN digital input data; bit 1
G0
20
GREEN digital input data; bit 0 (LSB)
B7
21
BLUE digital input data; bit 7 (MSB)
B6
22
BLUE digital input data; bit 6
B5
23
BLUE digital input data; bit 5
B4
24
BLUE digital input data; bit 4
B3
25
BLUE digital input data; bit 3
B2
26
BLUE digital input data; bit 2
V
DDD2
27
digital supply voltage 2
V
SSD2
28
digital supply ground 2
B1
29
BLUE digital input data; bit 1
B0
30
BLUE digital input data; bit 0 (LSB)
CLK
31
clock input
V
DDA1
32
analog supply voltage 1
V
REF
33
decoupling input for reference voltage
n.c.
34
not connected
V
DDA2
35
analog supply voltage 2
OUTB
36
BLUE analog output
n.c.
37
not connected
n.c.
38
not connected
V
DDA3
39
analog supply voltage 3
OUTG
40
GREEN analog output
1996 Jan 25
5
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
n.c.
41
not connected
V
SSA2
42
analog supply ground 2
V
DDA4
43
analog supply voltage 4
OUTR
44
RED analog output
SYMBOL
PIN
DESCRIPTION
Fig.2 Pin configuration.
handbook, full pagewidth
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
index
corner
TDA8771A
I REF
V SSA1
R7
R6
R5
R4
R3
R2
R1
B6
R0
G7
G6
G5
G4
G3
G2
G1
G0
B7
VSSD2
V REF
CLK
VDDA1
VDDD2
B2
B3
B4
V
DDA2
V
DDA4
V
DDA3
OUTR
n.c.
OUTG
V
SSA2
MBH040
VSSD1
VDDD1
B1
B0
B5
n.c.
n.c.
n.c.
OUTB
1996 Jan 25
6
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
THERMAL CHARACTERISTICS
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
DDA
analog supply voltage
-
0.5
+6.5
V
V
DDD
digital supply voltage
-
0.5
+6.5
V
V
DD
supply voltage difference between V
DDA
and V
DDD
-
1.0
+1.0
V
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
0
+70
C
T
j
junction temperature
-
+125
C
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
75
K/W
1996 Jan 25
7
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
CHARACTERISTICS
V
DDA
= V
DDD
= 4.5 to 5.5 V; V
SSA
and V
SSD
shorted together; V
DDA
-
V
DDD
=
-
0.5 to +0.5 V; T
amb
= 0 to 70
C;
typical values measured at V
DDA
= V
DDD
= 5 V and T
amb
= 25
C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
V
DDA
analog supply voltage
4.5
5.0
5.5
V
V
DDD
digital supply voltage
4.5
5.0
5.5
V
I
DDA
analog supply current
R
L
= 1 k
; note 1
10
33
45
mA
I
DDD
digital supply current
f
clk
= 35 MHz
-
7
20
mA
Inputs
C
LOCK INPUT
(
PIN
31)
V
IL
LOW level input voltage
0
-
1.2
V
V
IH
HIGH level input voltage
2.0
-
V
DDD
V
R, G, B
DIGITAL INPUTS
(
PINS
12
TO
8, 5
TO
3, 20
TO
13, 30, 29
AND
26
TO
21)
V
IL
LOW level input voltage
0
-
1.2
V
V
IH
HIGH level input voltage
2.0
-
V
DDD
V
I
REF
REFERENCE CURRENT INPUT FOR OUTPUT BUFFERS
(
PIN
1)
I
I
input current
-
0.6
0.7
mA
Timing; see Fig.3
f
clk(max)
maximum clock frequency
35
-
-
MHz
t
CPH
clock pulse width HIGH
8
-
-
ns
t
CPL
clock pulse width LOW
8
-
-
ns
t
r
clock rise time
-
-
5
ns
t
f
clock fall time
-
-
6
ns
t
SU;DAT
input data set-up time
4
-
-
ns
t
HD;DAT
input data hold time
4
-
-
ns
Voltage reference (pin 33, referenced to V
SSA
)
V
REF
output reference voltage
1.180
1.242
1.305
V
Outputs
OUTB, OUTR, OUTG
ANALOG OUTPUTS
(
PINS
36, 44
AND
40,
REFERENCED TO V
SSA
)
FOR
1 k
LOAD
; see Table 1
FSR
full-scale output voltage range
2.80
2.95
3.10
V
V
os
offset of analog voltage output
-
0.25
-
V
V
Omax
maximum output voltage
data inputs = logic 1;
note 2
2.95
3.20
3.45
V
V
Omin
minimum output voltage
data inputs = logic 0;
note 2
0.05
0.25
0.45
V
THD
total harmonic distortion
f
i
= 4.43 MHz;
f
clk
= 35 MHz
-
-
44
-
dB
Z
L
output load impedance
0.9
1.0
1.1
k
1996 Jan 25
8
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
Notes
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for
minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
2. V
O
is directly proportional to V
REF
.
Table 1
Input coding and DAC output voltages (typical values)
Transfer function (f
clk
= 35 MHz)
INL
integral non-linearity
ramp input
-
0.5
1
LSB
DNL
differential non-linearity
ramp input
-
0.25
0.5
LSB
ct
crosstalk DAC to DAC
-
50
-
-
dB
DAC to DAC matching
-
1.0
2.0
%
Switching characteristics (for 1 k
output load); see Fig.4
t
d
input to 50% output delay time
full-scale change
-
12
-
ns
t
s1
settling time
10% to 90% of
full-scale change
-
15
-
ns
t
s2
settling time
to
1 LSB
-
50
-
ns
Output transients (glitches)
V
g
area for 1 LSB change
-
1
-
LSB
ns
BINARY INPUT DATA
(SYNC = BLANK = 0)
CODE
DAC OUTPUT VOLTAGES (V)
OUTB, OUTR, OUTG
R
L
= 1 k
0000 0000
0
0.262
0000 0001
1
0.273
.... ....
.
.
1000 0000
128
1.731
.... ....
.
.
1111 1110
254
3.188
1111 1111
255
3.200
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1996 Jan 25
9
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
TIMING
Fig.3 Input timing.
handbook, full pagewidth
,,,,,
,,,,,
,,,,,
,,,,,
HD; DAT
t
data input
clock input
MBB656 - 1
SU; DAT
t
CPL
t
CPH
t
V IH
V IL
V IL
50 %
50 %
stable
Fig.4 Switching timing.
handbook, full pagewidth
MBB662 - 3
clock input
code 1023
code 0
input code
(example of a
full-scale input
data transition)
10 %
50 %
90 %
1 LSB
1 LSB
t d
s1
t
s2
t
Vo
(1)
714 mV
(code 1023)
54 mV
(code 0)
50 %
1996 Jan 25
10
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
INTERNAL CIRCUITRY
Fig.5 Internal circuitry.
1/1 page = 296 mm (Datasheet)
27 mm
MBB658 - 1
VDDD
VSSD
GND
(a)
V DDA
VSSA
(b)
DACs
resistor
string
V
(c)
V DDA
VSSA
(d)
V DD
V DD
V DD
V DDA
V DD
GND
DDA
125
(typ.)
(a) Digital inputs; pins 3 to 5, 8 to 26 and 29 to 31.
(b) V
REF
; pin 33.
(c) I
REF
; pin 1.
(d) OUTR, G, B; pins 44, 40 and 36.
1996 Jan 25
11
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
APPLICATION INFORMATION
Fig.6 Application diagram.
Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally.
All ground pins must be connected. One ground plane is preferred although it depends on application.
See Figs 7 and 9 for example of anti-aliasing filter.
handbook, full pagewidth
MBH041
V REF
100 nF
VSSA
VDDA2
CLK
B0
B1
VSSD2
R0
G7
G6
G5
G4
G3
G2
G1
G0
B7
VDDD1
10 nF
5 V
VSSD1
R4
R3
R2
R1
VDDA3
10 nF
5 V
VSSA2
1
k
n.c.
VDDA4
10 nF
5 V
VSSA1
R5
R6
R7
1
2
3
4
5
6
7
8
9
10
11
44
43
42
41
40
39
38
37
36
35
34
12
13
14
15
16
17
18
19
20
21
22
33
32
31
30
29
28
27
26
25
24
23
TDA8771A
1
k
VSSA
OUTR
VSSA
OUTG
VSSA
OUTB
VSSA
VDDA1
10 nF
5 V
VSSA
VSSD
VSSA
REF
I
n.c.
n.c.
10 nF
5 V
VSSA
1
k
n.c.
VDDD2
10 nF
5 V
VSSD
B2
B3
B4
B5
B6
VSSA
6.8 k
1996 Jan 25
12
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
Fig.7 Example of anti-aliasing filter for 2.4 V output swing.
handbook, full pagewidth
MBH042
56 pF
150 pF
56 pF
820
18 pF
18 pF
12
H
12
H
analog video output
(R,G or B)
2.4 V (p-p)
125
OUTR (pin 44)
and OUTG (pin 40)
and OUTB (pin 36)
TDA8771A
analog ground
180
Fig.8 Frequency response for filter shown in Fig.7.
1/2 page (Datasheet)
22 mm
0
10
20
40
0
40
120
160
80
MSA693
30
f (MHz)
(dB)
Characteristics of Fig.8
Order 5; adapted CHEBYSHEV
Ripple
0.7 dB
f at
-
3 dB = 6.2 MHz
f
NOTCH
= 10.8 MHz.
1996 Jan 25
13
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
Fig.9 Example of anti-aliasing filter for 1.5 V output swing.
handbook, full pagewidth
MBH043
27 pF
68 pF
27 pF
500
6.8 pF
6.8 pF
27
H
27
H
analog video output
(R,G or B)
1.5 V (p-p)
125
OUTR (pin 44)
and OUTG (pin 40)
and OUTB (pin 36)
TDA8771A
analog ground
500
Fig.10 Frequency response for filter shown in Fig.9.
1/2 page (Datasheet)
22 mm
0
10
20
40
0
40
120
160
80
MSA694
30
f (MHz)
i
(dB)
Characteristics of Fig.10
Order 5; adapted CHEBYSHEV
Ripple
0.25 dB
f at
-
3 dB = 5.6 MHz
f
NOTCH
= 11.7 MHz.
1996 Jan 25
14
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
PACKAGE OUTLINE
UNIT
A
1
A
2
A
3
b
p
c
E
(1)
e
H
E
L
L
p
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.25
0.05
1.85
1.65
0.25
0.40
0.20
0.25
0.14
10.1
9.9
0.8
1.3
12.9
12.3
1.2
0.8
10
0
o
o
0.15
0.1
0.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2
95-02-04
97-08-01
D
(1)
(1)
(1)
10.1
9.9
H
D
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
ZD
A
Z E
e
v
M
A
X
1
44
34
33
23
22
12
y
A
1
A
L
p
detail X
L
(A )
3
A
2
pin 1 index
D
H
v
M
B
b
p
b
p
w
M
w
M
0
2.5
5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
A
max.
2.10
1996 Jan 25
15
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all QFP
packages.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our
"Quality
Reference Handbook" (order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1996 Jan 25
16
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1996 Jan 25
17
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
NOTES
1996 Jan 25
18
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
NOTES
1996 Jan 25
19
Philips Semiconductors
Product specification
Triple 8-bit video Digital-to-Analog
Converter (DAC)
TDA8771A
NOTES
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SCDS47
Philips Electronics N.V. 1996
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Printed in The Netherlands
537021/1100/01/pp20
Date of release: 1996 Jan 25
Document order number:
9397 750 00591