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Электронный компонент: TDA8772-3

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DATA SHEET
Product specification
Supersedes data of 1995 Mar 09
File under Integrated Circuits, IC02
1997 Mar 06
INTEGRATED CIRCUITS
TDA8772
Triple 8-bit video digital-to-analog
converter
1997 Mar 06
2
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
FEATURES
8-bit resolution
Sampling rate up to:
35 MHz for TDA8772H/3
85 MHz for TDA8772H/8
Internal reference voltage regulator
No deglitching circuit required
SYNC, BLANK control inputs
3 independent clock inputs (one per DAC)
1 V output voltage range
75
output load
TDA8772 has BLANK control on the 3 channels
Single 5 V power supply
44-pin QFP package.
APPLICATIONS
General purpose high-speed digital-to-analog
conversion
Digital TV
Graphic display
Desktop video processing.
GENERAL DESCRIPTION
The TDA8772 is a triple 8-bit video Digital-to-Analog
Converter (DAC). It converts the digital input signals into
analog voltage outputs at a maximum conversion rate of
35 MHz (TDA8772H/3) and 85 MHz (TDA8772H/8).
The DAC is based on resistor-string architecture with
integrated output buffers. The output voltage range is
determined by a built-in reference source.
The device is fabricated in a 5 V CMOS process that
ensures high functionality with low power dissipation.
ORDERING INFORMATION
TYPE
NUMBER
PACKAGE
SAMPLING
FREQUENCY
NAME
DESCRIPTION
VERSION
TDA8772H/3
QFP44
plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10
10
1.75 mm
SOT307-2
35 MHz
TDA8772H/8
85 MHz
1997 Mar 06
3
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
QUICK REFERENCE DATA
Note
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for
minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DDA
analog supply voltage
4.5
5.0
5.5
V
V
DDD
digital supply voltage
4.5
5.0
5.5
V
I
DDA
analog supply current
R
L
= 75
; note 1
40
65
100
mA
I
DDD
digital supply current
TDA8772H/3
-
7
16
mA
TDA8772H/8
-
16
27
mA
INL
integral non-linearity2
f
clk
= 35 MHz; ramp input
-
0.5
1
LSB
f
clk
= 85 MHz; ramp input
-
0.75
1.2
LSB
DNL
differential non-linearity
f
clk
= 35 MHz; ramp input
-
0.25
0.5
LSB
f
clk
= 85 MHz; ramp input
-
0.5
0.75
LSB
f
clk(max)
maximum clock frequency
TDA8772H/3
35
-
-
MHz
TDA8772H/8
85
-
-
MHz
P
tot
total power dissipation
note 1
TDA8772H/3
R
L
= 75
;
f
clk
= 35 MHz
180
360
640
mW
TDA8772H/8
R
L
= 75
;
f
clk
= 85 MHz
180
405
700
mW
1997 Mar 06
4
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MBB661 - 2
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
RESISTOR
STRING
MSB
DECODER
LSB
DECODER
4
4
3128
4
2724
4
BANDGAP
REFERENCE
CONTROL
REGISTER
12
11
1613
4
2017
4
41
4
85
4
34
36
37,42
9,33
40
44
41
10,32
35,39,43
V DDA
DDD
V
reference
current input
RED
analog output
GREEN
analog output
BLUE
analog output
VSSA
SSD
V
reference voltage
decoupling input
BLANK
control input
SYNC
control input
BLUE
digital inputs
(bits B4 to B7)
BLUE
digital inputs
(bits B0 to B3)
GREEN
digital inputs
(bits G4 to G7)
GREEN
digital inputs
(bits G0 to G3)
RED
digital inputs
(bits R4 to R7)
RED
digital inputs
(bits R0 to R3)
TDA8772
RED
clock input
GREEN
clock input
22
BLUE
clock input
23
reference current
input for internal
reference
21
38
(V )
REF
(I )
REFA
(I )
REFB
1997 Mar 06
5
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
PINNING
SYMBOL
PIN
DESCRIPTION
R7
1
RED digital input data; bit 7 (MSB)
R6
2
RED digital input data; bit 6
R5
3
RED digital input data; bit 5
R4
4
RED digital input data; bit 4
R3
5
RED digital input data; bit 3
R2
6
RED digital input data; bit 2
R1
7
RED digital input data; bit 1
R0
8
RED digital input data; bit 0 (LSB)
V
SSD1
9
digital supply ground 1
V
DDD1
10
digital supply voltage 1
SYNC
11
composite sync control input; for
GREEN channel only (active LOW)
BLANK
12
composite blank control input
(active LOW)
G7
13
GREEN digital input data; bit 7
(MSB)
G6
14
GREEN digital input data; bit 6
G5
15
GREEN digital input data; bit 5
G4
16
GREEN digital input data; bit 4
G3
17
GREEN digital input data; bit 3
G2
18
GREEN digital input data; bit 2
G1
19
GREEN digital input data; bit 1
G0
20
GREEN digital input data; bit 0
(LSB)
CLKR
21
RED clock input
CLKG
22
GREEN clock input
CLKB
23
BLUE clock input
B7
24
BLUE digital input data; bit 7
(MSB)
B6
25
BLUE digital input data; bit 6
B5
26
BLUE digital input data; bit 5
B4
27
BLUE digital input data; bit 4
B3
28
BLUE digital input data; bit 3
B2
29
BLUE digital input data; bit 2
B1
30
BLUE digital input data; bit 1
B0
31
BLUE digital input data; bit 0 (LSB)
V
DDD2
32
digital supply voltage 2
V
SSD2
33
digital supply ground 2
V
REF
34
decoupling input for reference
voltage
V
DDA1
35
analog supply voltage 1
OUTB
36
BLUE analog output
V
SSA1
37
analog supply ground 1
I
REFA
38
reference current input for internal
reference
V
DDA2
39
analog supply voltage 2
OUTG
40
GREEN analog output
I
REFB
41
reference current input for output
buffers
V
SSA2
42
analog supply ground 2
V
DDA3
43
analog supply voltage 3
OUTR
44
RED analog output
SYMBOL
PIN
DESCRIPTION
1997 Mar 06
6
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
DDA
analog supply voltage
-
0.5
+6.5
V
V
DDD
digital supply voltage
-
0.5
+6.5
V
V
DD
supply voltage difference between V
DDA
and V
DDD
-
1.0
+1.0
V
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
0
70
C
T
j
junction temperature
-
125
C
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
75
K/W
Fig.2 Pin configuration.
handbook, full pagewidth
1
2
3
4
5
6
7
8
9
10
11
33
32
31
30
29
28
27
26
25
24
23
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
index
corner
TDA8772
V SSD1
R6
R5
R4
R3
R2
R1
R0
SYNC
BLANK
G7
G6
G5
G4
G3
G2
G1
G0
VDDD2
B0
B1
CLKR
V
DDA1
V
DDA2
V
SSA1
OUTR
REFB
OUTB
V
SSA2
MBB660 - 3
VSSD2
CLKG
R7
V DDD1
B2
B3
B4
B5
B6
B7
CLKB
V
DDA3
I
OUTG
REFAI
V
REF
1997 Mar 06
7
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
CHARACTERISTICS
TDA8772H/3 operating at 35 MHz and TDA8772H/8 operating at 85 MHz unless otherwise specified.
V
DDA
= V
DDD
= 4.5 V to 5.5 V; V
SSA
and V
SSD
shorted together; V
DDA
-
V
DDD
=
-
0.5 V to +0.5 V; T
amb
= 0 to +70
C;
typical values measured at V
DDA
= V
DDD
= 5 V and T
amb
= 25
C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
V
DDA
analog supply voltage
4.5
5.0
5.5
V
V
DDD
digital supply voltage
4.5
5.0
5.5
V
I
DDA
analog supply current
R
L
= 75
;
note 1
40
65
100
mA
I
DDD
digital supply current
TDA8772H/3
-
7
16
mA
TDA8772H/8
-
16
27
mA
Inputs
C
LOCK INPUTS
(
PINS
21
TO
23)
V
IL
LOW level input voltage
V
SSD
-
0.5
-
0.8
V
V
IH
HIGH level input voltage
2.0
-
V
DDD
+ 0.5 V
BLANK, SYNC
INPUTS
(
PINS
12
AND
11;
ACTIVE
LOW)
V
IL
LOW level input voltage
V
SSD
-
0.5
-
0.8
V
V
IH
HIGH level input voltage
2.0
-
V
DDD
+ 0.5 V
R, G, B
DIGITAL INPUTS
(
PINS
1
TO
8, 13
TO
20
AND
24
TO
31)
V
IL
LOW level input voltage
V
SSD
-
0.5
-
0.8
V
V
IH
HIGH level input voltage
2.0
-
V
DDD
+ 0.5 V
I
REFA
INTERNAL REFERENCE SUPPLY CURRENT
(
PIN
38)
I
i(REFA)
input current
-
0.17
0.25
mA
I
REFB
OUTPUT BUFFER SUPPLY CURRENT
(
PIN
41)
I
i(REFB)
input current
-
0.5
0.7
mA
Timing (C
L
= 25 pF; R
L
= 75
); see Fig.3
f
clk(max)
maximum clock frequency
TDA8772H/3
35
-
-
MHz
TDA8772H/8
85
-
-
MHz
t
CPH
clock pulse width HIGH
5
-
-
ns
t
CPL
clock pulse width LOW
5
-
-
ns
t
r
clock rise time
TDA8772H/3
-
-
5
ns
TDA8772H/8
-
-
3
ns
t
f
clock fall time
TDA8772H/3
-
-
5
ns
TDA8772H/8
-
-
3
ns
t
SU;DAT
input data set-up time
4
-
-
ns
t
HD;DAT
input data hold time
2.5
-
-
ns
1997 Mar 06
8
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
Notes
1. Minimum and maximum data of current and power consumption are measured in worse case conditions: for
minimum data, all digital inputs are at logic level 0 while for maximum data, all digital inputs are at logic level 1.
2. V
OUT
is directly proportional to V
ref
.
Voltage reference (pin 34, referenced to V
SSA
)
V
ref
output reference voltage
1.180
1.242
1.305
V
Outputs
OUTB, OUTR, OUTG
ANALOG OUTPUTS
(
PINS
36, 44
AND
40,
REFERENCED TO
V
SSA
) R
L
= 75
;
SEE
T
ABLES
1
AND
2
FSR
full-scale output voltage range
0.9
1.0
1.1
V
V
os
offset of analog voltage output
0.75
0.83
0.95
V
V
OUTmax
maximum output voltage
data inputs = logic 1;
note 2
1.65
1.83
2.05
V
V
OUTmin
minimum output voltage
data inputs = logic 0;
note 2
0.75
0.83
0.95
V
THD
total harmonic distortion
f
i
= 4.43 MHz;
f
clk
= 35 MHz
-
-
45
-
dB
f
i
= 4.43 MHz;
f
clk
= 85 MHz
-
-
43
-
dB
Z
L
output load impedance
60
75
90
Transfer function
INL
integral non-linearity
f
clk
= 35 MHz; ramp input
-
0.5
1
LSB
f
clk
= 85 MHz; ramp input
-
0.75
1.2
LSB
DNL
differential non-linearity
f
clk
= 35 MHz; ramp input
-
0.25
0.5
LSB
f
clk
= 85 MHz; ramp input -
0.5
0.75
LSB
CT
crosstalk DAC to DAC
-
45
-
-
dB
m
DAC to DAC matching
-
1.0
2.0
%
Switching characteristics (R
L
= 75
); see Fig.4
t
d
input to 50% output delay time
full-scale change
-
10
-
ns
t
s1
settling time
10% to 90% full-scale
change
-
6
-
ns
t
s2
settling time
to
1 LSB
-
30
-
ns
Output transients (glitches)
V
g
area for 1 LSB change
-
1
-
LSB.ns
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1997 Mar 06
9
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
Table 1
Input coding and DAC output voltages (typical values)
Table 2
Input coding and DAC output voltages (typical values)
BINARY INPUT DATA
(SYNC = BLANK = 0)
CODE
DAC OUTPUT VOLTAGES (V)
OUTB, OUTR, OUTG
R
L
= 75
0000 0000
0
0.830
0000 0001
1
0.834
.... ....
.
.
1000 0000
128
1.330
.... ....
.
.
1111 1110
254
1.826
1111 1111
255
1.830
BINARY INPUT DATA
SYNC
(PIN 11)
BLANK
(PIN 12)
DAC OUTPUT VOLTAGES (V)
OUTG
(PIN 40)
OUTR/B
(PINS 44, 46)
.... ....
x
1
see Table 1
see Table 1
.... ....
1
0
0.830
0.830
.... ....
0
0
0.440
1997 Mar 06
10
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
TIMING
Fig.3 Input timing.
andbook, full pagewidth
HD; DAT
t
data input
clock input
MBB656 - 1
SU; DAT
t
CPL
t
CPH
t
V IH
V IL
V IL
50 %
50 %
stable
Fig.4 Switching timing.
handbook, full pagewidth
MBB662 - 3
clock input
code 1023
code 0
input code
(example of a
full-scale input
data transition)
10 %
50 %
90 %
1 LSB
1 LSB
t d
s1
t
s2
t
Vo
(1)
714 mV
(code 1023)
54 mV
(code 0)
50 %
1997 Mar 06
11
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
INTERNAL CIRCUITRY
Fig.5 Internal circuitry.
handbook, full pagewidth
MBB663 - 2
VDDD
VSSD
GND
(a)
V DDA
VSSA
(b)
DACs
resistor
string
V DDA
(c)
V DDA
VSSA
(d)
V DD
V DD
V DD
V DDA
V DD
GND
VSSA
(e)
VSSA
GND
GND
GND
25
(typ)
(a) Digital inputs; pins 1 to 8 and 11 to 31.
(b) V
ref
; pin 34.
(c) I
REFA
; pin 38.
(d) OUTR, G, B; pins 44, 40 and 36.
(e) I
REFB
; pin 41.
1997 Mar 06
12
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
APPLICATION INFORMATION
Fig.6 Application diagram.
Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally.
All ground pins must be connected. One ground plane is preferred although it depends on the application.
See Fig.7 for example of anti-aliasing filter.
handbook, full pagewidth
MBB664 - 4
V REF
100 nF
VSSA
VDDA1
B1
B2
BLANK
G7
G6
G5
G4
G3
G2
G1
G0
CLKR
R2
R0
SYNC
VDDA2
10
nF
5 V
VSSA2
75
VDDA3
10 nF
5 V
R3
R4
R5
1
2
3
4
5
6
7
8
9
10
11
44
43
42
41
40
39
38
37
36
35
34
12
13
14
15
16
17
18
19
20
21
22
33
32
31
30
29
28
27
26
25
24
23
TDA8772
75
VSSA
OUTR
VSSA
OUTG
VSSA
OUTB
VSSA
VDDD2
10 nF
5 V
VSSD
VDDD1
10 nF
5 V
VSSD
VSSA
5 V
VSSA
75
B5
B6
B7
CLKB
CLKG
IREFB
8.2
k
OUTG
VSSA
VSSA1
IREFA
33
k
VSSD2
B0
B4
B3
R6
R7
R1
VSSD1
10
nF
1997 Mar 06
13
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
Fig.7 Example of anti-aliasing filter for 1 V output swing.
handbook, full pagewidth
MSA692 - 1
220 pF
1.5 nF
220 pF
75
12 pF
12 pF
1
H
1
H
analog video output
(R,G or B)
1 V (p-p)
25
OUTR (pin 44)
and OUTG (pin 40)
and OUTB (pin 36)
TDA8772
analog ground
Fig.8 Frequency response for filter shown in Fig.7.
handbook, halfpage
0
36
108
0
50
150
200
100
MSA691
72
f (MHz)
(dB)
Characteristics of Fig.8
Order 5; adapted CHEBYSHEV
Ripple
0.6 dB
Frequency at
-
3 dB = 6.5 MHz
f
NOTCH
= 46 MHz.
1997 Mar 06
14
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
PACKAGE OUTLINE
UNIT
A
1
A
2
A
3
b
p
c
E
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.25
0.05
1.85
1.65
0.25
0.40
0.20
0.25
0.14
10.1
9.9
0.8
1.3
12.9
12.3
0.85
0.75
1.2
0.8
10
0
o
o
0.15
0.1
0.15
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.95
0.55
SOT307-2
92-11-17
95-02-04
D
(1)
(1)
(1)
10.1
9.9
H
D
12.9
12.3
E
Z
1.2
0.8
D
e
E
B
11
c
E
H
D
ZD
A
Z E
e
v
M
A
X
1
44
34
33
23
22
12
y
A
1
A
L
p
Q
detail X
L
(A )
3
A
2
pin 1 index
D
H
v
M
B
b
p
b
p
w
M
w
M
0
2.5
5 mm
scale
QFP44: plastic quad flat package; 44 leads (lead length 1.3 mm); body 10 x 10 x 1.75 mm
SOT307-2
A
max.
2.10
1997 Mar 06
15
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all QFP
packages.
The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our
"Quality
Reference Handbook" (order code 9397 750 00192).
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1997 Mar 06
16
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1997 Mar 06
17
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
NOTES
1997 Mar 06
18
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
NOTES
1997 Mar 06
19
Philips Semiconductors
Product specification
Triple 8-bit video digital-to-analog
converter
TDA8772
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1997
SCA53
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
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Printed in The Netherlands
547047/1200/06/pp20
Date of release: 1997 Mar 06
Document order number:
9397 750 01836