DATA SHEET
Preliminary specification
File under Integrated Circuits, IC02
1996 Aug 14
INTEGRATED CIRCUITS
TDA8775
Triple 10-bit video Digital-to-Analog
Converter (DAC)
1996 Aug 14
2
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
FEATURES
10-bit resolution
Sampling rate up to:
50 MHz for normal mode; R
L
= 37.5
35 MHz for LOW power mode; R
L
= 150
Internal current reference
Current reference selector for:
normal mode, R
L
= 37.5
(typ.)
low-power mode, R
L
= 150
(typ.)
No deglitching circuit required
SYNC and BLANK control inputs
0.66 V output voltage range on red and blue channels
1 V output voltage range on green channel
(including sync)
BLANK control input on the 3 channels
+ 5 V power supply.
APPLICATIONS
General purpose high-speed digital-to-analog
conversion
Digital TV
Graphic display
Desktop video processing.
GENERAL DESCRIPTION
The TDA8775 consists of three 10-bit video
Digital-to-Analog Converters (DACs). They convert the
digital input signals into current outputs at a maximum
conversion rate of 50 MHz.
The DACs are based on current source architecture with
selectable current reference.
The devices are fabricated in a 5 V CMOS process that
ensures high functionality with low power dissipation.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
DDA
analog supply voltage
4.5
5.0
5.5
V
V
DDD
digital supply voltage
4.5
5.0
5.5
V
I
DDA
analog supply current
SLT = 1; R
L
= 37.5
-
67
tbf
mA
SLT = 0; R
L
= 150
-
16
tbf
mA
I
DDD
digital supply current
SLT = 1; R
L
= 37.5
-
15
tbf
mA
SLT = 0; R
L
= 150
-
10
tbf
mA
INL
DC integral non-linearity
-
1
2
LSB
DNL
DC differential non-linearity
-
0.7
1.0
LSB
f
clk(max)
maximum clock frequency
SLT = 1; R
L
= 37.5
50
-
-
MHz
SLT = 0; R
L
= 150
35
-
-
MHz
P
tot
total power dissipation
SLT = 1; R
L
= 37.5
;
f
clk
= 50 MHz
-
410
tbf
mW
SLT = 0; R
L
= 150
;
f
clk
= 35 MHz
-
130
tbf
mW
TYPE
NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA8775G
LQFP48
plastic low profile quad flat package; 48 leads; body 7
7
1.4 mm
SOT313-2
1996 Aug 14
3
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
BLOCK DIAGRAM
Fig.1 Block diagram.
handbook, full pagewidth
MGE965
6
6
10-7
6-1
24-21
20-15
35-32
31-26
14
13
48
39
12
36
42
40
43
47
44
46
25
11
45
41
38
6
4
4
4
CURRENT
SOURCE
MSB
DECODER
LSB
DECODER
CURRENT
REFERENCE
CURRENT
SOURCE
MSB
DECODER
LSB
DECODER
CURRENT
SOURCE
MSB
DECODER
LSB
DECODER
CONTROL
REGISTER
VDDA1
VDDA2
VDDA3
VDDD1
37
VDDD2
OUTB
OUTG
OUTR
VSSA1
VSSA2
VSSA3
CLK
SLT
reference current
decoupling input
(Iref)
VSSD1
VSSD2
red
digital inputs
(bits R0 to R3)
red
digital inputs
(bits R4 to R9)
green
digital inputs
(bits G0 to G3)
green
digital inputs
(bits G4 to G9)
blue
digital inputs
(bits B0 to B3)
blue
digital inputs
(bits B4 to B9)
BLANK
control input
SYNC
control input
TDA8775
1996 Aug 14
4
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
PINNING
SYMBOL
PIN
DESCRIPTION
R9
1
red digital input data; bit 9 (MSB)
R8
2
red digital input data; bit 8
R7
3
red digital input data; bit 7
R6
4
red digital input data; bit 6
R5
5
red digital input data; bit 5
R4
6
red digital input data; bit 4
R3
7
red digital input data; bit 3
R2
8
red digital input data; bit 2
R1
9
red digital input data; bit 1
R0
10
red digital input data; bit 0 (LSB)
V
DDD1
11
digital supply voltage 1
V
SSD1
12
digital supply ground 1
SYNC
13
composite sync control input; for green channel only (active LOW)
BLANK
14
composite blank control input (active LOW)
G9
15
green digital input data; bit 9 (MSB)
G8
16
green digital input data; bit 8
G7
17
green digital input data; bit 7
G6
18
green digital input data; bit 6
G5
19
green digital input data; bit 5
G4
20
green digital input data; bit 4
G3
21
green digital input data; bit 3
G2
22
green digital input data; bit 2
G1
23
green digital input data; bit 1
G0
24
green digital input data; bit 0 (LSB)
CLK
25
clock input
B9
26
blue digital input data; bit 9 (MSB)
B8
27
blue digital input data; bit 8
B7
28
blue digital input data; bit 7
B6
29
blue digital input data; bit 6
B5
30
blue digital input data; bit 5
B4
31
blue digital input data; bit 4
B3
32
blue digital input data; bit 3
B2
33
blue digital input data; bit 2
B1
34
blue digital input data; bit 1
B0
35
blue digital input data; bit 0 (LSB)
V
SSD2
36
digital supply ground 2
V
DDD2
37
digital supply voltage 2
V
DDA1
38
analog supply voltage 1
I
ref
39
decoupling pin for reference current
V
SSA1
40
analog supply ground 1
1996 Aug 14
5
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
V
DDA2
41
analog supply voltage 2
OUTB
42
blue analog output
V
SSA2
43
analog supply ground 2
OUTG
44
green analog output
V
DDA3
45
analog supply voltage 3
OUTR
46
red analog output
V
SSA3
47
analog supply ground 3
SLT
48
mode selection; normal mode, R
L
= 37.5
(active HIGH); low power mode,
R
L
= 150
(active LOW)
SYMBOL
PIN
DESCRIPTION
Fig.2 Pin configuration.
handbook, full pagewidth
1
2
3
4
5
6
7
8
9
10
11
36
35
34
33
32
31
30
29
28
27
26
13
14
15
16
17
18
19
20
21
22
23
48
47
46
45
44
43
42
41
40
39
38
12
24
37
25
TDA8775
MGE964
VSSD2
B0
B1
B2
B4
B5
B6
B7
B8
B9
CLK
R9
R8
R7
R6
R5
R4
R2
R1
VDDD1
VSSD1
B3
V
SSA3
OUTR
V
DDA3
OUTG
V
SSA2
OUTB
V
SSA1
I ref
V
DDA1
V
DDD2
SLT
V
DDA2
R3
R0
G9
G8
G7
G6
G5
G4
G2
G1
G0
G3
BLANK
SYNC
1996 Aug 14
6
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
THERMAL CHARACTERISTICS
HANDLING
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is
desirable to take normal precautions appropriate to handling integrated circuits.
CHARACTERISTICS
TDA8775 operating at 50 MHz; SLT = 1 and R
L
= 37.5
.
V
DDA
= V
DDD
= 4.5 to 5.5 V; V
SSA
and V
SSD
shorted together; V
DDA
-
V
DDD
=
-
0.5 to +0.5 V; T
amb
= 0 to +70
C; typical
values measured at V
DDA
= V
DDD
= 5 V and T
amb
= 25
C; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
DDA
analog supply voltage
-
0.5
+6.5
V
V
DDD
digital supply voltage
-
0.5
+6.5
V
V
DD
supply voltage difference between V
DDA
and V
DDD
-
1.0
+1.0
V
T
stg
storage temperature
-
55
+150
C
T
amb
operating ambient temperature
0
70
C
T
j
junction temperature
-
125
C
SYMBOL
PARAMETER
VALUE (TYP.)
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
72
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
V
DDA
analog supply voltage
4.5
5.0
5.5
V
V
DDD
digital supply voltage
4.5
5.0
5.5
V
I
DDA
analog supply current
SLT = 1; R
L
= 37.5
-
67
tbf
mA
SLT = 0; R
L
= 150
-
16
tbf
mA
I
DDD
digital supply current
SLT = 1; R
L
= 37.5
-
15
tbf
mA
SLT = 0; R
L
= 150
-
10
tbf
mA
Inputs
C
LOCK INPUT
(
PIN
25)
V
IL
LOW level input voltage
V
SSD
-
0.5
-
0.8
V
V
IH
HIGH level input voltage
2.0
-
V
DDD
+ 0.5 V
BLANK
AND
SYNC
INPUTS
(
PINS
13
AND
14;
ACTIVE
LOW)
V
IL
LOW level input voltage
V
SSD
-
0.5
-
0.8
V
V
IH
HIGH level input voltage
2.0
-
V
DDD
+ 0.5 V
R, G
AND
B
DIGITAL INPUTS
(
PINS
1
TO
10, 15
TO
24
AND
26
TO
35)
V
IL
LOW level input voltage
V
SSD
-
0.5
-
0.8
V
V
IH
HIGH level input voltage
2.0
-
V
DDD
+ 0.5 V
1996 Aug 14
7
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
Timing (C
L
= 25 pF); see Fig.4
f
clk(max)
maximum clock frequency
SLT = 1; R
L
= 37.5
50
-
-
MHz
SLT = 0; R
L
= 150
35
-
-
MHz
t
CPH
clock pulse width HIGH
6
-
-
ns
t
CPL
clock pulse width LOW
6
-
-
ns
t
r
clock rise time
-
-
4
ns
t
f
clock fall time
-
-
4
ns
t
SU;DAT
input data set-up time
4
-
-
ns
t
HD;DAT
input data hold time
2.5
-
-
ns
Outputs
OUTB, OUTR
AND
OUTG
ANALOG OUTPUTS
(
PINS
42, 46
AND
44,
REFERENCED TO
V
SSA
)
FOR
37.5
LOAD
V
OUTmax
maximum output voltage
BLANK and SYNC active
R and B channels
-
0.714
-
V
G channel
-
1.0
-
V
THD
total harmonic distortion
f
i
= 4.43 MHz; SLT = 1;
f
clk
= 50 MHz; R
L
= 37.5
-
-
52
-
dB
f
i
= 4.43 MHz; SLT = 0;
f
clk
= 35 MHz; R
L
= 150
-
-
50
-
dB
Z
L
output load impedance
SLT = 1
tbf
37.5
tbf
SLT = 0
tbf
150
tbf
Transfer function
INL
DC integral non-linearity
-
1
2
LSB
DNL
DC differential non-linearity
-
0.7
1.0
LSB
ct
crosstalk DAC to DAC
tbf
-
-
dB
DAC to DAC matching
-
1.0
tbf
%
Switching characteristics; see Fig.5
t
d
input to 50% output delay
time
full-scale change;
SLT = 1; R
L
= 37.5
-
tbf
-
ns
full-scale change;
SLT = 0; R
L
= 150
-
tbf
-
ns
t
s1
settling time
10 to 90% full-scale change;
SLT = 1; R
L
= 37.5
-
4
-
ns
10 to 90% full-scale change;
SLT = 0; R
L
= 150
-
10
-
ns
t
s2
settling time
to
1 LSB; SLT = 1;
R
L
= 37.5
-
tbf
-
ns
to
1 LSB; SLT = 0;
R
L
= 150
-
tbf
-
ns
Output transients (glitches)
V
g
area for 1 LSB change
-
tbf
-
LSB.ns
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
1996 Aug 14
8
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
Table 1
Input coding and DAC output currents (typical values)
BINARY INPUT
DAC OUTPUT CURRENT
(mA)
DAC OUTPUT CURRENT
(mA)
SLT = 1; R
L
= 37.5
SLT = 0; R
L
= 150
SYNC
BLANK
DATA
CODE
R, B
Channels
G Channel
R, B
Channels
G Channel
0
0
XXH
-
0
0
0
0
1
0
XXH
-
0
7.62
0
1.90
0
1
00H
0
1.44
1.44
0.36
0.36
-
-
-
-
-
-
3FFH
1023
19.05
19.05
4.76
4.76
1
1
00H
0
1.44
9.05
0.36
2.26
-
-
-
-
-
-
3FFH
1023
19.05
26.67
4.76
6.67
handbook, full pagewidth
BLANK
MGD630
1 V
660 mV
330 mV
SYNC
PERIOD
GREY
SCALE
SET-UP
LEVEL
VIDEO PICTURE DATA
BLANKING LEVEL
REFERENCE
BLACK
REFERENCE
WHITE
SYNC
(1)
SYNC LEVEL
(1)
100 IRE
UNITS
40 IRE UNITS
Fig.3 Video signal diagram.
(1) Sync only on green channel.
1996 Aug 14
9
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
TIMING
Fig.4 Input timing.
andbook, full pagewidth
HD; DAT
t
data input
clock input
MBB656 - 1
SU; DAT
t
CPL
t
CPH
t
V IH
V IL
V IL
50 %
50 %
stable
Fig.5 Switching timing.
handbook, full pagewidth
MBB662 - 3
clock input
code 1023
code 0
input code
(example of a
full-scale input
data transition)
10 %
50 %
90 %
1 LSB
1 LSB
t d
s1
t
s2
t
Vo
(1)
714 mV
(code 1023)
54 mV
(code 0)
50 %
(1) Output level conditions, SYNC = 0; BLANK = 1.
1996 Aug 14
10
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
INTERNAL PIN CIRCUITRY
Fig.6 Internal circuitry.
(a) Digital inputs; pins 1 to 10, 13 to 25 and 26 to 35.
(b) I
ref
; pin 39.
(c) OUTR, OUTG and OUTB; pins 46, 44 and 42.
handbook, full pagewidth
MGE967
VDDD
VSSD
GND
VDDA
VDDA
VSSA
VSSA
bitn
bitn
(b)
(c)
(a)
1996 Aug 14
11
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
APPLICATION INFORMATION
Fig.7 Application diagram.
Analog and digital supplies should be separated and decoupled.
Supplies are not connected internally.
All ground pins must be connected. One ground plane is preferred although it depends on the application.
(1) R = 37.5
; SLT = 1.
(2) R = 150
; SLT = 0.
handbook, full pagewidth
MGE966
1
(1)
(2)
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
46
41
42
43
44
45
47
48
100 nF
100 nF
100 nF
22
nF
22
nF
R
+
5 V
R
R
red
input
green input
CLK
blue
input
+
5 V
+
5 V
+
5 V
+
5 V
TDA8775
R = 37.5
or 150
1996 Aug 14
12
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
Fig.8 Example of reconstruction filter for 1 V output swing.
handbook, full pagewidth
MGE968
75
75
3.3
H
2.7
H
330 pF
27 pF
75
180
pF
R1
R2
R3
330 pF
video
output
video outputs
from TDA8775
Fig.9 Frequency response for filter shown in Fig.8.
handbook, full pagewidth
25
-
40
0
5
20
MGE969
10
15
-
30
-
20
-
10
0
att
(dB)
f (MHz)
(1)
(2)
(1) R2 = 75
.
(2) R2 = 0
.
1996 Aug 14
13
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
E
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
1.60
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.69
0.59
0.95
0.55
7
0
o
o
0.12
0.1
0.2
1.0
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2
93-06-15
94-12-19
D
(1)
(1)
(1)
7.1
6.9
H
D
9.15
8.85
E
Z
0.95
0.55
D
b
p
e
E
B
12
D
H
b
p
E
H
v
M
B
D
ZD
A
Z E
e
v
M
A
1
48
37
36
25
24
13
A
1
A
L
p
Q
detail X
L
(A )
3
A
2
X
y
c
w
M
w
M
0
2.5
5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
1996 Aug 14
14
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all LQFP
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45
to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1996 Aug 14
15
Philips Semiconductors
Preliminary specification
Triple 10-bit video Digital-to-Analog
Converter (DAC)
TDA8775
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1996
SCA51
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Printed in The Netherlands
537021/50/01/pp16
Date of release: 1996 Aug 14
Document order number:
9397 750 01021
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