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1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

FEATURES

5 V power supply

Video amplifier with clamp and white clip circuits

Programmable video modulation depth

FM sound modulator (4.5, 5.5, 6.0 and 6.5 MHz)

Programmable picture-to-sound ratio

Programmable deviation of the sound subcarrier

Input for modulated NICAM sound subcarrier or second
frequency modulated sound subcarrier

Asymmetrical or symmetrical RF output buffer

Symmetrical RF oscillator for UHF or VHF band
according to the application

One I

C-bus programmable output port

On-chip Phase-Locked Loop (PLL) frequency
synthesizer for the RF carrier

On-chip PLL frequency synthesizer for the sound carrier

On-chip power supply regulator

On-chip I

C-bus and/or hardware controlled Test

Pattern Signal Generator (TPSG) with LED driver

RF output switch-off during tuning.

APPLICATIONS

Video recorders

Cable converters

Satellite receivers

Set top boxes.

GENERAL DESCRIPTION

The TDA8822 is a programmable modulator which
generates an RF TV channel from a baseband video
signal and a baseband audio signal in the event of
negative video and FM sound standards (B/G, I, D/K, M
and N standards).

Two PLL frequency-synthesizers set the picture carrier
frequency and the sound subcarrier frequency to the
required frequencies. These PLL frequency-synthesizers
are programmed via the I

C-bus.

The I

C-bus controls these features:

Video modulation depth

Sound subcarrier modulation deviation

Picture-to-sound ratio.

This makes the IC suitable for multistandard applications
without any adjustment into the application.

Additional features are provided like an input for the
NICAM or second FM carrier, a test pattern signal
generator with a LED driver and a general purpose
output port.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA8822T

SO24

plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

TDA8822M

SSOP24

plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

QUICK REFERENCE DATA
V

CCA

= V

CCD

= 5 V; T

amb

= 25

C; in PAL B/G, PAL I, PAL D/K or NTSC; MD setting = 4; DEV setting = 2;

PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p); 1 kHz sine wave;
unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

CCA

analog supply voltage

4.5

5.0

5.5

CCD

digital supply voltage

4.5

5.0

5.5

CC(tot)

total supply current

modulation depth adjustment
range

typical value for MD setting between
0 and 7

72.5

90.0

P/S

picture-to-sound ratio
adjustment range

typical value for PS setting between
0 and 7

RF output voltage level
asymmetrical on a 75

load

frequency between 45 and 860 MHz

sound subcarrier frequency

4.5

6.5

MHz

sound subcarrier frequency
deviation range

for B/G, I, D/K, SC setting = 1, 2 or 3;
typical value for DEV setting between
0 and 7

kHz

for M, N, SC setting = 0; typical value
for DEV setting between 0 and 7

22.5

kHz

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

PINNING

SYMBOL

PIN

DESCRIPTION

CCA

analog power supply

ACP

audio charge pump output

PREEMPH

audio pre-emphasis network

RFOSCA

RF oscillator A (collector) output

RFOSCB

RF oscillator B (base) input

OGND

RF oscillator ground

RFOSCC

RF oscillator C (base) input

RFOSCD

RF oscillator D (collector) output

VVT

video tuning voltage output

VCP

video charge pump output

CCD

digital power supply

XTAL

crystal oscillator input

DGND

digital ground

SCL

serial clock (I

C-bus) input

SDA

serial data (I

C-bus) input/output

general purpose output

TPSG

test pattern signal generator
input/output pin

RFB

RF output B

RFA

RF output A

RFGND

ground for the RF outputs

NICAM

NICAM input

AUDIO

audio input

AGND

analog ground

VIDEO

video input

Fig.2 Pin configuration.

handbook, halfpage

VCCA

ACP

PREEMPH

RFOSCA

RFOSCB

OGND

RFOSCC

RFOSCD

VVT

VCP

VCCD

XTAL

VIDEO

AGND

AUDIO

NICAM

RFA

RFB

RFGND

TPSG

SDA

SCL

DGND

TDA8822

MGE673

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

FUNCTIONAL DESCRIPTION

The TDA8822 is a programmable RF modulator which can
be divided into the following parts:

Video part

Audio part

RF part.

Video part

The video part provides the following:

The video part includes a clamping circuit which sets the
internal reference voltage to the bottom of the
synchronizing pulse. The modulation depth is adjusted
using 3 bits of the I

C-bus programming, called MD2,

MD1 and MD0. These 3 bits make 8 different values for
the modulation depth possible (see Table 1).

After the modulation depth is set, the signal is fed
through a clip control circuit that clips the video signal to
avoid that the modulation depth becomes higher than
100%.

The video part also contains a TPSG. This TPSG
generates a pattern that helps to tune the TV set to the
programmed channel of the modulator. The pattern
consists of a sync pulse and two vertical white bars on
the screen (see Fig.3)

The TPSG is activated in two ways:

Forcing the pin TPSG to DGND in the application

(see Fig.8)

Setting the TPSG bit to 1 via the I

C-bus, then the

TPSG pin acts as an output port, sinking current to
allow the indication of the use of the TPSG in the
application e.g. with an LED (see Fig.9).

Table 1

Modulation depth setting (typical values)

SETTING

BIT

MODULATION

DEPTH (%)

MD2

MD1

MD0

72.5

75.0

77.5

80.0

82.5

85.0

87.5

90.0

Fig.3 Test pattern signal.

handbook, full pagewidth

MGE675

t (

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

Audio part

The audio part provides the following:

The sound subcarrier is created in an integrated VCO.
The signal at the output of this VCO is fed to a stage that
adjusts the picture-to-sound ratio and to the audio
programmable divider.

The frequency of the sound subcarrier is set by
programming the bits SC1 and SC0 of the I

C-bus (see

Table 2). These two bits set the dividing ratio of the
audio programmable divider to get the divided frequency
f

div(audio)

The audio phase detector compares the
phase/frequency of the divided audio frequency f

div(audio)

and the reference frequency for the audio, f

ref(audio)

and

drives the Charge Pump (CP) that charges or
discharges the audio loop filter connected between
pins ACP and AGND to get the VCO oscillating to the
programmed frequency.

ref(audio)

and f

div(audio)

can be monitored on the general

purpose output port during a special test mode.

The frequency deviation of the sound subcarrier is set
using 3 bits DEV2, DEV1 and DEV0 of the I

C-bus

programming (see Table 3), when a signal of 1 kHz with
a level of 50 mV (p-p) is applied on the audio input pin.

The difference between the picture carrier level and the
sound subcarrier level is adjusted using 3 bits PS2, PS1
and PS0 (see Table 4).

The NICAM amplifier has a constant gain, and is
designed for adding a second sound subcarrier in the TV
channel. This subcarrier can be either a second FM
carrier for dual-sound/stereo system used in PAL B/G or
a modulated NICAM carrier. The level between the
picture carrier and the NICAM carrier (P/N) will depend
on the input level on the NICAM input.

Table 2

Sound subcarrier frequency setting

Table 3

Sound subcarrier frequency deviation setting (typical values)

SC SETTING

BIT

SOUND SUBCARRIER

FREQUENCY (MHz)

STANDARD

SC1

SC0

4.5

M, N

5.5

B, G

6.0

6.5

D, K

DEV SETTING

BIT

DEVIATION

(%)

DEVIATION (kHz)

DEV2

DEV1

DEV0

B, G, I, D, K

M, N

40.0

20.0

10.0

45.0

22.5

11.3

50.5

25.3

12.6

56.5

28.3

14.1

63.5

31.8

15.9

71.5

35.8

17.9

80.0

40.0

20.0

90.0

45.0

22.5

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

Table 4

Picture-to-sound ratio setting (typical values)

PS SETTING

BIT

P/S RATIO

(dB)

PS2

PS1

PS0

RF part

The RF part provides the following:

The RF oscillator can produce any frequency used for
TV transmission, from 35 to 890 MHz. The frequency
range depends on the components used in the
application (see Table 11).

The RF mixer combines the video signal, the sound
subcarrier and the carrier from the NICAM input to build
a baseband TV channel. This baseband signal is then
mixed with the RF oscillator signal to get the RF TV
channel.

The two signals from the RF mixer are sent to the output
buffer. This output buffer can be used either as two
asymmetrical outputs or as one symmetrical output.

The output buffer is switched-off while the PLL is not
in-lock, to avoid parasitic output signal during the tuning
of the RF oscillator. The in-lock information is given by
the phase detector of the loop.

The signal from the RF oscillator is fed to the PLL which
controls the picture carrier frequency. The RF signal is
first divided by 8 in the prescaler, and then divided in the
programmable 14-bits divider. The dividing ratio of this
divider is programmed via the I

C-bus. The minimum

frequency that can be synthesized is 16 MHz, and the
maximum frequency is 1023.9375 MHz.

The divided frequency called f

div(video)

is compared to the

reference frequency called f

ref(video)

coming from the

crystal oscillator and divided in the reference divider.
The crystal oscillator is intended to be used with a
crystal of 4 MHz.

The comparison between f

ref(video)

and f

div(video)

is done

in the video phase detector. The resulting signal is fed
via the video charge pump to the loop amplifier,
including the tuning voltage drive (33 V) inside the IC.

ref(video)

and f

div(video)

can also be monitored on the

output port during a special test mode.

The I

C-bus receiver and control logic includes the

control of:

Picture carrier frequency

Sound subcarrier frequency

Sound subcarrier frequency deviation

Video modulation depth

Picture-to-sound ratio

TPSG on/off and LED drive control

RF oscillator on/off

Sound oscillator on/off

General purpose output port on/off

Test modes setting.

Software information

The transmission is made using 4 words in I

C-bus format.

First the address CA has to be sent, then at least two
consecutive words have to be sent, either the two words
F1 and F0, or the two words C1 and C0.

The two words C1 and F1 are differentiated inside the IC
by the first bit being logic 1 or logic 0 respectively.
The contents of the 4 bytes is shown in Table 5.

At the power-up of the TDA8822, the I

C-bus state is the

following:

N13 to N0 are not fixed

SC setting = 1: the sound carrier is fixed to 5.5 MHz

MD is set to 4 (82.5%), PS is set to 1 (

12 dB) and DEV

is set to 2 (50.5%)

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

T0 is set to logic 1, RF0 is set to logic 1, TPSG is set to
logic 1 and P0 is set to logic 0 to select the video high
impedance test mode because it is in this mode that the
RF oscillator starts in the best conditions.

The TPSG bit is used to switch on or off the TPSG using
the I

C-bus. It is also possible to switch the TPSG on in the

application, connecting the pin TPSG to DGND. This
pin TPSG has a double function and acts as an input or as
an output.

These are the two functions:

Output: if the TPSG is set using the I

C-bus, the

pin TPSG is used as an output open collector NPN port.
This port can be used to indicate with an LED that the
TPSG is on. This is especially useful in systems using
an on-screen display. If the TV set is not tuned to the
right channel there is an alternate indication that the
TPSG is on (see Fig.9).

Input: if the TPSG is set with an hardware switch in the
application, the TPSG pin is used as one of the inputs to
select the TPSG mode (see Fig.8).

Notice that if the TPSG bit is set to logic 1 while the RF0
bit is set to logic 0, the TPSG is turned off, and the sound
oscillator is off (see Table 8).

N13 to N0 are the 14 bits to set the video programmable
divider ratio and then to set the picture carrier frequency
following the formula: f

osc

= f

ref(video)

where:

ref(video)

is the frequency on pin XTAL divided by the

reference divider ratio. For example, with a 4 MHz
crystal connected to

pin XTAL, f

ref video

(

)

4 000 000

512

------------------------

7812.5 Hz

N is the programmable divider ratio:
N = N

+ N

+ ... + N

2 + N

osc

is the RF oscillator frequency.

DEV2, DEV1 and DEV0 are the bits to set the sound
subcarrier frequency deviation (see Table 3).

PS2, PS1 and PS0 are the bits to set the picture-to-sound
ratio (see Table 4).

MD2, MD1 and MD0 are the bits to set the modulation
depth (see Table 1).

SC1 and SC0 are the bits to set the sound subcarrier
frequency according to Table 2.

RF0 is a bit that controls the RF oscillator on/off. In normal
mode, it should be set to logic 1. If the modulator is not
used and may create some interferences with other
signals in the application, it should be set to logic 0
(see Table 6).

Notice that if the bit RF0 is logic 0 while the bit TPSG is
logic 1, then the RF oscillator is still running, but the sound
oscillator is off, and the TPSG is also off (see Table 8).

The bit P0 controls the output port P0, which is an open
collector NPN port, able to drive up to 10 mA
(see Table 7).

T0 is a bit used for test purposes. If this bit is set to logic 0,
the IC operates in normal configuration. If it is set to
logic 1, then the use of bits TPSG, RF0 and P0 is changed
to select 1 of the 8 test modes as explained in Table 9.

Table 5

Contents of programming words

BYTE

MSB

LSB

ACKNOWLEDGE BIT

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Address byte CA

ACK

F1: frequency
byte 1

TPSG

N13

N12

N11

N10

ACK

F0: frequency
byte 0

ACK

C1: control byte 1

DEV2

DEV1

DEV0

PS2

PS1

PS0

ACK

C0: control byte 0

MD2

MD1

MD0

SC1

SC0

RF0

ACK

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

Table 6

RF oscillator on/off setting (see note 1)

Note

1. This table is valid only if bit TPSG is set to logic 0.

Table 7

Output port programming

Table 8

Overview of the normal modes

Note

1. X means logic 0 or logic 1, don't care.

STATE OF RF0

ACTION ON RF OSCILLATOR

stopped; no RF carrier

operating; normal use

STATE OF P0

PORT STATE

VOLTAGE ON PORT

(with a pull-up resistor to V

CCD

)

high impedance

close to V

CCD

sinking current

close to 0 V

RF0

TPSG

PIN TPSG

MODE

(1)

input: open

RF on; TPSG off

(1)

input: to DGND

RF on; TPSG on

(1)

output: sinking current

RF on; TPSG on

(1)

input: open or to DGND

RF off

(1)

input: open

RF on; TPSG off; sound oscillator off

(1)

input: to DGND

RF on; TPSG on; sound oscillator off

(1)

Port P0 off (high impedance)

(1)

Port P0 on (sinking current)

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

Table 9

Overview of the test modes

Notes

1. During the test mode (bit T0 set to logic 1), the pin TPSG is unused, meaning that the input information does not have

any effect, and that the output port does not sink any current.

2. In `f

ref(audio)

on P0' mode, the reference frequency of the audio PLL is available on the port P0.

3. In `f

div(audio)

on P0' mode,

is available on the port P0 (f

div(audio)

is the frequency from the sound oscillator

divided by the dividing ratio of the audio programmable divider).

4. In `f

ref(video)

on P0' mode, the reference frequency of the video PLL is available on the port P0.

5. In `f

div(video)

on P0' mode,

is available on the port P0 (f

div(video)

is the frequency of the RF oscillator divided

by the dividing ratio of the video programmable divider).

6. In `both CP sinking or sourcing current' modes, the charge pump of the audio PLL and the one of the video PLL are

sinking or sourcing their nominal current.

7. The `video charge pump off' mode allows to measure the leakage current on the video PLL charge pump.

8. The `audio charge pump off' mode allows to measure the leakage current on the audio PLL charge pump.

9. In the `video high-impedance' mode, it is possible to inject an external tuning voltage for the RF carrier setting.

In this mode, the video PLL is off.

10. In the `baseband signal on RF outputs' mode, the RF oscillator is off, and it is possible to measure the baseband

video and audio subcarrier signals on the RF output pins.

11. During the `balance test' mode the picture carrier is over-modulated allowing the measurement of the residual carrier.

RF0

TPSG

PIN

(1)

TPSG

TEST MODES

ref(audio)

on P0; both CP sinking current; notes 2 and 6

div(audio)

on P0; note 3

ref(video)

on P0; both CP sourcing current; notes 4 and 6

div(video)

on P0; note 5

video charge pump off; note 7

audio charge pump off and balance test; notes 8 and 11

video high impedance test; note 9

baseband signal on RF outputs; note 10

div audio

(

)

--------------------------

div video

(

)

-------------------------

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

Example of programming

We want to program the TDA8822 in a UHF application, on channel 21 (picture carrier at 471.25 MHz) in a B/G standard
(sound carrier at 5.5 MHz from the picture carrier) with a Picture-to-Sound ratio of

12 dB, a modulation depth of 82.5%

and a deviation set to 50.5% in normal mode, without TPSG, output port on.

These are the values of the bits that must be programmed:

The video dividing ratio will be

TPSG bit will be set to logic 0

DEV2 will be set to logic 0, DEV1 to logic 1 and DEV0 to logic 0

PS2 will be set to logic 0, PS1 to logic 0 and PS0 to logic 1

MD2 will be set to logic 1, MD1 to logic 0 and MD0 to logic 0

SC1 will be set to logic 0 and SC0 to logic 1

P0 will be set to logic 1

RF0 will be set to logic 1

T0 will be set to logic 0.

The protocol to the TDA8822 is illustrated in Table 10.

Table 10 Example of programming for the TDA8822.

BYTE

MSB

LSB

ACKNOWLEDGE

BIT 7

BIT 6

BIT 5

BIT 4

BIT 3

BIT 2

BIT 1

BIT 0

Address byte CA

ACK

F1: frequency
byte 1

ACK

F0: frequency
byte 0

ACK

C1: control byte 1

ACK

C0: Control byte 0

ACK

osc

ref

-----------------

471 250 000

7 812.5

------------------------------

7540

01110101110100

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).

HANDLING

Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it
is desirable to take normal precautions appropriate to handling integrated circuits. The IC withstands the ESD test in
accordance with the

"UZW-B0/FQ-A302" specification equivalent to the "MIL-STD-883C category B" (2000 V). The IC

withstands the ESD test in accordance with Philips Semiconductors Machine Model (MM), specification
"UZW-B0/FQ-B302", issue date November 6

, 1990,(0

, 200 pF, 200 V).

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

MIN.

MAX.

UNIT

CCA

analog supply voltage

0.3

+7.0

CCD

digital supply voltage

0.3

+7.0

operating supply voltage

4.5

5.5

max

maximum voltage on all pins except SCL, SDA and VVT

0.3

BUS(max)

maximum voltage on SCL and SDA pins

0.3

+7.0

VVT(max)

maximum voltage on VVT pin

0.3

+35.0

stg

storage temperature

+125

amb

operating ambient temperature

+85

SYMBOL

PARAMETER

VALUE

UNIT

th j-a

thermal resistance from junction to ambient in free air

SO24; SOT137-1

K/W

SSOP24; SOT340-1

120

K/W

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

CHARACTERISTICS
V

CCA

= V

CCD

= 5 V; T

amb

= 25

C; in PAL B/G, PAL I, PAL D/K, or NTSC; MD setting = 4; DEV setting = 2;

PS setting = 1; video input signal = 500 mV (p-p) EBU colour bars; audio input signal = 45 mV (p-p) 1 kHz sine wave;
unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

power supply current

analog and digital parts

Video characteristics

VIDEO

video input current

0.5

2.0

VIDEO

video input impedance

modulation depth

part-to-part variation;
MD setting = 4

77.5

82.5

87.5

d(clip)

modulation depth during clipping
condition

video input level lower
than 1 V (p-p)

d(TPSG)

modulation depth when TPSG mode
on

part to part variation,
MD setting = 4

72.5

82.5

92.5

d(APL)

variation of the modulation depth with
change of APL between 10 and 90%

reference for APL = 50%

S/N

video signal-to-noise ratio

note 1

diff

differential gain

note 2

diff

differential phase

note 2

deg

V/S

video-to-sync ratio

input signal: V/S = 7 : 3

6.9 : 3.1 7 : 3

7.1 : 2.9

video

frequency response for the video
signal

note 3

Audio characteristics

AUDIO

audio input impedance

without any resistor
between AUDIO and
AGND

modulation deviation

SC setting = 1, 2 or 3;
DEV setting = 2

kHz

SC setting = 0;
DEV setting = 2

12.5

kHz

m(max)

maximum modulation deviation

AUDIO

= 500 mV (p-p);

note 4

180

250

kHz

THD

total harmonic distortion

50 mV (p-p) sine wave at
1 kHz on AUDIO pin

0.4

1.0

S/N

audio signal-to-noise ratio

note 5

AUDIO

frequency response of the audio signal note 6

sc(acc)

sound subcarrier accuracy

note 7

kHz

P/S

picture-to-sound ratio

no audio signal; no video
signal; PS setting = 1

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

NICAM characteristics

NICAM

NICAM input impedance

P/N

level between picture carrier and
NICAM carrier

NICAM input
level = 150 mV (p-p);
no video signal

NICAM

frequency response of the NICAM
input

for frequencies between 5
and 8 MHz; reference for
6.5 MHz

BER

bit error rate

note 11

EHD

eye-height degradation

note 11

Channel characteristics

RF frequency range

with application VHF 1

MHz

with application VHF 3

174

230

MHz

with application UHF

470

860

MHz

RF(acc)

picture carrier accuracy

note 7

+75

kHz

output level on RF outputs during sync.
pulse, loaded with 75

between 45 and 860 MHz 77

RF(flat)

flatness of the RF output level across
each band

reference is centre of
each band

o(RF)

RF output impedance

single ended

SPU

spurious outside channel

note 8

dBc

SPU

2PC

RF second harmonic level

on asymmetrical output at
low end of UHF band

dBc

SPU

2SC

sound carrier second harmonic level

dBc

SPU

3SC

sound carrier third harmonic level

dBc

SPU

fref

reference frequency spurious

measured with Philips
application board

dBc

CHR

BEAT

chroma beat

note 9

dBc

NIC

BEAT

NICAM beat

note 10

dBc

Video charge pump output and video tuning amplifier: VCP and VVT

VCP

output current

VCP(lk)

off-state leakage current

VVT(min)

minimum tuning voltage on pin VVT

27 k

resistor between

pin VVT and +33 V

0.2

VVT(lk)

leakage current on pin VVT

27 k

resistor between

pin VVT and +33 V; high
impedance test mode

Audio charge pump output: ACP

ACP

output current

ACP(lk)

off-state leakage current

ACP

tuning voltage range for the audio PLL,
on pin ACP

1.5

4.5

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

Notes

1. Ratio between the CCIR 17-line bar amplitude (corresponding to the level difference between black and white;

see Fig.4) and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after
demodulation. Measurement is done for frequencies between 200 kHz and 5 MHz. Measurement is unweighted.

2. Measured on CCIR 330 line, corresponding to a 5-step staircase with a chroma carrier of amplitude equal to 0.3

times the voltage between sync pulse and white (see Fig.5). The video signal is 500 mV (p-p). The modulation depth
is adjusted using the I

C-bus to MD setting = 4 (82.5% typical modulation depth).

3. Measured with a spectrum analyser with `peak hold' function, applying a 500 mV (p-p) sine wave at the video input

of the IC, with a sweeping frequency between 0.5 and 6.0 MHz. The reference is the value measured at 1.0 MHz.

4. To have a deviation between 50 and 250 kHz, the audio frequency must be higher than 100 Hz.

5. Measured with an audio frequency of 1 kHz with a level adjusted to get a deviation of 50 kHz with DEV setting = 2,

using CCIR 468-3 weighting filter, with a quasi-peak detection. The input signal has pre-emphasis and the receiver
has de-emphasis. Video signal is 500 mV (p-p) EBU colour bars on pin VIDEO.

XTAL characteristics

XTAL

XTAL input impedance

absolute value;
with a 4 MHz crystal

600

1200

Output Port characteristics

PORT

low voltage

port on; I

PORT

= 10 mA

150

400

PORT(lk)

off-state leakage current

port off; V

CCD

= 5.5 V

PORT(sink)

sinking current in the port

port on

TPSG pin characteristics

TPSG(on)

voltage on pin TPSG to switch the
TPSG on

1.5

TPSG(off)

voltage on pin TPSG to switch the
TPSG off

3.0

CCD

TPSGL

LOW input current in pin TPSG

TPSG to DGND

100

TPSGH

HIGH input current in pin TPSG

TPSG to V

CCD

100

TPSG(sink)

output sinking current in pin TPSG

TPSG set on using
I

C-bus

TPSG(sink)

voltage on pin TPSG used as output

TPSG set on using
I

C-bus

150

400

C-bus receiver characteristics, pins SCL and SDA

SCL

frequency on SCL line

100

kHz

HIGH level input voltage

5.5

LOW level input voltage

1.5

HIGH level input current

= 5 V; V

CCD

= 0 or 5 V

LOW level input current

= 0 V; V

CCD

= 0 or 5 V

SDA(ack)

acknowledge output voltage on SDA

during acknowledge
pulse; I

= 3 mA

0.4

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

6. Measured with no pre-emphasis on the audio input and no de-emphasis in the receiver. Measurement is done for

frequencies between 50 Hz and 15 kHz, reference is the level measured at 1 kHz.

7. The accuracy only depends on the accuracy of the reference frequency (accuracy of the crystal). Notice that the

value of the capacitor in series with the crystal must be chosen to be as close as possible to the load capacitance of
the crystal.

8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator

frequency and the sound oscillator frequency (f

+ 2f

, 2f

+ f

, etc.). This measurement includes the spurious at

the

and

RF.

9. Chroma beat

a) For PAL: measured applying a 4.43 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 1.07 MHz for PAL B/G, 1.57 MHz for PAL I and 2.07 MHz for PAL D/K.

b) For NTSC: measured applying a 3.58 MHz sine wave of 200 mV (p-p) at the video input. Measurement is the

difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 920 kHz.

10. NICAM beat

a) For PAL B/G: measured applying a sine wave of 150 mV (p-p) at 5.85 MHz on the NICAM input. Measurement

is the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 350 kHz or 5.15 MHz.

b) For PAL I: measured applying a sine wave of 150 mV (p-p) at 6.552 MHz on the NICAM input. Measurement is

the difference between the level of the unmodulated picture carrier and the level of the spike appearing at the
frequency of the picture carrier plus 552 kHz or 5.448 MHz.

11. NICAM eye height and Bit Error Rate measurement conditions:

a) A NICAM frame is applied from a Textronix 728E in B/G mode on the NICAM input of the TDA8822 through an

attenuator to get 150 mV (p-p). The sound subcarrier is set to 5.5 MHz (SC = 1) and the picture to sound ratio is
set to -12 dB (PS = 1). There is no video signal applied to the video input and no audio signal on the audio input.

b) The RF carrier is demodulated with a Rohde & Schwartz EMFP demodulator for PAL B/G, the sound trap filter is

set off, and the video signal is fed to a Textronix 728D NICAM demodulator for B/G. Measurements of the eye
height and bit error rate are done on the 728D.

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

Application design

In the design of the application, it is highly recommended to separate the part of the RF oscillator as much as possible
from the part of the RF outputs in order to avoid parasitic coupling between these two parts.

A good solution is shielding the RF oscillator part to avoid radiation from and to this part. The pin OGND must be
connected to the shielding box and to ground.

The frequency range the IC covers is fixed by the choice of the components marked with a note (1) in Fig.7. For these
components, it is recommended to use the values indicated in Table 11.

Table 11 Components to be used for the RF oscillator

BAND

FREQUENCY

RANGE

VALUE FOR

C4, C5, C7, C8

VALUE

FOR C6

L1: NUMBER

OF TURNS

L1:COIL

DIAMETER

L1: WIRE

DIAMETER

VHF1

47 to 130 MHz

5.6 pF

100 pF

BB132

14.5

3.0 mm

0.3 mm

VHF3

130 to 350 MHz

4.7 pF

150 pF

BB133

4.5

3.0 mm

0.4 mm

UHF

470 to 860 MHz

1.8 pF

22 pF

BB134

1.5

2.5 mm

0.5 mm

Video input (pin 24)

The video input level on the IC is of 500 mV (p-p). In most
of the cases, the available video signals are of 1 V (p-p)
with a source impedance of 75

To handle this kind of signal, we use a resistive divider with
two 470

resistors (R24 and R25 in Fig.7) to divide the

1 V (p-p) signal down to 500 mV (p-p). In order to get an
input impedance of 75

, a resistor of 82

is implemented

in parallel to the divider (R26 in Fig.7).

Audio pre-emphasis

The capacitor C22 connected in parallel with R27 is
defining the time constant for the pre-emphasis following
Table 12.

Table 12 Choice of the pre-emphasis constant

Note

1. This mode has to be considered if the pre-emphasis is

applied else-where on the path of the audio signal, or
if there is no need for pre-emphasis in specific
applications. Note also that the pre-emphasis can be
done by connecting a capacitor between pin
PREEMPH (pin 3) and ground. The value for this
capacitor is 10 nF for PAL and 15 nF for NTSC.

STANDARD

CAPACITOR

C22

TIME

CONSTANT

NTSC

330 pF

PAL

220 pF

special; note 1

no capacitor

Audio input (pin 22)

The IC is sensitive to 45 mV (p-p) on pin AUDIO and the
DC voltage on this pin is close to 0 V.

This pin needs to be grounded through a 12 k

resistor

(R22 in Fig.7). Care must then be taken if a coupling
capacitor needs to be implemented on the audio path to
connect it between the signal source and the input, with
the resistor of 12 k

still connected to the AUDIO pin.

NICAM input (pin 21)

The NICAM pin is sensitive to 150 mV (p-p) to reach a
level between picture carrier and NICAM carrier of typical

20 dBc.

It is possible to put on this pin either a NICAM modulated
carrier for a NICAM application or a frequency modulated
carrier for the stereo system with a second FM carrier used
e.g. in Germany.

In a specific application where the main sound subcarrier
would be generated outside the IC, it is also possible to
inject the main sound carrier to this pin, with a level
depending on the wanted P/S. In this event, it is necessary
to stop the internal sound oscillator by setting RF0 to
logic 0 and TPSG to logic 1 (see Table 8).

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

TPSG input/output (pin 17)

As already mentioned, this pin can be used either as an
input or as an output.

As an input, it allows to turn on the TPSG, without
changing anything to the word the TDA8822 is
programmed through the I

C-bus.

In this mode, it is simply necessary to connect a switch
between the pin TPSG and DGND (see Fig.8). If the
switch is open, then the TPSG is selected
corresponding to the I

C-bus programming; if the switch

is closed, then the TPSG is on.

As an output, it allows to indicate e.g. with an LED that
the TPSG has been programmed on using the I

C-bus.

In this mode, the pin acts as an open-collector output
port, it is possible to connect a LED to the 5 V power
supply with a series resistor to limit the current to about
10 mA (see Fig.9).

XTAL pin (pin 12)

This pin is connected to a 4 MHz crystal in series with a
capacitor. The value of this capacitor has to be as close as
possible to the load capacitance of the crystal.

It is also possible to drive the IC with an external 4 MHz
signal from a voltage source. A level of 50 mV(RMS)
insures stable operation. A capacitor of about 18 pF and a
resistor of 680

needs to be placed in series with the

voltage source.

ACP pin (pin 2)

This pin is the charge pump output for the sound subcarrier
PLL as well as the input of the sound subcarrier VCO.

It is necessary to connect the loop filter between this pin
and ground. The loop filter indicated in Fig.7 gives a cut-off
frequency lower than 20 Hz.

If a cutoff frequency slightly higher than 20 Hz can be
accepted, it is possible to reduce the value of the 2.2

capacitor (C2) to 220 nF. In this case C26 needs to be
changed from 68 nf to 22 nF and R3 needs to be changed
from 4.7 k

to 33 k

RF outputs (pins 18 and 19)

For inexpensive applications, it is possible to use the IC
with an asymmetrical output.

In an asymmetrical application, the unused output pin
must be loaded with a load as close as possible to the load
connected to the used pin.

A good improvement in performance is obtained using a
symmetrical to asymmetrical transformer
(balun; balance-to-unbalance) connected between the two
outputs. In this event both outputs have their loads
matched. The level of the RF second harmonic, and the
spurious outside channel is decreasing. The parasitic
coupling between RF outputs and RF oscillator is also
reduced.

RF harmonics

This IC has been designed to have the lowest level of
unwanted RF harmonics at the frequencies where these
are the hardest to be filtered out, especially for the second
harmonic of the RF carrier at the lowest frequencies of the
UHF band.

It is possible to reduce the level of the second harmonic by
using a wide-band transformer at the output of the IC and
create a symmetrical application.

To reduce the out-of-band harmonics and especially the
third one, it is necessary to use a low-pass filter at the
output of the IC.

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

PACKAGE OUTLINES

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

2.65

0.30
0.10

2.45
2.25

0.49
0.36

0.32
0.23

15.6
15.2

7.6
7.4

1.27

10.65
10.00

1.1
1.0

0.9
0.4

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1
0.4

SOT137-1

detail X

(A )

0.25

075E05

MS-013AD

pin 1 index

0.10

0.012
0.004

0.096
0.089

0.019
0.014

0.013
0.009

0.61
0.60

0.30
0.29

0.050

1.4

0.055

0.419
0.394

0.043
0.039

0.035
0.016

0.01

0.25

0.01

0.004

0.043
0.016

0.01

10 mm

scale

SO24: plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

95-01-24
97-05-22

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO and
SSOP packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

SSOP

Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

ETHOD

(SO

AND

SSOP)

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1997 Jan 08

Philips Semiconductors

Preliminary specification

Universal I

C-bus programmable RF

modulator

TDA8822

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

C COMPONENTS

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Purchase of Philips I

C components conveys a license under the Philips' I

C patent to use the

components in the I

C system provided the system conforms to the I

C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA53

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Printed in The Netherlands

537021/50/01/pp28

Date of release: 1997 Jan 08

Document order number:

9397 750 01601

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ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA8822