TDA8941P
1.5 W mono Bridge Tied Load (BTL) audio amplifier
Rev. 02 -- 7 April 2000
Product specification
c
c
1.
General description
The TDA8941P is a single-channel audio power amplifier with an output power of
1.5 W at an 16
load and a 9 V supply. The circuit contains a Bridge Tied Load
(BTL) amplifier with an all-NPN output stage and standby/mute logic. The TDA8941P
comes in a 8-pin dual in-line (DIP8) package. The TDA8941P is printed-circuit board
(PCB) compatible with all other types in the TDA894x family. One PCB footprint
accommodates both the mono and the stereo products.
2.
Features
s
Few external components
s
Fixed gain
s
Standby and mute mode
s
No on/off switching plops
s
Low standby current
s
High supply voltage ripple rejection
s
Outputs short-circuit protected to ground, supply and across the load
s
Thermally protected
s
Printed-circuit board compatible.
3.
Applications
s
Mains fed applications (e.g. TV sound)
s
PC audio
s
Portable audio.
4.
Quick reference data
Table 1:
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
V
CC
supply voltage
6
9
18
V
I
q
quiescent supply current
V
CC
= 9 V; R
L
=
-
14
20
mA
I
stb
standby supply current
-
-
10
A
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
2 of 21
9397 750 06864
Philips Electronics N.V. 2000. All rights reserved.
5.
Ordering information
6.
Block diagram
P
o
output power
THD = 10%; R
L
= 16
;
V
CC
= 9 V
1.2
1.5
-
W
THD
total harmonic distortion
P
o
= 0.5 W
-
0.03
0.3
%
G
v
voltage gain
31
32
33
dB
SVRR
supply voltage ripple
rejection
50
65
-
dB
Table 1:
Quick reference data
...continued
Symbol Parameter
Conditions
Min
Typ
Max
Unit
Table 2:
Ordering information
Type number
Package
Name
Description
Version
TDA8941P
DIP8
plastic dual in-line package; 8 leads (300 mil)
SOT97-1
Fig 1.
Block diagram.
idth
MGL579
STANDBY/
MUTE LOGIC
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
20
k
20
k
5
TDA8941P
3
2
7
4
6
VCC
VCC
8
1
OUT
+
GND
SVR
OUT
-
IN
-
IN
+
MODE
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
3 of 21
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7.
Pinning information
7.1 Pinning
7.2 Pin description
8.
Functional description
The TDA8941P is a mono BTL audio power amplifier capable of delivering 1.5 W
output power to an 16
load at THD = 10%, using a 9 V power supply. The voltage
gain is fixed at 32 dB.
With the three-level MODE input the device can be switched from `standby' to `mute'
and to `operating' mode.
The TDA8941P outputs are protected by an internal thermal shutdown protection
mechanism and a short-circuit protection.
8.1 Input configuration
The TDA8941P inputs can be driven symmetrical (floating) as well as asymmetrical.
In the asymmetrical mode one input pin is connected via a capacitor to the signal
ground which should be as close as possible to the SVR (electrolytic) capacitor
ground. Note that the DC level of the input pins is half of the supply voltage V
CC
, so
coupling capacitors for both pins are necessary.
Fig 2.
Pin configuration.
handbook, halfpage
1
2
3
4
8
7
6
5
MGR892
TDA8941P
OUT
+
GND
SVR
VCC
OUT
-
IN
-
IN
+
MODE
Table 3:
Pin description
Symbol
Pin
Description
V
CC
1
supply voltage
OUT+
2
positive loudspeaker terminal
IN+
3
positive input
MODE
4
mode selection input (standby, mute, operating)
IN
-
5
negative input
SVR
6
half supply voltage decoupling (ripple rejection)
OUT
-
7
negative loudspeaker terminal
GND
8
ground
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
4 of 21
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The input cut-off frequency is:
(1)
For R
i
= 45 k
and C
i
= 220 nF:
(2)
As shown in
Equation 1
and
2
, large capacitor values for the inputs are not
necessary
;
so the switch-on delay during charging of the input capacitors, can be
minimized. This results in a good low frequency response and good switch-on
behaviour.
Remark: To prevent HF oscillations do not leave the inputs open, connect a capacitor
of at least 1.5 nF across the input pins close to the device.
8.2 Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier with an all-NPN output
stage, capable of delivering a peak output current of 2 A.
The BTL principle offers the following advantages:
Lower peak value of the supply current
The ripple frequency on the supply voltage is twice the signal frequency
No expensive DC-blocking capacitor
Good low frequency performance.
8.2.1
Output power measurement
The output power as a function of the supply voltage is measured on the output pins
at THD = 10%; see
Figure 8
. The maximum output power is limited by the maximum
power dissipation in the plastic package.
8.2.2
Headroom
Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom
compared to the average power output for transferring the loudest parts without
distortion. At V
CC
= 9 V, R
L
= 16
and P
o
= 1 W at THD = 1% (see
Figure 6
), the
Average Listening Level (ALL) music power without any distortion yields:
P
o(ALL)
= 1 W/15.85 = 63 mW.
The power dissipation can be derived from
Figure 11 on page 10
for 0 dB
respectively 12 dB headroom.
f
i cut
off
(
)
1
2
R
i
C
i
(
)
-----------------------------
=
f
i cut
off
(
)
1
2
45
10
3
220
10
9
(
)
-----------------------------------------------------------------
16 Hz
=
=
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
5 of 21
9397 750 06864
Philips Electronics N.V. 2000. All rights reserved.
For the average listening level a power dissipation of 0.6 W can be used for
calculation of the maximum ambient temperature.
8.3 Mode selection
The TDA8941P has three functional modes, which can be selected by applying the
proper DC voltage to pin MODE. See
Figure 4
and
5
for the respective DC levels,
which depend on the supply voltage level. The MODE pin can be driven by a 3-state
logic output stage: e.g. a microcontroller with additional components for DC-level
shifting.
Standby -- In this mode the current consumption is very low and the outputs are
floating. The device is in standby mode when (V
CC
-
0.5 V) < V
MODE
< V
CC
, or when
the MODE pin is left floating (high impedance). The power consumption of the
TDA8941P will be reduced to <0.18 mW.
Mute -- In this mode the amplifier is DC-biased but not operational (no audio output);
t
he DC level of the input and output pins remain on half the supply voltage. This
allows the input coupling and Supply Voltage Ripple Rejection (SVRR) capacitors to
be charged to avoid pop-noise. The device is in mute mode when
3 V < V
MODE
< (V
CC
-
1.5 V).
Operating -- In this mode the amplifier is operating normally. The operating mode is
activated at V
MODE
< 0.5 V.
8.3.1
Switch-on and switch-off
To avoid audible plops during supply voltage switch-on or switch-off, the device is set
to standby mode before the supply voltage is applied (switch-on) or removed
(switch-off).
The switch-on and switch-off time can be influenced by an RC-circuit on the MODE
pin. Rapid on/off switching of the device or the MODE pin may cause `click- and
pop-noise'. This can be prevented by proper timing of the RC-circuit on the MODE
pin.
8.4 Supply Voltage Ripple Rejection (SVRR)
The SVRR is measured with an electrolytic capacitor of 10
F on pin SVR at a
bandwidth of 10 Hz to 80 kHz.
Figure 12 on page 11
illustrates the SVRR as function
of the frequency. A larger capacitor value on the SVR pin improves the ripple rejection
behaviour at the lower frequencies.
Table 4:
Power rating as function of headroom
Headroom
Power output (THD = 1%)
Power dissipation (P)
0 dB
P
o
= 1 W
1.15 W
12 dB
P
o(ALL)
= 63 mW
0.6 W
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
6 of 21
9397 750 06864
Philips Electronics N.V. 2000. All rights reserved.
8.5 Built-in protection circuits
The TDA8941P contains two types of protection circuits, i.e. short-circuit and thermal
shutdown.
8.5.1
Short-circuit protection
Short-circuit to ground or supply line -- This is detected by a so-called `missing
current' detection circuit which measures the current in the positive supply line and
the current in the ground line. A difference between both currents larger than 0.4 A,
switches the power stage to standby mode (high impedance).
Short-circuit across the load -- This is detected by an absolute-current
measurement. An absolute-current larger than 2 A, switches the power stage to
standby mode (high impedance).
8.5.2
Thermal shutdown protection
The junction temperature is measured by a temperature sensor; at a junction
temperature of approximately 150
C this detection circuit switches the power stage
to standby mode (high impedance).
9.
Limiting values
10. Thermal characteristics
Table 5:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
V
CC
supply voltage
no signal
-
0.3
+25
V
operating
-
0.3
+18
V
V
I
input voltage
-
0.3
V
CC
+ 0.3 V
I
ORM
repetitive peak output current
-
2
A
T
stg
storage temperature
non-operating
-
55
+150
C
T
amb
operating ambient
temperature
-
40
+85
C
P
tot
total power dissipation
-
1.25
W
V
CC(sc)
supply voltage to guarantee
short-circuit protection
-
12
V
Table 6:
Thermal characteristics
Symbol
Parameter
Conditions
Value Unit
R
th(j-a)
thermal resistance from junction to ambient
in free air
100
K/W
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
7 of 21
9397 750 06864
Philips Electronics N.V. 2000. All rights reserved.
11. Static characteristics
[1]
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the differential
output voltage offset
(
V
OUT
) divided by the load resistance (R
L
).
[2]
The DC output voltage with respect to ground is approximately 0.5V
CC
.
[3]
V
OUT
=
|
V
OUT+
-
V
OUT
-
|
.
Table 7:
Static characteristics
V
CC
= 9 V; T
amb
= 25
C; R
L
= 16
; V
MODE
= 0 V; V
i
= 0 V; measured in test circuit
Figure 13
; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
V
CC
supply voltage
operating
6
9
18
V
I
q
quiescent supply current
R
L
=
[1]
-
14
20
mA
I
stb
standby supply current
V
MODE
= V
CC
-
-
10
A
V
O
DC output voltage
[2]
-
4.5
-
V
V
OUT
[3]
differential output voltage offset
-
-
200
mV
V
MODE
mode selection input voltage
operating mode
0
-
0.5
V
mute mode
3
-
V
CC
-
1.5
V
standby mode
V
CC
-
0.5
-
V
CC
V
I
MODE
mode selection input current
0 < V
MODE
< V
CC
-
-
20
A
Fig 3.
Quiescent supply current as function of supply
voltage.
Fig 4.
Quiescent supply current as function of mode
voltage.
handbook, halfpage
30
20
25
15
10
5
0
0
4
8
12
16
VCC (V)
Iq
(mA)
20
MGU022
handbook, halfpage
20
16
12
8
4
0
0
2
4
6
8
VMODE (V)
Iq
(mA)
10
12
MGU023
VCC = 11 V
9 V
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
8 of 21
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Philips Electronics N.V. 2000. All rights reserved.
12. Dynamic characteristics
[1]
The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance
R
S
= 0
at the input.
[2]
Supply voltage ripple rejection is measured at the output, with a source impedance R
S
= 0
at the input. The ripple voltage is a sine
wave with a frequency f
ripple
and an amplitude of 700 mV (RMS), which is applied to the positive supply rail.
[3]
Output voltage in mute mode is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, so including noise.
Table 8:
Dynamic characteristics
V
CC
= 9 V; T
amb
= 25
C; R
L
= 16
; f = 1 kHz; V
MODE
= 0 V; measured in test circuit
Figure 13
; unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
P
o
output power
THD = 10%
1.2
1.5
-
W
THD = 0.5%
0.8
1
-
W
THD
total harmonic distortion
P
o
= 0.5 W
-
0.03
0.3
%
G
v
voltage gain
31
32
33
dB
Z
i(dif)
differential input impedance
70
90
110
k
V
n(o)
noise output voltage
[1]
-
90
120
V
SVRR
supply voltage ripple rejection
f
ripple
= 1 kHz
[2]
50
65
-
dB
f
ripple
= 100 Hz
to 20 kHz
[2]
-
60
-
dB
V
o(mute)
output voltage
mute mode
[3]
-
-
50
V
Fig 5.
Output voltage as function of mode voltage.
handbook, full pagewidth
VMODE (V)
12
MGU025
8
4
2
6
10
0
Vo
(V)
10
-
1
10
1
10
-
4
10
-
3
10
-
2
10
-
5
VCC = 11 V
9 V
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
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a.
V
CC
= 9 V; R
L
= 16
; f = 1 kHz.
b.
V
CC
= 11 V; R
L
= 25
; f = 1 kHz.
(1) Measured on the standard printed-circuit board without an additional heatsink (see
Figure 14
). These curves Influence of
thermal feedback caused by the high power dissipation in combination with the high thermal resistance of the plastic
package.
(2) Measured with a small heatsink on top of the plastic package body; R
th(h-a)
= 30 K/W.
Fig 6.
Total harmonic distortion as function of output power.
handbook, halfpage
THD
(%)
10
-
2
10
1
10
-
1
Po (W)
10
2
10
1
10
-
1
10
-
2
MGU018
(1)
(2)
handbook, halfpage
THD
(%)
10
-
2
10
1
10
-
1
Po (W)
10
2
10
1
10
-
1
10
-
2
MGU019
(1)
(2)
a.
V
CC
= 9 V; R
L
= 16
; P
o
= 0.1 W.
b.
V
CC
= 9 V; R
L
= 16
; P
o
= 0.5 W.
No bandpass filter applied.
(1) Measured on the standard printed-circuit board without an additional heatsink (see
Figure 14
). These curves Influence of
thermal feedback caused by the high power dissipation in combination with the high thermal resistance of the plastic
package.
(2) Measured with a small heatsink on top of the plastic package body; R
th(h-a)
= 30 K/W.
Fig 7.
Total harmonic distortion as function of frequency.
handbook, halfpage
THD
(%)
10
10
5
10
2
10
3
10
4
f (Hz)
1
10
10
-
1
10
-
2
MGU021
(1)
(2)
handbook, halfpage
THD
(%)
10
10
5
10
2
10
3
10
4
f (Hz)
1
10
10
-
1
10
-
2
MGU020
(1)
(2)
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
10 of 21
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Philips Electronics N.V. 2000. All rights reserved.
THD = 10%; f = 1 kHz.
THD = 1%.
Fig 8.
Output power as function of supply voltage.
Fig 9.
Total power dissipation as function of supply
voltage.
(1) V
CC
= 9 V.
(2) V
CC
= 11 V.
(1) V
CC
= 9 V; R
L
= 16
.
(2) V
CC
= 11 V; R
L
= 25 V.
Fig 10. Efficiency as function of output power.
Fig 11. Power dissipation as function of output power.
handbook, halfpage
3
2
2.5
1
0.5
1.5
0
0
2
4
6
8
VCC (V)
Po
(W)
14
10
12
MGU026
RL = 16
25
handbook, halfpage
2
1
0.5
1.5
0
0
2
4
6
8
VCC (V)
Ptot
(W)
14
10
12
MGU027
RL = 16
25
handbook, halfpage
100
80
60
40
20
0
0
0.5
1
1.5
2
Po (W)
(%)
2.5
MGU029
(1)
(2)
handbook, halfpage
2
1.5
1
0.5
0
0
0.5
1
1.5
2
Po (W)
P
(W)
2.5
MGU028
(2)
(1)
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
11 of 21
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V
CC
= 9 V; R
S
= 0
; V
ripple
= 700 mV (RMS); no bandpass filter applied.
Curve A: inputs short-circuited
Curve B: inputs short-circuited and connected to ground (asymmetrical application)
Fig 12. Supply voltage ripple rejection as function of frequency.
handbook, full pagewidth
SVRR
(dB)
10
2
10
3
10
4
10
5
10
f (Hz)
-
20
0
-
40
-
60
-
80
MGU024
B
A
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
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13. Internal circuitry
Table 9:
Internal circuitry
Pin
Symbol
Equivalent circuit
3 and 5
IN+ and IN
-
7 and 2
OUT
-
and OUT+
4
MODE
6
SVR
1.5 k
1.5 k
45 k
45 k
VCC
VCC
VCC
MGU082
1/2 VCC
(SVR)
5
3
40
100
MGU083
2, 7
1/2 VCC
1 k
20 k
OFF
HIGH
MUTE
HIGH
1 k
VCC
VCC
VCC
MGU073
4
Standby
20 k
20 k
VCC
MGU084
6
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
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14. Application information
14.1 Printed-circuit board (PCB)
14.1.1
Layout and grounding
For a high system performance level certain grounding techniques are essential.
The input reference grounds have to be tied with their respective source grounds and
must have separate tracks from the power ground tracks; this will prevent the large
(output) signal currents from interfering with the small AC input signals.
The small-signal ground tracks should be physically located as far as possible from
the power ground tracks. Supply and output tracks should be as wide as possible for
delivering maximum output power.
Fig 13. Application diagram.
handbook, full pagewidth
1
OUT
-
Rs
Symmetrical
input
RL
16
OUT
+
GND
MGU016
IN
-
IN
+
MODE
SVR
220 nF
5
3
4
6
7
2
8
+
VCC
1000
F
100 nF
20 k
20 k
10
F
-
-
-
+
+
+
+
-
Ri
45 k
Ri
45 k
30 k
30 k
R
C1
C2
R
VCC
VCC
signal
GND
TDA8941P
signal
GND
SHORT CIRCUIT
AND
TEMPERATURE
PROTECTION
STANDBY/
MUTE LOGIC
MICROCONTROLLER
Standby
MODE
Mute
On
0
0
1
0
C1
C2
1
0
1/2 VCC
220 nF
1.5
nF
Ci
Rs
Asymmetrical
input
220 nF
220 nF
Ci
1/2 VCC
1/2 VCC
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
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14.1.2
Power supply decoupling
Proper supply bypassing is critical for low-noise performance and high supply voltage
ripple rejection. The respective capacitor locations should be as close as possible to
the device and grounded to the power ground. Proper power supply decoupling also
prevents oscillations.
For suppressing higher frequency transients (spikes) on the supply line a capacitor
with low ESR typical 100 nF has to be placed as close as possible to the device.
For suppressing lower frequency noise and ripple signals, a large electrolytic
capacitor e.g. 1000
F or greater must be placed close to the device.
The bypass capacitor on the SVR pin reduces the noise and ripple on the midrail
voltage. For good THD and noise performance a low ESR capacitor is recommended.
Fig 14. Printed-circuit board layout (single-sided); components view.
idth
MGU017
ON
MUTE
220 nF
100 nF
1.5 nF
1000
F
10
F
1
+
-
IN
-
IN
+
OUT
+
OUT
-
VCC
GND
54 mm
56 mm
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
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14.2 Thermal behaviour and T
amb(max)
calculation
The measured maximum thermal resistance of the IC package, R
th(j-a)
is 100 K/W.
A calculation for the maximum ambient temperature can be made, with the following
parameters:
V
CC
= 9 V and R
L
= 16
T
j(max)
= 150
C.
R
th(tot)
is the total thermal resistance between the junction and the ambient.
At V
CC
= 9 V and R
L
= 16
the measured worst-case sine-wave dissipation is
1.15 W; see
Figure 11
. For T
j(max)
= 150
C the maximum ambient temperature is:
T
amb(max)
= 150 1.15
100 = 35
C
The calculation above is for an application at worst-case (stereo) sine-wave output
signals. In practice music signals will be applied, which decreases the maximum
power dissipation to approximately half of the sine-wave power dissipation (see
Section 8.2.2
). For T
j(max)
= 150
C the maximum ambient temperature is:
T
amb(max)
= 150 0.6
100 = 90
C
To increase the lifetime of the IC, T
j(max)
should be reduced to 125
C. This results in:
T
amb(max)
= 125 0.6
100 = 65
C
15. Test information
15.1 Quality information
The
General Quality Specification for Integrated Circuits, SNW-FQ-611D is
applicable.
15.2 Test conditions
T
amb
= 25
C; V
CC
= 9 V; f = 1 kHz; R
L
= 16
; audio pass band 22 Hz to 22 kHz;
unless otherwise specified.
Remark: In the graphs as function of frequency no bandpass filter was applied;
see
Figure 7
and
12
.
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
16 of 21
9397 750 06864
Philips Electronics N.V. 2000. All rights reserved.
16. Package outline
Fig 15. DIP8 package outline.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT97-1
95-02-04
99-12-27
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
0.254
2.54
7.62
8.25
7.80
10.0
8.3
1.15
4.2
0.51
3.2
inches
0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12
0.01
0.10
0.30
0.32
0.31
0.39
0.33
0.045
0.17
0.020
0.13
b
2
050G01
MO-001
SC-504-8
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
8
1
5
4
b
E
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
17 of 21
9397 750 06864
Philips Electronics N.V. 2000. All rights reserved.
17. Soldering
17.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth
account of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of through-hole mount IC
packages on a printed-circuit board.
17.2 Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is 260
C; solder at this
temperature must not be in contact with the joints for more than 5 seconds. The total
contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the
plastic body must not exceed the specified maximum storage temperature (T
stg(max)
).
If the printed-circuit board has been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within the permissible limit.
17.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron
bit is less than 300
C it may remain in contact for up to 10 seconds. If the bit
temperature is between 300 and 400
C, contact may be up to 5 seconds.
17.4 Package related soldering information
[1]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the
printed-circuit board.
Table 10: Suitability of through-hole mount IC packages for dipping and wave soldering
methods
Package
Soldering method
Dipping
Wave
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable
[1]
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
18 of 21
9397 750 06864
Philips Electronics N.V. 2000. All rights reserved.
18. Revision history
Table 11: Revision history
Rev Date
CPCN
Description
02
20000407
-
Product specification; second version; supersedes initial version TDA8941P-01 of
14 April 1999 (9397 750 04876). Modifications:
Table 1 on page 1
:THD: Max value 0.1% changed to
0.3%;
SVRR: Typ value 65 dB
added
Ordering options removed
Section 8 "Functional description"
:
Section 8.1 "Input configuration" on page 3
added.
Section 8.2 "Power amplifier" on page 4
: ........, capable of delivering a peak output
current of 1.5 A
changed to 2 A.
Section 8.2.1 "Output power measurement" on page 4
added
Section 8.2.2 "Headroom" on page 4
added
Section 8.3 "Mode selection"
:
Standby mode: V
MODE
> (V
CC
-
0.5 V)
changed to (V
CC
-
0.5 V) < V
MODE
< V
CC
; The
power consumption of the
TDA8941P
will be reduced to <0.18 mW
added.
Mute mode: the DC level of the input and output pins remain on half the supply
voltage
added;
2.5 V < V
MODE
< (V
CC
-
1.5 V)
changed to 3 V < V
MODE
< (V
CC
-
1.5 V)
Section 8.3.1 "Switch-on and switch-off" on page 5
added.
Section 8.4 "Supply Voltage Ripple Rejection (SVRR)" on page 5
added
Section 8.5 "Built-in protection circuits" on page 6
added
Table 5 on page 6
:
P
tot
value added 1.25 W
V
CC(sc)
value added 12 V
Table 7 on page 7
: V
MODE
- mute mode - value Min 2.5
changed to 3 V
Table 8 on page 8
:
THD: Max value 0.1% changed to
0.3%
SVRR; Typ values 65 and 60 dB
added
R
source
changed to
R
S
in table and associated table notes
Table note [2]
: .... 100 mV (RMS).... changed to
... 700 mV (RMS)....
Figure 3
to
12
: figures added
Section 13 "Internal circuitry" on page 12
:
added
Figure 13
: figure modified
Section 14.1 "Printed-circuit board (PCB)" on page 13
:
added
Figure 14
: figure added
Section 14.2 "Thermal behaviour and T
amb(max)
calculation" on page 15
:
added
Section 15 "Test information" on page 15
: Section 15.1
updated
Section 15.2 "Test conditions" on page 15
:
added.
01
19990414
-
Preliminary specification; initial version.
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
19 of 21
9397 750 06864
Philips Electronics N.V. 2000 All rights reserved.
19. Data sheet status
[1]
Please consult the most recently issued data sheet before initiating or completing a design.
20. Definitions
Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
21. Disclaimers
Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes -- Philips Semiconductors reserves the right to
make changes, without notice, in the products, including circuits, standard
cells, and/or software, described or contained herein in order to improve
design
and/or
performance.
Philips
Semiconductors
assumes
no
responsibility or liability for the use of any of these products, conveys no
licence or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products
are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Datasheet status
Product status
Definition
[1]
Objective specification
Development
This data sheet contains the design target or goal specifications for product development. Specification may
change in any manner without notice.
Preliminary specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design and
supply the best possible product.
Product specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any
time without notice in order to improve design and supply the best possible product.
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
Product specification
Rev. 02 -- 7 April 2000
20 of 21
9397 750 06864
Philips Electronics N.V. 2000. All rights reserved.
Philips Semiconductors - a worldwide company
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see The Netherlands
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Tel. +359 268 9211, Fax. +359 268 9102
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International Marketing & Sales Communications,
Building BE, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 272 4825
Internet: http://www.semiconductors.philips.com
(SCA69)
Philips Electronics N.V. 2000.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 7 April 2000
Document order number: 9397 750 06864
Contents
Philips Semiconductors
TDA8941P
1.5 W mono BTL audio amplifier
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
5
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
8
Functional description . . . . . . . . . . . . . . . . . . . 3
8.1
Input configuration . . . . . . . . . . . . . . . . . . . . . . 3
8.2
Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4
8.2.1
Output power measurement . . . . . . . . . . . . . . . 4
8.2.2
Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
8.3
Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5
8.3.1
Switch-on and switch-off. . . . . . . . . . . . . . . . . . 5
8.4
Supply Voltage Ripple Rejection (SVRR) . . . . . 5
8.5
Built-in protection circuits . . . . . . . . . . . . . . . . . 6
8.5.1
Short-circuit protection . . . . . . . . . . . . . . . . . . . 6
8.5.2
Thermal shutdown protection . . . . . . . . . . . . . . 6
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
10
Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
11
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
12
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
13
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 12
14
Application information. . . . . . . . . . . . . . . . . . 13
14.1
Printed-circuit board (PCB). . . . . . . . . . . . . . . 13
14.1.1
Layout and grounding . . . . . . . . . . . . . . . . . . . 13
14.1.2
Power supply decoupling . . . . . . . . . . . . . . . . 14
14.2
Thermal behaviour and T
amb(max)
calculation . 15
15
Test information. . . . . . . . . . . . . . . . . . . . . . . . 15
15.1
Quality information . . . . . . . . . . . . . . . . . . . . . 15
15.2
Test conditions . . . . . . . . . . . . . . . . . . . . . . . . 15
16
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16
17
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
17.1
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . 17
17.2
Soldering by dipping or by solder wave . . . . . 17
17.3
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17
17.4
Package related soldering information . . . . . . 17
18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
19
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
21
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
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