ChipFind - документация

Электронный компонент: TDA9820

Скачать:  PDF   ZIP
DATA SHEET
Product specification
Supersedes data of March 1991
File under Integrated Circuits, IC02
1996 Nov 20
INTEGRATED CIRCUITS
TDA9820
Multistandard/dual channel TV FM
intercarrier sound demodulator
1996 Nov 20
2
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
FEATURES
Multistandard application for sound standards M, B/G, I
and D/K
Two alignment-free PLL FM demodulators
Four-input source selector for one of the two FM
demodulators
Automatic second sound carrier mute
Mono and dual channel application
Low power consumption
Few external components required.
GENERAL DESCRIPTION
The TDA9820 is a monolithic, integrated, multistandard TV
FM intercarrier sound demodulator for all FM standards.
The circuit contains two separate FM demodulators using
Phase Locked Loop (PLL) reference frequency
generation. The circuit requires a minimum number of
external components.
QUICK REFERENCE DATA
ORDERING INFORMATION
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
P
supply voltage (pin 14)
4.5
5.0
8.8
V
I
P
supply current (pin 14)
23
30
37
mA
I
M
AC peak current (pins 7 and 8)
-
-
1.5
mA
V
i(rms)
input signal (RMS value)
-
150
250
V
V
o(rms)
output signal (pins 7 and 8; RMS value)
f
i
=
50 kHz
0.4
0.5
0.6
V
signal plus noise-to-noise ratio
(pins 7 and 8)
in accordance with
"CCIR 468-3"
64
68
-
dB
8/7
crosstalk attenuation
f = 50 to 12500 Hz
60
70
-
dB
RR
supply voltage ripple rejection
(pins 7 and 8)
V
RR
< 200 mV; f = 70 Hz
16
20
-
dB
T
amb
operating ambient temperature
0
-
70
C
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
VERSION
TDA9820
DIP16
plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
TDA9820T
SO16
plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
S
N
+
N
--------------
40 dB
=
S
N
+
N
--------------
1996 Nov 20
3
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
BLOCK DIAGRAM
Fig.1 Block diagram.
(1) Resistor and potentiometer between capacitor and earth are inserted if adjustment of stereo channel separation is required.
handbook, full pagewidth
TDA9820
V =
4.5 to 8.8 V
P
(1)
CONTROL
UNIT
7-STAGE
LIMITER
AMPLIFIER 1
VCO 1
7-STAGE
LIMITER
AMPLIFIER 2
VCO 2
optional stereo
channel separation
adjustment
V
AF1
V
AF2
S
1
S
2
standard
switch
mute
intercarrier
VCO
ref
SUPPLY
11
12
14
13
15
16
1
3
2
10
MHA420
9
+
-
7
+
-
6
5
8
4.5 MHz (M)
5.5 MHz (B/G)
6.0 MHz (I)
6.5 MHz (D/K)
4.72 MHz (M)
5.74 MHz (B/G)
6.74 MHz (D/K)
or
or
(1)
Rs
Rpot
1996 Nov 20
4
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
PINNING
SYMBOL
PIN
DESCRIPTION
IN
1(B/G)
1
intercarrier input 1 at 5.5 MHz
IN
1(D/K)
2
intercarrier input 1 at 6.5 MHz
IN
1(M)
3
intercarrier input 1 at 4.5 MHz
n.c.
4
not connected
S
1
5
standard switch bit 1 input
S
2
6
standard switch bit 2 input
V
AF2
7
audio output voltage 2
V
AF1
8
audio output voltage 1
C
1
9
decoupling capacitor 1
C
2
10
decoupling capacitor 2
VCO
ref
11
VCO reference
C
STAB
12
supply voltage stabilization
GND
13
ground
V
P
14
supply voltage
IN
2
15
intercarrier input 2
IN
1(I)
16
intercarrier input 1 at 6.0 MHz
Fig.2 Pin configuration.
handbook, halfpage
TDA9820
MHA529
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
IN1(B/G)
IN1(D/K)
IN1(M)
S1
S2
VAF2
VAF1
n.c.
IN1(I)
IN2
VP
CSTAB
VCOref
C2
C1
GND
1996 Nov 20
5
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
FUNCTIONAL DESCRIPTION
The complete circuit consists of two separate channels,
each consisting of a limiter-amplifier, FM demodulator and
AF amplifier. Circuit operation is also described in Fig.1.
Source selector
The intercarrier signal is fed through external ceramic
band-pass filters which are tuned to the sound carrier
frequencies.
One of the four filtered sound carriers from
pins 1, 2, 3 or 16 is fed to limiter-amplifier 1 via the
appropriate electronic switch in the source selector.
The electronic switch of the sound carrier is selected by
the control unit (see Table 1).
The second sound carrier of the intercarrier signal is
directly fed from pin 15 to limiter-amplifier 2.
FM demodulators
Each limiter-amplifier is AC-coupled into a
FM demodulator. The integrated FM demodulator PLLs
are alignment-free. The FM demodulator outputs are
amplified to 500 mV (RMS value). High amplification and
DC error signals of the PLLs, which are superimposed on
the FM demodulator outputs, require DC decoupling at
pins 9 and 10 of the AF amplifier inputs.
Stereo channel separation adjustment (optional)
Optimal stereo channel separation is achieved by
adjusting V
AF1
(pin 8) and V
AF2
(pin 7) as follows:
1. V
AF1
by a resistor in series with the DC decoupling
capacitor at pin 9
2. V
AF2
by a variable resistor in series with the
DC decoupling capacitor on pin 10 to the same
voltage as V
AF1
.
Second sound carrier mute
The output of the second FM demodulator is muted when
the signal level (signal and/or noise) at pin 15 is less than
typically 0.5 mV (RMS value). This avoids an incorrect
stereo or dual sound identification when a mono signal is
transmitted. Therefore, with a mono transmission, there is
no audio output at pin 7. When the signal level at pin 15 is
greater than typically 1.0 mV (RMS value) mute is
switched off.
Control unit
The control unit selects the required sound standard
according to the voltages on pin 5 and pin 6. The control
unit performs the following:
1. selects the free-running frequencies of VCO1 and
VCO2
2. switches the source selector (the four possible
combinations are shown in Table 1).
Table 1
Logic table; note 1
Note
1. In columns S1 and S2: 0 = LOW and 1 = HIGH.
STANDARD
S1
(PIN 5)
S2
(PIN 6)
FREQUENCY VCO1
(MHz)
FREQUENCY VCO2
(MHz)
SOURCE SELECTOR
CONNECTION
B/G
1
1
5.5
5.74
pin 1
M
1
0
4.5
4.72
pin 3
I
0
1
6.0
off
pin 16
D/K
0
0
6.5
6.74
pin 2
1996 Nov 20
6
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
Notes
1. Equivalent to discharging a 200 pF capacitor via a 0
series resistor.
2. Equivalent to discharging a 100 pF capacitor via a 1.5 k
series resistor.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V
P
supply voltage (pin 14)
-
0.5
+9.0
V
V
i
input signal (pins 1, 2, 3, 15 and 16)
-
0.5
+5.0
V
V
sw
switching voltage (pins 5 and 6)
-
0.5
V
P
+ 0.5
V
t
s
short-circuit time (each pin except pins 13 and 14 to
be tested; one at the time)
-
10
s
T
stg
storage temperature
device
-
25
+125
C
device in packing
-
25
+85
C
T
j
junction temperature
-
150
C
T
amb
operating ambient temperature
0
70
C
V
es
electrostatic handling for all pins
note 1
-
500
+500
V
note 2
-
4000
+4000
V
SYMBOL
PARAMETER
VALUE
UNIT
R
th j-a
thermal resistance from junction to ambient in free air
TDA9820 (DIP16)
74
K/W
TDA9820T (SO16)
104
K/W
1996 Nov 20
7
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
CHARACTERISTICS
All voltages are measured to GND (pin 13); V
P
= 5 V; T
amb
= 25
C;
f
i
=
50 kHz; f
mod
= 1 kHz;
V
1, 2, 3, 16/15
= 10 mV (RMS value); measurements taken in Fig.5; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply (pin 14)
V
P
supply voltage
4.5
5.0
8.8
V
I
P
supply current
23
30
37
mA
Source selector and limiter-amplifier 1 (pins 1, 2, 3 and 16)
V
I
DC input voltage
activated input
2.25
2.5
2.75
V
not activated input
-
-
0.1
V
R
I
input resistance
activated input
480
600
720
not activated input
-
-
600
V
i(rms)
input signal (RMS value)
-
150
250
V
allowed input signal (RMS value)
200
-
-
mV
ct
crosstalk attenuation
not activated input to
activated input
40
50
-
dB
Limiter-amplifier 2
V
15
DC input voltage
2.25
2.5
2.75
V
V
15(rms)
input signal (RMS value)
; note 1
-
150
250
V
input signal for mute off (RMS value)
0.7
1.0
1.5
mV
allowed input signal (RMS value)
200
-
-
mV
R
15
input resistance
480
600
720
hysteresis of level detector
8
12
16
dB
PLL FM demodulators VCO1 and VCO2
f
VCO1
free-running frequencies
R
11
= 27 k
;
see Table 1
-
4.5
-
MHz
-
5.5
-
MHz
-
6.0
-
MHz
-
6.5
-
MHz
f
VCO2
free-running frequencies
R
11
= 27 k
;
see Table 1
-
4.7
-
MHz
-
5.7
-
MHz
-
6.7
-
MHz
f
fr
negative/positive free-running
frequency spread
-
-
10
%
D/
f
fr
drift of free-running frequencies
T
amb
= 0 to 70
C
-
500
750
kHz
f
fr(shift)
shift of free-running frequencies
4.5 V < V
P
< 8.8 V
-
200
300
kHz
f
fr(ar)
negative/positive adjustment range of
free-running frequencies
R
11
= 22 k
1
-
-
MHz
R
11
adjustment resistance for free-running
frequencies (pin 11)
15
-
29
k
S
N
+
N
--------------
40 dB
=
S
N
+
N
--------------
40 dB
=
1996 Nov 20
8
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
S
negative slope of free-running frequency
adjustment
R
11
= 22 k
-
200
-
kHz/k
f1
negative/positive catching range of PLLs
1.4
1.9
-
MHz
f2
negative/positive holding range of PLLs
2.0
3.0
-
MHz
Output amplifiers AF1 (pin 8) and AF2 (pin 7)
V
O
DC output voltage
1.8
2.1
2.5
V
V
o(rms)
output signal (RMS value)
0.4
0.5
0.6
V
clipping level
1.2
-
-
V
I
M
AC peak current
-
-
1.5
mA
I
O
DC source current
-
-
2.0
mA
V
o
/V
o
absolute drift of AF output signals
T
amb
= 0 to 70
C
-
0.7
-
dB
V
o1
/
V
o2
relative drift of AF output signals
T
amb
= 0 to 70
C
-
0.2
-
dB
V
AF(1-2)
negative/positive difference between
output signals
50
s de-emphasis
-
0.3
1.0
dB
R
o
output resistance
-
100
150
cs(ar)
adjustment range of channel separation
R
s
= 1.1 k
;
R
pot
= 2.2 k
1.5
-
-
dB
THD
total harmonic distortion
50
s de-emphasis
pin 8
-
0.1
0.3
%
pin 7
-
0.25
0.5
%
AM
AM suppression of AF(1-2)
50
s de-emphasis;
m = 0.3; f
AM
= 1 kHz
46
66
-
dB
signal plus noise-to-noise ratio
50
s de-emphasis;
in accordance with
"CCIR 468-3"
64
68
-
dB
AF
resp
LOW-level AF frequency response
V
AF(1-2)
=
-
3 dB
-
-
20
Hz
HIGH-level AF frequency response
200
-
-
kHz
AM
res(rms)
residual sound carrier signal and
harmonics (RMS value)
-
50
80
mV
8/7
crosstalk attenuation between
AF outputs
f = 50 to 12500 Hz
60
70
-
dB
RR
supply voltage ripple rejection
V
RR
< 200 mV;
f
r
= 20 Hz to 200 kHz
V
P
= 5 V
16
20
-
dB
V
P
= 8 V
24
28
-
dB
RR
supply voltage ripple rejection with
improved application for V
P
= 5 V
f
r
= 20 Hz to 3 kHz;
see Fig.3 and note 2
V
P
= 4.5 V
18
24
-
dB
V
P
= 4.75 V
21
27
-
dB
V
P
= 5.0 V
24
30
-
dB
V
P
= 5.5 V
21
27
-
dB
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
S
N
+
N
--------------
1996 Nov 20
9
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
Notes
1. The output signal at pin 7 can only be measured when mute is disabled. This is achieved by inserting a resistor of
2.7 k
between pin 15 and ground. In this event the input impedance is 490
.
2. Improvement of ripple rejection is possible by connecting series RC between pin 11 and pin 14 (15 k
+ 2.2
F;
see Fig.5) for a supply voltage of 4.5 to 5.5 V. The rejection of ripple frequencies up to 3 kHz is improved, but up to
200 kHz is worse; see Fig.3.
3. An open pin (n.c.) is interpreted as HIGH.
Control unit; see Table 1
V
5,6
voltage for LOW level
0
-
0.8
V
I
5,6
source current for LOW level
0 < V
5,6
< 0.8
-
180
250
A
R
5,6
allowed resistance to ground
0 < V
5,6
< 0.8
(LOW-level)
-
-
3.0
k
V
5
voltage for HIGH level
note 3
2.2
-
V
P
V
V
6
voltage for HIGH level
note 3
1.8
-
V
P
V
I
5,6
sink current for HIGH level
V
5, 6
= V
P
-
-
10
A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Fig.3 Typical improvement.
The curves are typical and valid for ripple frequencies between 50 Hz and 3 kHz.
Conditions: input signal: f = 5.5 MHz, 10 mV (RMS value); ripple on V
P
= 100 mV (RMS value), f
r
= 1 kHz;
ripple rejection measurement: unweighted RMS.
(1) Without RC.
(2) With R = 15 k
and C = 2.2
F.
handbook, full pagewidth
9
VP (V)
40
30
10
0
4
5
6
7
8
RR
(dB)
20
MHA530
(2)
(1)
1996 Nov 20
10
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
INTERNAL CIRCUITRY
Fig.4 Internal circuitry.
handbook, full pagewidth
16
1
15
2
14
3
13
4
12
5
11
6
10
7
9
8
MHA421
TDA9820
5.5
k
620
3.5 V
5.5
k
620
3.5 V
5.5
k
620
3.5 V
n.c.
30
k
6
k
1
k
6
k
3.6 V
23
k
13
k
3.6 V
2 mA
100
2 mA
100
5.5
k
620
3.5 V
5.5
k
670
3.5 V
+
10 k
300
A
3
k
3
k
3.6 V
50
k
2.54 V
5
k
AF2
50
k
2.54 V
5
k
AF1
1996 Nov 20
11
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
TEST AND APPLICATION INFORMATION
Fig.5 Test circuit.
(1) See note 2 of Chapter "Characteristics".
handbook, full pagewidth
1
2
16
3
15
4
14
5
13
6
12
7
11
8
MHA422
10
9
V
P
10 nF
V
AF2
TDA9820
2.2
nF
S1
S2
n.c.
V
AF1
2.2 k
V
AF2
V
AF1
2.2 k
2.2
nF
2.2
nF
22
nF
22
nF
with 50
s
de-emphasis
10
F
5.5 MHz
2.2
nF
2.2
nF
intercarrier
intercarrier
2.2
F
2.2
F
600
600
600
600
600
6.5 MHz
4.5 MHz
6.0 MHz
4.72 MHz, or
5.74 MHz, or
6.74 MHz
27 k
2.2
F
without
de-emphasis
2.2 k
1.1 k
optional stereo
channel separation
adjustment
Rs
Rpot
15 k
2.2
F
(1)
(1)
1996 Nov 20
12
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
Fig.6 Application circuit.
(1) Resistor value depends on filter.
handbook, full pagewidth
1
2
16
3
15
4
14
5
13
6
12
7
11
8
MHA423
10
9
V
P
10 nF
V
AF2
TDA9820
S1
S2
n.c.
V
10
F
5.5
MHz
intercarrier
6.5
MHz
4.5
MHz
6.0
MHz
5.74
MHz
AF1
2.2
F
2.2
F
27 k
2.2
F
(1)
(1)
(1)
(1)
(1)
R16
R15
R1
R2
R3
1996 Nov 20
13
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
PACKAGE OUTLINES
UNIT
A
max.
1
2
b
1
c
E
e
M
H
L
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT38-1
92-10-02
95-01-19
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.055
0.045
0.53
0.38
0.32
0.23
21.8
21.4
0.86
0.84
6.48
6.20
0.26
0.24
3.9
3.4
0.15
0.13
0.254
2.54
7.62
0.30
8.25
7.80
0.32
0.31
9.5
8.3
0.37
0.33
2.2
0.087
4.7
0.51
3.7
0.15
0.021
0.015
0.013
0.009
0.01
0.10
0.020
0.19
050G09
MO-001AE
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
e
D
A
2
Z
16
1
9
8
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
(1)
(1)
D
(1)
Z
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
1996 Nov 20
14
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
10.5
10.1
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT162-1
8
16
w
M
b
p
D
detail X
Z
e
9
1
y
0.25
075E03
MS-013AA
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.41
0.40
0.30
0.29
0.050
1.4
0.055
0.42
0.39
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
X
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
0
5
10 mm
scale
92-11-17
95-01-24
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
1996 Nov 20
15
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
1996 Nov 20
16
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
1996 Nov 20
17
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
NOTES
1996 Nov 20
18
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
NOTES
1996 Nov 20
19
Philips Semiconductors
Product specification
Multistandard/dual channel TV FM
intercarrier sound demodulator
TDA9820
NOTES
Internet: http://www.semiconductors.philips.com
Philips Semiconductors a worldwide company
Philips Electronics N.V. 1996
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327
Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 247 9145, Fax. +7 095 247 9144
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. +27 11 470 5911, Fax. +27 11 470 5494
South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 So Paulo, SO PAULO - SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 829 1849
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 3 301 6312, Fax. +34 3 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 632 2000, Fax. +46 8 632 2745
Switzerland: Allmendstrasse 140, CH-8027 ZRICH,
Tel. +41 1 488 2686, Fax. +41 1 481 7730
Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. +66 2 745 4090, Fax. +66 2 398 0793
Turkey: Talatpasa Cad. No. 5, 80640 GLTEPE/ISTANBUL,
Tel. +90 212 279 2770, Fax. +90 212 282 6707
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,
Tel. +61 2 9805 4455, Fax. +61 2 9805 4466
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101, Fax. +43 1 60 101 1210
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773
Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 689 211, Fax. +359 2 689 102
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,
Tel. +45 32 88 2636, Fax. +45 31 57 1949
Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615800, Fax. +358 9 61580/xxx
France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,
Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427
Germany: Hammerbrookstrae 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240
Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.
Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722
Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,
Tel. +972 3 645 0444, Fax. +972 3 649 1007
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. +81 3 3740 5130, Fax. +81 3 3740 5077
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381
Middle East: see Italy
Printed in The Netherlands
537021/1200/02/pp20
Date of release: 1996 Nov 20
Document order number:
9397 750 01009