2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

FEATURES

Multi-source selector switches six AF inputs
(three stereo sources or six mono sources)

Each of the input signals can be switched to each of the
outputs (crossbar switch)

Outputs for loudspeaker channel and peri-TV connector
(SCART)

Switchable spatial stereo and pseudo stereo effects

Audio surround decoder can be added externally

Two general purpose logic output ports

C-bus control of all functions.

GENERAL DESCRIPTION

The TDA9859 provides control facilities for the main and
the SCART channel of a TV set. Due to extended
switching possibilities, signals from three stereo sources
can be handled.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

positive supply voltage (pin V

)

7.2

8.0

8.8

supply current

i(rms)

input signal levels for 0 dB gain (RMS value)

o(rms)

output signal levels for 0 dB gain (RMS value)

voltage gain in main channel

volume control (in 1 dB steps, balance included)

+15

mute

bass control (in 1.5 dB steps)

+15

treble control (in 3 dB steps)

+12

THD

total harmonic distortion

0.1

S/N

signal-to-noise ratio

amb

ambient temperature

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA9859

SDIP32

plastic shrink dual in-line package; 32 leads (400 mil)

SOT232-1

TDA9859H

QFP44

plastic quad flat package; 44 leads (lead length 1.3 mm);
body 10

1.75 mm

SOT307-2

2001

Jul

Philips Semiconductors

Product specification

Univ

ersal hi-fi

audio processor f

or TV

TD
A9859

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BLOCK DIA

GRAM

f
ull pagewidth

470 nF

28 (43)

470 nF

30 (3)

470 nF

1 (7)

470 nF

32 (5)

470 nF

3 (9)

470 nF

5 (13)

MULTIPLE

SOURCE

AND MODE
SELECTOR

(CROSSBAR

SWITCH)

REFERENCE

VOLTAGE

8 V

6 (14)

SCART

output

SCOUTL SCOUTR

26 (41)

7 (15)

4 (10)

CSMO

100

GND

24 (38)

9 (18)

MOUTL MOUTR

LINE output or optional

surround sound decoder

connection

VOLUME

CONTROL

23 (37) 10 (19)

STEREO

MHB917

SPATIAL
STEREO

PSEUDO

STEREO

FORCED

MONO

CPS1 CPS2

29 (2)

27 (42)

BASS

CONTROL

CBR1 CBR2

11 (20) 12 (21)

33 nF

CBL1

CBL2

22 (36) 21 (35)

TREBLE

CONTROL

5.6 nF

CTR

5.6 nF

CTL

14 (25)

VOLUME

BALANCE

MUTE

(30) 18

(26) 15

loudspeaker

channel

outputs

LOUTR

LOUTL

C-BUS

INTERFACE

MAD SDA SCL

C-bus

19 (31)

25
(40)

17
(29)

16 (27)

(4) 31

(17)

TDA9859

(TDA9859H)

11 (22)

12 (21)

68 nF

0.15

13 k

extended bass control

(1)

AUX

SCART

MAIN

33 nF

AIN L

AINR

SCIN L

SCIN R

MIN L

MIN R

LINL

LINR

audio

inputs

(1)

(16)

AGND

(8) 2

DGND

Fig.1 Block diagram and application circuit.

The pin numbers given in parenthesis refer to the TDA9859H version.

(1) For extended bass control, the capacitor between C

BR/L1

and C

BR/L2

should be replaced by the extended bass control network.

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

PINNING

SYMBOL

PIN

DESCRIPTION

TDA9859 TDA9859H

SCIN

SCART input;
left channel

port 1 output

MIN

MAIN input;
left channel

SMO

smoothing
capacitor of
reference voltage

n.c.

not connected

n.c.

not connected

MIN

MAIN input;
right channel

supply voltage

SCOUT

SCART output;
right channel

GND

ground

AGND

analog ground

DGND

digital ground

MOUT

MAIN output;
right channel

LIN

input to right
loudspeaker
channel

BR1

bass capacitor
connection 1;
right channel

BR2

bass capacitor
connection 2;
right channel

n.c.

not connected

n.c.

not connected

n.c.

not connected

treble capacitor
connection;
right channel

LOUT

loudspeaker output;
right channel

SCL

serial clock input;
I

C-bus

n.c.

not connected

SDA

serial data
input/output;
I

C-bus

LOUT

loudspeaker output;
left channel

treble capacitor
connection;
left channel

n.c.

not connected

n.c.

not connected

n.c.

not connected

BL2

bass capacitor
connection 2;
left channel

BL1

bass capacitor
connection 1;
left channel

LIN

input to left
loudspeaker
channel

MOUT

MAIN output;
left channel

n.c.

not connected

MAD

module address
select input

SCOUT

SCART output;
left channel

PS2

pseudo stereo
capacitor 2

AIN

AUX input;
left channel

n.c.

not connected

n.c.

not connected

PS1

pseudo stereo
capacitor 1

AIN

AUX input;
right channel

port 2 output

SCIN

SCART input signal
RIGHT

n.c.

not connected

SYMBOL

PIN

DESCRIPTION

TDA9859 TDA9859H

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

FUNCTIONAL DESCRIPTION

The TDA9859 consists of the following functions:

Source select switching block

Loudspeaker channel with effect controls

Two port outputs for general purpose

C-bus control.

Source select switching block

The TDA9859 selects and switches the input signals from
three stereo or six mono sources MAIN, AUX and SCART
(see Fig.1) to the outputs SCART and loudspeaker
(crossbar-switching; Table 4). The main channel (LINE
outputs) is looped outside the circuit (from pins MOUT

and MOUT

to pins LIN

and LIN

), so signals can be

used as LINE output or a surround sound decoder can be
inserted.

Effect controls

`Linear stereo', `stereo with spatial effect (30% or 52%
anti-phase crosstalk)' and `forced mono with or without
pseudo-stereo effect' are controlled by three bits. A muting
of 85 dB is provided.

Loudspeaker channel

Volume control is divided into volume control common and
volume control left/right. The common part
(

40 to +15 dB) controls the left and right channels

simultaneously; the left/right part (

23 to 0 dB) controls the

volume of left and right channels independently. Treble
control provides a control range from

12 to +12 dB and

bass control from

12 to +15 dB. Extended bass control

can be provided by an external T-network (see Fig.1) from

15 to +19 dB (in 2 dB steps).

C-bus control

All control settings are stored in subaddress registers.
Data transmission is simplified by auto-incrementing the
subaddresses. The on-chip Power-on reset sets the mute
bit to active, so both the SCART and the loudspeaker
outputs are muted.

The muting can be switched off by writing a `0' (non-muted)
into the mute control bits.

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).

Notes

1. Equivalent to discharging a 200 pF capacitor through a 0

series resistor (machine model).

2. Equivalent to discharging a 100 pF capacitor through a 1.5 k

series resistor (human body model).

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage (pin V

)

voltage on all pins, ground excluded

output current

at LOUT and SCOUT pins

2.5

at port output pins

1.5

tot

total power dissipation

850

amb

ambient temperature

stg

storage temperature

+150

electrostatic handling voltage

all pins; note 1

300

all pins; note 2

2000

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

THERMAL CHARACTERISTICS

CHARACTERISTICS
V

= 8 V; T

amb

= 25

C; treble and bass in linear positions (0 dB); volume control left/right 0 dB; spatial function,

pseudo-stereo function and forced-mono function in off position and measurements taken in Fig.1; unless otherwise
specified.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air

TDA9859 (SDIP32)

K/W

TDA9859H (QFP44)

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage (pin V

)

7.2

8.0

8.8

supply current (pin V

)

ref

internal reference voltage

0.5V

SMO

voltage at pin C

SMO

0.1

DC voltage on pins

DC input voltage at pins SCIN, MIN,
LIN and AIN

0.5V

DC output voltage at pins SCOUT,
MOUT and LOUT

0.5V

DC voltage on capacitors (pins C

BR1

BR2

, C

BL2

, C

BL1

, C

PS2

and C

PS1

)

0.5V

Audio select switch; line and SCART outputs (controlled via I

C-bus); see Table 4

i(rms)

maximum AF input signal on
pins SCIN, MIN and AIN (RMS value)

THD

0.5% on output

pins

input resistance at pins SCIN, MIN and
AIN

0.5 dB

0.5 dB bandwidth for pins SCOUT,

MOUT and LOUT

20 000

o(rms)

maximum AF output signal on
pins SCOUT and MOUT (RMS value)

THD

0.5%

allowed external load resistance

on output pins MOUT

on output pins SCOUT

voltage gain from any input to SCART
and MAIN outputs

switch crosstalk on outputs between
AF inputs

f = 10 kHz; unused inputs
connected to ground

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

Volume control common (f = 1 kHz, 55 steps)

i(rms)

maximum input signal on pins LIN
(RMS value)

= 0; THD

0.5% on

output pins LOUT

input resistance on pins LIN

7.5

volume control common voltage gain

nominal

+15

minimum

+14

volume control common voltage
gain step width

32 to +15 dB

0.5

1.0

1.5

40 to

33 dB

0.25

1.0

1.75

volume control common voltage
gain set error

32 to +15 dB

40 to

33 dB

Volume control left/right (f = 1 kHz, 24 steps)

volume control left/right voltage gain

nominal

minimum

mute position

volume control left/right voltage
gain step width

0.5

1.0

1.5

volume control left/right voltage
gain tracking error

Bass control

bass control voltage gain

= 33 nF; f = 40 Hz

maximum boost

maximum attenuation

bass control voltage gain step width

1.5

v(extended)

extended bass control voltage gain

see Fig.1; f = 60 Hz

maximum boost

maximum attenuation

v(extended)

extended bass control voltage gain step
width

Treble control

treble control voltage gain

f = 15 kHz

maximum boost

maximum attenuation

treble control voltage gain step width

2.5

3.5

Effect controls

ct(spat1)

anti-phase crosstalk by spatial effect 1

ct(spat2)

anti-phase crosstalk by spatial effect 2

phase shift by pseudo-stereo

see Fig.4

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

Loudspeaker channel outputs (pins LOUT

and LOUT

)

o(max)(rms)

maximum output signal (RMS value)

THD

0.5%; R

> 10 k

;

< 1.5 nF

DC(max)

maximum DC offset voltage between
adjoining step and any step to mute

for volume control

= 0 to +15 dB/mute

64 to 0 dB/mute

0.5

for bass control

= 0 to +15 dB/mute

12 to 0 dB/mute

0.5

for treble control

12 to +12 dB/mute

0.5

output resistance

100

o(L)

allowed output load resistor

o(L)

allowed output load capacitor

1.5

no(W)

weighted noise voltage at output
(quasi-peak level)

CCIR 468-3 weighted

= +15 dB

102

= 0 dB

40 dB

80 dB (mute)

1 dB

1 dB bandwidth for loudspeaker

channel

20000

THD

total harmonic distortion

f = 20 to 12500 Hz

for V

i(rms)

= 0.2 V

30 to +15 dB

0.1

0.3

for V

i(rms)

= 1 V

30 to 0 dB

0.1

0.3

for V

i(rms)

= 2 V

30 to

6 dB

0.1

0.3

cs(l-r)

stereo channel separation

f = 10 kHz; G

= 0 dB;

opposite input grounded
by 1 k

resistor

ct(bus)

crosstalk from I

C-bus to AF outputs

bus

= spurious I

C-bus signal voltage

on AF output)

= 0 dB

100

PSRR

100

power supply ripple rejection with
100 Hz ripple

= 0 dB;

ripple(rms)

< 200 mV

SCART output (pins SCOUT

and SCOUT

)

o(max)(rms)

maximum output signal (RMS value)

THD

0.5%; R

> 5 k

o(L)

output load resistor

Power-on reset

PONR

increasing supply voltage

start of reset

2.5

end of reset

5.2

6.0

6.8

decreasing supply voltage

start of reset

4.4

5.2

6.0

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

bus

20 log

bus(p-p)

o(rms)

---------------------

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

C-BUS PROTOCOL

This circuit operates as a slave receiver only. For more information about the I

C-bus, see

"The I

C-bus and how to use

it", order number 9398 393 40011.

C-bus format

Note

1. Multiple DATA-A (acknowledge) sequences may occur.

Table 1

Explanation of I

C-bus format

Note

1. If more than 1 byte of DATA is transmitted, then auto-increment of the subaddress is performed by the device.

Table 2

C-bus transmission

Note

1. If auto-increment of the subaddress is used, it is necessary to insert three dummy data words between the treble

control byte and the switching control bytes.

SLAVE ADDRESS

SUBADDRESS

DATA

(1)

NAME

DESCRIPTION

START condition (SCL HIGH, SDA HIGH-to-LOW)

SLAVE ADDRESS

100 0000 (MAD = LOW) or 100 0001 (MAD = HIGH)

acknowledge (SDA = LOW); generated by the device

SUBADDRESS

subaddress (byte); see Table 2

DATA

(1)

data byte; see Table 2

STOP condition (SCL = HIGH, SDA = LOW-to-HIGH)

FUNCTION

SUBADDRESS

DATA BITS

BINARY

HEX

Loudspeaker channel

Volume control common

0000 0000

V05

V04

V03

V02

V01

V00

Volume control left

0000 0001

VL4

VL3

VL2

VL1

VL0

Volume control right

0000 0010

VR4

VR3

VR2

VR1

VR0

Bass control

0000 0011

BA4

BA3

BA2

BA1

BA0

Treble control

0000 0100

TR3

TR2

TR1

TR0

Switching control byte

SCART output

(1)

0000 1000

MU1

I13

I12

I11

I10

Loudspeaker output

0000 1001

EF2

MU2

EF1

I23

I22

I21

I20

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

Table 3

Function of the bits in Table 2

Table 4

Input selection

Note

1. Byte 8 (SCART channels): The value of X depends on MU1 and control bits P1 and P2.

Byte 9 (loudspeaker channels): see Table 5 for the programming of these bits. The value of X depends on the
selected effects and MU2.

BITS

FUNCTION

V00 to V05

volume control common for loudspeaker channel; see Table 9

VL0 to VL4

volume control for left loudspeaker channel; see Table 6

VR0 to VR4

volume control for right loudspeaker channel; see Table 6

BA0 to BA4

bass control for left and right loudspeaker channels; see Table 7

TR0 to TR3

treble control for left and right loudspeaker channels; see Table 8

I10 to I13

input selection for SCART channels; see Table 4

I20 to I23

input selection for loudspeaker channels; see Table 4

MU1 and MU2

mute control bits (MU1 for SCART channel, MU2 for loudspeaker channel)

0 = channel not muted

1 = channel muted

EF1, EF2 and ST

effect control bits for loudspeaker channel; see Table 5

P1 and P2

control bits for ports P1 and P2

control bit = 0: port output = LOW-level

control bit = 1: port output = HIGH-level

INPUT

BITS OF DATA BYTE 8 AND 9

HEX

AUX LEFT

(1)

AUX RIGHT

(1)

AUX STEREO

(1)

SCART LEFT

(1)

SCART RIGHT

(1)

SCART STEREO

(1)

MAIN LEFT

(1)

MAIN RIGHT

(1)

MAIN STEREO

(1)

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

Table 5

Effect controls

Note

1. The value of X depends on the selected input (see Table 4).

SETTING SPECIAL EFFECTS

DATA BYTE TO SUBADDRESS 09

HEX

EF2

MU2

EF1

I23

I22

I21

I20

Stereo with spatial effect 1 (52%)

(1)

Stereo with spatial effect 2 (30%)

(1)

Stereo without spatial effect

(1)

Forced mono with pseudo stereo

(1)

Forced mono without pseudo stereo

(1)

Table 6

Volume control left/right

Table 7

Bass control

(dB)

DATA BITS

HEX

VL4

VL3

VL2

VL1

VL0

VR4

VR3

VR2

VR1

VR0

Mute

(dB)

DATA BITS

HEX

BA4

BA3

BA2

BA1

BA0

+15

+13.5

+12

+10.5

+7.5

+4.5

+1.5

1.5

4.5

7.5

10.5

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

Table 8

Treble control

Table 9

Volume control common

(dB)

DATA BITS

HEX

TR3

TR2

TR1

TR0

+12

(dB)

DATA BITS

HEX

V05

V04

V03

V02

V01

V00

+15

+14

+13

+12

+11

+10

(dB)

DATA BITS

HEX

V05

V04

V03

V02

V01

V00

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

SOLDERING

Introduction

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. Wave soldering can still be used
for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is
recommended.

Through-hole mount packages

OLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

ANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

Surface mount packages

EFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 220

C for

thick/large packages, and below 235

C for small/thin

packages.

AVE SOLDERING

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

ANUAL SOLDERING

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

C. When using a dedicated tool, all other leads can

be soldered in one operation within 2 to 5 seconds
between 270 and 320

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

MOUNTING

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

suitable

(2)

suitable

Surface mount

BGA, HBGA, LFBGA, SQFP, TFBGA

not suitable

suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS

not suitable

(3)

suitable

PLCC

(4)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(4)(5)

suitable

SSOP, TSSOP, VSO

not recommended

(6)

suitable

2001 Jul 11

Philips Semiconductors

Product specification

Universal hi-fi audio processor for TV

TDA9859

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS

(1)

PRODUCT

STATUS

(2)

DEFINITIONS

Objective specification

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary specification

Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Product specification

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2001

Philips Semiconductors a worldwide company

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 7 - 9 Rue du Mont Valérien, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4728 6600, Fax. +33 1 4728 6638

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: Philips Hungary Ltd., H-1119 Budapest, Fehervari ut 84/A,
Tel: +36 1 382 1700, Fax: +36 1 382 1800

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553

Printed in The Netherlands

753504/03/pp

Date of release:

2001 Jul 11

Document order number:

9397 750 08551

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA9859H

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TDA9859H