1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

FEATURES

5 V supply voltage

Gain controlled wide-band Vision Intermediate
Frequency (VIF) amplifier (AC-coupled)

True synchronous demodulation with active carrier
regeneration (very linear demodulation, good
intermodulation figures, reduced harmonics and
excellent pulse response)

Fully integrated VIF Voltage Controlled Oscillator
(VCO), alignment-free

Digital acquisition help, VIF frequencies of 38.0, 38.9,
45.75 and 58.75 MHz

4 MHz reference frequency input [signal from
Phase-Locked Loop (PLL) tuning system] or operating
as crystal oscillator

VIF Automatic Gain Control (AGC) detector for gain
control, operating as peak sync detector, fast reaction
time

Precise fully digital Automatic Frequency Control (AFC)
detector with 4-bit digital-to-analog converter

Fully integrated sound carrier trap for 4.5, 5.5,
6.0 and 6.5 MHz, controlled by reference signal

Alignment-free selective FM-PLL demodulator with high
linearity and low noise

Digital frequency control, sound carrier frequencies
4.5, 5.5, 6.0 and 6.5 MHz

Stabilizer circuit for ripple rejection and to achieve
constant output signals

Electrostatic discharge (ESD) protection for all pins.

GENERAL DESCRIPTION

The TDA9880(T) is an integrated circuit for multistandard
vision IF signal processing and FM demodulation in TV
and VTR sets.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TDA9880

SDIP20

plastic shrink dual in-line package; 20 leads (300 mil)

SOT325-1

TDA9880T

SO20

plastic small outline package; 20 leads; body width 7.5 mm

SOT163-1

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

QUICK REFERENCE DATA

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

note 1

4.5

5.5

supply current

100

115

i(sens)(VIF)(rms)

VIF input voltage sensitivity
(RMS value)

1 dB video at output

100

VIF(cr)

VIF gain control range

see Fig.4

VIF

VIF frequencies

see Table 2

38.0

MHz

38.9

MHz

45.75

MHz

58.75

MHz

VIF

VIF frequency window of digital
acquisition help

referenced to f

VIF

2.38

MHz

o(v)(p-p)

video output signal voltage
(peak-to-peak value)

sound carrier off; see Fig.10 1.7

2.0

2.3

trap bypass mode;
see Fig.10

0.95

1.10

1.25

dif

differential gain

"NTC-7 Composite"

dif

differential phase

"NTC-7 Composite"

deg

3dB)(trap)

3 dB video bandwidth including

sound carrier trap

< 20 pF; R

> 1 k

;

AC load; note 2

trap

= 4.5 MHz

(M/N standard)

3.95

4.05

MHz

trap

= 5.5 MHz

(B/G standard)

4.90

5.00

MHz

SC1

trap attenuation at first sound carrier M/N standard

B/G standard

S/N

weighted signal-to-noise ratio of
video signal

see Fig.6; note 3

PSRR

power supply ripple rejection at
pin 13

ripple

= 70 Hz; video signal;

grey level; see Fig.9

1dB)

1 dB video bandwidth

< 20 pF; R

> 1 k

;

AC load; trap bypass mode

MHz

ch(max)(20)

AGC maximum charge current at
pin 20

dch(max)(20)

AGC maximum discharge current at
pin 20

7.5

12.5

sink(14)

sink current of tuner AGC at pin 14

maximum tuner gain
reduction; V

= 1 V;

see Fig.4

450

600

750

AFC

stps

AFC steepness

0.85

1.05

1.25

A/kHz

o(source)(19)

AFC output source current at pin 19

160

200

240

o(sink)(19)

AFC output sink current at pin 19

160

200

240

o(intc)(rms)

intercarrier output voltage
(RMS value)

; note 4

i(SC)

i(PC)

--------------

24 dB

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Notes

1. Values of video and sound parameters can be decreased at V

= 4.5 V.

2. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps

(see Figs 13 to 18);

H (s)

is the absolute value of transfer function.

3. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13). B = 4.2 MHz

(M/N standard) or B = 5.0 MHz (B/G, I and D/K standard) weighted in accordance with

"CCIR 567".

4. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal

video signal with 1.1 V (p-p) as a reference:

where:

= correction term for RMS value,

= sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB,

6 dB = correction term of internal circuitry and

3 dB = tolerance of video output and intercarrier output amplitude

o(intc)(rms)

intc(

3dB)(ul)

upper limit

3 dB intercarrier

bandwidth

7.5

MHz

o(AF)(8)(rms)

audio output signal voltage at pin 8
(RMS value)

25 kHz FM deviation;
75

s de-emphasis

400

500

600

THD

total harmonic distortion at pin 8

0.15

0.5

AF(

3dB)

3 dB audio frequency bandwidth

without de-emphasis;
dependent on loop filter at
pin 4

100

120

kHz

S/N

W(AF)

weighted signal-to-noise ratio of
audio signal

black picture

white picture

6 kHz sine wave
(black-to-white modulation)

sound carrier
subharmonics;
f = 2.25 MHz

3 kHz

AM(sup)

AM suppression of FM demodulator

s de-emphasis;

AM: f = 1 kHz; m = 0.3
referenced to 25 kHz
FM deviation

PSRR

power supply ripple rejection at pin 8 f

ripple

= 70 Hz; see Fig.9

frequency window of digital
acquisition help for FM demodulator

225

kHz

ref(15)

frequency of reference signal at
pin 15

4.0

MHz

ref(15)(rms)

amplitude of reference signal source
at pin 15 (RMS value)

operation as input terminal

400

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

o(intc)(rms)

1.1 V (p-p)

2 2

-----------

i SC

(

)

i PC

(

)

--------------- dB

(

)

6 dB

3 dB

----------------------------------------------------------------

2 2

-----------

i SC

(

)

i PC

(

)

--------------- dB

(

)

1999

Jul

Philips Semiconductors

Product specification

Alignment-free m

ultistandard vision and

FM sound IF-PLL demodulator

TD
A9880

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BLOCK DIA

GRAM

book, full pagewidth

MHB506

DIGITAL VCO CONTROL

AFC DETECTOR

RC VCO

VIF-PLL

AGC

SUPPLY

LOGIC

NARROW-BAND FM-PLL DETECTOR

SOUND TRAPS

4.5 to 6.5 MHz

TAGC

CVAGC

VAGC

RTOP

TOP

external reference

or 4 MHz crystal

REF

AFC

CTR

trap disable

switch

CVBS

AUD

audio output

video output 2 V (p-p)

[1.1 V (p-p) without trap]

CAFD

CFAGC

FAGC

SIO

VPLL

GND

FMPLL

DEEM

AFD

CDEEM

sound

intercarrier

output

VIF-PLL

filter

FM-PLL

filter

de-emphasis decoupling

VIF1

VIF2

TDA9880

Fig.1 Block diagram.

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

PINNING

SYMBOL

PIN

DESCRIPTION

VIF1

VIF differential input 1

VIF2

VIF differential input 2

TOP

tuner AGC TakeOver Point (TOP)

FMPLL

FM-PLL filter

DEEM

de-emphasis capacitor

AFD

AF decoupling capacitor

FAGC

FM-PLL AGC capacitor

AUD

audio output

switch input S0

switch input S1

SIO

sound intercarrier output

trap control

CVBS

video output

TAGC

tuner AGC output

REF

4 MHz crystal or reference input

GND

ground supply

supply voltage (+5 V)

VPLL

VIF-PLL filter

AFC

AFC output

VAGC

VIF-AGC capacitor

SYMBOL

PIN

DESCRIPTION

Fig.2 Pin configuration for SDIP20.

handbook, halfpage

VIF1

VIF2

TOP

FMPLL

DEEM

AFD

FAGC

AUD

VAGC

AFC

VPLL

REF

TAGC

GND

CVBS

SIO

TDA9880

MHB072

Fig.3 Pin configuration for SO20.

handbook, halfpage

VIF1

VIF2

TOP

FMPLL

DEEM

AFD

FAGC

AUD

VAGC

AFC

VPLL

REF

TAGC

GND

CVBS

SIO

TDA9880T

MHB106

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

FUNCTIONAL DESCRIPTION

Figure 1 shows the simplified block diagram of the
integrated circuit. The integrated circuit comprises the
following functional blocks:

1. VIF amplifier

2. Tuner-AGC and VIF-AGC

3. VIF-AGC detector

4. Frequency Phase-Locked Loop (FPLL) detector

5. VCO and Travelling Wave Divider (TWD)

6. Digital acquisition help and AFC

7. Video demodulator and amplifier

8. Sound carrier trap

9. Intercarrier mixer

10. FM demodulator and acquisition help

11. Audio amplifier

12. Internal voltage stabilizer.

VIF amplifier

The VIF amplifier consists of three AC-coupled differential
amplifier stages. Each differential stage comprises a
feedback network controlled by emitter degeneration.

Tuner-AGC and VIF-AGC

The AGC capacitor voltage is converted to an internal VIF
gain control signal, and is fed to the tuner AGC to generate
the tuner AGC output current at pin TAGC (open-collector
output). The tuner AGC takeover point can be adjusted
with R

TOP

. This allows the tuner to be matched to the SAW

filter in order to achieve the optimum IF input level.

VIF-AGC detector

The AGC detector generates the required VIF gain control
voltage for constant video output by charging or
discharging the AGC capacitor. Gain control is performed
by sync level detection. The newly developed AGC circuit
provides fast reaction time to cope with `aeroplane
fluttering'. The time constants for decreasing or increasing
gain are nearly equal.

Frequency Phase-Locked Loop (FPLL) detector

The VIF amplifier output signal is fed into a Frequency
Detector (FD) and into a Phase Detector (PD) via a limiting
amplifier. During acquisition the frequency detector
produces a DC current proportional to the frequency
difference between the input and the VCO signal.

After frequency lock-in the phase detector produces a DC
current proportional to the phase difference between the
VCO and the input signal. The DC current of either the
frequency detector or the phase detector is converted into
a DC voltage via the VIF-PLL filter, which controls the VCO
frequency.

VCO and Travelling Wave Divider (TWD)

The Resistor Capacitor (RC) VCO operates as an
integrated relaxation oscillator at double the picture carrier
frequency. The control voltage required to tune the VCO to
actually double the picture carrier frequency is generated
by the FPLL detector and fed via the loop filter to the VCO
control input terminal.

The oscillator signal is divided-by-two with a TWD which
generates two differential output signals with a 90 degrees
phase difference independent of the frequency.

Digital acquisition help and AFC

The integrated relaxation oscillator has a very wide
frequency range from approximately 30 to 70 MHz (after
the TWD). To prevent false locking of the FPLL and with
respect to the catching range of the frequency detector of
maximum

2.5 MHz, the Digital Acquisition Help (DAH)

provides current into the loop filter until the VCO is in a
frequency window of

2.3 MHz around the wanted VIF

frequency. In this case the analog operating FPLL will lock
the VCO to the VIF carrier and the acquisition help does
not provide any current to the loop filter.

The principle of the digital acquisition help is as follows:
the VCO is connected to a downcounter, which is preset
depending on the required VIF frequency. The counting
time, as well as the counter control, is derived from a
4 MHz reference signal. This signal can be supplied from
the internal 4 MHz crystal oscillator or from the 4 MHz
reference oscillator of an external tuning system.
The counting result after a counting cycle corresponds to
the actual VCO frequency.

The digital AFC is also derived from the counting result
after a counting cycle by digital-to-analog converting the
last four bits of the counter.

Video demodulator and amplifier

The video demodulator is realized by a multiplier which is
designed for low distortion and large bandwidth. The vision
IF input signal is multiplied with the `in phase' signal of the
travelling wave divider output.

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

The demodulator output signal is fed via an integrated
low-pass filter for attenuation of the carrier harmonics to
the video amplifier. The video amplifier is realized by an
operational amplifier with internal feedback and high
bandwidth. A low-pass filter is integrated to achieve an
attenuation of the carrier harmonics. The video signal of
1.1 V (p-p) for nominal vision IF modulation is fed
internally to the integrated sound carrier trap as well as to
the VIF-AGC detector. The second stage of the video
amplifier converts and amplifies the differential output
signal from the sound carrier trap to the single-ended
CVBS output signal at pin 13 with a 2 V (p-p) amplitude.

Noise clipping is provided. Furthermore the trap can be
bypassed by the implemented input switch of the second
amplifier stage, forced by connecting pin 12 to ground.

Sound carrier trap

The sound carrier trap consists of a reference filter, a
phase detector and the sound trap itself.

A sound carrier reference signal is fed into the reference
low-pass filter and is shifted by a nominal 90 degrees.
The phase detector compares the original reference signal
with the signal shifted by the reference filter and produces,
at the external capacitor C

, a DC voltage by charging or

discharging the capacitor with a current proportional to the
phase difference between both signals, respectively to the
frequency error of the integrated filters. The DC voltage is
converted to currents which control the frequency position
of the reference filter and the sound trap.

The sound trap itself is constructed of three separate traps
to realize sufficient suppression of the first and second
sound carrier. The right frequency position of the different
standards is set by the sound carrier reference signal.

Intercarrier mixer

The intercarrier mixer is realized by a multiplier, operating
in quadrature mode for suppression of low frequency video
signals. The VIF amplifier output signal is fed to the
intercarrier mixer and converted to an intercarrier
frequency by the regenerated 90 degree picture carrier
from the VCO. The mixer output signal is fed via a
band-pass filter and amplifier for attenuation of the high
frequency video signal components and carrier harmonics
to the output pin 11. The intercarrier signal is fed also to
the integrated FM demodulator.

FM demodulator and acquisition help

The FM demodulator is realized as a narrow-band PLL
with external loop filter, which provides the necessary
selectivity. To achieve good selectivity, a linear phase
detector and constant input level are required.
The intercarrier signal from the intercarrier mixer is fed via
a gain controlled amplifier to the phase detector and it's
output signal controls (via the loop filter) the integrated
relaxation oscillator. The possible frequency range is from
4 to 7 MHz. As a result of locking the oscillator frequency
tracks with the FM modulation of the input signal;
therefore, the oscillator control voltage is superimposed by
the AF voltage. In this way the FM-PLL operates as an
FM demodulator. The AF voltage is present at the loop
filter and is fed via a buffer with 0 dB gain to the audio
amplifier.

The digital acquisition help operates in the same way as
described in Section "Digital acquisition help and AFC".

Audio amplifier

The audio amplifier consists of two parts:

1. The AF preamplifier is an operational amplifier with

internal feedback, high gain and high common mode
rejection. The AF voltage from the PLL demodulator,
by principle a small output signal, is amplified by
30 dB. A DC operating point control circuit (pin 6)
decouples the AF amplifier from the DC voltage of the
PLL. The low-pass characteristic of the amplifier
reduces the harmonics of the intercarrier signal at the
sound output terminal. If required, a de-emphasis
network can be realized by the amplifier output
resistance and an external capacitor.

2. The AF output amplifier (10 dB) provides the required

output level by a rail-to-rail output stage. This amplifier
makes use of an input selector for switching to mute
state, automatically controlled by the mute switching
voltage from the digital acquisition help in order to
avoid lock-in noise. During normal operation the
automatic audio mute function is not active.
Application of a 2.2 k

resistor between the

intercarrier output (pin 11) and ground will activate the
automatic audio mute function.

Internal voltage stabilizer

The band gap circuit internally generates a voltage of
approximately 2.4 V, independent of the supply voltage
and the temperature. A voltage regulator circuit, controlled
by this voltage, produces a constant voltage of 3.55 V
which is used as an internal reference voltage.

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).

Notes

1. Charge device model class A; machine model: discharging a 200 pF capacitor via a 0.75

H inductance.

2. Charge device model class B; human body model: discharging a 100 pF capacitor via a 1.5 k

series resistor.

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

supply voltage

= 115 mA; T

amb

= 70

C; at

maximum chip temperature of 125

5.5

voltage at

pins 1 to 4, 6 to 10, 12 and 17 to 20

pin 14

13.2

short-circuit time to ground or V

stg

storage temperature

+150

amb

ambient temperature

+70

electrostatic handling voltage for all
pins

note 1

250

+250

note 2

3000

+3000

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air

TDA9880 (SDIP20)

K/W

TDA9880T (SO20)

K/W

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

CHARACTERISTICS
V

= 5 V; T

amb

= 25

C; see Table 2 for input frequencies; M standard (f

= 45.75 MHz; f

= 41.25 MHz;

PC/SC = 10 dB) is used for specification; V

i(VIF)(rms)

= 10 mV (sync level); IF input from 50

via broadband transformer

1 : 1; DSB video modulation; 10% residual carrier; video signal in accordance with

"NTC-7 Composite"; measurements

taken in test circuit of Fig.19; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply (pin 17)

supply voltage

note 1

4.5

5.5

supply current

100

115

tot

total power dissipation

500

633

VIF amplifier (pins 1 and 2)

i(sens)(VIF)(rms)

VIF input voltage sensitivity
(RMS value)

1 dB video at output

100

i(max)(rms)

maximum input signal voltage
(RMS value)

1 dB video at output;
note 2

110

int

internal IF amplitude difference
between picture and sound
carrier

within AGC range;

f = 4.5 MHz

0.7

VIF(cr)

VIF gain control range

see Fig.4

VIF(

3dB)(ll)

lower limit

3 dB VIF

bandwidth

MHz

VIF(

3dB)(ul)

upper limit

3 dB VIF

bandwidth

100

MHz

i(dif)

differential input resistance

note 3

1.7

2.2

2.7

i(dif)

differential input capacitance

note 3

1.2

1.7

2.5

DC input voltage

3.35

FPLL and true synchronous video demodulator; note 4

VCO(max)

maximum oscillator frequency
for carrier regeneration

f = 2f

120

140

MHz

VIF

vision carrier operating
frequencies

see Table 2

38.0

MHz

38.9

MHz

45.75

MHz

58.75

MHz

VIF

VIF frequency window of digital
acquisition help

referenced to f

VIF

2.38

MHz

acq

acquisition time

BL = 70 kHz; note 5

i(sens)(VIF)(rms)

VIF input voltage sensitivity at
pins 1 and 2 (RMS value)

for PLL to be locked

maximum IF gain

for C/N = 10 dB

notes 6 and 7

100

140

IGNAL AT PIN

o(source)(PD)(max)

maximum source current of
phase detector output

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

o(sink)(PD)(max)

maximum sink current of
phase detector output

o(source)(DAH)

output source current of digital
acquisition help

o(sink)(DAH)

output sink current of digital
acquisition help

W(min)(DAH)

minimum pulse width of digital
acquisition help current

O(VIF)

VCO steepness

VIF

MHz/V

D(VIF)

phase detector steepness

VIF

A/rad

Video output signal and sound carrier trap (pin 13; sound carrier off)

o(v)(p-p)

video output signal voltage
(peak-to-peak value)

see Fig.10

1.7

2.0

2.3

sync

sync pulse voltage level

see Fig.10

1.15

1.35

1.55

zero carrier voltage level

see Fig.10

3.27

3.57

3.87

v(clu)

upper video clipping voltage
level

1.1 V

v(cll)

lower video clipping voltage
level

0.7

1.0

output resistance

note 3

bias(int)

internal DC bias current for
emitter-follower

2.0

2.5

o(source)(max)

maximum AC and DC output
source current

2.4

o(sink)(max)

maximum AC and DC output
sink current

1.4

deviation of CVBS output
signal voltage

50 dB gain control

0.5

30 dB gain control

0.1

o(bl)

black level tilt

dif

differential gain

"NTC-7 Composite"

dif

differential phase

"NTC-7 Composite"

deg

3dB)(trap)

3 dB video bandwidth

including sound carrier trap

< 20 pF; R

> 1 k

;

AC load; note 8

trap

= 4.5 MHz

(M/N standard)

3.95

4.05

MHz

trap

= 5.5 MHz

(B/G standard)

4.90

5.00

MHz

trap

= 6.0 MHz

(I standard)

5.2

5.50

MHz

trap

= 6.5 MHz

(D/K standard)

5.5

5.95

MHz

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

SC1

trap attenuation at first sound
carrier

M/N standard

B/G standard

I standard

D/K standard

SC1(60 kHz)

trap attenuation at first sound
carrier f

SC1

60 kHz

M/N standard

B/G standard

I standard

D/K standard

SC2

trap attenuation at second
sound carrier

M/N standard

B/G standard

I standard

D/K standard

SC2(60 kHz)

trap attenuation at second
sound carrier f

SC2

60 kHz

M/N standard

B/G standard

I standard

D/K standard

d(g)(CC)

group delay at chrominance
carrier frequency

3.58 MHz at
M/N standard

110

180

250

4.43 MHz at B/G standard 110

180

250

4.43 MHz at I standard

160

4.28 MHz at D/K standard

130

S/N

weighted signal-to-noise ratio

weighted in accordance
with

"CCIR 567";

see Fig.6; note 9

S/N

unweighted signal-to-noise
ratio

note 9

blue

intermodulation attenuation at
`blue'

f = 0.92 MHz; see Fig.7;
note 10

f = 2.76 MHz; see Fig.7;
note 10

yellow

intermodulation attenuation at
`yellow'

f = 0.92 MHz; see Fig.7;
note 10

f = 2.76 MHz; see Fig.7;
note 10

r(vc)(rms)

residual vision carrier
(RMS value)

fundamental wave and
harmonics

H(sup)

harmonics suppression in
video signal

< 20 pF; R

> 1 k

;

AC load; note 11a

H(spur)

spurious elements suppression
in video signal

note 11b

PSRR

power supply ripple rejection at
pin 13

ripple

= 70 Hz; video

signal; grey level;
see Fig.9

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Video output signal (pin 13; trap bypass mode; V

< 0.8 V; sound carrier off); see Fig.10; note 12

o(v)(p-p)

video output signal voltage
(peak-to-peak value)

see Fig.10

0.95

1.10

1.25

sync

sync pulse voltage level

1.4

1.5

1.6

zero carrier voltage level

2.57

2.72

2.87

v(clu)

upper video clipping voltage
level

3.1

3.25

v(cll)

lower video clipping voltage
level

1.15

1.3

1dB)

1 dB video bandwidth

< 20 pF; R

> 1 k

;

AC load

MHz

3dB)

3 dB video bandwidth

< 20 pF; R

> 1 k

;

AC load

MHz

S/N

weighted signal-to-noise ratio

weighted in accordance
with

"CCIR 567";

see Fig.6; note 9

S/N

unweighted signal-to-noise
ratio

note 9

Trap control (pin 12)

o(source)(max)

maximum output source
current

o(sink)(max)

maximum output sink current

D(trap)

frequency detector steepness

trap

= 4.5 MHz

(M/N standard)

A/MHz

trap

= 6.5 MHz

(D/K standard)

5.5

A/MHz

operating voltage range of trap
frequency control at pin 12

1.5

3.5

L(12)

leakage current at pin 12

trap

25 kHz

stps

control steepness

trap

= 4.5 MHz

(M/N standard)

4.5

MHz/V

trap

= 6.5 MHz

(D/K standard)

MHz/V

switching voltage

trap bypass mode active

0.8

source

source current

trap bypass mode active;
V

0.8 V

185

VIF-AGC detector (pin 20)

ch(max)(20)

maximum charge current

dch(max)(20)

maximum discharge current

7.5

12.5

res(inc)

AGC response time to an
increasing VIF step

6 dB; note 13

2.0

20 dB; note 13

2.5

40 dB; note 13

4.0

SYMBOL

PARAMETER

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1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

res(dec)

AGC response time to a
decreasing VIF step

6 dB; note 13

1.0

20 dB; note 13

1.5

40 dB; note 13

2.5

gain control voltage range at
pin 20

1.7

3.6

stps

control steepness

= 2.2 to 3.2 V

dB/V

Tuner AGC (pin 14); see Figs 4 and 5

i(VIF)(min)(rms)

VIF input signal voltage for
minimum starting point of tuner
takeover at pins 1 and 2
(RMS value)

TOP

= 22 k

;

= 120

i(VIF)(max)(rms)

VIF input signal voltage for
maximum starting point of
tuner takeover at pins 1 and 2
(RMS value)

TOP

= 0

; I

= 120

i(VIF)(rms)

tuner takeover point accuracy
(RMS value)

TOP

= 12 k

;

= 120

permissible output voltage

from external source

13.2

sat

saturation voltage

= 450

0.2

i(VIF)(rms)

variation of takeover point with
temperature

= 120

0.03

0.07

dB/K

sink

sink current

no tuner gain reduction;
see Fig.4

= 12 V

0.75

= 13.2 V

1.5

maximum tuner gain
reduction; V

= 1 V;

see Fig.4

450

600

750

IF slip by automatic gain
control

tuner gain current from
20% to 80%

AFC circuit (pin 19); notes 14 and 15

AFC

stps

AFC steepness

VIF

0.85

1.05

1.25

A/kHz

VIF

accuracy of AFC circuit

o(19)

= 0; f

= 4.0 MHz

+20

kHz

sat(ul)

upper limit saturation voltage

see Fig.8

0.6 V

0.3

sat(ll)

lower limit saturation voltage

see Fig.8

0.3

0.6

o(source)

output source current

160

200

240

o(sink)

output sink current

160

200

240

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1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Intercarrier mixer (pin 11)

o(intc)(rms)

intercarrier output voltage
(RMS value)

; note 16

intc(

3dB)(ul)

upper limit

3 dB intercarrier

bandwidth

7.5

MHz

r(SC)(rms)

residual sound carrier
(RMS value)

fundamental wave and
harmonics

output resistance

note 3

DC output voltage

1.85

2.05

2.35

bias(int)

internal DC bias current for
emitter-follower

0.9

1.15

o(source)(max)

maximum AC output source
current

note 17

0.6

0.8

o(sink)(max)

maximum AC output sink
current

note 17

0.6

0.8

O(source)

DC output source current

automatic audio mute
function activated;
note 17

0.75

0.93

1.20

FM-PLL demodulator; notes 15 and 18 to 21

intc

sound intercarrier operating
frequencies

see Table 2

4.5

MHz

5.5

MHz

6.0

MHz

6.5

MHz

frequency window of digital
acquisition help for
FM demodulator

225

kHz

FM(rms)

IF intercarrier level for gain
controlled operation of FM-PLL
(RMS value)

corresponding PC/SC
ratio at input pins 1 and 2
is 7 to 40 dB

320

FM(lock)(rms)

IF intercarrier level for lock-in
of PLL (RMS value)

IF intercarrier gain control
range

IGNAL AT PIN

gain control voltage range at
pin 7

1.5

3.5

ch(max)(7)

maximum charge current

1.5

2.2

2.9

dch(max)(7)

maximum discharge current

1.5

2.2

2.9

stps

control steepness

= 2.2 to 2.7 V

dB/V

IGNAL AT PIN

o(AF)(rms)

audio output signal voltage
(RMS value)

25 kHz FM deviation

400

500

600

27 kHz FM deviation

432

540

648

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i(SC)

i(PC)

--------------

24 dB

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

o(AF)(cl)(rms)

audio output clipping signal
voltage level (RMS value)

THD < 1.5%

1.3

1.4

THD

total harmonic distortion

0.15

0.5

o(AF)

temperature drift of AF output
signal voltage

dB/K

audio frequency deviation

THD < 1.5%; note 22

kHz

AF(

3dB)

3 dB audio frequency

bandwidth

without de-emphasis;
dependent on loop filter at
pin 4; measured in
accordance with Fig.19

100

kHz

S/N

weighted signal-to-noise ratio
of audio signal

black picture

white picture

6 kHz sine wave
(black-to-white
modulation)

sound carrier
subharmonics;
f = 2.25 MHz

3 kHz

r(SC)(rms)

residual sound carrier
(RMS value)

fundamental wave and
harmonics; without
de-emphasis

AM(sup)

AM suppression of
FM demodulator

s de-emphasis;

AM: f = 1 kHz; m = 0.3
referenced to 25 kHz
FM deviation

PSRR

power supply ripple rejection at
pin 8

ripple

= 70 Hz; see Fig.9

IGNAL AT PIN

o(source)(PD)(max)

maximum phase detector
output source current

o(sink)(PD)(max)

maximum phase detector
output sink current

o(source)(DAH)

output source current of digital
acquisition help

110

o(sink)(DAH)

output sink current of digital
acquisition help

110

W(DAH)

pulse width of digital
acquisition help current

cy(DAH)

cycle time of digital acquisition
help

O(FM)

VCO steepness

3.3

MHz/V

D(FM)

phase detector steepness

A/rad

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1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Audio amplifier (pins 5, 6 and 8)

o(5)

output resistance at pin 5

note 23

4.4

5.0

5.6

AF(5)(rms)

audio signal (RMS value) at
pin 5

170

O(5)

DC output voltage at pin 5

2.37

o(8)

output resistance at pin 8

note 3

200

O(8)

DC output voltage at pin 8

2.37

o(source)(max)(8)

maximum AC and DC output
source current at pin 8

0.5

o(sink)(max)(8)

maximum AC and DC output
sink current at pin 8

0.5

DC decoupling voltage at pin 6 dependent on intercarrier

frequency f

1.5

3.3

L(6)

leakage current at pin 6

O(8)

50 mV

ch(max)(6)

maximum charge current at
pin 6

1.15

1.5

1.85

dch(max)(6)

maximum discharge current at
pin 6

1.15

1.5

1.85

AF(

3dB)

3 dB audio frequency

bandwidth of audio amplifier

upper limit

150

kHz

lower limit; note 24

mute(8)

mute attenuation of AF signal
at pin 8

note 17

DC jump voltage at pin 8 for
switching AF output to mute
state and vice versa

activated by digital
acquisition help; note 17

150

Standard switch (pins 9 and 10); see Table 2

input voltage

pin open-circuit;
I

i(9,10)

< 0.1

2.8

3.0

3.6

for LOW

0.8

for MID

1.3

1.8

2.3

for HIGH

2.8

i(source)

input source current

i(9,10)

= 0 V

105

122

i(9,10)

= 1.8 V

Reference input (pin 15); note 25

DC input voltage

2.3

2.6

2.9

input resistance

2.5

3.0

3.5

xtal

resonance resistance of crystal operation as crystal

oscillator

200

pull-up/down capacitance

note 26

ref

frequency of reference signal

4.0

MHz

ref

tolerance of reference
frequency

note 15

0.1

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1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Notes

1. Values of video and sound parameters can be decreased at V

= 4.5 V.

2. This parameter is tested with 110 mV to ensure maximum input level.

3. This parameter is not tested during production and is only given as application information for designing the television

receiver.

4. Loop bandwidth BL = 70 kHz (damping factor d = 1.9; calculated with sync level within gain control range).

Calculation of the VIF-PLL filter can be done by use of the following formulae:

, valid for d

1.2

where:

= VCO steepness

; K

= phase detector steepness

;

R = loop resistor; C = loop capacitor; BL

3 dB

= loop bandwidth for

3 dB; d = damping factor.

5. V

i(VIF)(rms)

= 10 mV;

f = 1 MHz (VCO frequency offset related to picture carrier frequency); white picture video

modulation.

6. V

i(VIF)

signal for nominal video signal.

7. Broadband transformer at VIF input. The C/N ratio at VIF input is defined as the VIF input signal (sync level,

RMS value) related to a superimposed 4.2 MHz band-limited white noise signal (RMS value); white picture video
modulation.

8. The sound carrier frequencies (depending on TV standard) are attenuated by the integrated sound carrier traps

(see Figs 13 to 18);

H (s)

is the absolute value of transfer function.

9. S/N is the ratio of black-to-white amplitude to the black level noise voltage (RMS value, pin 13).

B = 4.2 MHz (M/N standard) or B = 5.0 MHz (B/G, I and D/K standard).

10. The intermodulation figures are defined:

;

0.92

value at 0.92 MHz referenced to black or white signal;

;

2.76

value at 2.76 MHz referenced to chrominance carrier.

11. Measurements taken with SAW filter M1963M (sound shelf: 20 dB); loop bandwidth BL = 70 kHz.

a) Modulation Vestigial Side-Band (VSB); sound carrier off; f

video

> 0.5 MHz.

b) Sound carrier on; f

video

= 10 kHz to 10 MHz.

12. The sound carrier trap can be disabled by switching pin 12 to ground (<0.8 V). In this way the full composite video

spectrum appears at pin 13. The amplitude is 1.1 V (p-p).

13. Response time valid for a VIF input level range of 200

V to 70 mV.

ref(rms)

amplitude of reference signal
source (RMS value)

operation as input
terminal

400

o(ref)

output resistance of reference
source

4.7

decoupling capacitance to
external reference source

operation as input
terminal

100

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

3 dB

------- K

1
2

--- R K

rad

--------

-------

rad

--------

0.92

at 3.58 MHz

at 0.92 MHz

---------------------------------------

3.6 dB

log

2.76

at 3.58 MHz

at 2.76 MHz

---------------------------------------

log

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

14. To match the AFC output signal to different tuning systems a current source output is provided. The test circuit is

given in Fig.8. The AFC steepness can be changed by resistors R1 and R2.

15. The tolerance of the reference frequency determines the accuracy of the VIF AFC, FM demodulator centre frequency

and maximum FM deviation.

16. The intercarrier output signal at pin 11 can be calculated by the following formula taking into account the internal

video signal with 1.1 V (p-p) as a reference:

where:

= correction term for RMS value,

= sound-to-picture carrier ratio at VIF input (pins 1 and 2) in dB,

6 dB = correction term of internal circuitry and

3 dB = tolerance of video output and intercarrier output amplitude

o(intc)(rms)

17. For normal operation no DC load at pin 11 is allowed, so the automatic audio mute function is not active.

By connecting a 2.2 k

resistor between pin 11 and ground the automatic audio mute function will be activated.

With this application also the series capacitor C

of the loop filter at pin 4 should be changed from 33 nF to 4.7 nF.

18. Calculation of the FM-PLL filter can be done approximately by use of the following formulae:

The formulae are only valid under the following conditions:

1 and C

> 5C

where:

= VCO steepness

; K

= phase detector steepness

;

= loop resistor; C

= series capacitor; C

= parallel capacitor; f

= natural frequency of PLL;

3 dB

= loop bandwidth for

3 dB;

= damping factor. For examples see Table 1.

19. For all S/N measurements the used vision IF modulator requires an incidental phase modulation for black-to-white

jump of less than 0.5 degrees.

20. Measurements taken with SAW filter M1963M (Siemens) for vision and sound IF (sound shelf: 20 dB).

Picture-to-sound carrier ratio of transmitter: PC/SC = 10 dB. Input level (at pins 1 and 2) V

i(VIF)(rms)

= 10 mV (sync

level), 25 kHz FM deviation for sound carrier, f

= 400 Hz. Measurement in accordance with

"CCIR 468-4".

De-emphasis = 75

21. The PC/SC ratio is calculated as the addition of TV transmitter PC/SC ratio and SAW filter PC/SC ratio. This PC/SC

ratio is necessary to achieve the S/N

values as noted. A different PC/SC ratio will change these values.

22. Measured with an FM deviation of 25 kHz, the typical AF output signal is 500 mV (RMS). By using R

= 20 k

the

AF output signal is attenuated by 6 dB, so 250 mV (RMS). For handling an FM deviation of more than 55 kHz the
AF output signal has to be reduced by using R

in order to avoid clipping (THD < 1.5%). For an FM deviation up to

100 kHz an attenuation of 6 dB is recommended.

23. C

DEEM

= 10 nF results in

= 50

s and C

DEEM

= 15 nF results in

= 75

o(intc)(rms)

1.1 V (p-p)

2 2

-----------

i SC

(

)

i PC

(

)

--------------- dB

(

)

6 dB

3 dB

----------------------------------------------------------------

2 2

-----------

i SC

(

)

i PC

(

)

--------------- dB

(

)

-------

---------------

2R K

------------------------------------

3 dB

1.55

(

)

rad

--------

-------

rad

--------

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

24. The lower limit of audio bandwidth depends on the value of the capacitor at pin 6. A value of C

AFD

= 470 nF leads to

AF(

3 dB)

20 Hz and C

AFD

= 220 nF leads to f

AF(

3 dB)

40 Hz.

25. The reference input pin 15 is able to operate as a 1-pin crystal oscillator as well as an input terminal with external

reference signal, e.g. from the tuning system.

26. The value of C

determines the accuracy of the resonance frequency of the crystal. It depends on the type of crystal

used.

Table 1

Examples to note 18 of Chapter "Characteristics"

Table 2

Standard switch settings

3 dB

(kHz)

(nF)

(pF)

R (k

)

100

820

2.7

0.5

160

330

3.9

0.5

VIF

(MHz)

intc

(MHz)

STANDARD

REMARK

LOW

38.9

5.5

B/G

Europe

LOW

MID

38.9

6.5

D/K

LOW

HIGH

38.9

6.0

United Kingdom

MID

LOW

38.0

5.5

B/G

MID

38.0

6.0

MID

HIGH

38.0

6.5

D/K

HIGH

LOW

45.75

4.5

M/N

USA

HIGH

MID

38.0

4.5

HIGH

58.75

4.5

Japan

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Fig.4 Typical VIF and tuner AGC characteristic.

(1) VIF AGC voltage.

(2) I

tuner

; R

TOP

= 22 k

(3) I

tuner

; R

TOP

= 12 k

(4) I

tuner

; R

TOP

= 0

handbook, halfpage

110

300

600

200

500

100

400

MHB158

Vi(VIF) (dB/

V20

(V)

I14

(

(2)

(3)

(4)

(1)

Fig.5

Typical tuner takeover point as a function of
R

TOP

handbook, halfpage

120

100

MHB159

Vi(VIF)

(dB/

RTOP (k

)

Fig.6

Typical signal-to-noise ratio as a function of
VIF input voltage.

handbook, halfpage

110

MHB160

Vi(VIF) (dB/

S/N

(dB)

Fig.7 Input signal conditions.

SC = sound carrier, with respect to sync level.

CC = chrominance carrier, with respect to sync level.

PC = picture carrier, with respect to sync level.

The sound carrier levels are taking into account a sound shelf
attenuation of 20 dB (SAW filter M1963M).

handbook, halfpage

SC CC

BLUE

YELLOW

21 dB

13.2 dB

3.2 dB

21 dB

13.2 dB

10 dB

MHA739

1999

Jul

Philips Semiconductors

Product specification

Alignment-free m

ultistandard vision and

FM sound IF-PLL demodulator

TD
A9880

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TEST CIRCUIT

handbook, full pagewidth

MHB162

sound

intercarrier

output

AFC

output

(1)

VIF-PLL

filter

fref

4 MHz

470 nF

820

CDEEM

15 nF

CFAGC

100 nF

22 k

(4)

VIF1

VIF2

TOP

FMPLL

VAGC

AFC

VPLL

GND

REF

DEEM

AFD

FAGC

AUD

100

TAGC
output

CVBS
output

10
nF

TAGC

CVBS

SIO

2.7 k

33 nF

RTOP

FM-PLL

filter

(2)

1.5

22 k

2.2

3.3

R
150

C
220 nF

(3)

CTR

470

CVAGC
10 nF

logic

audio

output

TDA9880

input

10 nF

bypass

auto

mute

Fig.19 Test circuit.

(1) See note 4 of Chapter "Characteristics".

(2) See notes 17 and 18 of Chapter "Characteristics".

(3) See note 26 of Chapter "Characteristics".

(4) See note 22 of Chapter "Characteristics".

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

SOLDERING

Introduction

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

Through-hole mount packages

OLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

ANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

Surface mount packages

EFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

AVE SOLDERING

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

ANUAL SOLDERING

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

1999 Jul 21

Philips Semiconductors

Product specification

Alignment-free multistandard vision and
FM sound IF-PLL demodulator

TDA9880

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

MOUNTING

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

suitable

(2)

suitable

Surface mount

BGA, SQFP

not suitable

suitable

HLQFP, HSQFP, HSOP, HTSSOP, SMS

not suitable

(3)

suitable

PLCC

(4)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(4)(5)

suitable

SSOP, TSSOP, VSO

not recommended

(6)

suitable

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

1999

Philips Semiconductors a worldwide company

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
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China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
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Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
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Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920

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Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
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Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
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Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

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Tel. +60 3 750 5214, Fax. +60 3 757 4880

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Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain

Romania: see Italy

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Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398

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04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
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Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 62 5344, Fax.+381 11 63 5777

Printed in The Netherlands

545004/03/pp

Date of release:

1999 Jul 21

Document order number:

9397 750 05318

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