1997 Oct 07

Philips Semiconductors

Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

FEATURES

Dual head pre-amplifiers

Reverse head switching

Equalization with electronically switched time constants

Output level like Dolby level of 387.5 mV = 0 dB

Improved EMC behaviour.

GENERAL DESCRIPTION

The TEA0676T is a monolithic bipolar integrated circuit
intended for applications in car radios. It includes head and
equalization amplifiers with electronically switchable time
constants. Furthermore it includes electronically
switchable inputs for tape drivers with reverse heads.

The device will operate with power supplies in a range of
7.6 to 12.0 V. The output overload level increases with the
increase in supply voltage, so it is advisable to use a
regulated power supply or a supply with a long time
constant.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

7.6

supply current

= 10 V

signal plus noise-to-noise ratio

unweighted RMS value

o (rms)

output voltage (0 dB) (RMS value)

gain internal = 40 dB; linear

387.5

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TEA0676T

SO16

plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

--------------

1997 Oct 07

Philips Semiconductors

Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

PINNING

SYMBOL

PIN

DESCRIPTION

OUTA

output channel A

n.c.

not connected

EQOUTA

output equalizer channel A

EQINA

input equalizer channel A

supply voltage

INA1

input channel A1
(forward or reverse)

ref

reference voltage

INA2

input channel A2
(reverse or forward)

INB2

input channel B2
(reverse or forward)

HSW

input head switch

INB1

input channel B1
(forward or reverse)

GND

ground

EQINB

input equalizer channel B

EQOUTB

output equalizer channel B

EQSW

input equalizer switch

OUTB

output channel B

Fig.2 Pin configuration.

handbook, halfpage

TEA0676T

MGE861

OUTA

n.c.

EQOUTA

EQINA

VCC

INA1

Vref

INA2

INB2

HSW

INB1

GND

EQINB

EQOUTB

EQSW

OUTB

FUNCTIONAL DESCRIPTION

Gain of pre-amplifier = 30 dB; minimum gain of
EQ-amplifier = 24.5 dB at f = 1 kHz with 70

s cut-off

frequency.

Head switching is achieved when pin 10 (HSW) is
connected to ground via a 27 k

resistor (inputs INA2,

INB2 are active) or connected to HIGH level (0.8V

)

(inputs INA1, INB1 are active).

Equalization time constant switching (70

s/120

s) is

achieved when pin 15 (EQSW) is connected to ground via
an 18 k

resistor (120

s) or left open-circuit (70

s).

1997 Oct 07

Philips Semiconductors

Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

CHARACTERISTICS

= 10 V; R

= 10 k

; C

= 2.5 nF; T

amb

= 25

C; V

= 0 dB means 387.5 mV at output; all levels are referenced to

387.5 mV with 0 dB as standard; EQ switch in 70

s position; unless otherwise specified; see notes 1 and 2.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

supply voltage (pin 5)

7.6

10.0

12.0

supply current

THD

total harmonic distortion

f = 1 kHz; V

= 0 dB

0.08

0.15

f = 10 kHz; V

= 6 dB

0.15

0.3

headroom at output

= 7.6 V; THD = 1%;

f = 1 kHz

PSRR

power supply ripple
rejection

R(rms)

< 0.25 V; f = 1 kHz

channel separation

selective measurement;
f = 1 kHz; V

= 10 dB

channel matching

selective measurement;
f = 1 kHz; V

= 0 dB

0.5

+0.5

crosstalk between active
and inactive input

selective measurement;
f = 1 kHz; V

= 10 dB

signal plus noise-to-noise
ratio (RMS value)

unweighted;
f = 20 Hz to 20 kHz; R

= 0

;

internal gain 40 dB; linear;
see Fig.13

no(rms)

equivalent input noise
voltage (RMS value)

unweighted;
f = 20 Hz to 20 kHz; R

= 0

0.8

voltage gain of
pre-amplifier

from pin INA1 or INA2 to
pin EQINA and from pin INB1
or INB2 to pin EQINB

open-loop amplification

pin INA1 to pin OUTA and
pin INB1 to pin OUTB

f = 10 kHz

f = 400 Hz

104

110

equalization resistor

4.7

5.8

6.9

input impedance
pre-amplifier

100

output impedance
EQ-amplifier

100

output load resistance

output load capacitance

offset(DC)

input offset voltage

pins INA1, INA2, INB1 and
INB2 connected to V

ref

O(GND)

DC current capability

output to ground

O(VCC)

DC current capability

output to V

300

EMC

DC offset voltage at
pins 1 and 16

f = 900 MHz; V

= 6 V (RMS);

see Figs 12, 14 and 15

--------------

1997 Oct 07

Philips Semiconductors

Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

Notes

1. For an application with a fixed equalization time constant of 120

s the equalizing network may be applied completely

external. In this application the 8.2 k

resistor has to be changed to 14 k

and the internal resistor R

= 5.8 k

must be short-circuited by fixing the equalization switch input at 70

s (pin 15 left open-circuit). To activate the inputs

INA1 and INB1, pin 10 (HSW) might be left open-circuit. In this event the DC level at pin 10 (HSW) is 0.8V

2. It is recommended to switch off V

with a gradient of 400 V/s at maximum to avoid plops on the tape in the event

of contact between tape and tape head while switching off.

Switching thresholds

QUALIZATION TIME CONSTANT SWITCHING

EQSW

pin voltage

load current +100 to

100

0.8V

EQSW

input current

EQSW

= 0 to V

180

+180

EQSW(HIGH)

pin voltage

time constant 70

s active

+ 0.5

EQSW(LOW)

pin voltage

time constant 120

s active

0.5 V

EAD SWITCHING

HSW

pin voltage

load current +90 to

0.8V

HSW

input current

HSW

= 0 to V

170

+170

HSW(HIGH)

HIGH-level pin voltage

inputs INA1 and INB1 active

+ 0.5

HSW(LOW)

LOW-level pin voltage

inputs INA2 and INB2 active

0.5 V

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1997 Oct 07

Philips Semiconductors

Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

PACKAGE OUTLINE

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

2.65

0.30
0.10

2.45
2.25

0.49
0.36

0.32
0.23

10.5
10.1

7.6
7.4

1.27

10.65
10.00

1.1
1.0

0.9
0.4

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.1
0.4

SOT162-1

detail X

0.25

075E03

MS-013AA

pin 1 index

0.10

0.012
0.004

0.096
0.089

0.019
0.014

0.013
0.009

0.41
0.40

0.30
0.29

0.050

1.4

0.055

0.419
0.394

0.043
0.039

0.035
0.016

0.01

0.25

0.01

0.004

0.043
0.016

0.01

(A )

10 mm

scale

SO16: plastic small outline package; 16 leads; body width 7.5 mm

SOT162-1

95-01-24
97-05-22

1997 Oct 07

Philips Semiconductors

Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1997 Oct 07

Philips Semiconductors

Product specification

Dual pre-amplifier and equalizer for
reverse tape decks

TEA0676T

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

Philips Semiconductors a worldwide company

SCA55

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

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Printed in The Netherlands

547027/1200/02/pp20

Date of release: 1997 Oct 07

Document order number:

9397 750 02743

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