Document Outline
- FEATURES
- GENERAL DESCRIPTION
- QUICK REFERENCE DATA
- ORDERING INFORMATION
- PINNING
- FUNCTIONAL DESCRIPTION
- Time constant switching for equalization
- LIMITING VALUES
- CHARACTERISTICS
- PACKAGE OUTLINE
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
DATA SHEET
Product specification
File under Integrated Circuits, IC01
August 1993
INTEGRATED CIRCUITS
TEA0677T
Dual pre-amplifier and equalizer for
reverse tape decks
August 1993
2
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
FEATURES
Head pre-amplifiers
Reverse head switching
Equalization with electronically switched time constants
0 dB = 387.5 mV
Pin compatible to TEA0675 Dolby B, music search IC.
GENERAL DESCRIPTION
The TEA0677T is a monolithic bipolar integrated circuit
intended for applications in car radios. It includes head and
equalization amplifiers with electronically switchable time
constants. Furthermore it includes electronically
switchable inputs for tape drives with reverse heads. The
device is intended to replace the regular TEA0675T in
low-cost car radios using the same PCB. External
components that are necessary for Dolby B and music
search features can be omitted.
The device will operate with power supplies in the range of
7.6 V to 12.0 V, output overload level increasing with
increase in supply voltage. Current drain varies with
supply voltage, so it is advisable to use a regulated power
supply or a supply with a long time constant.
QUICK REFERENCE DATA
ORDERING INFORMATION
Note
1. SOT137-1; 1996 August 27.
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage
7.6
10
12
V
I
CC
supply current
-
23
26
mA
(S + N)/N
signal-plus-noise to noise ratio
68
74
-
dB
EXTENDED TYPE
NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
TEA0677T
24
SO
plastic
SOT137A
(1)
August 1993
3
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
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Fig.1 Block and application diagram.
Instead of potentiometers at EQ AMP
fixed resistors may be used. The value
depends on applied heads.
August 1993
4
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
PINNING
SYMBOL
PIN
DESCRIPTION
OUTA
1
output channel A
n.c.
2
not connected
n.c.
3
not connected
n.c.
4
not connected
n.c.
5
not connected
n.c.
6
not connected
EQA
7
equalizing output channel A
EQFA
8
equalizing input channel A
V
CC
9
supply voltage
INA1
10
input channel A1 (forward or
reverse)
V
REF
11
reference voltage
INA2
12
input channel A2 (reverse or
forward)
INB2
13
input channel B2 (reverse or
forward)
HS
14
head switch input
INB1
15
input channel B1 (forward or
reverse)
GND
16
ground
EQFB
17
equalizing input channel B
EQB
18
equalizing output channel B
EQS
19
equalizing switch input
n.c.
20
not connected
ACUR
21
auxiliary current
n.c.
22
not connected
n.c.
23
not connected
OUTB
24
output channel B
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
Head switching is achieved when pin 14 (HS) is
connected to GND via a 27 k
resistor (inputs INA2, INB2
active), or left open-circuit (inputs INA1, INB1 active).
The 10
F capacitor at pin 14 sets the time constant for
smooth switching.
Time constant switching for equalization
(70
s/120
s) is achieved when pin 19 (EQS) is
connected to ground via an 18 k
resistor (120
s) or left
open-circuit (70
s).
August 1993
5
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC134).
Note to the Limiting values
1. Classification A: human body model; C = 100 pF, R = 1.5 k
, V
2 kV; charge device model; C = 200 pF, R = 0
,
V
500 V.
CHARACTERISTICS
V
CC
= 10 V; f = 20 Hz to 20 kHz; T
amb
=
+
25
C; all levels are referenced to 387.5 mV (RMS; 0 dB) at output; see Fig.1;
EQ switch in the 70
s position; unless otherwise specified.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
CC
DC supply voltage
0
16
V
V
I
input voltage (pin 1 to 24) except pin 11 (V
REF
) to V
CC
-
0.3
V
CC
V
t
short
pin 11 (V
REF
) to V
CC
short-circuiting duration
-
5
s
T
amb
operating ambient temperature
-
40
+85
C
T
stg
storage temperature
-
65
+150
C
T
s
soldering temperature (wave solder for 10 s at lead)
-
260
C
V
es
electrostatic handling (note 1)
-
-
-
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage
7.6
10
12
V
I
CC
supply current
pins 10, 12, 13 and 15
-
23
26
mA
connected to V
REF
channel matching
f = 1 kHz; V
O
= 0 dB
-0.5
-
+0.5
dB
THD
total harmonic distortion 2nd and 3rd
f = 1 kHz; V
O
= 0 dB
-
0.04
0.1
%
harmonic
f = 10 kHz; V
O
= 6 dB
-
0.08
0.15
%
head room at output
V
CC
= 7.6 V;
12
14
-
dB
THD = 1%; f = 1 kHz
PSRR
power supply ripple rejection
0.25 V (RMS);
45
50
-
dB
f = 1 kHz; see Fig.3
CS
channel separation
f = 1 kHz; V
O
= +10 dB; 64
70
-
dB
see Fig.4
CC
crosstalk between active and inactive
input
f = 1 kHz; V
O
= +10 dB
70
77
-
dB
R
Lmin
minimum load resistance at output
f = 1 kHz; V
O
= 12 dB;
10
-
-
k
THD = 1%
G
v
voltage gain (pre-amplifier) from input
pins 10, 12, 13 and 15 to pin EQF
f = 1 kHz
29
30
31
dB
V
off
input offset voltage
-
2
-
mV
I
B
input bias current
-
0.1
0.4
A
R
EQ
equalizing resistor
4.7
5.8
6.9
k
R
I
input resistance head inputs
60
100
-
k
August 1993
6
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
Note to the characteristics
1. For an application with a fixed EQ time constant of 120
s the equalizing network may be applied completely
external. In this application the 8.2 k
resistor has to be changed to 14 k
and the internal resistor R
EQ
= 5.8 k
must be short-circuited by fixing the EQ-switch input at the 70
s position (pin 19; EQS left open-circuit). To activate
the inputs INA1 and INB1 pin 10 (HS) may be left open-circuit. In this event the DC level at pin 10 (HS) is 0.775 V
CC
.
General note
It is recommended to switch off V
CC
with a gradient of 400 V/s at maximum to avoid plops on tape in the event of contact
between tape and tape head while switching off.
A
V
open-loop gain
pins INA1/INA2 to pin OUTA
f = 10 kHz
80
86
-
dB
pins INB1/INB2 to pin OUTB
f = 400 Hz
104
110
-
dB
N
equivalent noise voltage input
unweighted;
-
0.7
1.4
V
(RMS value)
20 Hz to 20 kHz;
R
source
= 0
(S+N)/N
signal-plus-noise to noise ratio
internal gain 40 dB
linear;
68
74
-
dB
CCIR/ARM weighted;
see Fig.4
DC output voltage; pins 1 (OUTA)
reference to V
REF;
-
-
0.15
V
and 16 (OUTB)
tape head DC coupled
I
OGND
DC output current capability
to ground
-
2
-
-
mA
I
OVCC
DC output current capability
to V
CC
300
-
-
A
Z
O
output impedance
-
80
100
Switching thresholds
Equalization (pin 19)
V
EQS
voltage at pin EQS
-
-
5
V
I
EQ70
70
s input current
-
-
-
150
A
I
EQ120
120
s input current
-
250
-
-
1000
A
Head switch (pin 14)
V
IN1
inputs INA1 and INB1 active
note 1
0.65V
CC
0.775V
CC
1.0V
CC
V
I
IN1
maximum input current
-
150
90
150
A
V
IN2
inputs INA2 and INB2 active
0.1V
CC
0.225V
CC
0.35V
CC
V
I
IN2
maximum input current
-
50
-
90
-
150
A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
August 1993
7
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
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Fig.3 Test circuit for power supply ripple rejection.
August 1993
8
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
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Fig.4 Test circuit for channel separation and signal-to-noise ratio.
August 1993
9
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
Fig.5 PCB layout example.
August 1993
10
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
Table 1
Component list pcb layout example.
COMPONENT
VALUE
R1, R11
270 k
R2, R12
180 k
R3, R13, R20
1.5 k
R4, R14
24 k
R5, R15
8.2 k
R6, R16
330 k
R7, R17
1 k
R8, R18
0.18 k
R9
68 k
to 1000 k
R10
27 k
R19
18 k
R21, R22
0 k
C1, C11, C7, C17, C20
10
F
C2, C12
330 nF
C3, C13
100 nF
C4, C14
15 nF
C5, C15
4.7 nF
C6, C16
10 nF
C8, C9, C18, C19
0.47 nF
C10
100
F
August 1993
11
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
PACKAGE OUTLINE
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
15.6
15.2
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT137-1
X
12
24
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
c
L
v
M
A
13
(A )
3
A
y
0.25
075E05
MS-013AD
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.61
0.60
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
e
1
0
5
10 mm
scale
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
95-01-24
97-05-22
August 1993
12
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow.
The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
August 1993
13
Philips Semiconductors
Product specification
Dual pre-amplifier and equalizer for
reverse tape decks
TEA0677T
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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