March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

FEATURES

Internal supply

Optimum current split-up

Low constant current (adjustable) in transmission IC

Nearly all line current available for monitoring

Stabilized supply voltage

Loudspeaker amplifier with a fixed gain of 35 dB

Volume controlled by potentiometer

Power-down input (TEA1083A only)

Loudspeaker enable input.

GENERAL DESCRIPTION

The TEA1083/83A is a bipolar IC which has been
designed for use in line powered telephone sets. It is
intended to offer a monitoring facility of the line signal via

a loudspeaker during on-hook dialling. The TEA1083/83A
is intended for use in conjunction with a transmission
circuit of the TEA1060 family. The device uses a part of the
available line current via the internal supply circuit.
The loudspeaker amplifier, which consists of a preamplifier
and a power amplifier, amplifies the received line signals
from the transmission circuit when enabled via the LSE
input. The loudspeaker amplifier can also be used to
amplify dialling tones from the dialler IC. The power
amplifier contains a push-pull output stage to drive the
loudspeaker in a Single Ended Load (SEL) configuration.
The internal voltage stabilizer can be used to supply
external devices. By activating the power-down (PD) input
of the TEA1083A, the current consumption of the circuit
will be reduced, this enables pulse dialling or flash (register
recall).
An internal start circuit ensures normal start-up of the
transmission IC.

QUICK REFERENCE DATA

ORDERING INFORMATION

Notes

1. SOT97-1; 1998 Jun 18.

2. SOT38-1; 1998 Jun 18.

3. SOT162-1; 1998 Jun 18.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

SUP

input current range

3.0

120

stabilized supply current

2.95

SUP

current consumption

PD = HIGH; TEA1083A only

voltage gain of loudspeaker amplifier

SUP

minimum input current

= 10 mW (typ) into 50

amb

operating ambient temperature range

EXTENDED TYPE

NUMBER

PACKAGE

PINS

PIN POSITION

MATERIAL

CODE

TEA1083

DIL

PLASTIC

SOT97D

(1)

TEA1083A

DIL

PLASTIC

SOT38

(2)

TEA1083AT

SOL

PLASTIC

SOT162AG

(3)

March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

Table 1

Comparison of the TEA108X family.

PRODUCT

CONDITIONS

TEA1083

TEA1083A

TEA1085/85A

Application area

note 1

call progress monitoring

listening-in

PD facility

MUTE or LSE facility

note 2

Dynamic limiter

Howling limiter

setting

SEL

note 3

BTL

note 3

Number of pins

note 4

Notes

1. A call progress monitor is recommended by the

European Telecommunications Standards Institute
(ETSI) for telephone sets with automatic on-hook
dialling facilities so that audible, or visual, progress of
a call attempt can be monitored. In accordance with
the ETSI (at a frequency of 440 Hz and a line level of
20 dBm (600

)), a minimum level of 50 dBA shall be

guaranteed at a distance of 50 cm from the set. This
corresponds to a minimum level of approximately
100 mV (RMS) (P

0.2 mW) across a loudspeaker;

Philips type AD2071/Z50.

A listening-in set has to offer the user more facilities
e.g. howling limiting to reduce annoying loudspeaker
and line signals. Dynamic limiting of the loudspeaker
signal, with respect to supply conditions, can also be
required. Acoustic output levels for listening-in sets are
approximately 70 to 75 dBA. This corresponds to a
loudspeaker level of approximately 1 mV (RMS)
(P

20 mW).

2. The MUTE function of the TEA1085A has a logic input;

the MUTE function of the TEA1085 has a toggle input.

3. SEL: loudspeaker connected in a single-ended-load

configuration
BTL: loudspeaker connected in a bridge-tied-load
configuration

4. Consult the product specification for the package

outline/s.

FUNCTIONAL DESCRIPTION

The TEA1083/83A is normally used in conjunction with a
transmission circuit of the TEA1060 family. The circuit
must be connected between the positive line terminal
(pin 2) and pin SLPE of the transmission IC. The
transmission characteristics (impedance, gain settings,
etc.) are not affected.
An interconnection between the TEA1083/83A and a
member of the TEA1060 family is illustrated in Fig.5.

Supplies SUP, SREF, V

and V

In Fig.6 the line current is divided into I

for the

transmission IC and I

SUP

for the monitoring circuit

TEA1083/83A.

is constant:

= V

int

/ R20

SUP

= I

line

Where:

int

is an internal temperature compensated reference

voltage of 500 mV (typ) between pins SUP and SREF

R20 is a resistor connected between SUP and SREF

is the internal current consumption of the TEA106X

(approximately 1 mA).

A practical value for resistor R20 is 150

; this produces a

current of approximately 3.3 mA (typ) for I

and I

SUP

approximately equal to I

line

4.3 mA.

March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

The circuit stabilizes its own supply voltage at V

Transistor TR1 provides the supplies for the internal
circuits. Transistor TR2 is used to minimize signal
distortion on the line by momentarily diverting the input
current to V

whenever the instantaneous value of the

voltage at V

SUP

drops below the supply voltage V

. V

fixed to a typical value of 2.95 V.
The supply at V

is decoupled with respect to V

by a

220

F capacitor (C20).

The DC voltage (V

SUP

) is determined by the

transmission IC and V

int

; thus

SUP

= V

SLPE

int

The reference voltage of the transmission IC has to be
adjusted to a level where V

SUP

BB (max)

is greater than

400 mV. The minimum voltage space between SUP and
V

(400 mV) is required to maintain a 'high' efficiency of

the internal supply for mean speech levels. V

BB (max)

is the

specified maximum level.

The internal current consumption of the TEA1083/83A
(I

SUP0

) is typically 2.5 mA (where V

SUP

= 3.6 V).

The current I

SUP0

consists of currents I

BIAS

(approximately

0.4 mA) for the circuitry connected to SUP and I

BB0

(approximately 2.1 mA) for the internal circuitry connected
to V

(see Fig.6).

LOUDSPEAKER AMPLIFIER (LSI1/LSI2 and QLS)

The TEA1083/83A has symmetrical inputs at LSI1 and
LSI2. The input signal is normally taken from the earpiece
output of the transmission circuit (see Fig.5) and/or from
the signal output of the DTMF generator via a resistive
attenuator.
The attenuation factor must be chosen in accordance with
the output levels from the transmission IC and/or DTMF
generator and, in accordance with the required output
power and permitted signal distortion from the
loudspeaker signal.

The output QLS drives the loudspeaker as a single-ended
load. The output stage has been optimized for use with a
50

loudspeaker (e.g. Philips type AD2071). The

loudspeaker amplifier is enabled when the LSE input goes
HIGH. The gain of the amplifier is fixed at 35 dB.

Volume control of the loudspeaker signal can be obtained
by using a level control at the input (see Fig.5).

The maximum voltage swing at the QLS output is
V

O(p-p)

= 2.5 V (typical with 50

load). The input level

LSI

is approximately 16 mV(rms) and the supply current

SUP

11 mA. In this condition the signal is limited by the

available voltage space (V

). Higher input levels and/or

lower supply currents will result in an increase of the
harmonic distortion due to signal clipping.

With a limit of 2.5 V (p-p), the maximum output swing is
dependent on the supply current and loudspeaker
impedance. It can be approximated, for low distortions, by
the following equation:

O(p-p)

= 2

SUP

SUPO

)

× ×

Where;

O(p-p)

= the peak-to-peak level of the loudspeaker

= the loudspeaker impedance

SUPO

= 2.5 mA (typ.)

POWER-DOWN INPUT (PD)

During pulse dialling or register recall (timed loop break)
the telephone line is interrupted, thereby breaking the
supply current to the transmission IC. The capacitor
connected to V

provides the supply for the

TEA1083/83A during the supply breaks.

By making the PD input HIGH during the loop break, the
requirement on the capacitor is eased and, consequently,
the internal current consumption I

BB0

(see Fig.5) is

reduced from 2.1 mA to 400

A typically. Transistors TR1

and TR2 are inhibited during power-down and the bias
current is reduced from approximately 400

A to

approximately 50

A with V

SUP

= 3.6 V in the following

equation:

SUP(PD)

= I

BIAS(PD)

= (V

SUP

)/Ra

Where 3.6

SUP

3 V

is the voltage drop across 2 internal diodes

(approximately 1.3 V)

Ra is an internal resistor (typical 50 k

)

LOUDSPEAKER ENABLE INPUT (LSE)

The LSE input has a pull-down structure. It switches the
loudspeaker amplifier, in the monitoring condition, by
applying a HIGH level at the input. The amplifier is in the
standby condition when LSE is LOW (input open-circuit or
connected to V

March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC134)

THERMAL RESISTANCE

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

SUP

Supply voltage

continuous

during switch-on or line interruption

13.2

SUP

Repetitive supply voltage from 1 ms to
5 s with 12

current limiting resistor

in series with supply

SREF

Supply reference voltage

0.5

SUP

0.5

Voltage on all other pins

0.5

SUP

Supply current

see Fig.6

120

tot

Total power dissipation

amb

= 75

C; T

= 125

TEA1083

500

TEA1083A

769

TEA1083AT

555

stg

Storage temperature range

125

amb

Operating ambient temperature range

Junction temperature

125

SYMBOL

PARAMETER

THERMAL RESISTANCE

th j-a

from junction to ambient in free air (TEA1083)

100 K/W

from junction to ambient in free air (TEA1083A)

65 K/W

from junction to ambient in free air (TEA1083AT)

90 K/W

March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

CHARACTERISTICS

SUP

= 3.6 V; V

= 0 V; I

SUP

= 15 mA; V

SUP

= 0 V (RMS); f = 800 Hz; T

amb

= 25

C; PD = LOW; LSE = HIGH;

loudspeaker amplifier load = 50

; all measurements taken in test circuit Fig.10; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

SUP

Minimum DC input voltage

0.6

SUP

SREF

Internal reference voltage

400

500

600

Stabilized supply voltage

SUP

= 15 mA

2.75

2.95

3.15

Variation of supply voltage

from I

SUP

= 15 to 120 mA

Variation of supply voltage with
temperature, referred to 25

amb

25 to

sup

= 15 mA

0.2

mV/K

SUP

Minimum operating current

2.5

4.0

THD

Distortion of AC signal between
SUP and V

SUP(RMS)

= 1 V

0.3

no(RMS)

Noise between SUP and V

(RMS value)

psophometrically
weighted (P53 curve)

dBmp

Current consumption in
power-down condition

PD = HIGH

SUP

= 3.6 V

= 2.95 V

400

550

Loudspeaker amplifier inputs LSI1 and LSI2

input impedance (LSI1 and LSI2) single ended

7.5

9.5

11.5

differential (LSI1 to LSI2)

Voltage gain from LSI1/2 to QLS

SUP

= 15 mA;

= 2 mV (RMS)

Total gain variation with input
signal from 2 mV(RMS) to
10 mV(RMS)

0.2

Total gain variation with
temperature referred to 25

amb

25 to

0.4

Output capabilities

O(p-p)

Maximum output voltage
(peak-to-peak value)

THD = 3%; 50

load

2.0

2.5

O(p-p)

Output voltage (peak-to-peak
value)

= 10 mV(RMS);

SUP

= 15 mA;

SUP

= 1 V (RMS)

1.6

no(RMS)

Noise output voltage (RMS
value)

1 k

between inputs

LSI1 and LSI2;
psophometrically
weighted (P53 curve)

250

Power-down input (PD) (TEA1083A only)

LOW level input voltage

0.3

HIGH level input voltage

1.5

Input current

PD = HIGH

2.3

2.8

March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

Notes to figure 10

1. I

SUP

= I

4. The pin numbers in parenthesis refer to the TEA1083A/AT

5. LSE has to be HIGH to measure the voltage gain

6. PD has to be HIGH to measure in PD conditions

7. The pins not shown in the TEA1060 are left open-circuit

8. An impedance in series with pin SUP (e.g. an ammeter) should

be avoided as it interferes with the values of I

and I

SUP

LSE input

LOW level input voltage

0.3

HIGH level input voltage

1.5

Input current

LSE = HIGH

Reduction of gain from LSI1/LSI2
to QLS

LSE = LOW

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Fig.10 Test circuit.

handbook, full pagewidth

MGR054

TEA1060

VCC

VLSI

VEE

SLPE

REG

STAB

MIC

GAS1

MIC

GAS2

GAR

4.7

C21

220

C20

470

100

3.6

RLS
50

R1
620

R20
150

R9
20

TEA1083

(TEA1083A)

VBB

SREF

VSS

LSE

QLS

7 (15)

(13) 6

(12)

LSI1

(8) 4

LSI2

(9) 5

1 (1)

8 (16)

3 (4)

SUP

2 (2)

ITR

Iin

Iline

ICC

VSUP

VSREF

ISUP

IBB

VBB

20 log

LSI

-----------

SUP

SREF

R20

-------------------------------

March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

APPLICATION INFORMATION

An application of the TEA1083/83A, in conjunction with a
member of the TEA1060 family, is illustrated in figure 11.
The TEA1083/83A is used for call progress monitoring
during on-hook dialling. The dialling facilities are
performed by a microcontroller (e.g. PCD3344,
PCD3349).
Only the most important components have been shown.
For detailed information refer to a data sheet of the
TEA1060 family.
The electronic hook switch can be replaced by a
mechanical system (hook switch) with a hold/release
function which is intended for on-hook dialling.

ok, full pagewidth

MGR055

VEE

Zbal

GAR

DTMF

MIC

VCC

MIC

REG

SLPE

MICROCONTROLLER AND

INTERFACE CIRCUITRY

ENABLE

DTMF

DP/FL

MUTE

4.7

R9
20

R22

2.2

MUTE

TEA1060

50 k

R21

2.2 k

150

C14

150 nF

100 nF

(12)

QLS

LSE

(15)
7

(13)

4 (8)

5 (9)

1 (1)

LSI1

LSI2

VSS

SREF

VBB

TEA1083

(TEA1083A)

SUP

3 (4)

8 (16)

2 (2)

C22

220

C23

220

C21

100

C24

150 nF

R20
150

R1
620

R2
130 k

390

R3
3.9 k

C20

220

VSS

VDD

XTAL

CRS

cradle switch

line-interrupter
electronic
hook switch

a/b

line

b/a

Fig.11 Application example when the TEA1083/83A is used in conjunction with the TEA1060.

Pin numbers in parenthesis refer to the TEA1083A/AT.

March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300

C it may remain in

contact for up to 10 seconds. If the bit temperature is
between 300 and 400

C, contact may be up to 5 seconds.

EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

AVE SOLDERING

Wave soldering techniques can be used for all SO
packages if the following conditions are observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

The longitudinal axis of the package footprint must be
parallel to the solder flow.

The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

March 1994

Philips Semiconductors

Product specification

Call progress monitor for line powered
telephone sets

TEA1083; TEA1083A

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

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Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,
Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381

Printed in The Netherlands

415102/00/02/pp20

Date of release: March 1994

Document order number:

9397 750 nnnnn

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1083A/C1

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1083A/C1