1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

FEATURES

Low power consumption

Power-down function (TEA1094A only)

Microphone channel with:

externally adjustable gain

microphone mute function.

Loudspeaker channel with:

externally adjustable gain

dynamic limiter to prevent distortion

rail-to-rail output stage for single-ended load drive

logarithmic volume control via linear potentiometer

loudspeaker mute function.

Duplex controller consisting of:

signal envelope and noise envelope monitors for both

channels with:

externally adjustable sensitivity

externally adjustable signal envelope time constant

externally adjustable noise envelope time constant

decision logic with:

externally adjustable switch-over timing

externally adjustable idle mode timing

externally adjustable dial tone detector in
receive channel

voice switch control with:

adjustable switching range

constant sum of gain during switching

constant sum of gain at different volume settings.

APPLICATIONS

Mains, battery or line-powered telephone sets with
hands-free/listening-in functions

Cordless telephones

Answering machines

Fax machines.

GENERAL DESCRIPTION

The TEA1094 and TEA1094A are bipolar circuits intended
for use in mains, battery or line-powered telephone sets,
cordless telephones, answering machines and Fax
machines. In conjunction with a member of the TEA106X,
TEA111X families of transmission circuits, the devices
offer a hands-free function. They incorporate a
microphone amplifier, a loudspeaker amplifier and a
duplex controller with signal and noise monitors on
both channels.

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TEA1094

DIP28

plastic dual in-line package; 28 leads (600 mil)

SOT117-1

TEA1094A

DIP24

plastic dual in-line package; 24 leads (600 mil)

SOT101-1

TEA1094T

SO28

plastic small outline package; 28 leads; body width 7.5 mm

SOT136-1

TEA1094AT

SO24

plastic small outline package; 24 leads; body width 7.5 mm

SOT137-1

TEA1094AM

SSOP24

plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

QUICK REFERENCE DATA
V

= 5 V; V

GND

= 0 V; f = 1 kHz; T

amb

= 25

C; MUTET = LOW; PD = LOW (TEA1094A only); R

= 50

; R

VOL

= 0

;

measured in test circuit of Fig.12; unless otherwise specified.

Note

1. Corresponds to 200 mW output power.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage

3.3

12.0

current consumption from pin V

3.1

4.4

vtx

voltage gain from pin MIC to
pin MOUT in transmit mode

MIC

= 1 mV (RMS);

GAT

= 30.1 k

15.5

vtxr

voltage gain adjustment with R

GAT

15.5

+15.5

vrx

voltage gain in receive mode; the
difference between RIN1 and RIN2
to LSP

RIN

= 20 mV (RMS);

GAR

= 66.5 k

;

= 50

18.5

vrxr

voltage gain adjustment with R

GAR

18.5

+14.5

O(p-p)

output voltage (peak-to-peak value)

RIN

= 150 mV (RMS);

GAR

= 374 k

;

= 33

; V

= 9.0 V;

note 1

7.5

SWRA

switching range

SWRA

switching range adjustment with R

SWR

referenced to R

SWR

= 365 k

+12

amb

operating ambient temperature

+75

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

PINNING

SYMBOL

PINS

DESCRIPTION

TEA1094

TEA1094A

DLC/MUTER

dynamic limiter timing adjustment; receiver channel mute input

RIN1

receiver amplifier input 1

RIN2

receiver amplifier input 2

n.c.

not connected

GAR

receiver gain adjustment

LSP

loudspeaker amplifier output

n.c.

not connected

GND

ground reference

n.c.

not connected

supply voltage

VOL

receiver volume adjustment

SWR

switching range adjustment

STAB

reference current adjustment

SWT

switch-over timing adjustment

n.c.

not connected

IDT

idle mode timing adjustment

power-down input

n.c.

not connected

MICGND

ground reference for the microphone amplifier

MUTET

transmit channel mute input

MOUT

microphone amplifier output

GAT

microphone gain adjustment

MIC

microphone input

RNOI

receive noise envelope timing adjustment

RENV

receive signal envelope timing adjustment

RSEN

receive signal envelope sensitivity adjustment

TNOI

transmit noise envelope timing adjustment

TENV

transmit signal envelope timing adjustment

TSEN

transmit signal envelope sensitivity adjustment

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

Fig.2 Pin configuration (TEA1094).

handbook, halfpage

DLC/MUTER

RIN1

RIN2

n.c.

GAR

LSP

n.c.

GND

n.c.

VBB

VOL

SWR

STAB

SWT

TSEN

TENV

TNOI

RSEN

RNOI

MIC

RENV

GAT

MOUT

MUTET

MICGND

n.c.

IDT

n.c.

TEA1094

MGE434

Fig.3 Pin configuration (TEA1094A).

handbook, halfpage

DLC/MUTER

RIN1

RIN2

GAR

LSP

GND

VBB

VOL

SWR

STAB

SWT

IDT

TSEN

TENV

TNOI

RSEN

RNOI

MIC

RENV

GAT

MOUT

MUTET

MICGND

TEA1094A

MGE435

FUNCTIONAL DESCRIPTION

General

The values given in the functional description are typical
values unless otherwise specified.

A principle diagram of the TEA106X is shown on the left
side of Fig.4. The TEA106X is a transmission circuit of the
TEA1060 family intended for hand-set operation.
It incorporates a receiving amplifier for the earpiece, a
transmit amplifier for the microphone and a hybrid.
For more details on the TEA1060 family, please refer to
"data Handbook IC03". The right side of Fig.4 shows a
principle diagram of the TEA1094 and TEA1094A,
hands-free add-on circuits with a microphone amplifier, a
loudspeaker amplifier and a duplex controller.

As can be seen from Fig.4, a loop is formed via the
sidetone network in the transmission circuit and the
acoustic coupling between loudspeaker and microphone
of the hands-free circuit. When this loop gain is greater
than 1, howling is introduced. In a full duplex application,
this would be the case.
The loop-gain has to be much lower than 1 and therefore

has to be decreased to avoid howling. This is achieved by
the duplex controller. The duplex controller of the
TEA1094 and TEA1094A detects which channel has the
`largest' signal and then controls the gain of the
microphone amplifier and the loudspeaker amplifier so that
the sum of the gains remains constant.
As a result, the circuit can be in three stable modes:

1. Transmit mode (Tx mode).

The gain of the microphone amplifier is at its maximum
and the gain of the loudspeaker amplifier is at its
minimum.

2. Receive mode (Rx mode).

The gain of the loudspeaker amplifier is at its
maximum and the gain of the microphone amplifier is
at its minimum.

3. Idle mode.

The gain of the amplifiers is halfway between their
maximum and minimum value.

The difference between the maximum gain and minimum
gain is called the switching range.

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

Fig.4 Hands-free telephone set principles.

handbook, full pagewidth

MGE438

DUPLEX

CONTROL

HYBRID

telephone

line

sidetone

acoustic
coupling

TEA106x

TEA1094

TEA1094A

Supply: pins V

, GND and PD

The TEA1094 and TEA1094A must be supplied with an
external stabilized voltage source between pins V

and

GND. In the idle mode, without any signal, the internal
supply current is 3.1 mA at V

= 5 V.

To reduce the current consumption during pulse dialling or
register recall (flash), the TEA1094A is provided with a
power-down (PD) input. When the voltage on PD is HIGH
the current consumption from V

is 180

Microphone channel: pins MIC, GAT, MOUT, MICGND
and MUTET (see Fig.5)

The TEA1094 and TEA1094A have an asymmetrical
microphone input MIC with an input resistance of 20 k

The gain of the input stage varies according to the mode
of the TEA1094 and TEA1094A. In the transmit mode, the
gain is at its maximum; in the receive mode, it is at its
minimum and in the idle mode, it is halfway between
maximum and minimum.

Switch-over from one mode to the other is smooth and
click-free. The output capability at pin MOUT is
20

A (RMS).

In the transmit mode, the overall gain of the microphone
amplifier (from pins MIC to MOUT) can be adjusted from
0 dB up to 31 dB to suit specific application requirements.
The gain is proportional to the value of R

GAT

and equals

15.5 dB with R

GAT

= 30.1 k

A capacitor must be connected in parallel with R

GAT

ensure stability of the microphone amplifier. Together with
R

GAT

, it also provides a first-order low-pass filter.

By applying a HIGH level on pin MUTET, the microphone
amplifier is muted and the TEA1094 and TEA1094A are
automatically forced into the receive mode.

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

OUDSPEAKER AMPLIFIER

PINS

RIN1, RIN2, GAR

AND

LSP

The TEA1094 and TEA1094A have symmetrical inputs for
the loudspeaker amplifier with an input resistance of 40 k

between RIN1 and RIN2 (2

20 k

). The input stage can

accommodate signals up to 390 mV (RMS) at room
temperature for 2% of total harmonic distortion (THD).
The gain of the input stage varies according to the mode
of the TEA1094 and TEA1094A. In the receive mode, the
gain is at its maximum; in the transmit mode, it is at its
minimum and in the idle mode, it is halfway between
maximum and minimum. Switch-over from one mode to
the other is smooth and click-free. The rail-to-rail output
stage is designed to power a loudspeaker connected as a
single-ended load (between LSP and GND).

In the receive mode, the overall gain of the loudspeaker
amplifier can be adjusted from 0 dB up to 33 dB to suit
specific application requirements. The gain from
RIN1 and RIN2 to LSP is proportional to the value of R

GAR

and equals 18.5 dB with R

GAR

= 66.5 k

. A capacitor

connected in parallel with R

GAR

can be used to provide a

first-order low-pass filter.

OLUME CONTROL

VOL

The loudspeaker amplifier gain can be adjusted with the
potentiometer R

VOL

. A linear potentiometer can be used to

obtain logarithmic control of the gain at the loudspeaker
amplifier. Each 950

increase of R

VOL

results in a gain

loss of 3 dB. The maximum gain reduction with the volume
control is internally limited to the switching range.

YNAMIC LIMITER

DLC/MUTER

The dynamic limiter of the TEA1094 and TEA1094A
prevents clipping of the loudspeaker output stage and
protects the operation of the circuit when the supply
voltage at V

falls below 2.9 V.

Hard clipping of the loudspeaker output stage is prevented
by rapidly reducing the gain when the output stage starts
to saturate. The time in which gain reduction is effected
(clipping attack time) is approximately a few milliseconds.
The circuit stays in the reduced gain mode until the peaks
of the loudspeaker signals no longer cause saturation.
The gain of the loudspeaker amplifier then returns to its
normal value within the clipping release time (typically
250 ms). Both attack and release times are proportional to
the value of the capacitor C

DLC

. The total harmonic

distortion of the loudspeaker output stage, in reduced gain
mode, stays below 5% up to 10 dB (minimum) of input
voltage overdrive [providing V

RIN

is below 390 mV (RMS)].

When the supply voltage drops below an internal threshold
voltage of 2.9 V, the gain of the loudspeaker amplifier is
rapidly reduced (approximately 1 ms). When the supply
voltage exceeds 2.9 V, the gain of the loudspeaker
amplifier is increased again.

By forcing a level lower than 0.2 V on pin DLC/MUTER, the
loudspeaker amplifier is muted and the TEA1094
(TEA1094A) is automatically forced into the transmit
mode.

Duplex controller

IGNAL AND NOISE ENVELOPE DETECTORS

PINS

TSEN,

TENV, TNOI, RSEN, RENV

AND

RNOI

The signal envelopes are used to monitor the signal level
strength in both channels. The noise envelopes are used
to monitor background noise in both channels. The signal
and noise envelopes provide inputs for the decision logic.
The signal and noise envelope detectors are shown in
Fig.7.

For the transmit channel, the input signal at MIC is 40 dB
amplified to TSEN. For the receive channel, the differential
signal between RIN1 and RIN2 is 0 dB amplified to RSEN.
The signals from TSEN and RSEN are logarithmically
compressed and buffered to TENV and RENV
respectively. The sensitivity of the envelope detectors is
set with R

TSEN

and R

RSEN

. The capacitors connected in

series with the two resistors block any DC component and
form a first-order high-pass filter. In the basic application,
see Fig.13, it is assumed that V

MIC

= 1 mV (RMS) and

RIN

= 100 mV (RMS) nominal and both R

TSEN

and R

RSEN

have a value of 10 k

. With the value of C

TSEN

and C

RSEN

at 100 nF, the cut-off frequency is at 160 Hz.

The buffer amplifiers leading the compressed signals to
TENV and RENV have a maximum source current of
120

A and a maximum sink current of 1

A. Together with

the capacitor C

TENV

and C

RENV

, the timing of the signal

envelope monitors can be set. In the basic application, the
value of both capacitors is 470 nF. Because of the
logarithmic compression, each 6 dB signal increase
means 18 mV increase of the voltage on the envelopes
TENV or RENV at room temperature. Thus, timings can be
expressed in dB/ms. At room temperature, the 120

sourced current corresponds to a maximum rise-slope of
the signal envelope of 85 dB/ms. This is sufficient to track
normal speech signals. The 1

A current sunk by TENV or

RENV corresponds to a maximum fall-slope of 0.7 dB/ms.
This is sufficient for a smooth envelope and also eliminates
the effect of echoes on switching behaviour.

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

To determine the noise level, the signals on TENV and
RENV are buffered to TNOI and RNOI. These buffers have
a maximum source current of 1

A and a maximum sink

current of 120

A. Together with the capacitors C

TNOI

and

RNOI

, the timing can be set. In the basic application of

Fig.13 the value of both capacitors is 4.7

F. At room

temperature, the 1

A sourced current corresponds to a

maximum rise-slope of the noise envelope of
approximately 0.07 dB/ms.

This is small enough to track background noise and not to
be influenced by speech bursts. The 120

A current that is

sunk corresponds to a maximum fall-slope of
approximately 8.5 dB/ms. However, during the decrease
of the signal envelope, the noise envelope tracks the
signal envelope so it will never fall faster than
approximately 0.7 dB/ms. The behaviour of the signal
envelope and noise envelope monitors is illustrated in
Fig.8.

Fig.7 Signal and noise envelope detectors.

handbook, full pagewidth

MGD223

LOG

(24)

(23)

(22)

(21)

(20)

(19)

LOG

from
microphone
amplifier

from
loudspeaker
amplifier

DUPLEX CONTROLLER

TSEN

RTSEN

CTSEN

CTENV

CTNOI

RRSEN

CRSEN

CRENV

CRNOI

TENV

TNOI

RSEN

RENV

RNOI

to logic

The pin numbers given in parenthesis refer to the TEA1094A.

handbook, full pagewidth

MBG354

INPUT SIGNAL

SIGNAL ENVELOPE

NOISE ENVELOPE

4 mV (RMS)

1 mV (RMS)

36 mV

time

A: 85 dB/ms
B: 0.7 dB/ms

B: 0.7 dB/ms
C: 0.07 dB/ms

Fig.8 Signal and noise envelope waveforms.

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

ECISION LOGIC

PINS

IDT

AND

SWT

Fig.9 Decision logic.

The pin numbers given in parenthesis refer to the TEA1094A.

(1) When MUTET = HIGH, +10

A is forced.

When DLC/MUTER < 0.2 V,

A is forced.

handbook, full pagewidth

MGD224

13 mV

TENV

TNOI

RENV

MUTET

from dynamic

limiter

RNOI

Vdt

Vref

RIDT

CSWT

SWT

(12)

(11)

(23)

(22)

(20)

(19)

(15)

IDT

DUPLEX CONTROLLER

LOGIC

(1)

ATTENUATOR

The TEA1094 and TEA1094A select their modes of
operation (transmit, receive or idle mode) by comparing
the signal and the noise envelopes of both channels. This
is executed by the decision logic. The resulting voltage on
pin SWT is the input for the voice-switch.

To facilitate the distinction between signal and noise, the
signal is considered as speech when its envelope is more
than 4.3 dB above the noise envelope. At room
temperature, this is equal to a voltage difference
V

ENV

NOI

= 13 mV. This so called speech/noise

threshold is implemented in both channels.

The signal on MIC contains both speech and the signal
coming from the loudspeaker (acoustic coupling). When
receiving, the contribution from the loudspeaker overrules
the speech.

As a result, the signal envelope on TENV is formed mainly
by the loudspeaker signal. To correct this, an attenuator is
connected between TENV and the TENV/RENV
comparator. Its attenuation equals that applied to the
microphone amplifier.

When a dial tone is present on the line, without monitoring,
the tone would be recognized as noise because it is a
signal with a constant amplitude. This would cause the
TEA1094 (TEA1094A) to go into the idle mode and the
user of the set would hear the dial tone fade away. To
prevent this, a dial tone detector is incorporated which, in
standard applications, does not consider input signals
between RIN1 and RIN2 as noise when they have a level
greater than 127 mV (RMS). This level is proportional to
R

RSEN

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

As can be seen from Fig.9, the output of the decision logic
is a current source. The logic table gives the relationship
between the inputs and the value of the current source.
It can charge or discharge the capacitor C

SWT

with a

current of 10

A (switch-over). If the current is zero, the

voltage on SWT becomes equal to the voltage on IDT via
the high-ohmic resistor R

IDT

(idling). The resulting voltage

difference between SWT and IDT determines the mode of
the TEA1094 (TEA1094A) and can vary between

400 and +400 mV (see Table 1).

Table 1 Modes of TEA1094; TEA1094A

The switch-over timing can be set with C

SWT

, the idle mode

timing with C

SWT

and R

IDT

. In the basic application given in

Fig.13, C

SWT

is 220 nF and R

IDT

is 2.2 M

. This enables a

switch-over time from transmit to receive mode or
vice-versa of approximately 13 ms (580 mV swing on
SWT). The switch-over time from idle mode to transmit
mode or receive mode is approximately 4 ms (180 mV
swing on SWT).

The switch-over time, from receive mode or transmit mode
to idle mode, is equal to 4

IDT

SWT

and is

approximately 2 seconds (idle mode time).

The inputs MUTET and DLC/MUTER overrule the decision
logic. When MUTET goes HIGH, the capacitor C

SWT

charged with 10

A thus resulting in the receive mode.

When the voltage on pin DLC/MUTER goes lower than
0.2 V, the capacitor C

SWT

is discharged with 10

A thus

resulting in the transmit mode.

OICE

SWITCH

PINS

STAB

AND

SWR

A diagram of the voice-switch is illustrated in Fig.10. With
the voltage on SWT, the TEA1094 (TEA1094A)
voice-switch regulates the gains of the transmit and the
receive channel so that the sum of both is kept constant.

In the transmit mode, the gain of the microphone amplifier
is at its maximum and the gain of the loudspeaker amplifier
is at its minimum. In the receive mode, the opposite
applies. In the idle mode, both microphone and
loudspeaker amplifier gains are halfway.

SWT

IDT

(mV)

MODE

180

transmit mode

idle mode

>180

receive mode

The difference between maximum and minimum is the so
called switching range. This range is determined by the
ratio of R

SWR

and R

STAB

and is adjustable between

0 and 52 dB. R

STAB

should be 3.65 k

and sets an

internally used reference current. In the basic application
diagram given in Fig.13, R

SWR

is 365 k

which results in a

switching range of 40 dB. The switch-over behaviour is
illustrated in Fig.11.

In the receive mode, the gain of the loudspeaker amplifier
can be reduced using the volume control. Since the
voice-switch keeps the sum of the gains constant, the gain
of the microphone amplifier is increased at the same time
(see dashed curves in Fig.11). In the transmit mode,
however, the volume control has no influence on the gain
of the microphone amplifier or the gain of the loudspeaker
amplifier. Consequently, the switching range is reduced
when the volume is reduced. At maximum reduction of
volume, the switching range becomes 0 dB.

Fig.10 Voice switch.

The pin numbers given in parenthesis refer to the TEA1094A.

(1) C = constant.

Gvtx

Gvrx

(1)

VOICE SWITCH

RSTAB

RSWR

STAB

(10)

(9)

SWR

microphone

amplifier

from

SWT

from

volume

control

loudspeaker

amplifier

DUPLEX CONTROLLER

MGD225

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

THERMAL CHARACTERISTICS

CHARACTERISTICS
V

= 5 V; V

GND

= 0 V; f = 1 kHz; T

amb

= 25

C; MUTET = LOW; PD = LOW (TEA1094A only); R

= 50

; R

VOL

= 0

;

measured in test circuit of Fig.12; unless otherwise specified.

SYMBOL

PARAMETER

VALUE

UNIT

th j-a

thermal resistance from junction to ambient in free air

TEA1094

K/W

TEA1094A

K/W

TEA1094T

K/W

TEA1094AT

K/W

TEA1094AM

104

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply (V

, GND and PD)

supply voltage

3.3

12.0

current consumption from pin V

3.1

4.4

OWER

DOWN INPUT

PD (TEA1094A

ONLY

)

LOW level input voltage

GND

0.4

0.3

HIGH level input voltage

1.5

+ 0.4

input current

PD = HIGH

2.5

BB(PD)

current consumption from pin V

in power-down condition

PD = HIGH

180

240

Microphone channel (MIC, GAT, MOUT, MUTET and MICGND)

ICROPHONE AMPLIFIER

input impedance between
pins MIC and MICGND

vtx

voltage gain from pin MIC to
MOUT in transmit mode

MIC

= 1 mV (RMS)

15.5

vtxr

voltage gain adjustment with R

GAT

15.5

+15.5

vtxT

voltage gain variation with
temperature referenced to 25

MIC

= 1 mV (RMS);

amb

25 to +75

0.3

vtxf

voltage gain variation with
frequency referenced to 1 kHz

MIC

= 1 mV (RMS);

f = 300 to 3400 Hz

0.3

notx

noise output voltage at pin MOUT

pin MIC connected to
MICGND through 200

series with 10

psophometrically weighted
(P53 curve)

100

dBmp

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

RANSMIT MUTE INPUT

MUTET

LOW level input voltage

GND

0.4

0.3

HIGH level input voltage

1.5

+ 0.4

MUTET

input current

MUTET = HIGH

2.5

vtxm

voltage gain reduction with
MUTET active

MUTET = HIGH

Loudspeaker channel (RIN1, RIN2, GAR, LSP and DLC/MUTER)

OUDSPEAKER AMPLIFIER

input impedance

between pins RIN1 or RIN2
and GND

between pins RIN1 and
RIN2

vrx

voltage gain in receive mode;
between RIN1 and RIN2 to LSP

RIN

= 20 mV (RMS)

18.5

vrxr

voltage gain adjustment with R

GAR

18.5

+14.5

vrxT

voltage gain variation with
temperature referenced to 25

RIN

= 20 mV (RMS);

amb

25 to +75

0.3

vrxf

voltage gain variation with
frequency referenced to 1 kHz

RIN

= 20 mV (RMS);

f = 300 to 3400 Hz

0.3

RIN(rms)

maximum input voltage between
RIN1 and RIN2 (RMS value)

GAR

= 11.8 k

; for 2%

THD in input stage

390

norx(rms)

noise output voltage at pin LSP
(RMS value)

inputs RIN1 and RIN2
short-circuited through
200

in series with 10

psophometrically weighted
(P53 curve)

CMRR

common mode rejection ratio

vrxv

voltage gain variation related to

VOL

= 950

when total attenuation does
not exceed the switching
range

UTPUT CAPABILITY

OSE(p-p)

output voltage
(peak-to-peak value)

RIN

= 300 mV (RMS);

note 1

3.5

4.5

RIN

= 150 mV (RMS);

GAR

= 374 k

; R

= 33

;

= 9.0 V; note 2

7.5

maximum output current at LSP
(peak value)

150

500

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

YNAMIC LIMITER

att

attack time when V

RIN

jumps from

20 mV to 20 mV + 10 dB

GAR

= 374 k

rel

release time when V

RIN

jumps

from 20 mV + 10 dB to 20 mV

GAR

= 374 k

250

THD

total harmonic distortion at
V

RIN

= 20 mV + 10 dB

GAR

= 374 k

; t

att

0.9

BB(th)

limiter threshold

2.9

att

attack time when V

jumps below

BB(th)

UTE RECEIVE

DLC(th)

threshold voltage required on pin
DLC/MUTER to obtain mute
receive condition

GND

0.4

0.2

DLC(th)

threshold current sourced by
pin DLC/MUTER in mute receive
condition

DLC

= 0.2 V

100

vrxm

voltage gain reduction in mute
receive condition

DLC

0.2 V

Envelope and noise detectors (TSEN, TENV, RSEN, RENV, RNOI and TNOI)

REAMPLIFIERS

v(TSEN)

voltage gain from MIC to TSEN

37.5

42.5

v(RSEN)

voltage gain between RIN1 and
RIN2 to RSEN

2.5

+2.5

OGARITHMIC COMPRESSOR AND SENSITIVITY ADJUSTMENT

det(TSEN)

sensitivity detection on pin TSEN;
voltage change on pin TENV
when doubling the current from
TSEN

TSEN

= 0.8 to 160

det(RSEN)

sensitivity detection on
pin RSEN; voltage change on
pin RENV when doubling the
current from RSEN

RSEN

= 0.8 to 160

IGNAL ENVELOPE DETECTORS

source(ENV)

maximum current sourced from
pin TENV or RENV

120

sink(ENV)

maximum current sunk by
pin TENV or RENV

0.75

1.25

ENV

voltage difference between
pins RENV and TENV

when 10

A is sourced

from both RSEN and
TSEN; envelope detectors
tracking; note 3

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

Notes

1. Corresponds to 50 mW output power.

2. Corresponds to 200 mW output power.

3. Corresponds to

1 dB tracking.

4. Corresponds to 4.3 dB noise/speech recognition level.

OISE ENVELOPE DETECTORS

source(NOI)

maximum current sourced from
pins TNOI or RNOI

0.75

1.25

sink(NOI)

maximum current sunk by
pins TNOI or RNOI

120

NOI

voltage difference between
pins RNOI and TNOI

when 5

A is sourced from

both RSEN and TSEN;
noise detectors tracking;
note 3

IAL TONE DETECTOR

RINDT(rms)

threshold level at pins RIN1 and
RIN2 (RMS value)

127

Decision logic (IDT and SWT)

IGNAL RECOGNITION

Srx(th)

threshold voltage between
pins RENV and RNOI to
switch-over from receive to idle
mode

RIN

RINDT

; note 4

Stx(th)

threshold voltage between
pins TENV and TNOI to
switch-over from transmit to idle
mode

note 4

WITCH

OVER

source(SWT)

current sourced from pin SWT
when switching to receive mode

7.5

12.5

sink(SWT)

current sunk by pin SWT when
switching to transmit mode

7.5

12.5

idle(SWT)

current sourced from pin SWT in
idle mode

Voice switch (STAB and SWR)

SWRA

switching range

SWRA

switching range adjustment

with R

SWR

referenced to

365 k

+12

voltage gain variation from
transmit mode to idle mode on
both channels

gain tracking (G

vtx

+ G

vrx

) during

switching, referenced to idle mode

0.5

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300

C it may remain in

contact for up to 10 seconds. If the bit temperature is
between 300 and 400

C, contact may be up to 5 seconds.

SO and SSOP

EFLOW SOLDERING

Reflow soldering techniques are suitable for all SO and
SSOP packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating

method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

AVE SOLDERING

Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.

Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

1996 Jul 15

Philips Semiconductors

Product specification

Hands free IC

TEA1094; TEA1094A

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com/ps/

(1)

TEA1094_3 June 26, 1996 11:51 am

Philips Semiconductors a worldwide company

SCA50

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Printed in The Netherlands

417021/1200/03/pp28

Date of release: 1996 Jul 15

Document order number:

9397 750 00926

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