2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

FEATURES

Designed for general purpose supplies up to 50 W

Integrated power switch:

TEA1520: 48

; 650 V

TEA1521: 24

; 650 V

TEA1522: 12

; 650 V

TEA1523: 6.5

; 650 V

TEA1524: 3.4

; 650 V.

Operates from universal AC mains supplies
(80 to 276 V)

Adjustable frequency for flexible design

RC oscillator for load insensitive regulation loop
constant

Valley switching for minimum switch-on loss (not
implemented in TEA152xAJM versions)

Frequency reduction at low power output makes low
standby power possible (<100 mW)

Adjustable overcurrent protection

Under voltage protection

Temperature protection

Short circuit winding protection

Simple application with both primary and secondary
(opto) feedback

Available in 8-pin DIP, 14-pin SO and 9-pin DBS
packages.

GENERAL DESCRIPTION

The TEA152x family is a Switched Mode Power
Supply (SMPS) controller IC that operates directly from
the rectified universal mains. It is implemented in the high
voltage EZ-HV SOI process, combined with a low voltage
BICMOS process. The device includes a high voltage
power switch and a circuit for start-up directly from the
rectified mains voltage.

A dedicated circuit for valley switching is built in (not
implemented in TEA152xAJM versions), which makes a
very efficient slim-line electronic powerplug concept
possible.

In its most basic version of application, the TEA152x family
acts as a voltage source. Here, no additional secondary
electronics are required. A combined voltage and current
source can be realized with minimum costs for external
components. Implementation of the TEA152x family
renders an efficient and low cost power supply system.

Table 1

Available type numbers

APPLICATIONS

Typical application areas for the STARplug

are:

Chargers

Adapters

STB (Set Top Box)

DVD

CD(R)

TV/monitor standby supplies

PC peripherals

Microcontroller supplies in home applications and small
portable equipment, etc.

DS(on)

DIP8

SO14

DBS9P

TEA1520P

TEA1520T

TEA1521P

TEA1521T

TEA1522P

TEA1522T

TEA1522AJM

6.5

TEA1523P

TEA1523T

TEA1523AJM

3.4

TEA1524P

TEA1524AJM

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

drain(max)

maximum voltage at the DRAIN
pin

> 0

650

DS(on)

drain-source on-state resistance
of TEA1520

= 25

C; I

source

0.06 A

55.2

= 100

C; I

source

0.06 A

78.2

drain-source on-state resistance
of TEA1521

= 25

C; I

source

0.125 A

27.6

= 100

C; I

source

0.125 A

39.1

drain-source on-state resistance
of TEA1522

= 25

C; I

source

0.25 A

13.8

= 100

C; I

source

0.25 A

19.6

drain-source on-state resistance
of TEA1523

= 25

C; I

source

0.5 A

6.5

7.5

= 100

C; I

source

0.5 A

9.0

10.0

drain-source on-state resistance
of TEA1524

= 25

C; I

source

1.0 A

3.4

3.9

= 100

C; I

source

1.0 A

4.8

5.5

CC(max)

maximum supply voltage

osc

frequency range of oscillator

100

200

kHz

drain

supply current drawn from DRAIN
pin

no auxiliary supply

1.5

amb

ambient temperature

+85

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TEA152xP

DIP8

plastic dual in-line package; 8 leads (300 mil)

SOT97-1

TEA152xT

SO14

plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

TEA152xAJM

DBS9P

plastic DIL-bent-SIL power package; 9 leads (lead length
12/11 mm); exposed die pad

SOT523-1

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

PINNING

SYMBOL

PIN

DESCRIPTION

TEA152xP

TEA152xT

TEA152xAJM

supply voltage

GND

2, 3, 4, 5,

9 and 10

ground

frequency setting

REG

regulation input

SGND

signal ground; connected to exposed die pad; must be
connected to pin 2

AUX

input for voltage from auxiliary winding for timing
(demagnetization)

SOURCE

source of internal MOS switch

n.c.

12 and 13

not connected

DRAIN

drain of internal MOS switch; input for start-up current
and valley sensing

handbook, halfpage

MGT420

TEA152xP

DRAIN

n.c.

GND

SOURCE

AUX

REG

VCC

Fig.2 Pin configuration of TEA152xP.

handbook, halfpage

MGT421

TEA152xT

VCC

GND

REG

AUX

GND

SOURCE

n.c.

DRAIN

Fig.3 Pin configuration of TEA152xT.

handbook, halfpage

VCC

GND

REG

SGND

AUX

SOURCE

n.c.

DRAIN

TEA152xAJM

MGT422

Fig.4 Pin configuration of TEA152xAJM.

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

FUNCTIONAL DESCRIPTION

The TEA152x family is the heart of a compact flyback
converter, with the IC placed at the primary side. The
auxiliary winding of the transformer can be used for
indirect feedback to control the isolated output. This
additional winding also powers the IC. A more accurate
control of the output voltage and/or current can be
implemented with an additional secondary sensing circuit
and optocoupler feedback.

The TEA152x family uses voltage mode control. The
frequency is determined by the maximum transformer
demagnetizing time and the time of the oscillator. In the
first case, the converter operates in the Self Oscillating
Power Supply (SOPS) mode. In the latter case, it operates
at a constant frequency, which can be adjusted with
external components R

and C

. This mode is called

Pulse Width Modulation (PWM). Furthermore, a primary
stroke is started only in a valley of the secondary ringing.
This valley switching principle minimizes capacitive
switch-on losses.

Start-up and under voltage lock-out

Initially, the IC is self supplying from the rectified mains
voltage. The IC starts switching as soon as the voltage on
pin V

passes the V

CC(start)

level. The supply is taken

over by the auxiliary winding of the transformer as soon as
V

is high enough and the supply from the line is stopped

for high efficiency operation.

When for some reason the auxiliary supply is not sufficient,
the high voltage supply also supplies the IC. As soon as
the voltage on pin V

drops below the V

CC(stop)

level, the

IC stops switching and restarts from the rectified mains
voltage.

Oscillator

The frequency of the oscillator is set by the external
resistor and capacitor on pin RC. The external capacitor is
charged rapidly to the V

RC(max)

level and, starting from a

new primary stroke, it discharges to the V

RC(min)

level.

Because the discharge is exponential, the relative
sensitivity of the duty factor to the regulation voltage at low
duty factor is almost equal to the sensitivity at high duty
factors. This results in a more constant gain over the duty
factor range compared to PWM systems with a linear
sawtooth oscillator. Stable operation at low duty factors is
easily realized. For high efficiency, the frequency is
reduced as soon as the duty factor drops below a certain
value. This is accomplished by increasing the oscillator
charge time.

Duty factor control

The duty factor is controlled by the internal regulation
voltage and the oscillator signal on pin RC. The internal
regulation voltage is equal to the external regulation
voltage (minus 2.5 V) multiplied by the gain of the error
amplifier (typical 20 dB (10

)).

Valley switching (not implemented in TEA152xAJM
versions)

A new cycle is started when the primary switch is switched
on (see Fig.5). After a certain time (determined by the
oscillator voltage RC and the internal regulation level), the
switch is turned off and the secondary stroke starts. The
internal regulation level is determined by the voltage on
pin REG. After the secondary stroke, the drain voltage
shows an oscillation with a frequency of approximately

where L

is the primary self inductance and C

is the

parasitic capacitance on the drain node.

As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for a low
drain voltage before starting a new primary stroke.
Figure 5 shows the drain voltage together with the valley
signal, the signal indicating the secondary stroke and the
RC voltage.

The primary stroke starts some time before the actual
valley at low ringing frequencies, and some time after the
actual valley at high ringing frequencies. Figure 6 shows a
typical curve for a reflected output voltage N

of 80 V.

This voltage is the output voltage V

(see Fig.7)

transferred to the primary side of the transformer with the
factor N (determined by the turns ratio of the transformer).
Figure 6 shows that the system switches exactly at
minimum drain voltage for ringing frequencies of 480 kHz,
thus reducing the switch-on losses to a minimum.
At 200 kHz, the next primary stroke is started at 33

before

the valley. The switch-on losses are still reduced
significantly.

Demagnetization

The system operates in discontinuous conduction mode all
the time. As long as the secondary stroke has not ended,
the oscillator will not start a new primary stroke. During the
first t

suppr

seconds, demagnetization recognition is

suppressed. This suppression may be necessary in
applications where the transformer has a large leakage
inductance and at low output voltages.

(

)

(

)

----------------------------------------------------

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

Minimum and maximum duty factor

The minimum duty factor of the switched mode power
supply is 0%. The maximum duty factor is set to 75%
(typical value at 100 kHz oscillation frequency).

Overcurrent protection

The cycle-by-cycle peak drain current limit circuit uses the
external source resistor to measure the current. The circuit
is activated after the leading edge blanking time t

leb

. The

protection circuit limits the source voltage to V

SRC(max)

and thus limits the primary peak current.

Short circuit winding protection

The short circuit winding protection circuit is also activated
after the leading edge blanking time. If the source voltage
exceeds the short circuit winding protection voltage V

swp

the IC stops switching. Only a Power-on reset will restart
normal operation. The short circuit winding protection also
protects in case of a secondary diode short circuit.

Overtemperature protection

An accurate temperature protection is provided in the
device. When the junction temperature exceeds the
thermal shutdown temperature, the IC stops switching.
During thermal protection, the IC current is lowered to the
start-up current. The IC continues normal operation as
soon as the overtemperature situation has disappeared.

Overvoltage protection

Overvoltage protection can be achieved in the application
by pulling pin REG above its normal operation level. The
current primary stroke is terminated immediately, and no
new primary stroke is started until the voltage on pin REG
drops to its normal operation level. Pin REG has an
internal clamp. The current feed into this pin must be
limited.

Output characteristics of complete powerplug

UTPUT POWER

A wide range of output power levels can be handled by
choosing the R

DS(on)

and package of the TEA152x family.

Power levels up to 50 W can be realised.

CCURACY

The accuracy of the complete converter, functioning as a
voltage source with primary sensing, is approximately 8%
(mainly dependent on the transformer coupling). The
accuracy with secondary sensing is defined by the
accuracy of the external components. For safety
requirements in case of optocoupler feedback loss, the
primary sensing remains active when an overvoltage
circuit is connected.

FFICIENCY

An efficiency of 75% at maximum output power can be
achieved for a complete converter designed for universal
mains.

IPPLE

A minimum ripple is obtained in a system designed for a
maximum duty factor of 50% under normal operating
conditions, and a minimized dead time. The magnitude of
the ripple in the output voltage is determined by the
frequency and duty factor of the converter, the output
current level and the value and ESR of the output
capacitor.

Input characteristics of complete powerplug

NPUT VOLTAGE

The input voltage range comprises the universal AC mains
(80 to 276 V).

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); all voltages are measured with respect to
ground; positive currents flow into the device; pins V

and RC are not allowed to be current driven, pins REG and AUX

are not allowed to be voltage driven.

Notes

1. Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k

series resistor. All pins are

2500 V maximum, except pin DRAIN, which is 1000 V maximum.

2. Machine model: equivalent to discharging a 200 pF capacitor through a 0.75

H coil and a 10

series resistor.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX. UNIT

Voltages

low supply voltage

continuous

0.4

+40

oscillator input voltage

0.4

source

source of the DMOS power transistor voltage

0.4

drain

drain of the DMOS power transistor voltage

0.4

+650

Currents

REG

regulation input current

AUX

auxiliary winding input current

source

source current of

TEA1520

0.25

+0.25

TEA1521

0.5

+0.5

TEA1522

TEA1523

TEA1524

drain

drain current of

TEA1520

0.25

+0.25

TEA1521

0.5

+0.5

TEA1522

TEA1523

TEA1524

General

tot

total power dissipation

TEA152xP

amb

< 45

1.0

TEA152xT

amb

< 50

1.0

TEA152xAJM

amb

< 45

C without heatsink

1.5

stg

storage temperature

+150

amb

ambient temperature

+85

junction temperature

+145

esd

electrostatic discharge voltage

human body model; note 1

2500

machine model; note 2

200

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

THERMAL CHARACTERISTICS

Note

1. Thermal resistance R

th(j-a)

can be lower when the GND pins are connected to sufficient copper area on the

printed-circuit board. See the TEA152x application notes for details.

QUALITY SPECIFICATION

In accordance with

"SNW-FQ-611 part E".

CHARACTERISTICS
T

amb

= 25

C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing

into the IC; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

note 1

TEA152xP

in free air

100

K/W

TEA152xT

in free air

K/W

TEA152xAJM

in free air

K/W

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Supply

CC(operate)

supply current

normal operation

1.3

1.9

CC(startup)

start-up supply current

start-up

180

400

drain

supply current drawn from DRAIN
pin

no auxiliary supply; V

drain

> 60 V

1.5

with auxiliary supply; V

drain

> 60 V

125

CC(ch)

pin charging current

drain

> 60 V

CC(start)

start voltage

9.5

CC(stop)

stop voltage (under voltage

lock-out)

7.0

7.5

8.0

Pulse width modulator

min

minimum duty factor

max

maximum duty factor

f = 100 kHz

SOPS

demag

demagnetization recognition
voltage level

100

150

suppr

suppression of transformer ringing
at start of secondary stroke

1.0

1.5

2.0

RC oscillator

RC(min)

minimum voltage of RC oscillator
setting

RC(max)

maximum voltage of RC oscillator
setting

2.4

2.5

2.6

RC(ch)

RC charging time

osc

frequency range of oscillator

100

200

kHz

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

Duty factor regulator (pin REG)

REG

input voltage

2.4

2.5

2.6

V(erroramp)

voltage gain of error amplifier

REG(clamp)

clamping voltage at pin REG

REG

= 6 mA

7.5

Valley switching (not implemented in TEA152xAJM versions)

dV/dt

valley

dV/dt for valley recognition

102

valley

ringing frequency for valley
switching

= 100 V

200

550

800

kHz

d(valley-swon)

delay from valley recognition to
switch-on

150

Current and short circuit winding protection

source(max)

maximum source voltage

dV/dt = 0.1 V/

0.47

0.50

0.53

d(propagation)

delay from detecting V

SRC(max)

switch-off

dV/dt = 0.5 V/

160

185

swp

short circuit winding protection
voltage

dV/dt = 0.5 V/

0.7

0.75

0.8

leb

blanking time for current and short
circuit winding protection

250

350

450

Output stage (FET)

L(drain)

drain leakage current

drain

= 650 V

125

(BR)drain

drain breakdown voltage

> 0

650

DS(on)

drain-source on-state resistance
of TEA1520

= 25

C; I

source

0.06 A

55.2

= 100

C; I

source

0.06 A

78.2

drain-source on-state resistance
of TEA1521

= 25

C; I

source

0.125 A

27.6

= 100

C; I

source

0.125 A

39.1

drain-source on-state resistance
of TEA1522

= 25

C; I

source

0.25 A

13.8

= 100

C; I

source

0.25 A

19.6

drain-source on-state resistance
of TEA1523

= 25

C; I

source

0.5 A

6.5

7.5

= 100

C; I

source

0.5 A

9.0

10.0

drain-source on-state resistance
of TEA1524

= 25

C; I

source

1.0 A

3.4

3.9

= 100

C; I

source

1.0 A

4.8

5.5

drain(f)

drain fall time

= 300 V; no external capacitor at

drain

Temperature protection

prot(max)

maximum temperature threshold

150

160

170

prot(hys)

hysteresis temperature

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

SOLDERING

Introduction

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mount components are mixed on
one printed-circuit board. However, wave soldering is not
always suitable for surface mount ICs, or for printed-circuit
boards with high population densities. In these situations
reflow soldering is often used.

Through-hole mount packages

OLDERING BY DIPPING OR BY SOLDER WAVE

The maximum permissible temperature of the solder is
260

C; solder at this temperature must not be in contact

with the joints for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

ANUAL SOLDERING

Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300

C it may remain in contact for up to

10 seconds. If the bit temperature is between
300 and 400

C, contact may be up to 5 seconds.

Surface mount packages

EFLOW SOLDERING

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 230

AVE SOLDERING

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

ANUAL SOLDERING

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

Suitability of IC packages for wave, reflow and dipping soldering methods

Notes

1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.

3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink

(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).

4. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;

it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

MOUNTING

PACKAGE

SOLDERING METHOD

WAVE

REFLOW

(1)

DIPPING

Through-hole mount DBS, DIP, HDIP, SDIP, SIL

suitable

(2)

suitable

Surface mount

BGA, LFBGA, SQFP, TFBGA

not suitable

suitable

HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, SMS

not suitable

(3)

suitable

PLCC

(4)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(4)(5)

suitable

SSOP, TSSOP, VSO

not recommended

(6)

suitable

2000 Sep 08

Philips Semiconductors

Product specification

STARplug

TEA152x family

DATA SHEET STATUS

Note

1. Please consult the most recently issued data sheet before initiating or completing a design.

DATA SHEET STATUS

PRODUCT

STATUS

DEFINITIONS

(1)

Objective specification

Development

This data sheet contains the design target or goal specifications for
product development. Specification may change in any manner without
notice.

Preliminary specification

Qualification

This data sheet contains preliminary data, and supplementary data will be
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.

Product specification

Production

This data sheet contains final specifications. Philips Semiconductors
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

SCA

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

2000

Philips Semiconductors a worldwide company

For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825

Argentina: see South America

Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139

Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210

Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773

Belgium: see The Netherlands

Brazil: see South America

Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America

Czech Republic: see Austria

Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
Tel. +45 33 29 3333, Fax. +45 33 29 3905

Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920

France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300

Hungary: see Austria

India: Philips INDIA Ltd, Band Box Building, 2nd floor,
254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. +91 22 493 8541, Fax. +91 22 493 0966

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. +353 1 7640 000, Fax. +353 1 7640 200

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007

Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399

New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811

Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341

Pakistan: see Singapore

Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001

Portugal: see Spain

Romania: see Italy

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919

Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria

Slovenia: see Italy

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114,
Tel. +27 11 471 5401, Fax. +27 11 471 5398

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382

Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263

Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260,
Tel. +66 2 361 7910, Fax. +66 2 398 3447

Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087

Uruguay: see South America

Vietnam: see Singapore

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553

Printed in The Netherlands

613502/01/pp

Date of release:

2000 Sep 08

Document order number:

9397 750 07242

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1523

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1523

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1523