General description

The GreenChipTMII is the second generation of green Switched Mode Power Supply
(SMPS) controller ICs. Its high level of integration allows the design of a cost effective
power supply with a very low number of external components.

The TEA1532 can also be used in fixed frequency, Continuous Conduction Mode (CCM)
converter designs for low voltage, high current applications. At low power (standby) levels,
the system operates in cycle skipping mode which minimizes the switching losses during
standby.

The special built-in green functions allow the efficiency to be optimum at all power levels.
This holds for quasi-resonant operation at high power levels, as well as fixed frequency
operation with valley switching at medium power levels. At low power (standby) levels, the
system operates in cycle skipping mode with valley detection.

The proprietary high voltage BCD800 process makes direct start-up possible from the
rectified universal mains voltage in an effective and green way. A second low voltage
BICMOS IC is used for accurate, high speed protection functions and control.

The TEA1532 enables highly efficient and reliable supplies to be designed easily.

Features

2.1 Distinctive features

Universal mains supply operation (70 V to 276 V AC)

High level of integration, resulting in a very low external component count

Fixed frequency Continuous Conduction Mode (CCM) operation capability

Quasi-Resonant (QR) Discontinuous Conduction Mode (DCM) operation capability.

2.2 Green features

Valley or zero voltage switching for minimum switching losses in QR operation

Cycle skipping mode at very low loads; input power <300 mW at no-load operation for
a typical adapter application

On-chip start-up current source.

2.3 Protection features

Safe restart mode for system fault conditions

Zero current switch-on in QR mode

Undervoltage protection (foldback during overload)

TEA1532

GreenChip

II SMPS control IC

Rev. 01 -- 28 May 2004

Preliminary data sheet

9397 750 13113

Preliminary data sheet

Rev. 01 -- 28 May 2004

2 of 27

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

IC overtemperature protection (latched)

Low and adjustable overcurrent protection trip level

Soft (re)start

Mains voltage-dependent operation-enabling level

General purpose input for latched or safe restart protection and timing, e.g. to be used
for overvoltage protection (OVP), output short-circuit protection or system
overtemperature protection

Brown-out protection.

Applications

Printer adapters and chargers. The device can also be used in all applications that
demand an efficient and cost-effective solution up to 250 W.

Ordering information

Table 1:

Ordering information

Type number

Package

Name

Description

Version

TEA1532T

SO8

plastic small outline package; 8 leads; body
width 3.9 mm

SOT96-1

TEA1532P

DIP8

plastic dual in-line package; 8 leads (300 mil)

SOT97-1

9397 750 13113

Preliminary data sheet

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3 of 27

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

Block diagram

Fig 1.

Block diagram.

SUPPLY

MANAGEMENT

internal

supply

UVLO start

GND

CTRL

OSCILLATOR

DCM

AND

CCM

DETECTION

LOGIC

BROWN-OUT

PROTECTION

soft

start

OVER-

TEMPERATURE

PROTECTION

UVLO

MAXIMUM

ON-TIME

PROTECTION

POWER-ON

RESET

VALLEY

80
mV

clamp

DRIVER

START-UP

CURRENT SOURCE

0.5 V

SENSE

DRIVER

coa014

DEM

DRAIN

OCP

LEB

blank

Islopecomp

0.63 V

VCC < 4.5 V

prot(dem)

TEA1532T
TEA1532P

Osc_Rdy

Duty_Max

SLOPE

COMPENSATION

5.6 V

control
detect

charge

PROTECT

5.6 V

discharge

300

protect
detect

3 V

2.5 V

DCM and CCM

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Preliminary data sheet

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Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

Pinning information

6.1 Pinning

6.2 Pin description

Functional description

The TEA1532 is the controller of a compact flyback converter, with the IC situated at the
primary side. An auxiliary winding of the transformer provides demagnetization detection
and powers the IC after start-up; see

Figure 4

Fig 2.

Pin configuration: TEA1532T (SOT96-1).

Fig 3.

Pin configuration: TEA1532P (SOT97-1).

TEA1532T

DRAIN

GND

DRIVER

PROTECT

SENSE

CTRL

DEM

001aaa829

TEA1532P

DRAIN

GND

DRIVER

PROTECT

SENSE

CTRL

DEM

001aaa828

Table 2:

Pin description

Symbol

Pin

Description

supply voltage

GND

ground

PROTECT

protection and timing input

CTRL

control input

DEM

input from auxiliary winding for demagnetization timing

SENSE

programmable current sense input

DRIVER

MOSFET Gate driver output

DRAIN

connected to drain of external MOS switch, input for start-up
current compensation and valley sensing

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Preliminary data sheet

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Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

The TEA1532 can operate in multi modes; see

Figure 5

In QR mode, the next converter stroke is started only after demagnetization of the
transformer current (zero current switching), while the drain voltage has reached the
lowest voltage to minimize switching losses (green function). The primary resonant circuit
of primary inductance and drain capacitor ensures this quasi-resonant operation. The
design can be optimized in such a way that zero voltage switching can extend over most of
the universal mains range.

To prevent very high frequency operation at lower loads, the quasi-resonant operation
changes smoothly in fixed frequency Pulse Width Modulation (PWM) control.

Fig 4.

Typical configuration

Fig 5.

Multi mode and FF-CCM operation.

coa015

TEA1532T
TEA1532P

VCC

Cycle

skip

fixed

FF-CCM

P (W)

coa017

(kHz)

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Preliminary data sheet

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Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

In fixed frequency continuous conduction mode, the internal oscillator determines the start
of the next converter stroke.

In both operating modes, a cycle skipping mode is activated at very low power (standby)
levels.

7.1 Start-up, mains enabling operation level and undervoltage lock out

Refer to

Figure 10

and

Figure 11

. Initially, the IC is self supplying from the rectified mains

voltage via pin DRAIN. Supply capacitor C

VCC

(at pin 1) is charged by the internal start-up

current source to a level of about 4 V or higher, depending on the drain voltage. Once the
drain voltage exceeds the V

(mains-dependent operation-enabling level), the start-up

current source will continue charging capacitor C

VCC

(switch S1 will be opened); see

Figure 1

. The IC will activate the power converter as soon as the voltage on pin V

passes the V

start

level. The IC supply is taken over by the auxiliary winding as soon as the

output voltage reaches its intended level and the IC supply from the mains voltage is
subsequently stopped for high efficiency operation (green function).

The moment the voltage on pin V

drops below V

UVLO

(undervoltage lock out), the IC

stops switching and enters a safe restart from the rectified mains voltage. Inhibiting the
auxiliary supply by external means causes the converter to operate in a stable,
well-defined burst mode.

7.2 Supply management

All (internal) reference voltages are derived from a temperature compensated, on-chip
band gap circuit.

7.3 Current control mode

Current control mode is used for its good line regulation behavior.

The on-time is controlled by the internally inverted pin CTRL voltage, which is compared
with the primary current information. The primary current is sensed across an external
resistor. The driver output is latched in the logic, preventing multiple switch-on.

The internal control voltage is inversely proportional to the external pin CTRL voltage, with
an offset of 1.5 V. This means that a voltage range from 1 V to approximately 1.5 V on
pin CTRL will result in an internal control voltage range from 0.5 V to 0 V (a high external
control voltage results in a low duty cycle).

Fig 6.

The V

sense(max)

voltage as a function of V

CTRL

CTRL

1 V

(typ)

0.52 V

1.5 V

(typ)

coa016

sense(max)

Cycle
skip
active

25 mV

9397 750 13113

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Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

7.4 Oscillator

The fixed frequency of the oscillator is set by an internal current source and capacitor.

7.5 Cycle skipping

At very low power levels, a cycle skipping mode activates. An internal control voltage
(V

sense(max)

) lower than 25 mV will inhibit switch-on of the external power MOSFET until

this voltage increases to a higher value; see

Figure 6

7.6 Demagnetization (QR operation)

The system will be in Discontinuous Conduction Mode (DCM) (QR operation) when
resistor R

DEM

is applied. The oscillator will not start a new primary stroke until the

secondary stroke has ended.

Demagnetization features a cycle-by-cycle output short-circuit protection which
immediately reduces the frequency (longer off-time), thereby reducing the power level.

Demagnetization recognition is suppressed during the first t

supp

time. This suppression

may be necessary in applications where the transformer has a large leakage inductance
and at low output voltages or start-up.

7.7 Continuous Conduction Mode (CCM)

It is also possible to operate the IC in the so-called Fixed Frequency Continuous
Conduction Mode (FF CCM). This mode is activated by connecting pin DEM to ground
and connecting pin DRAIN to the rectified constant V

voltage; see

Figure 13

7.8 Overcurrent Protection (OCP)

The current in the transformer primary is measured accurately by the internal
cycle-by-cycle source current limit circuit using the external sense resistor R

sense

The accuracy of the current limit circuit allows the transformer core to have a minimum
specification for the output power required. The OCP circuit limits the `sense' voltage to an
internal level, and is activated after the leading edge blanking period, t

leb

generated by the

Leading Edge Blanking (LEB) circuit.

7.9 Control pin protection

If pin CTRL becomes open-circuit or is disconnected, a fault condition is assumed and the
converter will stop operating immediately. Operation recommences when the fault
condition is removed.

7.10 Adjustable slope compensation

A slope compensation function has been added at pin CTRL; see

Figure 7

. The slope

compensation function prevents sub-harmonic oscillation in CCM at duty cycles over
50 %. The CTRL voltage is modulated by sourcing a (non-constant) current out of
pin CTRL and adding a series resistor R

slopecomp

. This increases the CTRL voltage

proportionally with the on-time, which therefore limits the OCP level. Thus, a longer
on-time results in a higher CTRL voltage, however, this increase in CTRL voltage will
actually decrease the on-time. Slope compensation can be adjusted by changing the

9397 750 13113

Preliminary data sheet

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8 of 27

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

value of R

slopecomp

. Slope compensation prevents modulation of the on-time (duty cycle)

while operating in FF CCM. A possible drawback of sub-harmonic oscillation can be
output voltage ripple.

7.11 Minimum and maximum on-time

The minimum on-time of the SMPS is determined by the LEB time. The IC limits the
on-time to a maximum time which is dependent on the mode of operation:

QR mode: When the system requires an `on-time' of more than 25

s, a fault condition is

assumed (e.g. C

VCC

removed), the IC stops switching and enters the safe restart mode.

CCM: The driver duty cycle is limited to 70 %. So the maximum on-time is correlated to
the oscillator time which results in an accurate limit of the minimum input voltage of the
flyback converter.

7.12 PROTECT and timing input

The PROTECT input (pin 3) is a multi-purpose (high-impedance) input, which can be used
to switch off the IC and create a relatively long timing function. As soon as the voltage on
this pin rises above 2.5 V, switching stops immediately. For the timing function, a current of
typically 50

A flows out of pin PROTECT and charges an external capacitor until the

activation level of 2.5 V is reached. This current source however, is only activated when
the converter is not in regulation, which is detected by the voltage on pin CTRL
(V

CTRL

< 0.63 V). A (small) discharge current is also implemented to ensure that the

capacitor is not charged, for example, by spikes, and a MOSFET switch is added to
ensure a defined start situation. The voltage on pin CTRL determines whether the IC
enters latched protection mode, or safe restart protection mode:

Fig 7.

Slope compensation.

001aaa830

CTRL

Slope compensation
current

0.63 V

control
detect

5.6 V

TEA1532

CTRL

slopecomp

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Philips Semiconductors

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GreenChip

II SMPS control IC

When the voltage on pin CTRL is below 0.63 V, the IC is assumed to be out of
regulation (e.g. the control loop is open). In this case activating pin PROTECT
(V

PROTECT

> 2.5 V) will cause the converter to stop switching. Once V

drops below

UVLO

, capacitor C

VCC

will be recharged and the supply will restart. This cycle will be

repeated until the fault condition is removed (safe restart mode)

When the voltage on pin CTRL is above 0.63 V, the IC is assumed to be in regulation.
In this case activating pin PROTECT (V

PROTECT

> 2.5 V), by external means, will latch

the IC: The voltage on pin V

will cycle between V

start

and V

UVLO

, but the IC will not

start switching again until the latch function is reset. The latch is reset as soon as V

drops below 4.5 V (typical value). The internal overtemperature protection will also
trigger this latch; see also

Figure 1

A voltage higher than 3 V on pin PROTECT will always latch the IC. This is independent of
the state of the IC.

7.13 Valley switching

Refer to

Figure 8

. A new cycle starts when the power switch is activated. After the on-time

(determined by the sense voltage and the internal control voltage), the switch is opened
and the secondary stroke starts. After the secondary stroke, the drain voltage shows an

oscillation with a frequency of approximately

where L

is the primary self inductance of the transformer and C

is the capacitance on

the drain node.

As soon as the oscillator voltage is high again and the secondary stroke has ended, the
circuit waits for the lowest drain voltage before starting a new primary stroke. This method
is called valley detection.

Figure 8

shows the drain voltage, valley signal, secondary stroke

signal and the oscillator signal.

In an optimum design, the reflected secondary voltage on the primary side will force the
drain voltage to zero. Thus, zero voltage switching is possible, preventing large capacitive

switching losses

, and allowing high frequency operation, which

results in small and cost effective magnetics.

(

)

(

-------------------------------------------------

1
2

---

9397 750 13113

Preliminary data sheet

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Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

7.14 Brown-out protection

During the so called brown-out test, the input voltage is slowly decreased. Since the
on-time depends on V

, overlong on-times at low V

can damage the (external) power

device. This is prevented by stopping the converter when the input voltage drops too low.

When the voltage on pin DEM drops below

50 mV during the on-time (QR mode), the

maximum on-time is set to 25

s. The maximum on-time will be reached while V

is low.

Subsequently, the IC stops switching and V

drops below V

UVLO

. Capacitor C

VCC

will

only be recharged and the supply will restart only when voltage V

is high enough (V

also see

Section 7.1

). In addition to this, a V

level at which the converter has to enter a

safe restart can be set with a demag resistor. During the primary stroke, the rectified
mains input voltage is measured by sensing the current drawn from pin DEM. This current
depends on the mains voltage, according to the following formula:

Where:

The latter function requires an on-time of at least 2

s. This on-time ensures that a reliable

demag current can be measured.

(1) Start of new cycle at lowest drain voltage.

(2) Start of new cycle in a classical PWM system at high drain voltage.

Fig 8.

Signals for valley switching.

drain

secondary

stroke

mgu235

secondary

ringing

primary

stroke

valley

(2)

(1)

secondary

stroke

oscillator

DEM

(

)

aux

DEM

---------------

mains

DEM

--------------------------

aux

------------

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GreenChip

II SMPS control IC

When pin DEM is grounded (CCM), the brown-out protection is disabled. In this case the
duty cycle is limited to 0.7, so at low mains voltage the on-time is limited and therefore the
dissipation in the FET is limited.

7.15 OverTemperature Protection (OTP)

The IC provides accurate temperature protection. The IC will stop switching when the
junction temperature exceeds the thermal shutdown temperature. When V

drops to

UVLO

, capacitor C

VCC

will be recharged to the V

start

level, however switching will not

restart. Subsequently, V

will drop again to V

UVLO

, etc..

Operation only recommences when V

drops below a level of about 4.5 V (typically,

when V

mains

is disconnected for a short period).

7.16 Soft start-up (pin SENSE)

To prevent transformer rattle at start-up or during hiccup, the transformer peak current is
slowly increased by the soft start function. This can be achieved by inserting a resistor
and a capacitor between pin SENSE (pin 6) and sense resistor R

sense

. An internal current

source charges the capacitor to V

sense

= I

(about 0.5 V maximum).

The start level and the time constant of the increasing primary current level can be
adjusted externally by changing the values of R

and C

The charging current I

will flow as long as the voltage on pin SENSE is

below approximately 0.5 V. If the voltage on pin SENSE exceeds 0.5 V, the soft start
current source will start limiting current I

. At V

start

, the I

current source is completely

switched off; see

Figure 9

Since the soft start current I

is supplied from pin DRAIN, the R

value will not affect V

current during start-up.

Fig 9.

Soft start-up.

primary(max)

ocp

(

)

sense

------------------------------------------

SENSE

sense

ocp

start-up

mgu237

0.5 V

9397 750 13113

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GreenChip

II SMPS control IC

7.17 Driver

The driver circuit to the Gate of the power MOSFET has a current sourcing capability of
typically 170 mA and a current sink capability of typically 700 mA. This permits fast
turn-on and turn-off of the power MOSFET for efficient operation.

A low driver source current has been chosen to limit the

t at switch-on. This reduces

Electro Magnetic Interference (EMI) and also limits the current spikes across R

sense

Limiting values

[1]

Equivalent to discharging a 100 pF capacitor through a 1.5 k

series resistor.

[2]

Equivalent to discharging a 200 pF capacitor through a 0.75

H coil and a 10

resistor.

Table 3:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured
with respect to ground (pin 2); positive currents flow into the chip; pin V

may not be current driven.

The voltage ratings are valid provided other ratings are not violated; current ratings are valid
provided the maximum power rating is not violated.

Symbol

Parameter

Conditions

Min

Max

Unit

Voltages

supply voltage

continuous

0.4

+20

PROTECT

voltage on pin PROTECT

continuous

0.4

CTRL

voltage on pin CTRL

0.4

DEM

voltage on pin DEM

current limited

SENSE

voltage on pin SENSE

current limited

0.4

DRAIN

voltage on pin DRAIN

0.4

+650

Currents

CTRL

current on pin CTRL

d < 10 %

DEM

current on pin DEM

1000

+250

SENSE

current on pin SENSE

+10

DRIVER

current on pin DRIVER

d < 10 %

0.8

DRAIN

current on pin DRAIN

General

tot

total power dissipation

amb

< 70

SO8 package

0.5

DIP8 package

0.75

stg

storage temperature

+150

junction temperature

+145

ESD

ESD

electrostatic discharge
voltage

class 1

human body model

pins 1 to 7

[1]

2000

pin 8 (DRAIN)

[1]

1500

machine model

[2]

200

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Preliminary data sheet

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GreenChip

II SMPS control IC

Thermal characteristics

10. Characteristics

Table 4:

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

th(j-a)

thermal resistance from
junction to ambient

in free air; SO8 package

150

K/W

in free air; DIP8 package

K/W

Table 5:

Characteristics

amb

= 25

C; V

= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Start-up current source (pin DRAIN)

DRAIN

supply current drawn from
pin DRAIN

DRAIN

> 100 V;

1.0

1.2

1.4

= 0 V

with auxiliary supply

100

300

breakdown voltage

650

mains-dependent
operation-enabling level

100

Supply voltage management (pin V

)

start

start-up voltage

10.3

11.7

UVLO

lock-out undervoltage

8.1

8.7

9.3

hys

hysteresis voltage

start

UVLO

2.0

2.3

2.6

ch(h)

high charging current

DRAIN

> 100 V; V

< 3V

1.2

0.8

ch(l)

low charging current

DRAIN

> 100 V;

3 V < V

< V

UVLO

1.2

0.75

0.45

restart

restart current

DRAIN

> 100 V;

UVLO

< V

start

650

550

450

oper

supply current under normal
operation

no load on pin DRIVER

1.1

1.3

1.5

Demagnetization management (pin DEM)

th(DEM)

demagnetization comparator
threshold voltage

110

th(CCM)

continuous conduction mode
detection threshold voltage

prot(dem)

pin protection current

DEM

= 50 mV

clamp(neg)

negative clamp voltage

DEM

500

0.5

0.45

0.40

clamp(pos)

positive clamp voltage

DEM

= 250

0.5

0.7

0.9

supp

suppression of transformer
ringing at start of secondary
stroke

1.1

1.5

1.9

Pulse width modulator

on(min)

minimum on-time

leb

on(max)

maximum on-time

QR mode

max

maximum duty-cycle

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Oscillator

osc

oscillator frequency (fixed
frequency)

CTRL

< 1 V

kHz

Duty cycle control (pin CTRL)

min

minimum voltage for maximum
duty cycle

1.0

max

maximum voltage for minimum
duty cycle

1.5

slopecomp

slope compensation current

1.2

0.8

CTRL(detect)

Control detect level

0.56

0.63

0.70

Protection and timing input (pin PROTECT)

trip

trip level

2.37

2.5

2.63

trip(latch)

trip level for latch

2.85

3.15

CC(latch)(reset)

voltage level on pin V

which

resets the latch

CC(latch)

< 2.3 V

4.5

charge

charge current

CTRL

< 0.63 V

discharge

discharge current

100

Valley switch (pin DRAIN)

valley

valley recognition voltage
change

+43

valley-swon

delay from valley recognition to
switch-on

[1]

150

Overcurrent and winding short-circuit protection (pin SENSE)

sense(max)

maximum source voltage for
OCP

t = 0.1 V/

0.48

0.52

0.56

propagation delay from
detecting V

sense(max)

switch-off

t = 0.5 V/

140

185

leb

blanking time for current and
winding short-circuit protection

330

400

470

soft start current

sense

< 0.5 V

Brown-out protection (pin DEM)

brown-out

brown-out protection current

A constant I

(brown-out)

is drawn

from pin DEM.

[2]

on(min)(brown-out)

minimum on-time for enabling
the brown-out protection.

1.5

2.5

Driver (pin DRIVER)

source

source current

= 9.5 V; V

DRIVER

= 2 V

170

sink

sink current

= 9.5 V;

DRIVER

= 2 V

300

DRIVER

= 9.5 V

400

700

o(max)

maximum output voltage

> 12 V

11.5

Table 5:

Characteristics

...continued

amb

= 25

C; V

= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

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GreenChip

II SMPS control IC

[1]

Guaranteed by design.

[2]

detection level. Set by the demagnetization resistor R

DEM

; see

Section 7.14

[3]

Valid for V

> 2 V.

11. Application information

A converter with the TEA1532 consists of an input filter, a transformer with a third winding
(auxiliary), and an output stage with a feedback circuit.

Capacitor C

VCC

buffers the IC supply voltage, which is powered via the high voltage

rectified mains during start-up and via the auxiliary winding during operation.

A sense resistor R

sense

converts the primary current into a voltage at pin SENSE. The

value of R

sense

defines the maximum primary peak current.

Figure 10

shows a flyback configuration using the discontinuous conduction mode.

Pin PROTECT is used in this example for external overvoltage protection and open loop
or output short-circuit protection. If this pin is not used, it must be tied to ground.

Figure 13

shows a flyback configuration using the continuous conduction mode. Pin PROTECT is
used in this example for external overtemperature protection and open loop or output
short-circuit protection.

Temperature protection

prot(max)

maximum temperature
protection level

130

140

150

prot(hyst)

hysteresis for the temperature
protection level

[3]

Table 5:

Characteristics

...continued

amb

= 25

C; V

= 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into

the IC; unless otherwise specified.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

9397 750 13113

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II SMPS control IC

13. Package outline

Fig 14. Package outline.

UNIT

max.

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

5.0
4.8

4.0
3.8

1.27

6.2
5.8

1.05

0.7
0.6

0.7
0.3

8
0

0.25

0.1

0.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0
0.4

SOT96-1

detail X

(A )

pin 1 index

076E03

MS-012

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.20
0.19

0.16
0.15

0.05

0.244
0.228

0.028
0.024

0.028
0.012

0.01

0.041

0.004

0.039
0.016

2.5

5 mm

scale

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

99-12-27
03-02-18

9397 750 13113

Preliminary data sheet

Rev. 01 -- 28 May 2004

21 of 27

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

Fig 15. Package outline.

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOT97-1

99-12-27
03-02-13

UNIT

max.

(1)

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min.

max.

1.73
1.14

0.53
0.38

0.36
0.23

9.8
9.2

6.48
6.20

3.60
3.05

0.254

2.54

7.62

8.25
7.80

10.0

8.3

1.15

4.2

0.51

3.2

inches

0.068
0.045

0.021
0.015

0.014
0.009

1.07
0.89

0.042
0.035

0.39
0.36

0.26
0.24

0.14
0.12

0.01

0.1

0.3

0.32
0.31

0.39
0.33

0.045

0.17

0.02

0.13

050G01

MO-001

SC-504-8

(e )

seating plane

10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

DIP8: plastic dual in-line package; 8 leads (300 mil)

SOT97-1

9397 750 13113

Preliminary data sheet

Rev. 01 -- 28 May 2004

22 of 27

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

14. Soldering

14.1 Introduction

This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all IC packages. Wave soldering is often
preferred when through-hole and surface mount components are mixed on one
printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it
is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing.

14.2 Through-hole mount packages

14.2.1 Soldering by dipping or by solder wave

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250

C or

265

C, depending on solder material applied, SnPb or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specified maximum storage temperature (T

stg(max)

). If the

printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.

14.2.2 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300

C it may remain in contact for up to 10 seconds. If the bit temperature is

between 300 and 400

C, contact may be up to 5 seconds.

14.3 Surface mount packages

14.3.1 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215 to 270

C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free process)

for all the BGA and SSOP-T packages

9397 750 13113

Preliminary data sheet

Rev. 01 -- 28 May 2004

23 of 27

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a volume

350 mm

so called

thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3.2 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal results:

Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45

angle to

the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250

C or

265

C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.

14.3.3 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320

9397 750 13113

Preliminary data sheet

Rev. 01 -- 28 May 2004

24 of 27

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

14.4 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.

[4]

Hot bar soldering or manual soldering is suitable for PMFP packages.

[5]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217

C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

[6]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.

[7]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[8]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[9]

Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

Table 6:

Suitability of IC packages for wave, reflow and dipping soldering methods

Mounting

Package

[1]

Soldering method

Wave

Reflow

[2]

Dipping

Through-hole
mount

DBS, DIP, HDIP, RDBS,
SDIP, SIL

suitable

[3]

suitable

Through-hole-
surface mount

PMFP

[4]

not suitable

not
suitable

Surface mount

BGA, LBGA, LFBGA,
SQFP, SSOP-T

[5]

, TFBGA,

VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA,
HLQFP, HSQFP, HSOP,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS

not suitable

[6]

suitable

PLCC

[7]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[7] [8]

suitable

SSOP, TSSOP, VSO,
VSSOP

not recommended

[9]

suitable

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

9397 750 13113

Preliminary data sheet

Rev. 01 -- 28 May 2004

26 of 27

16. Data sheet status

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

17. Definitions

Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

18. Disclaimers

Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

19. Trademarks

GreenChip -- is a trademark of Koninklijke Philips Electronics N.V.

20. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level

Data sheet status

[1]

Product status

[2] [3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.

Date of release: 28 May 2004

Document order number: 9397 750 13113

Published in The Netherlands

Philips Semiconductors

TEA1532

GreenChip

II SMPS control IC

21. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.1

Distinctive features . . . . . . . . . . . . . . . . . . . . . . 1

2.2

Green features . . . . . . . . . . . . . . . . . . . . . . . . . 1

2.3

Protection features . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Pinning information . . . . . . . . . . . . . . . . . . . . . . 4

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4

Functional description . . . . . . . . . . . . . . . . . . . 4

7.1

Start-up, mains enabling operation level and
undervoltage lock out . . . . . . . . . . . . . . . . . . . . 6

7.2

Supply management. . . . . . . . . . . . . . . . . . . . . 6

7.3

Current control mode . . . . . . . . . . . . . . . . . . . . 6

7.4

Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.5

Cycle skipping. . . . . . . . . . . . . . . . . . . . . . . . . . 7

7.6

Demagnetization (QR operation) . . . . . . . . . . . 7

7.7

Continuous Conduction Mode (CCM). . . . . . . . 7

7.8

Overcurrent Protection (OCP) . . . . . . . . . . . . . 7

7.9

Control pin protection . . . . . . . . . . . . . . . . . . . . 7

7.10

Adjustable slope compensation . . . . . . . . . . . . 7

7.11

Minimum and maximum on-time. . . . . . . . . . . . 8

7.12

PROTECT and timing input . . . . . . . . . . . . . . . 8

7.13

Valley switching. . . . . . . . . . . . . . . . . . . . . . . . . 9

7.14

Brown-out protection. . . . . . . . . . . . . . . . . . . . 10

7.15

OverTemperature Protection (OTP) . . . . . . . . 11

7.16

Soft start-up (pin SENSE). . . . . . . . . . . . . . . . 11

7.17

Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12

Thermal characteristics. . . . . . . . . . . . . . . . . . 13

Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13

Application information. . . . . . . . . . . . . . . . . . 15

Test information . . . . . . . . . . . . . . . . . . . . . . . . 19

12.1

Quality information . . . . . . . . . . . . . . . . . . . . . 19

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

14.1

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 22

14.2

Through-hole mount packages . . . . . . . . . . . 22

14.2.1

Soldering by dipping or by solder wave . . . . . 22

14.2.2

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 22

14.3

Surface mount packages . . . . . . . . . . . . . . . . 22

14.3.1

Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 22

14.3.2

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 23

14.3.3

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23

14.4

Package related soldering information . . . . . . 24

Revision history . . . . . . . . . . . . . . . . . . . . . . . 25

Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 26

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Contact information . . . . . . . . . . . . . . . . . . . . 26

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1532

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1532

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1532