2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

FEATURES

Distinctive features

Universal mains supply operation (70 to 276 V AC)

High level of integration, giving a very low external
component count.

Green features

Valley or zero voltage switching for minimum switching
losses

Efficient quasi-resonant operation at high power levels

Frequency reduction at low power standby for improved
system efficiency (<3 W)

Cycle skipping mode at very low loads; P

<300 mW at

no-load operation for a typical adapter application

On-chip start-up current source.

Protection features

Safe restart mode for system fault conditions

Continuous mode protection by means of
demagnetization detection (zero switch-on current)

Accurate and adjustable overvoltage protection (latched
in TEA1533T, safe restart in TEA1533AT)

Short winding protection

Undervoltage protection (foldback during overload)

Overtemperature protection (latched in TEA1533T, safe
restart in TEA1533AT)

Low and adjustable overcurrent protection trip level

Soft (re)start

Mains voltage-dependent operation enabling level.

APPLICATIONS

Besides typical application areas, i.e. adapters and
chargers, the device can be used in TV and monitor
supplies and all applications that demand an efficient and
cost-effective solution up to 250 W.

MGU499

TEA1533T

TEA1533AT

Fig.1 Basic application diagram.

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

GENERAL DESCRIPTION

The GreenChip

(1)

II is the second generation of green

Switched Mode Power Supply (SMPS) control ICs
operating directly from the rectified universal mains. A high
level of integration leads to a cost effective power supply
with a very low number of external components.

The special built-in green functions allow the efficiency to
be optimum at all power levels. This holds for
quasi-resonant operation at high power levels, as well as
fixed frequency operation with valley switching at medium
power levels. At low power (standby) levels, the system
operates at a reduced frequency and with valley detection.

The proprietary high voltage BCD800 process makes
direct start-up possible from the rectified mains voltage in
an effective and green way. A second low voltage
BICMOS IC is used for accurate, high-speed protection
functions and control.

Highly efficient and reliable supplies can easily be
designed using the GreenChipII control IC.

(1) GreenChip is a trademark of Koninklijke Philips

Electronics N.V.

ORDERING INFORMATION

TYPE

NUMBER

PACKAGE

NAME

DESCRIPTION

VERSION

TEA1533T

SO14

plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

TEA1533AT

2002

Aug

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T

; TEA1533A

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BLOCK DIA

GRAM

bo
ok, full pagewidth

SUPPLY

MANAGEMENT

internal

supply

UVLO

start

M-level

VCC

GND

CTRL

FREQUENCY

CONTROL

VOLTAGE

CONTROLLED

OSCILLATOR

DEMAG

SHORT

PROTECTION

LOGIC

OVER-

VOLTAGE

PROTECTION

OVERPOWER
PROTECTION

short

winding

soft

start

OVER-

TEMPERATURE

PROTECTION

UVLO

MAXIMUM

ON-TIME

PROTECTION

POWER-ON

RESET

UP/DOWN

COUNTER

VALLEY

OCP

TEA1533T

TEA1533AT

100

clamp

DRIVER

START-UP

CURRENT SOURCE

0.88 V

0.5 V

Isense

DRIVER

MGU500

DEM

DRAIN

12, 13

HVS
n.c.

OCP

LEB

blank

Iss

Iprot(CTRL)

2.5 V

burst
detect

VCC < 4.5 V

or UVLO

(TEA1533AT)

Iprot(DEM)

Fig.2 Block diagram.

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

PINNING

FUNCTIONAL DESCRIPTION

The TEA1533 is the controller of a compact flyback
converter, and is situated at the primary side. An auxiliary
winding of the transformer provides demagnetization
detection and powers the IC after start-up.

The TEA1533 can operate in multi modes (see Fig.4).

The next converter stroke is started only after
demagnetization of the transformer current (zero current
switching), while the drain voltage has reached the lowest
voltage to prevent switching losses (green function). The
primary resonant circuit of the primary inductance and
drain capacitor ensures this quasi-resonant operation. The
design can be optimized in such a way that zero voltage
switching can be reached over almost the universal mains
range.

To prevent very high frequency operation at lower loads,
the quasi-resonant operation changes smoothly in fixed
frequency PWM control.

At very low power (standby) levels, the frequency is
controlled down, via the VCO, to a minimum frequency of
approximately 25 kHz.

Start-up, mains enabling operation level and
undervoltage lock-out

Initially, the IC is self supplying from the rectified mains
voltage via pin DRAIN (see Figs 11 and 12). Supply
capacitor C

VCC

is charged by the internal start-up current

source to approximately 4 V or higher, depending on the
voltage on pin DRAIN.

SYMBOL PIN

DESCRIPTION

n.c.

not connected

supply voltage

GND

ground

n.c.

not connected

n.c.

not connected

CTRL

control input

DEM

input from auxiliary winding for
demagnetization timing, overvoltage
and overpower protection

n.c.

not connected

sense

programmable current sense input

n.c.

not connected

DRIVER

gate driver output

HVS

high voltage safety spacer, not
connected

HVS

high voltage safety spacer, not
connected

DRAIN

drain of external MOS switch, input for
start-up current and valley sensing

handbook, halfpage

TEA1533T

TEA1533AT

MGU501

n.c.

VCC

GND

n.c.

CTRL

DEM

DRAIN

HVS

DRIVER

n.c.

Isense

n.c.

Fig.3 Pin configuration.

handbook, halfpage

VCO

fixed

quasi resonant

P (W)

MGU508

(kHz)

175

Fig.4 Multi modes operation.

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

Once the drain voltage exceeds the M-level
(mains-dependent operation-enabling level), the start-up
current source will continue charging capacitor C

VCC

(switch S1 will be opened); see Fig.2. The IC will activate
the converter as soon as the voltage on pin V

passes

the V

CC(start)

level. The IC supply is taken over by the

auxiliary winding as soon as the output voltage reaches its
intended level and the IC supply from the mains voltage is
subsequently stopped for high efficiency operation (green
function).

The moment the voltage on pin V

drops below the

undervoltage lock-out level, the IC stops switching and
enters a safe restart from the rectified mains voltage.
Inhibiting the auxiliary supply by external means causes
the converter to operate in a stable, well defined burst
mode.

Supply management

All (internal) reference voltages are derived from a
temperature compensated, on-chip band gap circuit.

Current mode control

Current mode control is used for its good line regulation
behaviour.

The `on-time' is controlled by the internally inverted control
voltage, which is compared with the primary current
information. The primary current is sensed across an
external resistor. The driver output is latched in the logic,
preventing multiple switch-on.

The internal control voltage is inversely proportional to the
external control pin voltage, with an offset of 1.5 V. This
means that a voltage range from 1 to 1.5 V on pin CTRL
will result in an internal control voltage range from
0.5 to 0 V (a high external control voltage results in a low
duty cycle).

Oscillator

The maximum fixed frequency of the oscillator is set by an
internal current source and capacitor. The maximum
frequency is reduced once the control voltage enters the
VCO control window. Then, the maximum frequency
changes linearly with the control voltage until the minimum
frequency is reached (see Figs 5 and 6).

Cycle skipping

At very low power levels, a cycle skipping mode will be
activated. A high control voltage will reduce the switching
frequency to a minimum of 25 kHz. If the voltage on the
control pin is raised even more, switch-on of the external
power MOSFET will be inhibited until the voltage on the
control pin has dropped to a lower value again (see Fig.7).

For system accuracy it is not the absolute voltage on the
control pin that will trigger the cycle skipping mode, but a
signal derived from the internal VCO will be used.

Remark 1: If the no-load requirement of the system is such
that the output voltage can be regulated to its intended
level at a switching frequency of 25 kHz or above, the
cycle skipping mode will not be activated.

Remark 2: As switching will stop when the voltage on the
control pin is raised above a certain level, the burst mode
has to be activated by a microcontroller or any other circuit
sending a 30

s, 16 mA pulse to the control input

(pin CTRL) of the IC.

handbook, halfpage

VCTRL

1 V

(typ)

0.52 V

1.5 V

(typ)

MGU233

Vsense(max)

Fig.5 V

sense(max)

voltage as function of V

CTRL

handbook, halfpage

Vsense(max) (V)

MGU509

(kHz)

175

175 kHz

VCO2

level

VCO1

level

Fig.6 VCO frequency as function of V

sense(max)

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

handbook, full pagewidth

MGU510

1.5 V

VCTRL

Isense

fosc

fmax

fmin

Vx (mV)

CTRL

current

comparator

cycle

skipping

150 mV

OSCILLATOR

DRIVER

Vx (mV)

dV2

dV1

150

Fig.7 The cycle skipping circuitry.

The voltage levels dV

and dV

are fixed in the IC to 50 mV (typical) and 18 mV (typical) respectively.

Demagnetization

The system will be in discontinuous conduction mode all
the time. The oscillator will not start a new primary stroke
until the secondary stroke has ended.

Demagnetization features a cycle-by-cycle output
short-circuit protection by immediately lowering the
frequency (longer off-time), thereby reducing the power
level.

Demagnetization recognition is suppressed during the first
t

suppr

time. This suppression may be necessary in

applications where the transformer has a large leakage
inductance, at low output voltages and at start-up.

If pin DEM is open-circuit or not connected, a fault
condition is assumed and the converter will stop operating
immediately. Operation will recommence as soon as the
fault condition is removed.

If pin DEM is shorted to ground, again a fault condition is
assumed and the converter will stop operating after the
first stroke. The converter will subsequently enter the safe
restart mode. This situation will persist until the
short-circuit is removed.

Minimum and maximum `on-time'

The minimum `on-time' of the SMPS is determined by the
Leading Edge Blanking (LEB) time. The IC limits the
`on-time' to 50

s. When the system desires an `on-time'

longer than 50

s, a fault condition is assumed (e.g.

removed C

in Fig.11), the IC will stop switching and enter

the safe restart mode.

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

OverVoltage Protection (OVP)

An OVP mode is implemented in the GreenChip series.
This works for the TEA1533 by sensing the auxiliary
voltage via the current flowing into pin DEM during the
secondary stroke. The auxiliary winding voltage is a
well-defined replica of the output voltage. Any voltage
spikes are averaged by an internal filter.

If the output voltage exceeds the OVP trip level, an internal
counter starts counting subsequent OVP events. The
counter has been added to prevent incorrect OVP
detections which might occur during ESD or lightning
events. If the output voltage exceeds the OVP trip level a
few times and not again in a subsequent cycle, the internal
counter will count down with twice the speed compared
with counting up. However, when typical 10 cycles of
subsequent OVP events are detected, the IC assumes a
true OVP and the OVP circuit switches the power
MOSFET off. Next, the controller waits until the UVLO
level is reached on pin V

. When V

drops to UVLO,

capacitor C

VCC

will be recharged to the V

start

level.

Regarding the TEA1533T, this IC will not start switching
again. Subsequently, V

will drop again to the UVLO

level, etc. Operation only recommences when the V

voltage drops below a level of approximately 4.5 V
(practically when V

mains

has been disconnected for a short

period).

Regarding the TEA1533AT, switching starts again (safe
restart mode) when the V

start

level is reached. This

process is repeated as long as the OVP condition exists.

The output voltage V

o(OVP)

at which the OVP function trips,

can be set by the demagnetization resistor, R

DEM

where N

is the number of secondary turns and N

aux

is the

number of auxiliary turns of the transformer.

Current I

(OVP)(DEM)

is internally trimmed.

The value of R

DEM

can be adjusted to the turns ratio of the

transformer, thus making an accurate OVP possible.

Valley switching

A new cycle starts when the power MOSFET is switched
on (see Fig.8). After the `on-time' (which is determined by
the `sense' voltage and the internal control voltage), the
switch is opened and the secondary stroke starts. After the
secondary stroke, the drain voltage shows an oscillation

with a frequency of approximately

where L

is the primary self inductance of the transformer

and C

is the capacitance on the drain node.

As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for the
lowest drain voltage before starting a new primary stroke.
This method is called valley detection. Figure 8 shows the
drain voltage together with the valley signal, the signal
indicating the secondary stroke and the oscillator signal.

In an optimum design, the reflected secondary voltage on
the primary side will force the drain voltage to zero. Thus,
zero voltage switching is very possible, preventing large

capacitive switching losses

and

allowing high frequency operation, which results in small
and cost effective inductors.

o OVP

(

)

aux

----------- I

(OVP)(DEM)

DEM

clamp(DEM)(pos)

{

}

(

)

-----------------------------------------------

1
2

---

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

handbook, full pagewidth

drain

secondary

stroke

MGU235

secondary

ringing

primary

stroke

valley

secondary

stroke

oscillator

A: Start of new cycle at lowest drain voltage.

B: Start of new cycle in a classical PWM system at high drain voltage.

Fig.8 Signals for valley switching.

OverCurrent Protection (OCP)

The cycle-by-cycle peak drain current limit circuit uses the
external source resistor to measure the current accurately.
This allows optimum size determination of the transformer
core (cost issue). The circuit is activated after the leading
edge blanking time, t

leb

. The OCP circuit limits the `sense'

voltage to an internal level.

OverPower Protection (OPP)

During the primary stroke, the rectified mains input voltage
is measured by sensing the current drawn from pin DEM.
This current is dependent on the mains voltage, according

to the following formula:

where:

The current information is used to adjust the peak drain
current, which is measured via pin I

sense

. The internal

compensation is such that an almost mains independent
maximum output power can be realized.

The OPP curve is given in Fig.9.

DEM

aux

DEM

---------------

mains

DEM

--------------------------

aux

------------

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

Short winding protection

After the leading edge blanking time, the short winding
protection circuit is activated. If the `sense' voltage
exceeds the short winding protection voltage V

swp

, the

converter will stop switching. Once V

drops below the

UVLO level, capacitor C

VCC

will be recharged and the

supply will restart again. This cycle will be repeated until
the short-circuit is removed (safe restart mode).

The short winding protection will also protect in case of a
secondary diode short-circuit.

OverTemperature Protection (OTP)

An accurate temperature protection is provided in the
circuit. When the junction temperature exceeds the
thermal shutdown temperature, the IC will stop switching.
When V

drops to UVLO, capacitor C

VCC

will be

recharged to the V

start

level.

Regarding the TEA1533T, this IC will not start switching
again. Subsequently, V

will drop again to the UVLO

level, etc. Operation only recommences when the V

voltage drops below a level of approximately 4.5 V
(practically when the V

mains

has been disconnected for a

short period).

Regarding the TEA1533AT, when the V

start

level is

reached, switching starts again (safe restart mode). This
process is repeated as long as the OTP condition exists.

Control pin protection

If pin CTRL is open-circuit or not connected, a fault
condition is assumed and the converter will stop switching.
Operation will recommence as soon as the fault condition
is removed.

Burst mode standby

Pin CTRL is also used to implement the burst mode
standby. In burst mode standby, the power supply enters
a special low dissipation state. Figure 11 shows a flyback
converter using the burst mode standby function. The
system enters burst mode standby when the
microcontroller activates NPN transistor T1 on the
secondary side.

When the voltage on C

micro

exceeds a certain voltage,

measured by the microcontroller, the opto-coupler is
activated by T1, sending a large current signal to
pin CTRL. In response to this signal, the IC stops switching
and enters a `hiccup' mode. This burst activation signal
should be present for longer than the `burst blank' period
(typically 30

s): the blanking time prevents false burst

triggering due to spikes. Figure 12 shows the burst mode
standby signals. The hiccup mode during burst mode
standby operation does not differ from the hiccup mode at
safe restart during a system fault condition (e.g. output
short-circuit). The power is reduced during soft restart
mode.

Burst mode standby operation continues until the
microcontroller stops activating transistor T1. The system
then enters the start-up sequence and begins normal
switching behaviour.

handbook, halfpage

MGU236

0.52 V
(typ)

0.3 V
(typ)

IDEM

Vsense(max)

(typ)

100

(typ)

Fig.9 OPP correction curve.

burstmode

CTRL

----------------

th(on)

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

Soft start-up

To prevent transformer rattle during hiccup, the
transformer peak current is slowly increased by the soft
start function. This can be achieved by inserting a resistor
and a capacitor between pin I

sense

and the sense resistor

(see Fig.10). An internal current source charges the
capacitor to V = I

, with a maximum of

approximately 0.5 V.

The start level and the time constant of the increasing
primary current level can be adjusted externally by
changing the values of R

and C

The charging current I

will flow as long as the voltage on

pin I

sense

is below approximately 0.5 V. If the voltage on

pin I

sense

exceeds 0.5 V, the soft start current source will

start limiting the current I

. At the V

CC(start)

level, the I

current source is completely switched off.

Since the soft start current I

is subtracted from pin V

charging current, the R

value will affect the V

charging

current level by a maximum of 60

A (typical value).

Driver

The driver circuit to the gate of the power MOSFET has a
current sourcing capability of 170 mA typical and a current
sink capability of 700 mA typical. This permits fast turn-on
and turn-off of the power MOSFET for efficient operation.

A low driver source current has been chosen to limit the

t at switch-on. This reduces Electro Magnetic

Interference (EMI) and also limits the current spikes
across R

sense

primary(max)

ocp

(

)

sense

-----------------------------------------------

handbook, halfpage

CSS

RSS

Isense

Rsense

ISS

Vocp

start-up

MGU502

0.5 V

Fig.10 Soft start.

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.

Notes

1. All voltages are measured with respect to ground; positive currents flow into the IC; pin V

may not be current

driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the
maximum power rating is not violated.

2. Human Body Model (HBM): equivalent to discharging a 100 pF capacitor through a 1.5 k

resistor.

3. Machine Model (MM): equivalent to discharging a 200 pF capacitor through a 0.75

H coil and a 10

resistor.

THERMAL CHARACTERISTICS

Note

1. With pin GND connected to sufficient copper area on the printed-circuit board.

QUALITY SPECIFICATION

In accordance with `SNW-FQ-611-D'.

SYMBOL

PARAMETER

CONDITIONS

MIN.

MAX.

UNIT

Voltages

supply voltage

continuous

0.4

+20

CTRL

voltage on pin CTRL

0.4

DEM

voltage on pin DEM

current limited

0.4

sense

voltage on pin I

sense

current limited

0.4

DRAIN

voltage on pin DRAIN

0.4

+650

Currents

CTRL

current on pin CTRL

d < 10%

DEM

current on pin DEM

250

+250

sense

current on pin I

sense

+10

DRIVER

current on pin DRIVER

d < 10%

0.8

DRAIN

current on pin DRAIN

General

tot

total power dissipation

amb

< 70

0.75

stg

storage temperature

+150

operating junction temperature

+145

esd

electrostatic discharge voltage

pins 1 to 13

HBM class 1; note 2

2000

pin DRAIN

HBM class 1; note 2

1500

any pin

MM; note 3

400

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

th(j-a)

thermal resistance from junction to ambient

in free air; note 1

100

K/W

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

CHARACTERISTICS
T

amb

= 25

C; V

= 15 V; all voltages are measured with respect to ground; currents are positive when flowing into

the IC; unless otherwise specified.

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

Start-up current source (pin DRAIN)

DRAIN

supply current drawn from
pin DRAIN

= 0 V; V

DRAIN

> 100 V

1.0

1.2

1.4

with auxiliary supply;
V

DRAIN

> 100 V

100

300

DSS

breakdown voltage

650

M-level

mains-dependent operation
enabling level

100

Supply voltage management (pin V

)

CC(start)

start-up voltage on V

10.3

11.7

CC(UVLO)

under voltage lock-out on V

8.1

8.7

9.3

CC(hys)

hysteresis voltage on V

CC(start)

CC(UVLO)

2.0

2.3

2.6

CC(h)

pin V

charging current, high

DRAIN

> 100 V; V

< 3V

1.2

0.8

CC(l)

pin V

charging current, low

DRAIN

> 100 V;

3 V < V

< V

CC(UVLO)

1.2

0.75

0.45

CC(restart)

pin V

restart current

DRAIN

> 100 V;

CC(UVLO)

< V

CC(start)

650

550

450

CC(oper)

supply current under normal
operation

no load on pin DRIVER

1.1

1.3

1.5

CC(burstmode)

supply current while not switching

0.85

Demagnetization management (pin DEM)

th(DEM)

demagnetization comparator
threshold voltage on pin DEM

100

150

prot(DEM)

protection current on pin DEM

DEM

= 50 mV

(1)

clamp(DEM)(neg)

negative clamp voltage on
pin DEM

DEM

150

0.5

0.25

0.05

clamp(DEM)(pos)

positive clamp voltage on
pin DEM

DEM

= 250

0.5

0.7

0.9

suppr

suppression of transformer
ringing at start of secondary
stroke

1.1

1.5

1.9

Pulse width modulator

on(min)

minimum on-time

leb

on(max)

maximum on-time

latched

Oscillator

osc(l)

oscillator low fixed frequency

CTRL

> 1.5 V

kHz

osc(h)

oscillator high fixed frequency

CTRL

< 1 V

145

175

205

kHz

vco(start)

peak voltage on pin I

sense

, where

frequency reduction starts

see Figs 6 and 7

VCO

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

vco(max)

peak voltage on pin I

sense

, where

the frequency is equal to f

osc(l)

VCO

Duty cycle control (pin CTRL)

CTRL(min)

minimum voltage on pin CTRL for
maximum duty cycle

1.0

CTRL(max)

maximum voltage on pin CTRL for
minimum duty cycle

1.5

prot(CTRL)

protection current on pin CTRL

CTRL

= 1.5V

(1)

0.8

-0.5

Burst mode standby (pin CTRL)

th(burst)(on)

burst mode standby active
threshold voltage

burst

= 6 mA

3.3

3.8

4.3

th(burst)(on)

burst mode standby active current

th(burst)(off)

burst mode standby inactive
current

burst-blank

burst mode standby blanking time

Valley switch (pin DRAIN)

valley

valley recognition voltage change

valley-swon

delay from valley recognition to
switch-on

150

(1)

Overcurrent and short winding protection (pin I

sense

)

sense(max)

maximum source voltage OCP

t = 0.1 V/

0.48

0.52

0.56

propagating delay from detecting
V

sense(max)

to switch-off

t = 0.5 V/

140

185

swp

short winding protection voltage

0.83

0.88

0.96

leb

blanking time for current and
short winding protection

300

370

440

soft start current

sense

< 0.5 V

Overvoltage protection (pin DEM)

OVP(DEM)

OVP current on pin DEM

set by resistor R

DEM

, see

Section "OverVoltage
Protection (OVP)"

Overpower protection (pin DEM)

OPP(DEM)

OPP current on pin DEM to start
OPP correction, set by the
demagnetization resistor R

DEM

set by resistor R

DEM

, see

Section "OverPower
Protection (OPP)"

OPP50%(DEM)

OPP current on pin DEM, where
maximum source voltage is
limited to 0.3 V

100

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

Note

1. Guaranteed by design.

Driver (pin DRIVER)

source

source current capability of driver

= 9.5 V; V

DRIVER

= 2 V

170

sink

sink current capability of driver

= 9.5 V; V

DRIVER

= 2 V

300

= 9.5 V;

DRIVER

= 9.5 V

400

700

o(max)

maximum output voltage of the
driver

> 12 V

11.5

Overtemperature protection

prot(max)

maximum temperature protection
level

130

140

150

prot(hys)

hysteresis for the temperature
protection level

(1)

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

APPLICATION INFORMATION

A converter with the TEA1533 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage
with a feedback circuit.

Capacitor C

VCC

(at pin V

) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains

during start-up and via the auxiliary winding during operation.

A sense resistor converts the primary current into a voltage at pin I

sense

. The value of this sense resistor defines the

maximum primary peak current.

handbook, full pagewidth

VCC

Vmains

RCTRL

RDEM

Rsense

Rreg1

Rreg2

RSS

CSS

CCTRL

CVCC

GND

n.c.

CTRL

DEM

DRAIN

power
MOSFET

DRIVER

Isense

HVS

Naux

MGU503

TEA1533T

TEA1533AT

MICRO-

CONTROLLER

standby
pulse

Cmicro

Dmicro

Fig.11 Flyback configuration with secondary sensing using the burst mode standby.

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

PACKAGE OUTLINE

UNIT

max.

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

inches

1.75

0.25
0.10

1.45
1.25

0.25

0.49
0.36

0.25
0.19

8.75
8.55

4.0
3.8

1.27

6.2
5.8

0.7
0.6

0.7
0.3

8
0

0.25

0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

1.0
0.4

SOT108-1

detail X

(A )

076E06

MS-012

pin 1 index

0.069

0.010
0.004

0.057
0.049

0.01

0.019
0.014

0.0100
0.0075

0.35
0.34

0.16
0.15

0.050

1.05

0.041

0.244
0.228

0.028
0.024

0.028
0.012

0.01

0.25

0.01

0.004

0.039
0.016

97-05-22
99-12-27

2.5

5 mm

scale

SO14: plastic small outline package; 14 leads; body width 3.9 mm

SOT108-1

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

SOLDERING

Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"Data Handbook IC26; Integrated Circuit Packages"

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.

Reflow soldering

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.

Typical reflow peak temperatures range from
215 to 250

C. The top-surface temperature of the

packages should preferable be kept below 220

C for

thick/large packages, and below 235

C for small/thin

packages.

Wave soldering

Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering
method was specifically developed.

If wave soldering is used the following conditions must be
observed for optimal results:

Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;

smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the
printed-circuit board.

The footprint must incorporate solder thieves at the
downstream end.

For packages with leads on four sides, the footprint must
be placed at a 45

angle to the transport direction of the

printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Manual soldering

Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300

When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

Suitability of surface mount IC packages for wave and reflow soldering methods

Notes

1. For more detailed information on the BGA packages refer to the

"(LF)BGA Application Note" (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the

"Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods".

3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.

4. If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is

definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

PACKAGE

(1)

SOLDERING METHOD

WAVE

REFLOW

(2)

BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA

not suitable

suitable

HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS

not suitable

(3)

suitable

PLCC

(4)

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

(4)(5)

suitable

SSOP, TSSOP, VSO

not recommended

(6)

suitable

2002 Aug 23

Philips Semiconductors

Product specification

GreenChip

II SMPS control IC

TEA1533T; TEA1533AT

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

DATA SHEET STATUS

(1)

PRODUCT

STATUS

(2)

DEFINITIONS

Objective data

Development

This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.

Product data

Production

This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.

DEFINITIONS

Short-form specification

The data in a short-form

specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.

Limiting values definition

Limiting values given are in

accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.

Application information

Applications that are

described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.

DISCLAIMERS

Life support applications

These products are not

designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes

Philips Semiconductors

reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.

SCA74

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Philips Semiconductors a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

Printed in The Netherlands

613502/02/pp

Date of release:

2002 Aug 23

Document order number:

9397 750 10262

Document Outline

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1533T

Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: TEA1533T