September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

FEATURES

Modulation Transfer Function correction (MTF) at signal
input for both standards

HF drop out detector

Data slicer, data output for program information
(IEC standards)

Separation of signals for Electronic Time Base
Correction (ETBC)

Noise reduction with chrominance trap, noise level
adjust point

Dynamic picture insertion and 6 dB video attenuation of
main picture

Bandgap reference voltage output, suitable for CCD
delay line

GENERAL DESCRIPTION

Bipolar IC for video signal processing used in
CD-Video/LaserVision players.
Standard PAL respectively NTSC output signal (CVBS).
MTF amplifier.
FM-demodulator followed by de-emphasis stage.
PAL/NTSC switch for switching the MTF and
de-emphasis.
Drop out detector with drop out switch, also externally
switchable.

5 volt supply, only 325 mW total power dissipation.

QUICK REFERENCE DATA

ORDERING AND PACKAGE INFORMATION

Note

1. SOT196-1; 1996 November 25.

SYMBOL

PARAMETER

MIN.

TYP.

MAX.

UNIT

supply voltage (pins 12, 30, 47)

total supply current

i (p-p)

FM input signal at pin 7 (peak-to-peak value)

300

o (p-p)

CVBS output signal for CCDs (peak sync

peak white, pin 29)

850

black level voltage (pin 29)

1.85

i (p-p)

delayed CVBS input signal for drop out path at pin 27
(peak-to-peak value)

700

i (p-p)

delayed CVBS input signal at pin 31 from ETBC path
(peak-to-peak value)

600

o (p-p)

main CVBS output signal at pin 42 (peak-to-peak value)

black level voltage (pin 42)

2.2

o (p-p)

chrominance output signals at pins 44, 48 (peak-to-peak value)

PAL (burst)

760

NTSC (burst)

725

ref

reference output voltage (pin 41)

1.6

EXTENDED TYPE NUMBER

PACKAGE

PINS

PIN POSITION

MATERIAL

CODE

TEA7650H

QFP48

plastic

SOT196A

(1)

September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

PINNING

SYMBOL

PIN

DESCRIPTION

CRSC1

3.67 MHz resonant circuit 1

CS1

line synchronization output pulse 1 (composite sync)

DOCO

drop out control, input/output for external control

field sync output

charging capacitor for burst rectifier

MTF

charging capacitor for MTF control voltage

FM-IN

FM input signal from preamplifier

FREF1

PAL resonant circuit for the MTF

FREF2

NTSC resonant circuit for the MTF

MTFO

MTF output signal (corrected FM signal)

AMPIN

input for 8 dB amplifier (FM signal)

+5 V supply (referred to pins 6 to 15 and 18)

AMPO

output of 8 dB amplifier (FM signal)

LIMIN1

limiter amplifier input (FM signal to demodulator)

LIM

capacitor for slicing level control of limiter

DEM

capacitor for clamping level of FM demodulator

DRQ

data request input for data at pin 25

DEMO

FM demodulator output (CVBS negative)

GND1

ground (0 V) for V

FBO1

feedback output at PAL and NTSC (de-emphasis)

FBO2

feedback output, additional at NTSC (de-emphasis)

CVBS

capacitor for clamping of CVBS amplifier

DEEMI

de-emphasis input for CVBS from demodulator

AGC1

capacitor for AGC of CVBS amplifier

DATA

data output of information code

AGC2

capacitor for AGC of drop out amplifier

PRLIN

input signal of preceding line from CCD delay

GND3

ground (0 V) for V

DOSW

drop out switch buffer output (to CCD delay and ETBC)

+5 V supply (referred to pins 5, 17, 20 to 36, 38 to 42)

VIDIN

CVBS input signal from ETBC

AGC3

capacitor for AGC of CVBS follower amplifier

VIBUF

video signal buffer output to chroma trap circuitry

FTRAP

switching output for chroma trap at NTSC

LIMI2

limiter amplifier input for noise reduction

NRADJ

noise level adjust point (resistor to ground)

MODE

standard select input PAL/NTSC (PAL = LOW)

INSEN

insertion enable input

VDATT

6 dB CVBS attenuation (active HIGH)

EXVID

external CVBS input for insertion

September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

FUNCTIONAL DESCRIPTION

Figures 1, 2 show the block diagram of the Video Signal
Processor (VSP) including the peripheral circuitry for the
video signal processing. The pulse-width modulated FM
signal from the preamplifier is fed, via a DC blocking
capacitor, into the IC (pin 7) at the input to the Modulation
Transfer Function (MTF) circuit which corrects for the
characteristic of the optical reading system.

MTF correction

Due to the finite diameter of the laser beam spot and the
tangential velocity of the track of pits on the disk, the MTF
of the optical system acts like a radius-dependent
low-pass filter for the FM input signal. Although the video
signal can be recovered without correction, the ratio of the
amplitudes of the chrominance and luminance signals
would not then be the same at the most inner and the most
outer part of the disk. This influence of the disk radius is
automatically corrected by the Video Signal Processor.
The principle of correction is to use the deviation of the
demodulated burst signal to generate an error voltage in
order to control the frequency selective MTF circuit. The
burst measurement operates as follows: A burst-key
generator is triggered by the line synchronization pulse
(CS1) to generate a burst-key pulse which activates the
burst gate and rectifier stage. The signal at the rectifier
output (pin 6) is used to control the amplification of the
MTF circuit.

The carrier frequency in the PAL standard is different to
that in the NTSC standard, therefore two separate
resonant circuits are required on pins 8 and 9. They are
selected by the PAL/NTSC system selector (pin 37).

The MTF-corrected FM signal at pin 10 is amplified (

8 dB)

and fed, via the external filter which removes the audio
frequency components from the signal, into the
demodulator at pin 14.

Demodulation

The FM signal is first fed into a limiter circuit (pin 14) with
automatic slicing level control to suppress the main carrier
in the demodulated signal. The demodulator has two
outputs. The first (internal) clamps the demodulated video
signal on peak-sync by controlling the transconductance of
the demodulator. The FM signal can now be demodulated
during disk start-up, thereby facilitating fast run-in. The
second output signal from the demodulator (pin 18) is
passed through an external 5 MHz low-pass filter to extract
the CVBS signal. The CVBS signal is then fed into the
de-emphasis network to compensate for the pre-emphasis
of the video signal recorded on the disk.

De-emphasis

The de-emphasis circuit consists of an internal inverting
amplifier and an external RC feedback network. Since the
pre-emphasis on the disk in the PAL standard is different
from that in the NTSC standard, the time constants are
switchable. When PAL is selected, the first arm of the
feedback network is active, otherwise both operate in
parallel. The de-emphasized video signal is fed into an
AGC stage (pin 20) where it is clamped on its black level
and amplitude-controlled to a constant level. The signal is
then fed into the data slicer and the drop out switch.

Data slicer

Coded signals on the video disk are extracted by the data
slicer (output pin 25) when the Data Request input is
activated (pin 17).

Drop out compensation

The drop out detector (DOD) in the IC is triggered by every
positive or negative transition of the FM signal. A drop out
is detected when the half-cycle period is outside the limits.
Protection against a drop out is achieved by use of a video
signal delayed by one line. The signal at the output of the
drop out switch is fed out of the IC via a buffer (pin 29) and
then through a delaying device (CCD) before being fed
back into the IC (pin 27). The delayed video signal appears
at the input of an AGC circuit to compensate for gain
tolerances of the delay line and avoids the need for an
external adjustment. When a drop out is detected, the drop
out detector activates the video switch so that the lost
information of the line is substituted by the information of
the preceding line.

The drop out pulse is also present at pin 3 and can be used
for different purposes. This pin can also act as an input to
control the drop out switch by an external signal for test
purposes.

Time error compensation

In a videodisc player timing errors are caused by
deviations of the rotational speed of the motor,
imperfections in the disk and unavoidable tolerances in the
centering of the disk on the turntable. Track eccentricity is
the main cause of timing errors.

To minimize timing errors, it is necessary in the first place
to keep the rotational speed of the disk as constant as
possible. Referring back to the output of the switch in
Fig.1-2, the video signal is also fed into a sync separator
and a chrominance separator with its external resonant
circuits tuned to the chrominance subcarrier

September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

frequency.The phase of the line synchronization pulses
(CS1, pin 2) can be used to control the speed of the
turntable motor.

However, with this method it is not possible to obtain an
acceptable reduction of timing errors for frequencies of
25 Hz and above. To reduce errors, use is made of an
external Electronic Time Base Corrector (ETBC) between
pins 27 and 31 which functions as a variable delay line
driven by an error signal.

This error signal can be extracted from the output signal
CS1 (pin 2), CHR1 (pin 48), CS2 (pin 46) and CHR2
(pin 44).

Since the line sync pulses (CS1) are not suitable to
achieve an accurate enough measurement of time
difference, use is made of the 3.58 MHz burst signal
derived from the chrominance signal CHR1. If the same
zero crossing of the burst signal is used in every line, the
actual time can be measured with sufficient accuracy.

The CVBS signal leaving the ETBC might still have small
timing errors due to residual control error. A second
(feedback) loop is therefore required. The CVBS signal is
fed into an AGC circuit (pin 31) that compensates for gain
tolerances in the ETBC. As in the first loop, the line
synchronization pulses (CS2) and the chrominance signal
(CHR2) are derived from the CVBS signal by using second
sync and chrominance separators. The error signal
obtained by comparison in this feedback loop is added to
the error signal obtained in the first loop.

Using the burst signal for accurate measurements is a
problem in the PAL format due to its alternating phase.
A special 3.75 MHz (240 fh) burst has therefore been
added to the video signal recorded on the PAL disk. This
burst is inserted on the top level of the line sync pulses.

In dual standard applications, the resonant circuits of the
chrominance separators (pins 1 and 45) should be tuned
to 3.67 MHz to ensure good separation of the special burst
or the chrominance subcarrier.

When the timebase-corrected CVBS signal has by-passed
the second sync and chrominance separators, it reaches
the special burst suppressor which removes the special
burst. The signal is then fed into the noise reduction circuit.

Noise reduction

A noise reduction circuit can be used to improve the
apparent picture quality of a noisy signal. It operates as
follows: First the timebase corrected CVBS signal is
buffered (pin 33) and then fed into an external network
which removes the chrominance subcarrier and all

low-frequency components. It is then fed into a limiter
(pin 35) which ensures that only small amplitudes (mainly
noise) are removed from the main signal.

The chrominance subcarrier trap is switched to either the
PAL subcarrier frequency (4.43 MHz) or the NTSC
subcarrier (3.58 MHz) by the PAL/NTSC system selector
(pin 37) using the additional small capacitor at pin 34. An
external resistor at pin 36 is included so that
manufacturers can select their preferred level of noise
reduction, or none at all, by grounding the pin.

Picture insertion

The CVBS signal containing the information to be
displayed is applied to pin 40. A clamp circuit ensures that
the black level of this signal is the same as that of the main
signal. Both signals are applied to the insertion switch.

When, for example, a character is to be displayed the 6 dB
attenuation (pin 39) is first activated to generate a reduced
contrast background area around the character (with
respect to the black level so that the original picture is still
visible). Next, the insertion switch (pin 38) is activated and
the character appears at the output. By switching back to
the original picture, the procedure operates in the reverse
sequence.

Other examples of the picture insertion facility are
displaying a background picture during start-up of the
video disk player or the use of picture-in-picture.

A buffer is provided at the CVBS output (pin 42) which
delivers a CVBS signal clamped to black level and
controlled to a peak-to-peak amplitude of 1 V.

Reference voltage

A reference voltage of 1.6 V is provided by a bandgap
circuit. Internally, all control circuits are supplied with this
reference voltage. Externally, it can be used for various
purposes.

September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

CHARACTERISTICS

= V

= 5 V, T

amb

= 25

C, measurements taken in Fig.1-2 ; unless otherwise specified.

Voltages referred to

GND1 (pin 19):

and voltage at pins 6 to 15, 18

GND2 (pin 43):

and voltage at pins 1 to 4, 16, 37, 44 to 48

GND3 (pin 28):

and voltage at pins 5, 17, 20 to 36, 38 to 42

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

supply voltage 1 (pin 12)

4.5

5.5

supply voltage 2 (pin 47)

4.5

5.5

supply voltage 3 (pin 30)

4.5

5.5

total supply current

Standard select input (pin 37)

input voltage for standard PAL (LOW)

input voltage for standard NTSC (HIGH),
alternative measure for standard NTSC

pin connected

pin open-circuit

input current (LOW)

= 1 V

100

input current (HIGH)

= 4 V

Modulation transfer function MTF (referred to GND1, pin 19)

i (p-p)

FM input signal at pin 7
(peak-to-peak value)

300

for proper MTF correction

200

input impedance

MTF control signal

(p-p)

output current for storage of the burst
amplitude at pin 5 (peak-to-peak value)

200

burst amplitude integrator,
charging current (pin 6)

conductance g = dI

/ dV

MTF frequency selection (pins 8 and 9)

pin 8 active for PAL;
pin 9 active for NTSC

o (p-p)

output signal

7 (p-p)

output impedance

o (p-p)

output current

4.5

o (p-p)

MTF output signal (pin 10)

300

MTF output impedance

100

signal gain

= V

/ V

= G

20 log G

)

minimum gain

= 0

maximum gain

= 2.6 V

300

/R8

maximum gain

= 2.6 V

300

/R9

bandwidth

3 dB; G

= 0

MHz

second harmonic suppression

f = 8 MHz

September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

MTF following amplifier (pins 11 and 13)

i (p-p)

FM input signal at pin 11
(peak-to-peak value)

300

input impedance

internal emitter resistor to ground

1.8

output impedance (pin 13)

o (p-p)

output current at pin 13
(peak-to-peak value)

voltage gain (pins 13-11)

bandwidth (pin 13)

3 dB

MHz

second harmonic suppression

Limiting amplifier for demodulator

i (p-p)

input signal for proper demodulation
at pin 14 (peak-to-peak value)

0.1

input impedance

(p-p)

charging current of 2nd harmonic control
at pin 15 (peak-to-peak value)

200

FM demodulator with pulswidth-modulated current output (f = 2 f

). Referred to GND1, pin 19

(p-p)

output current pulse at pin 18
(peak-to-peak value)

3.2

mean (average) DC current

for top sync

1.75

output impedance

DC output voltage range

transconductance

at PAL

210

A/MHz

at NTSC

185

A/MHz

static non-linearity

bandwidth

1 dB

MHz

main carrier suppression

14 (p-p)

= 100 mV

(p-p)

charging current at pin 16 (amplitude
storage for top sync, peak-to-peak value)

De-emphasis amplifier (output pin 21 only for NTSC active). Referred to GND3, pin 28

input impedance (pin 23)

DC input current

(p-p)

charging current for black clamping
capacitor at pin 22 (peak-to-peak value)

20, 21

output impedance (pins 20 and 21)

100

20, 21

DC output voltage (black level)

2.2

gain bandwidth product

MHz

24 (p-p)

charging current for AGC capacitor
at pin 24 (peak-to-peak current)

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September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

Composite sync output CS1 (pin 2; referred to GND2, pin 43)

sync output voltage (active HIGH)

0.5 mA

sync output voltage (LOW)

= 0.5 mA

0.4

delay of positive going sync edge

300

jitter of positive going sync edge

, t

rise and fall time

= 22 pF

200

Vertical sync output (VS), open collector output with 500

internal series resistor, referred to GND2, pin 43

sync output voltage active LOW (pin 4)

0.5 mA

0,7

delay time

elongation time

Drop out processing. (referred to GND3, pin 28)

frequency range for no drop out
recognition

minimum value at PAL

5.6

MHz

maximum value at PAL

9.7

MHz

minimum value at NTSC

6.97

MHz

maximum value at NTSC

11.1

MHz

delay time on negative going edge
for an abrupt drop out with

f < 0.5 f

or f > 1.5 f

250

drop out elongation time

C3 = 47 pF;
R3 = 100 k

3.5

output voltage during drop out

internal R

= 500

;

0.5 mA

0.7

3 thr

threshold voltage of drop out switch

3 DO

input voltage for forced drop out switching

0.7

i (p-p)

delayed video input signal at pin 27
(peak-to-peak value)

1 k

700

DC input voltage (black level)

2.2

input impedance

(p-p)

charging current for coupling capacitor
at pin 27 (peak-to-peak value)

(p-p)

charging current for AGC of the delayed
signal at pin 26 (peak-to-peak value)

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September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

Chrominance output for purpose of ETBC, with R

= 5 k

(pin 48) and nominal input signal. Resonant circuit at pin

1 tuned to 4.43 MHz for PAL (3.58 MHz for NTSC). Referred to GND2, pin 43. See previous comment to
characteristics.

o (p-p)

burst amplitude (peak-to-peak value)
at pin 48

PAL; f = 4.43 MHz

760

NTSC; f = 3.58 MHz

725

output impedance

250

o (p-p)

output current (peak-to-peak value)

700

crosstalk attenuation from pin 44

output impedance for resonant circuit

1.4

Electronic time base control ETBC and CCD delay (external). Referred to GND3, pin 28.

o (p-p)

CVBS output signal of emitter output
at pin 29 (peak-to-peak value)

20 (p-p)

= 0.5 V

3 dB

(peak-to-peak value)

850

burst amplitude in signal

for PAL

230

for NTSC

219

DC output voltage (black level)

1.85

output impedance

/ I

output current (source)

S/N

signal-to-noise ratio from pin 7 to pin 29

5 MHz unweighted

o (p-p)

difference of CVBS amplitude
(peak-to-peak value)

switching from main
to delayed signal;
V

27 (p-p)

= 0.7 V

at pin 29 referred to 0 dB level

0 dB

at pin 29 referred to

4 dB level

4 dB

crosstalk attenuation

f = 2 MHz

offset voltage after switching

spike amplitude at switching (pin 29)

> 50 ns

Chrominance and luminance amplifier (referred to GND3, pin 28).

i (p-p)

delayed CVBS input signal (pin 31)

1 k

600

DC input voltage (black level)

2.2

input impedance

(p-p)

charging current for coupling capacitor
at pin 31 (peak-to-peak value)

(p-p)

charging current for AGC
at pin 32 (peak-to-peak value)

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September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

Chrominance output for purpose of ETBC, with R

= 5 k

(pin 44) and nominal input signal. Resonant circuit at pin

45 tuned to 4.43 MHz for PAL (3.58 MHz for NTSC). Referred to GND2, pin 43. See previous comment to
characteristics.

o (p-p)

burst amplitude (peak-to-peak value)
at pins 44

for PAL

f = 4.43 MHz

760

for NTSC

f = 3.58 MHz

725

output impedance

250

o (p-p)

output current (peak-to-peak value)

700

crosstalk attenuation from pin 48

output impedance for resonant circuit

1.4

Luminance noise reduction (referred to GND3, pin 28)

(p-p)

output signal at pin 33
(peak-to-peak value)

i (p-p)

= 0.6 V

3 dB

at pin 31

DC output voltage (black level)

2.2

internal emitter current to ground
of emitter follower

output impedance

100

o (p-p)

AC output current at pin 33
(peak-to-peak value)

1.5

(p-p)

chroma trap switch, active for NTSC
input current (peak-to-peak value)

350

input impedance (pin 34)

i (p-p)

limiter amplifier input signal at pin 35
(peak-to-peak value)

input signal for start of limiting

100

input impedance

voltage range or limiter control (pin 36)

0.1

1.5

voltage for control-off

DC output current

100

Main CVBS output (referred to GND3, pin 28).

o (p-p)

CVBS output signal of emitter output
at pin 42 (peak-to-peak value)

i (p-p)

= 0.6 V

0 dB

at pin 31

o (p-p)

residual variation of output voltage
at pin 42 (peak-to-peak value)

i (p-p)

= 0.6 V

3 dB

at pin 31

DC output voltage (black level)

2.2

internal emitter current to ground
of emitter follower

300

output impedance

100

output source current

video bandwidth

3 dB

MHz

S/N

signal-to-noise ratio from pin 31 to pin 42

5 MHz unweighted

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September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

crosstalk attenuation between main
and inserted signal

f = 5 MHz

differences at output due to switching
from main to inserted signal (pin 42)

burst

suppression of special burst

offset voltage after switching

spike amplitude at switching

> 50 ns

VID

video attenuation for internal signal

= HIGH

External video insertion input and switching control

i (p-p)

input signal at pin 40 (peak-to-peak value) R

1 k

DC voltage (black level)

2.9

voltage gain (pins 42-40)

input impedance

(p-p)

charging current at pin 40
(peak-to-peak value)

video bandwidth

3 dB

MHz

voltage for insertion-on (HIGH)

voltage for insertion-off (LOW)

input current (HIGH)

= 4 V

input current (LOW)

= 1 V

switchover delay time

voltage for video attenuation-on (HIGH)

6 dB video

voltage for video attenuation-off (LOW)

0 dB video

input current (HIGH)

= 4 V

input current (LOW)

= 1 V

switchover delay time

100

Data output and data request input (pins 25 and 17)

output voltage HIGH-level (pin 25)

0.5 mA

3.5

output voltage LOW-level

= 0.5 mA

0.8

duty factor (t

/ T)

and t

rise and fall time

= 22 pF

150

delay time

200

voltage for data request-on (HIGH)
at pin 17

voltage for data request-off (LOW)

input current (HIGH)

= 4 V

input current (LOW)

= 1 V

100

data delay time

200

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September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

PACKAGE OUTLINE

UNIT

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

EIAJ

0.3
0.1

1.85
1.65

0.25

0.42
0.28

0.25
0.14

10.1

9.9

0.75

15.5
14.5

1.05
0.75

1.05
0.70

7
0

0.15

0.1

0.3

2.5

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.4
1.6

SOT196-1

92-11-17
95-02-04

(1)

10.1

9.9

15.5
14.5

1.05
0.70

detail X

(A )

Z D

Z E

pin 1 index

2.5

5 mm

scale

QFP48: plastic quad flat package; 48 leads (lead length 2.5 mm); body 10 x 10 x 1.75 mm

SOT196-1

max.

2.20

September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser vision

TEA7650H

SOLDERING

Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

"IC Package Databook" (order code 9398 652 90011).

Reflow soldering

Reflow soldering techniques are suitable for all QFP
packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

"Quality

Reference Handbook" (order code 9397 750 00192).

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45

Wave soldering

Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.

The footprint must be at an angle of 45

to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260

C, and

maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150

C within

6 seconds. Typical dwell time is 4 seconds at 250

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300

C. When

using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320

September 1990

Philips Semiconductors

Preliminary specification

Video signal processor for CD-video/laser
vision

TEA7650H

DEFINITIONS

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification

This data sheet contains target or goal specifications for product development.

Preliminary specification

This data sheet contains preliminary data; supplementary data may be published later.

Product specification

This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

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