Document Outline
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ORDERING INFORMATION
- QUICK REFERENCE DATA
- PINNING
- FUNCTIONAL DESCRIPTION
- WRITE mode: R/W = 0
- READ mode: R/W = 1
- Address selection
- LIMITING VALUES
- THERMAL RESISTANCE
- CHARACTERISTICS
- FLOCK FLAG DEFINITION (FL)
- PACKAGE OUTLINE
- SOT102-1
- SOT109-1
- SOT163-1
- SOT266-1
- SOLDERING
- DEFINITIONS
- LIFE SUPPORT APPLICATIONS
- PURCHASE OF PHILIPS I 2 C COMPONENTS
DATA SHEET
Product specification
File under Integrated Circuits, IC02
October 1992
INTEGRATED CIRCUITS
TSA5512
1.3 GHz Bidirectional I
2
C-bus
controlled synthesizer
October 1992
2
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
FEATURES
Complete 1.3 GHz single chip system
Low power 5 V, 35 mA
I
2
C-bus programming
In-lock flag
Varicap drive disable
Low radiation
Address selection for Picture-In-Picture (PIP), DBS
tuner (3 addresses)
Analog-to-digital converter
8 bus controlled ports (6 for TSA5512T), 8 open
collector outputs (4 bidirectional)
Power-down flag
APPLICATIONS
TV tuners
VCR Tuners
DESCRIPTION
The TSA5512 is a single chip PLL frequency synthesizer
designed for TV tuning systems. Control data is entered
via the I
2
C-bus; five serial bytes are required to address
the device, select the oscillator frequency, programme the
eight output ports and set the charge-pump current. Four
of these ports can also be used as input ports (three
general purpose I/O ports, one ADC). Digital information
concerning those ports can be read out of the TSA5512 on
the SDA line (one status byte) during a READ operation. A
flag is set when the loop is "in-lock" and is read during a
READ operation. The device has one fixed I
2
C-bus
address and 3 programmable addresses, programmed by
applying a specific voltage on Port 3. The phase
comparator operates at 7.8125 kHz when a 4 MHz crystal
is used.
ORDERING INFORMATION
Note
1. SOT102-1; 1996 December 5.
2. SOT109-1; 1996 December 5.
3. SOT163-1; 1996 December 5.
4. SOT266-1; 1996 December 5.
EXTENDED TYPE
NUMBER
PACKAGE
PINS
PIN POSITION
MATERIAL
CODE
TSA5512
18
DIL
plastic
SOT102
(1)
TSA5512T
16
SO
plastic
SOT109A
(2)
TSA5512AT
20
SO
plastic
SOT163A
(3)
TSA5512M
20
SSOP
plastic
SOT266
(4)
October 1992
3
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
QUICK REFERENCE DATA
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
V
CC
supply voltage
-
5
-
V
I
CC
supply current
-
35
-
mA
fr
frequency range
64
-
1300
MHz
V
I
input voltage level
80 MHz to 150 MHz
12
-
300
mV
150 MHz to 1 GHz
9
-
300
mV
1 GHz to 1.3 GHz
40
-
300
mV
f
XTAL
crystal oscillator frequency
3.2
4.0
4.48
MHz
I
O
open-collector output current
5
-
-
mA
T
amb
operating ambient temperature range
-
10
-
+80
C
T
stg
IC storage temperature range
-
40
-
+150
C
October 1992
4
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled
synthesizer
TSA5512
Fig.1 Block diagram.
October 1992
5
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
Fig.2 Pin configuration for SOT102.
Fig.3 Pin configuration for SOT109.
Fig.4 Pin configuration for SOT163/SOT266.
October 1992
6
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
PINNING
FUNCTIONAL DESCRIPTION
The TSA5512 is controlled via the two-wire I
2
C-bus. For programming, there is one module address (7 bits) and the R/W
bit for selecting READ or WRITE mode.
WRITE mode: R/W = 0 (see Table 1)
After the address transmission (first byte), data bytes can be sent to the device. Four data bytes are required to fully
program the TSA5512. The bus transceiver has an auto-increment facility which permits the programming of the
TSA5512 within one single transmission (address + 4 data bytes).
The TSA5512 can also be partially programmed on the condition that the first data byte following the address is byte 2
or byte 4. The meaning of the bits in the data bytes is given in Table 1. The first bit of the first data byte transmitted
indicates whether frequency data (first bit = 0) or charge pump and port information (first bit = 1) will follow. Until an
I
2
C-bus STOP condition is sent by the controller, additional data bytes can be entered without the need to re-address the
device. This allows a smooth frequency sweep for fine tuning or AFC purpose. At power-on the ports are set to the high
impedance state.
The 7.8125 kHz reference frequency is obtained by dividing the output of the 4 MHz crystal oscillator by 512.
Because the input of UHF/VHF signal is first divided by 8 the step size is 62.5 kHz. A 3.2 MHz crystal can offer step sizes
of 50 kHz.
SYMBOL
PIN
DESCRIPTION
SOT102
SOT109
SOT163
SOT266
PD
1
1
1
charge-pump output
Q1
2
2
2
crystal oscillator input 1
Q2
3
3
3
crystal oscillator reference voltage
n.c.
-
-
4
not connected
SDA
4
4
5
serial data input/output
SCL
5
5
6
serial clock input
P7
6
6
7
port output/input (general purpose)
n.c.
-
-
8
not connected
P6
7
7
9
port output/input for general purpose ADC
P5
8
8
10
port output/input (general purpose)
P4
9
9
11
port output/input (general purpose)
P3
10
10
12
port output/input for address selection
P2
11
11
13
port output
P1
12
-
14
port output
P0
13
-
15
port output
V
CC
14
12
16
voltage supply
RF
IN1
15
13
17
UHF/VHF signal input 1
RF
IN2
16
14
18
UHF/VHF signal input 2 (decoupled)
V
EE
17
15
19
ground
UD
18
16
20
drive output
October 1992
7
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
Table 1
Write data format
Note to Table 1
MSB
LSB
Address
1
1
0
0
0
MA1
MA0
0
A
byte 1
Programmable
divider
0
N14
N13
N12
N11
N10
N9
N8
A
byte 2
Programmable
divider
N7
N6
N5
N4
N3
N2
N1
N0
A
byte 3
Charge-pump
and test bits
1
CP
T1
T0
1
1
1
OS
A
byte 4
Output ports
control bits
P7
P6
P5
P4
P3
P2
P1*
P0*
A
byte 5
*
not valid for TSA5512T
MA1,MAO
programmable address bits (see Table 4)
A
acknowledge bit
N14 to N0
programmable divider bits
N = N14
2
14
+ N13
2
13
+... +N1
2
1
+ NO
CP
charge-pump current
CP = 0
50
A
CP = 1
220
A
P7 to P0 = 1
open-collector output is active
P7 to P0 = 0
outputs are in high impedance state
T1, T0, OS = 0 0 0
normal operation
T1 = 1
P6 = f
ref
, P7 = f
DIV
T0 = 1
3-state charge-pump
OS = 1
operational amplifier output is switched off (varicap drive disable)
October 1992
8
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
READ mode: R/W = 1 (see Table 2)
Data can be read out of the TSA5512 by setting the R/W bit to 1. After the slave address has been recognized, the
TSA5512 generates an acknowledge pulse and the first data byte (status word) is transferred on the SDA line (MSB first).
Data is valid on the SDA line during a high position of the SCL clock signal. A second data byte can be read out of the
TSA5512 if the processor generates an acknowledge on the SDA line. End of transmission will occur if no acknowledge
from the processor occurs. The TSA5512 will then release the data line to allow the processor to generate a STOP
condition. When ports P3 to P7 are used as inputs, they must be programmed in their high-impedance state. The POR
flag (power-on reset) is set to 1 when V
CC
goes below 3 V and at power-on. It is reset when an end of data is detected
by the TSA5512 (end of a READ sequence). Control of the loop is made possible with the in-lock flag FL which indicates
(FL = 1) when the loop is phase-locked. The bits I2, I1 and I0 represent the status of the I/O ports P7, P5 and P4
respectively. A logic 0 indicates a LOW level and a logic 1 a HIGH level (TTL levels). A built-in 5-level ADC is available
on I/O port P6. This converter can be used to feed AFC information to the controller from the IF section of the television
as illustrated in the typical application circuit (Fig.8). The relationship between bits A2, A1 and A0 and the input voltage
on port P6 is given in Table 3.
Table 2
Read data format
Note to Table 2
MSB is transmitted first
Address selection
The module address contains programmable address bits (MA1 and MA0) which together with the I/O port P3 offers the
possibility of having several synthesizers (up to 3) in one system.
The relationship between MA1 and MA0 and the input voltage I/O port P3 is given in Table 4
MSB
LSB
Address
1
1
0
0
0
MA1
MA0
1
A
byte 1
Status byte
POR
FL
I2
I1
I0
A2
A1
A0
-
byte 2
POR
power-on reset flag. (POR = 1 on power-on)
FL
in-lock flag (FL = 1 when the loop is phase-locked)
I2, I1, I0
digital information for I/O ports P7, P5 and P4 respectively
A2, A1 A0
digital outputs of the 5-level ADC. Accuracy is 1/2 LSB (see Table 3)
October 1992
9
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
Table 3
ADC levels
Table 4
Address selection
LIMITING VALUES
In accordance with Absolute Maximum Rating System (IEC 134); all pin numbers refer to DIL18 version
THERMAL RESISTANCE
VOLTAGE APPLIED ON THE PORT P6
A2
A1
A0
0.6 V
CC
to 13.5 V
1
0
0
0.45 V
CC
to 0.6 V
CC
0
1
1
0.3 V
CC
to 0.45 V
CC
0
1
0
0.15 V
CC
to 0.3 V
CC
0
0
1
0 to 0.15 V
CC
0
0
0
MA1
MA0
VOLTAGE APPLIED ON PORT P3
0
0
0 to 0.1 V
CC
0
1
always valid
1
0
0.4 to 0.6 V
CC
1
1
0.9 V
CC
to 13.5 V
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
CC
supply voltage
-
0.3
6
V
V
1
charge-pump output voltage
-
0.3
V
CC
V
V
2
crystal (Q1) input voltage
-
0.3
V
CC
V
V
4
serial data input/output voltage
-
0.3
6
V
V
5
serial clock input voltage
-
0.3
6
V
V
6-13
P7 to P0 input/output voltage
-
0.3
+16
V
V
15
prescaler input voltage
-
0.3
V
CC
V
V
18
drive output voltage
-
0.3
V
CC
V
I
6-13
P7 to P0 output current (open collector)
-
1
15
mA
I
4
SDA output current (open collector)
-
1
5
mA
T
stg
IC storage temperature range
-
40
+150
C
T
j
maximum junction temperature
-
150
C
SYMBOL
PARAMETER
THERMAL RESISTANCE
R
th j-a
from junction to ambient in free air
DIL18
80 K/W
SO16
110 K/W
SO20
80 K/W
SSOP20
120 K/W
October 1992
10
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
CHARACTERISTICS
V
CC
= 5 V; T
amb
= 25
C, unless otherwise specified
All pin numbers refer to DIL18 version
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Functional range
V
CC
supply voltage range
4.5
-
5.5
V
T
amb
operating ambient
temperature range
-
10
-
+80
C
f
input frequency
64
-
1300
MHz
N
divider
256
-
32767
I
CC
supply current
25
35
50
mA
f
XTAL
crystal oscillator
frequency range
crystal series resonance
resistance
150
3.2
4.0
4.48
MHz
Z
I
input impedance (pin 2)
-
480
-
400
-
320
input level
V
CC
= 4.5 V to 5.5 V;
T
amb
=
-
10 to +80
C;
see typical sensitivity curve
Fig.6
f = 80 to 150 MHz
12/
-
25
-
300/2.6
mV/dBm
f = 150 to 1000 MHz
9/
-
28
-
300/2.6
mV/dBm
f = 1000 to 1300 MHz
40/
-
15
-
300/2.6
mV/dBm
R
I
prescaler input resistance
(see Fig.7)
-
50
-
C
I
input capacitance
-
2
-
pF
Output ports (open collector) P0 to P7 (see note 1)
I
LO
output leakage current
V
O
= 13.5 V
-
-
10
A
V
OL
LOW level output voltage
I
OL
= 5 mA; note 2
-
-
0.7
V
Input port P3
I
OH
HIGH level input current
V
OH
= 13.5 V
-
-
10
A
I
OL
LOW level input current
V
OL
= 0 V
-
10
-
-
A
Input ports P4, P5 and P7
V
IL
LOW level input voltage
-
-
0.8
V
V
IH
HIGH level input voltage
2.7
-
-
V
I
IH
HIGH level input current
V
IH
= 13.5 V
-
-
10
A
I
IL
LOW level input current
V
IL
= 0 V
-
10
-
-
A
Input port P6
I
IH
HIGH level input current
V
IH
= 13.5 V
-
-
10
A
I
IL
LOW level input current
V
IL
= 0 V
-
10
-
-
A
SCL and SDA inputs
V
IH
HIGH level input voltage
3.0
-
5.5
V
V
IL
LOW level input voltage
-
-
1.5
V
October 1992
11
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
Notes to the characteristics
1. When a port is active, the collector voltage must not exceed 6 V.
2. Measured with all open-collector ports active.
SCL and SDA inputs
I
IH
HIGH level input current
V
IH
= 5 V; V
CC
= 0 V
-
-
10
A
V
IH
= 5 V; V
CC
= 5 V
-
-
10
A
I
IL
LOW level input current
V
IL
= 0 V; V
CC
= 0 V
-
10
-
-
A
V
IL
= 0 V; V
CC
= 5 V
-
10
-
-
A
Output SDA (pin 4; open collector)
I
LO
output leakage current
V
O
= 5.5 V
-
-
10
A
V
O
output voltage
I
O
= 3 mA
-
-
0.4
V
Charge-pump output PD (pin 1)
I
OH
HIGH level output current
(absolute value)
CP = 1
90
220
300
A
I
OL
LOW level output current
(absolute value)
CP = 0
22
50
75
A
V
1
output voltage
in-lock
1.5
-
2.5
V
I
1leak
off-state leakage current
T0 = 1
-
5
-
5
nA
Operational amplifier output UD (test mode T0 = 1)
V
18
output voltage
V
IL
= 0 V
-
-
100
mV
V
18
output voltage when
switched-off
OS = 1; V
IL
= 2 V
-
-
200
mV
G
operational amplifier
current gain;
I
18
/(I
1
- I
1leak
)
OS = 0; V
IL
= 2 V;
I
18
= 10
A
2000
-
-
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
October 1992
12
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled
synthesizer
TSA5512
Fig.5 Typical application (DIL18).
October 1992
13
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
Fig.6 Prescaler typical input sensitivity curve; V
CC
= 4.5 to 5.5 V; T
amb
=
-
10 to +80
C.
Fig.7 Prescaler Smith chart of typical input impedance; V
CC
= 5 V; reference value = 50
.
October 1992
14
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
FLOCK FLAG DEFINITION (FL)
When the FL flag is 1, the maximum frequency deviation (
f) from stable frequency can be expressed as follows:
Where:
FLOCK FLAG APPLICATION
K
VCO
= 16 MHz/V (UHF band)
I
CP
= 220 mA
C1 = 180 nF
C2 = 39 nF
f =
27.5 kHz.
Table 5
Flock flag settings
K
VCO
=
oscillator slope (Hz/V)
I
CP
=
charge-pump current (A)
K
O
=
4
10E6
C1 and C2
=
loop filter capacitors (see Fig.8)
MIN.
MAX.
UNIT
Time span between actual phase lock and FL-flag setting
1024
1152
s
Time span between the loop losing lock and FL-flag resetting
0
128
s
f
K
VCO
K
O
/
(
)
I
CP
C1
C2
+
(
)
C1
C2
(
)
/
=
Fig.8 Loop filter.
October 1992
15
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
PACKAGE OUTLINE
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT102-1
93-10-14
95-01-23
UNIT
A
max.
1
2
b
1
(1)
(1)
(1)
b
2
c
D
E
e
M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.40
1.14
0.53
0.38
0.32
0.23
21.8
21.4
6.48
6.20
3.9
3.4
0.254
2.54
7.62
8.25
7.80
9.5
8.3
0.85
4.7
0.51
3.7
inches
0.055
0.044
0.021
0.015
0.013
0.009
1.40
1.14
0.055
0.044
0.86
0.84
0.26
0.24
0.15
0.13
0.01
0.10
0.30
0.32
0.31
0.37
0.33
0.033
0.19
0.020
0.15
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w
M
b
1
b
2
e
D
A
2
Z
18
1
10
9
b
E
pin 1 index
0
5
10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
DIP18: plastic dual in-line package; 18 leads (300 mil)
SOT102-1
October 1992
16
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
X
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.0
0.4
SOT109-1
95-01-23
97-05-22
076E07S
MS-012AC
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15
0.050
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01
0.004
0.039
0.016
0
2.5
5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
October 1992
17
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
UNIT
A
max.
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
inches
2.65
0.30
0.10
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w
M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04
MS-013AC
pin 1 index
0.10
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.050
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
X
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
95-01-24
97-05-22
October 1992
18
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
UNIT
A
1
A
2
A
3
b
p
c
D
(1)
E
(1)
(1)
e
H
E
L
L
p
Q
Z
y
w
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.15
0
1.4
1.2
0.32
0.20
0.20
0.13
6.6
6.4
4.5
4.3
0.65
1.0
0.2
6.6
6.2
0.65
0.45
0.48
0.18
10
0
o
o
0.13
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
0.75
0.45
SOT266-1
90-04-05
95-02-25
w
M
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
X
(A )
3
A
y
0.25
1
10
20
11
pin 1 index
0
2.5
5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm
SOT266-1
A
max.
1.5
October 1992
19
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled
synthesizer
TSA5512
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
"IC Package Databook" (order code 9398 652 90011).
DIP
S
OLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260
C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
stg max
). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
R
EPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
C, contact may be up to 5 seconds.
SO and SSOP
R
EFLOW SOLDERING
Reflow soldering techniques are suitable for all SO and
SSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250
C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45
C.
W
AVE SOLDERING
Wave soldering is not recommended for SSOP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The longitudinal axis of the package footprint must
be parallel to the solder flow and must incorporate
solder thieves at the downstream end.
Even with these conditions, only consider wave
soldering SSOP packages that have a body width of
4.4 mm, that is SSOP16 (SOT369-1) or
SSOP20 (SOT266-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260
C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150
C within
6 seconds. Typical dwell time is 4 seconds at 250
C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
R
EPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300
C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320
C.
October 1992
20
Philips Semiconductors
Product specification
1.3 GHz Bidirectional I
2
C-bus controlled synthesizer
TSA5512
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I
2
C COMPONENTS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
Purchase of Philips I
2
C components conveys a license under the Philips' I
2
C patent to use the
components in the I
2
C system provided the system conforms to the I
2
C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
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