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Электронный компонент: TB502-02

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TB502-02
Layout Recommendation and Test Board for PLL502-02
47745 Fremont Blvd., Fremont, California 94538 TEL (510) 492-0990 FAX (510) 492-0991 Rev 10/30/01 Page 1
This note provides Layout recommendations for the PLL502-02 and documents the test
board prepared for the PLL502-02
Best phase noise and jitter performance is achieved by applying good decoupling practices between VDD and GND, and best pull-range
performance is obtained by optimizing the layout in order to minimize parasitic capacitances on the board.
As an example, and to simplify testing and evaluation of PLL502-02 by customers, PhaseLink provides a test board that implements the
best approaches for decoupling the VCXO chip using discrete external components. It is brought to the attention of our customers that
PLL502-02 is pin-to-pin compatible with PLL501-01 and PLL501-05, with the exception of pin#2 which is not connected internally on
PLL502-02.
While this test board achieves satisfactory decoupling results, best results are achieved when the VCXO chip is laid out into the final
PCB, following the recommendations indicated in the data sheet.
1. External Components and Layout Recommendations (as per PLL502-02 data sheet)
The PLL502-02 requires a minimum number of external components for proper operation. A standard low frequency decoupling
capacitor of 4.7
F or more should be used between VDD (pin 6) and GND. Additionally, higher frequency decoupling capacitors of
0.1
F are required between VDD and GND. These higher frequency decoupling capacitors must be connected as close to the PLL502-
02 chip as possible, and preferably directly next to the PLL502-02 pins. A series termination resistor of 33
may be used for the clock
output (series termination resistor not implemented on test board).
The input crystal must be connected as close to the chip as possible, and preferably directly next to the PLL502-02 pins. Care must be
given to the C
L
rating of the crystal: at nominal voltage control (1.65V) the load capacitance presented to the crystal by the PLL502-02
is 9.5pF. Therefore, if a crystal with C
L
higher than 9.5pF is used, it will require additional (fixed) loading capacitors externally to
complement the internal 9.5pF of the PLL502-02: one between each crystal electrode and GND, as close to the crystal as possible, and
preferably directly next to the crystal electrodes. Example, for crystal rated for C
L
= 14.5pF, two external 10pF capacitors (one between
each electrode of the crystal and GND) are required in order to load the crystal correctly. The two external capacitors (seen in series by
the crystal) result in an additional 5pF in parallel to the 9.5pF presented by the PLL502-02, thus providing the total 14.5pF required by
the crystal (9.5pF // 5pF = 14.5pF). However, if the crystal used with the PLL502-02 is rated for a CL = 9.5pF, no external capacitors
are requiredConsult PhaseLink for recommended suppliers.
2. Crystal Specifications (as per PLL502-02 data sheet)
PARAMETERS
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNITS
Crystal Resonator Frequency
F
XIN
Parallel Fundamental Mode
10
20
MHz
Crystal Loading Capacitance Rating
C
L
(xtal)
At VIN = 1.65V
9.5
pF
Crystal Pullability
C
0
/C
1
(xtal)
AT cut
250
-
Recommended ESR
R
E
AT cut
30
3. Test board schematic
+3.3V
XTAL, NSK 17.664 MHz, 14 pF
R1= 0 or 10
U1
PLL501-01
XIN
1
VDD
2
CTRL
3
GND
4
XOUT
8
GND
7
VDD
6
CLK
5
Y1
17.664 MHz
C4
10 pF
C5
10 pF
R1
?
C6
0.1uf
C1
0.1uf
C2
0.1uf
C3
4.7 uf
Clock output
Vin control
= 0
Note: C5 and C4
are only
required if
a crystal of
C
L
greater
than 9.5 pF
is used.
Please order a
test board without
external C5 and
C4 capacitors if
you intend to use
a crystal of CL
equal to 9.5pF.
PLL502-02