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Specifications are subject to change without notice.
Chip Guard
MLC Series Varistor ESD Clamp Protectors
Electrical Characteristics @ 25 C (unless otherwise noted)
Description
Device Symbol
Features
0603 package
Rated for IEC 61000-4-2, level 4 ESD requirements for high speed USB 2.0 or
IEEE1394 applications
Withstands multiple ESD strikes
Low capacitance and leakage currents for invisible load protection
Tape and reel packaging
Parameter
Device
Typ.
Max.
Unit
V
DC
Continuous operating voltage
CG0603MLC-05
5
6
V
CG0603MLC-12
12
V
CLAMP
Clamping voltage
CG0603MLC-05
20
35
V
(see notes 1,2,3)
CG0603MLC-12
30
50
C
off
Off-state capacitance,
0.5
pF
f = 1 MHz, 1 Vrms bias
I
L
Off-state current,
50
nA
VDC = max. rating
V
T
Trigger voltage (see notes 1,3,4)
150
V
Surge Withstand Ratings
Parameter
Peak Voltage
Repetitions
(Min.)
ESD Voltage Capability,
8 kV
100 at 8 kV
Contact Discharge
ESD Voltage Capability,
15 kV
100 at 15 kV
Air Discharge
Standard
IEC61000-4-2 Level 4
Environmental Characteristics
The Chip Guard
CG0603MLC Series has
been specifically designed to protect
sensitive electronic components from
electrostatic discharge damage. The MLC
family has been designed to protect
equipment to IEC61000-4-2, level 4 ESD
specifications targeted for high speed
USB 2.0 or IEEE1394 applications.
The Chip Guard
MLC Series has been
manufactured to provide very low capacitance
and leakage currents with excellent clamp
qualities, making the family almost transpar-
ent under normal working conditions.
Notes: 1.Per IEC 61000-4-2, 30 A at 8 kV, level 4.
2.Measurement made 30 ns after initiation of pulse.
3.Test conducted in contact discharge mode.
4.Measurement made at maximum pulse voltage.
V
Response Time ................................................................................................................<1 ns
Operating Temperature ..................................................................................-55 C to +85 C
Storage Temperature ......................................................................................-55 C to +85 C
How to Order
CG 0603 MLC - 05 E
Chip Guard
Product Designator
Package Option
0603 = 0603 Package
Multilayer Series Designator
Operating Voltage
05 = 5 V
12 = 12 V
Packaging
E = Tape and Reel
5,000 pcs. per reel
Ni barrier terminations are standard on all Chip
Guard
part numbers.
Chip Guard
MLC Series Varistor ESD Clamp Protectors
Specifications are subject to change without notice.
REV. B
"Chip Guard" is a registered trademark of Bourns, Inc.
Product Dimensions
DIMENSIONS =
MM
(INCHES)
1.60
0.20
(0.064
0.008)
0.80
0.20
(0.032
0.008)
0.30
0.20
(0.012
0.008)
0.80
0.20
(0.032
0.008)
Recommended Pad Layout
0.75
0.10
(0.03
0.004)
0.75
0.10
(0.03
0.004)
0.75
0.10
(0.03
0.004)
Packaging Dimensions
NOTES: TAPE MATERIAL IS PAPER.
COVER TAPE ADHESION IS 40
15 GRAMS.
TAPE THICKNESS IS
4.00
0.10
(0.16
0.004)
2.00
0.05
(0.08
0.002)
8.00
0.30
(0.32
0.012)
0.60
0.05
(0.024
0.002)
3.50
0.05
(0.14
0.002)
1.75
0.10
(0.04
0.004)
1.90
0.20
(0.076
0.008)
1.10
0.20
(0.044
0.008)
1.50
0.10
(0.06
0.004)
2.0
0.50
(0.08
0.02)
180.8
2.0
(7.12
0.08)
9.0
0.50
(0.36
0.02)
13.0
1.0
(0.52
0.04)
13.0
0.50
(0.52
0.02)
62.0
1.50
(2.48
0.06)
21.0
0.80
(0.84
0.032)
COPYRIGHT 2003, BOURNS, INC. LITHO IN U.S.A. E 01/03/CG0302
Solder Reflow Recommendations
110 sec. (min.)
300
250
200
150
100
50
0
30-70
sec.
Temperature (
C)
120 sec. (min.)
Preheat Stages 1-3
Soldering
Cooling
Time (seconds)
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
A
Stage 1 Preheat Ambient to Preheating
30 s to 60 s
Temperature
B
Stage 2 Preheat 140 C to 160 C
60 s to 120 s
C
Stage 3 Preheat Preheat to 200 C
20 s to 40 s
D
Main Heating
200 C
60 s to 70 s
210 C
55 s to 65 s
220 C
50 s to 60 s
230 C
40 s to 50 s
240 C
30 s to 40 s
E
Cooling
200 C to 100 C
1 C/s to 4 C/s
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