TIPP110, TIPP111, TIPP112
NPN SILICON POWER DARLINGTONS
P R O D U C T I N F O R M A T I O N
1
MAY 1989 - REVISED MARCH 1997
Copyright 1997, Power Innovations Limited, UK
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
q
20 W Pulsed Power Dissipation
q
100 V Capability
q
2 A Continuous Collector Current
q
4 A Peak Collector Current
LP PACKAGE
(TOP VIEW)
MDTRAB
E
C
B
1
2
3
absolute maximum ratings
at 25C case temperature (unless otherwise noted)
NOTES: 1. This value applies for t
p
0.3 ms, duty cycle
10%.
2. Derate linearly to 150C case temperature at the rate of 0.32 W/C.
3. V
CE
= 20 V, I
C
= 1 A, P
W
= 10 ms, duty cycle
2%.
RATING
SYMBOL
VALUE
UNIT
Collector-base voltage (I
E
= 0)
TIPP110
TIPP111
TIPP112
V
CBO
60
80
100
V
Collector-emitter voltage (I
B
= 0)
TIPP110
TIPP111
TIPP112
V
CEO
60
80
100
V
Emitter-base voltage
V
EBO
5
V
Continuous collector current
I
C
2
A
Peak collector current (see Note 1)
I
CM
4
A
Continuous base current
I
B
50
mA
Continuous device dissipation at (or below) 25C case temperature (see Note 2)
P
tot
0.8
W
Pulsed power dissipation (see Note 3)
P
T
20
W
Operating junction temperature range
T
j
-55 to +150
C
Storage temperature range
T
stg
-55 to +150
C
Lead temperature 3.2 mm from case for 10 seconds
T
L
260
C
TIPP110, TIPP111, TIPP112
NPN SILICON POWER DARLINGTONS
2
MAY 1989 - REVISED MARCH 1997
P R O D U C T I N F O R M A T I O N
NOTES: 4. These parameters must be measured using pulse techniques, t
p
= 300 s, duty cycle
2%.
5. These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts and located
within 3.2 mm from device body.
electrical characteristics at 25C case temperature
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
(BR)CEO
Collector-emitter
breakdown voltage
I
C
= 10 mA
(see Note 4)
I
B
= 0
TIPP110
TIPP111
TIPP112
60
80
100
V
I
CEO
Collector-emitter
cut-off current
V
CE
= 30 V
V
CE
= 40 V
V
CE
= 50 V
V
BE
= 0
V
BE
= 0
V
BE
= 0
TIPP110
TIPP111
TIPP112
2
2
2
mA
I
CBO
Collector-base
cut-off current
V
CE
= 60 V
V
CE
= 80 V
V
CE
= 100 V
I
B
= 0
I
B
= 0
I
B
= 0
TIPP110
TIPP111
TIPP112
1
1
1
mA
I
EBO
Emitter cut-off
current
V
EB
= 5 V
I
C
= 0
2
mA
h
FE
Forward current
transfer ratio
V
CE
= 4 V
V
CE
= 4 V
I
C
= 1 A
I
C
= 2 A
(see Notes 4 and 5)
1000
500
V
CE(sat)
Collector-emitter
saturation voltage
I
B
= 8 mA
I
C
= 2 A
(see Notes 4 and 5)
2.5
V
V
BE
Base-emitter
voltage
V
CE
= 4 V
I
C
= 2 A
(see Notes 4 and 5)
2.8
V
V
EC
Parallel diode
forward voltage
I
E
= 4 A
I
B
= 0
(see Notes 4 and 5)
3.5
V
3
MAY 1989 - REVISED MARCH 1997
TIPP110, TIPP111, TIPP112
NPN SILICON POWER DARLINGTONS
P R O D U C T I N F O R M A T I O N
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
MECHANICAL DATA
ALL LINEAR DIMENSIONS IN MILLIMETERS
12,7 MIN.
2,03
2,67
4,44
5,21
3,43 MIN.
4,32
5,34
0,40
0,56
1,14
1,40
2,41
2,67
0,35
0,41
2,03
2,67
3,17
4,19
(see Note A)
Seating Plane
1
2
3
LP003 (TO-92)
LP003 Falls Within JEDEC
TO-226AA Dimensions
MDXXAX
1,27
NOTE A: Lead dimensions are not controlled in this area.
TIPP110, TIPP111, TIPP112
NPN SILICON POWER DARLINGTONS
4
MAY 1989 - REVISED MARCH 1997
P R O D U C T I N F O R M A T I O N
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
MECHANICAL DATA
LP003 (TO-92) - Formed Leads Version
ALL LINEAR DIMENSIONS IN MILLIMETERS
2,03
2,67
4,44
5,21
3,43 MIN.
4,32
5,34
0,40
0,56
2,40
2,90
0,35
0,41
2,03
2,67
3,17
4,19
4,00 MAX.
2,90
2,40
LP003 Falls Within JEDEC
TO-226AA Dimensions
1
2
3
MDXXAR
5
MAY 1989 - REVISED MARCH 1997
TIPP110, TIPP111, TIPP112
NPN SILICON POWER DARLINGTONS
P R O D U C T I N F O R M A T I O N
LPR
tape dimensions
MECHANICAL DATA
LP Package (TO-92) Tape (Formed Lead Version)
ALL LINEAR DIMENSIONS IN MILLIMETERS
0,00
0,50
5,50
19,00
8,50
9,75
17,50
19,00
3,70
4,30
12,40
13,00
5,95
6,75
2,40
2,90
8,50
11,00
15,50
16,50
17,66
27,68
23,00
32,00
11,70
13,70
2,50 MIN.
2,90
2,40
4,44
5,21
2,03
2,67
3,43 MIN.
4,32
5,34
4,00 MAX.
0,40
0,56
3,17
4,19
2,03
2,67
0,35
0,41
MDXXAS
PDF 
ZIP