EMIF2MIC-68FCC
1
05212.R1 9/05
www.protekdevices.com
EMI FILTER/TVS ARRAY
Only One Name Means ProTek'TionTM
APPLICATIONS
Cellular Phones
Notebooks
Personal Digital Assistant (PDA)
Ground Positioning System (GPS)
Audio Ports
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Bidirectional EMI Filtering/TVS Low Pass Filters
Low Insertion Loss: -3db Roll-Off @ 72MHz
Bidirectional Configuration
Protects Up to Two(2) Signal Lines
RoHS Compliant on Lead-Free Versions
MECHANICAL CHARACTERISTICS
5 Bump Flip Chip Package
Weight 0.73 milligrams (Approximate)
Available in Tin-Lead or Lead-Free Plating
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245C
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C
Flammability Rating UL 94V-0
8mm Tape and Reel Per EIA Standard 481
05212
PIN CONFIGURATION
G
5 BUMP FC
2
www.protekdevices.com
05212.R1 9/05
EMIF2MIC-68FCC
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55C to 150C
C
C
-40C to 85C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
DC Power Per Resistor
mW
100
P
Typical Resistance (@ 15% Tolerance)
OHMS
68
R
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
DIODE
LEAKAGE
CURRENT
@ 5V
I
D
A
TYPICAL
CAPACITANCE
PER LINE
(See Note 1)
@0V, 1 MHz
C
pF
EMIF2MIC-68FCC
6.0
1
80
CUT-OFF
FREQUENCY
(50 Ohms I/O
ZERO BIAS)
fc
MHz
72
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
5.0
MINIMUM
ATTENUATION
@
800-3000 MHz
dB
30
Note 1:
20% tolerance.
3
www.protekdevices.com
05212.R1 9/05
EMIF2MIC-68FCC
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25C to Peak
30-60 seconds
T
emperature - C
T
P
155
140
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
50m
20m
60 Seconds
270C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270C
T
P
for Tin-Lead: 240-245C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
4
www.protekdevices.com
05212.R1 9/05
EMIF2MIC-68FCC
PACKAGE OUTLINE & DIMENSIONS
COPYRIGHT ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and
specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or
specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA-481.
2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e.,
EMIF2MIC-68FCC-T73-1.
3. Suffix - LF - Lead-Free, i.e.,
EMIF2MIC-68FCC-LF-T73-1.
Outline & Dimensions: Rev 1 - 8/05, 06055
Top cover tape
K0
t
D
P0
P2
10 Pitches Cumulative
Tolerance on Tape. 0.2
A0
B0
P
E
F
W
User Direction of Feed
Tape & Reel Specifications (Dimensions in millimeters)
D
E
P0
t
F
P2
W
1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05
P
4.00 0.10 0.200.025
A0
B0
K0
Reel Dia.
Tape Width
178mm (7")
8mm
1.08 0.05 1.60 0.05 0.72 0.05
A
B
C
D
E
F
G
H
I
J
0.914
1.285
0.495
0.245
0.430
0.430
0.180
0.180
0.432
0.330
0.036
0.0506
0.0195
0.0096
0.0169
0.0169
0.0071
0.0071
0.017
0.013
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
PACKAGE OUTLINE
1.016
1.375
0.505
0.255
0.440
0.440
0.280
0.280
0.559
0.457
0.040
0.0541
0.0199
0.0100
0.0173
0.0173
0.0110
0.0110
0.022
0.018
MIN
MIN
MAX
MAX
NOTE:
1. Controlling dimensions in millimeters.
1
2
O
G
I
BOTTOM VIEW
G
A
C
E
F
H
I
B
J
D
0.30 DIA.
63/67 Sn/Pb
SOLDER BUMPS
SIDE VIEW
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