LC0406FC3.3C
thru
LC0406FC24C
1
05158.R3 8/03
www.protekdevices.com
LOW CAPACITANCE FLIP CHIP ARRAY
Only One Name Means ProTek'TionTM
APPLICATIONS
Cellular Phones
Personal Digital Assistant (PDA)
Notebook Computers
SMART Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Available in Six Voltage Types Ranging From 3.3V to 24V
200 Watts Peak Pulse Power per Line (tp = 8/20s)
Low Clamping Voltage
Bidirectional Configuration & Monolithic Structure
Protects 3 to 5 Lines
LOW CAPACITANCE
LOW LEAKAGE CURRENT
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0406
Weight 0.73 milligrams (Approximate)
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
Top Contacts: Solder Bump 0.004" in Height (Nominal)
0406
(Single Chip Shown)
05158
PIN CONFIGURATION
2
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DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55
C to 150
C
C
C
-55
C to 150
C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
Peak Pulse Power (t
p
= 8/20s) - See Figure 1
P
PP
200
Watts
0 5 10 15 20 25 30
t - Time - s
0
20
40
60
80
100
120
I
PP
- Peak Pulse Current - % of I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8s
t
d
= 20s
t
f
Peak Value I
PP
e
-t
t
d
= t
I
PP
/2
FIGURE 2
PULSE WAVE FORM
0.01 1 10 100 1,000 10,000
t
d
- Pulse Duration - s
10
100
1,000
10,000
P
PP
- Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
200W, 8/20s Waveform
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20s
V
C
@ I
PP
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
LC0406FC3.3C
LC0406FC05C
LC0406FC08C
LC0406FC12C
LC0406FC15C
LC0406FC24C
3.3
5.9
8.0
12.0
15.0
24.0
4.0
6.0
8.5
13.3
16.7
26.7
7.0
11.0
13.2
19.8
25.4
37.2
12.5V @ 16A
13V @ 15A
18V @ 11A
26.9V @ 7.4A
34.5V @ 5.8A
50.6V @ 4A
70
35
32
30
25
20
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
A
75*
10**
1
1
1
1
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V.
3
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LC0406FC24C
GRAPHS
0 5 10 15 20
V
C
- Clamping
V
oltage -
V
olts
0
4
8
12
14
FIGURE 6
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0406FC05C
10
6
2
I
PP
- Peak Pulse Current - Amps
225C
5-10 sec
Instantaneous
to 200C
Soldering
Time
Cool Down
Time
1-2 Minutes
to 150C
1-2 Minutes to 25C
Pre-Heat
Time
100C
200C
Note:
This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.
0 25 50 75 100 125 150
T
L
- Lead Temperature - C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20s
Average Power
FIGURE 3
POWER DERATING CURVE
0
FIGURE 4
REFLOW SOLDER PROFILE
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
OVERSHOOT & CLAMPING VOLTAGE FOR LC0406FC05C
5
V
olts per Division
-5
5
15
25
35
4
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PACKAGE OUTLINE & DIMENSIONS
A
B
C
E
F
G
H
I
0.56 NOM
0.86 NOM
0.99 0.0254
0.15 SQ
1.5 0.0254
0.15 NOM
0.127 MAX
0.076 MIN
0.406 NOM
0.022 NOM
0.034 NOM
0.039 0.001
0.006 SQ
0.059 0.001
0.006 NOM
0.005 MAX
0.003 MIN
0.016 NOM
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx 0.05mm ( 0.002").
PACKAGE OUTLINE
MOUNTING PAD LAYOUT - Option 1
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
NOTE:
1.
Preferred: Using 0.1mm (0.004") stencil.
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
PAD DIMENSIONS
DIM
MILLIMETERS
INCHES
Outline & Dimensions: Rev 3 - 11/02, 06023
G
H
E
F
I
SIDE
A
B
C
TOP
END
C
SOLDER PRINT
0.010" - 0.012" DIA.
A
H
D
I
SOLDER PADS
F
G
E
SOLDER MASK
DIE
SOLDER
BUMPS
5
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PACKAGE OUTLINE & DIMENSIONS
A
F
G
H
I
0.51
0.15 SQ
0.71
0.99
0.51
0.020
0.006 SQ
0.028
0.039
0.020
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx 0.05mm ( 0.002").
3.
Preferred: Using 0.1mm (0.004") stencil.
MOUNTING PAD LAYOUT - Option 2
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and
reeled in accordance with EIA 481.
2.
8mm Plastic Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., LC0406FC05C-T75-1).
3.
8mm Paper Tape: 7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-2
(i.e., LC0406FC05C-T75-2).
Outline & Dimensions: Rev 3 - 11/02, 06023
COPYRIGHT ProTek Devices 2003
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer's and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
TAPE & REEL ORIENTATION
NOTE:
1. Top view of tape. Solder bumps are face
down in tape package.
Triple Die - 0406
SOLDER PRINT
0.014" [0.36] DIA.
A
H
I
F
G
SOLDER MASK
DIE
SOLDER
BUMPS
COPPER CONTACTS
0.009" [0.23] DIA.
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