1
www.protekdevices.com
05102.R2 1/02
BIDIRECTIONAL LOW CAPACITANCE TVS ARRAYS
APPLICATIONS
Ethernet - 10/100 Base T
FireWire
SCSI
Bluetooth & RF
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kv, Contact - 8kv
61000-4-4 (EFT): 40A - 5/50ns
61000-4-5 (Surge): 24A, 8/20s - Level 2(Line-Gnd) & Level 3(Line-Line)
FEATURES
500 Watts Peak Pulse Power Dissipation(t
p
= 8/20s)
Bidirectional Configuration
Available in 4 Voltage Types: 3.3V to 15V
Protects Up to Six (6) Lines
ESD Protection > 40 kilovolts
LOW CAPACITANCE -8pF
MECHANICAL CHARACTERISTICS
Molded JEDEC SO-8
Weight 15 milligrams (Approximate)
Flammability Rating UL 94V-0
12mm Tape and Reel Per EIA Standard 481-1-A
Device Marking Code & Logo
Pin 1 Indicated By Dot on Package
CIRCUIT DIAGRAM
SO-8
. . . engineered solutions for the transient environmentTM
05102
PLCDA03C-6
thru
PLCDA15C-6
1
2
3
4
8
7
6
5
I/O
I/O
I/O
GND
GND
I/O
I/O
I/O
2
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05102.R2 1/02
PLCDA03C-6
thru
PLCDA15C-6
DEVICE CHARACTERISTICS
0.01 1 10 100 1,000 10,000
t
d
- Pulse Duration - s
0 5 10 15 20 25 30
t - Time - s
0
20
40
60
80
100
120
I
PP
- Peak Pulse Current - % of I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8s
t
d
= 20s
t
f
Peak Value I
PP
e
-t
t
d
= t
I
PP
/2
FIGURE 2
PULSE WAVE FORM
10
100
1,000
10,000
P
PP
- Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
500W, 8/20s Waveshape
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55
C to 150
C
C
C
-55
C to 150
C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
Note 1: Spice model and parameters for this series are available on the ProTek Devices web site:
www.protekdevices.com
.
Note 2: Capacitance between I/O pins and ground (pins 4 & 5) is typically 8pF. Capacitance between I/O pins is typically 4 pF.
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
DEVICE
MARKING
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20s
V
C
@ I
PP
TYPICAL
CAPACITANCE
(See Note 2)
0V @ 1 MHz
C
pF
PLCDA03C-6
PLCDA05C-6
PLCDA08C-6
PLCDA15C-6
PRS
PRT
PRW
PRU
4.5
6.0
8.5
16.7
7.0
9.8
13.4
22.0
10.9V @ 43.0A
13.5V @ 42.0A
16.9V @ 34.0A
30.0V @ 17.0A
8
8
8
8
MAXIMUM
LEAKAGE
CURRENT
@V
WM
I
D
A
125
20
10
2
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
3.3
5.0
8.0
15.0
3
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05102.R2 1/02
PLCDA03C-6
thru
PLCDA15C-6
0 25 50 75 100 125 150
T
L
- Lead Temperature - C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20s
Average Power
FIGURE 3
POWER DERATING CURVE
0
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PLCDA05C-6
ESD Test Pulse: 25 kilovolt, 1/30ns (waveshape)
5
V
olts per Division
0
10
20
30
40
GRAPHS
FIGURE 7
RETURN LOSS - PLCDA05C-6
100 MHz per Division
10 db per Division
-50 db
-20 db
Ref 0 db
20 db
FIGURE 6
INSERTION LOSS - PLCDA05C-6
100 MHz per Division
10 db per Division
-50 db
-20 db
Ref 0 db
20 db
PLCDA05C-6
0 2 4 6 8 10 12 14 16 18
I
PP
- Peak Pulse Current - Amps
V
C
- Clamping
V
oltage -
V
olts
0
4
8
12
16
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT
4
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05102.R2 1/02
PLCDA03C-6
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PLCDA15C-6
APPLICATION NOTE
The PLCDAxxC-6 Series are low capacitance, bidirectional TVS arrays that are designed to protect I/O or high speed data lines from the damaging
effects of ESD or EFT. This product series has a surge capability of 500 Watts P
PP
per line for an 8/20s waveshape and offers ESD protection >
40kv.
BIDIRECTIONAL COMMON MODE CONFIGURATION (Figure 1)
Ideal for use multimode transceiver I/O lines, the PLCDAxxC-6 Series provides
up to six (6) lines of protection in a common mode configuration as depicted in
Figure 1.
Circuit connectivity is as follows:
Line 1 is connected to Pin 1.
Line 2 is connected to Pin 2.
Line 3 is connected to Pin 3.
Line 4 is connected to Pin 8.
Line 5 is connected to Pin 7.
Line 6 is connected to Pin 6.
Pins 4 and 5 are connected to Ground.
BIDIRECTIONAL COMMON MODE CONFIGURATION (Figure 2)
The PLCDAxxC-6 Series also provides video line applications six (6) lines of
protection in a common mode configuration as depicted in Figure 2.
Circuit connectivity is as follows:
Line 1 (Red) is connected to Pin 1.
Line 2 (Green) is connected to Pin 2.
Line 3 (Blue) is connected to Pin 3.
Line 4 (VSYNC) is connected to Pin 6.
Line 5 (HSYNC) is connected to Pin 7.
Pins 4 and 5 are connected to Ground.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic Compat-
ibility (EMC) protection. The following guidelines are
recommended:
The protection device should be placed near the input
terminals or connectors, the device will divert the
transient current immediately before it can be coupled
into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground loops
should be minimized.
The transient current return path to ground should be
kept as short as possible to reduce parasitic induc-
tance.
Ground planes should be used whenever possible.
For multilayer PCBs, use ground vias.
1
2
3
4
8
7
6
5
LINE 6
LINE 1
LINE 2
LINE 3
LINE 4
LINE 5
Figure 1: Typical Transceiver Protection Circuit
1
2
3
4
8
7
6
5
LINE 1 (RED)
LINE 2 (GREEN)
LINE 3 (BLUE)
LINE 4 (VSYNC)
LINE 4 (HSYNC)
GRAPHIC CONTROLLER
DB-15
CONNECTOR
Figure 2: Typical Video Line Protection Circuit
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05102.R2 1/02
PLCDA03C-6
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PLCDA15C-6
PACKAGE OUTLINE & DIMENSIONS
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
COPYRIGHT ProTek Devices 2001
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and
technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
A
B
C
D
F
G
J
K
P
R
4.80
3.80
1.35
0.35
0.40
1.27 BSC
0.18
0.10
5.80
0.25
5.00
4.00
1.75
0.49
1.250
1.27 BSC
0.25
0.25
6.20
0.50
0.189
0.150
0.054
0.014
0.016
0.05 BSC
0.007
0.004
0.229
0.010
0.196
0.157
0.068
0.019
0.049
0.05 BSC
0.009
0.008
0.244
0.019
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. - T - = Seating Plane and Datum Surface.
2. Dimensions "A" and "B" are Datum.
3. Dimensions "A" and "B" do not include mold
protrusion.
4. Maximum mold protrusion is 0.015" (0.380 mm)
per side.
5. Dimensioning and tolerances per ANSI Y14.5M,
1982.
6. Dimensions are exclusive of mold flash and metal
burrs.
-A-
P
-B-
D
G
8
5
4
1
-T-
K
C
R X 45
J
F
0
- 10
0.010" (0.25 MM)
M
B
M
4 PL
0.010" (0.25 MM)
S
B
M
8 PL
T
A
S
PACKAGE OUTLINE
SO-8
0.030"
0.005"
0.050"
0.005"
0.160"
0.005"
0.045"
0.005"
0.245" MIN
MOUNTING PAD
06009 Rev 1 -11/01
TAPE & REEL PACKAGING:
Surface mount product is taped and reeled in accordance with EIA-481, reel quantites
and sizes are as follows:
7 Inch Reel - 1,000 pieces per reel; 13 Inch Reel - 2,500 pieces per reel
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