SM16LC03
thru
SM16LC36C
1
05051.R10 4/05
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LOW CAPACITANCE TVS ARRAY
Only One Name Means ProTek'TionTM
APPLICATIONS
Wireless Communication Circuits
RS-422, RS-432 & RS-485
Low Voltage ASICs
Ethernet - 10/100 Base T
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
61000-4-5 (Surge): 12A, 8/20s Level 1 (Line-Ground) & Level 2 (Line-Line)
FEATURES
500 Watts Peak Pulse Power per Line (tp=8/20s)
Unidirectional & Bidirectional Configuration
ESD Protection > 40 kilovolts
Available in Multiple Voltage Types: 3.3V to 36V
Protects Up to Eight (8) Lines
LOW CAPACITANCE: 15pF
RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
Molded JEDEC SO-16 Package
Weight 0.15 grams (Approximate)
Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245C
Pure-Tin - Sn, 100: 260-270C
Flammability rating UL 94V-0
16mm Tape and Reel Per EIA Standard 481
Marking: Logo, Part Number, Date Code & Pin One Defined By Dot on Top of Package
SO-16
05051
PIN CONFIGURATIONS
1
2
5
4
16
3
6
7
8
9
10
11
12
13
14
15
1
2
5
4
16
3
6
7
8
9
10
11
12
13
14
15
BIDIRECTIONAL
CONFIGURATION
UNIDIRECTIONAL
CONFIGURATION
2
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DEVICE CHARACTERISTICS
Note 1:
Only applies to unidirectional devices.
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55
C to 150
C
C
C
-55
C to 150
C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
Peak Pulse Power (t
p
= 8/20s) - See Figure 1
P
PP
500
Watts
Forward Voltage @ 50mA, 300s - Square Wave (Note 1)
Volts
1.5
V
F
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
(Notes 1 & 2)
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1 A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ 8/20s
V
C
@ I
PP
TEMPERATURE
COEFFICIENT
OF V
(BR)
V
(BR)
mV/C
SM16LC03
SM16LC03C
SM16LC05
SM16LC05C
SM16LC08
SM16LC08C
SM16LC12
SM16LC12C
SM16LC15
SM16LC15C
SM16LC24
SM16LC24C
SM16LC36
SM16LC36C
3.3
3.3
5.0
5.0
8.0
8.0
12.0
12.0
15.0
15.0
24.0
24.0
36.0
36.0
4.5
4.5
6.0
6.0
8.5
8.5
13.3
13.3
16.7
16.7
26.7
26.7
40.0
40.0
7.0
7.0
9.8
9.8
13.4
13.4
19.0
19.0
25.5
25.5
40.0
40.0
53.0
53.0
20.0V @ 35A
20.0V @ 35A
24.0V @ 42A
24.0V @ 42A
26.0V @ 30A
26.0V @ 30A
33.0V @ 21A
33.0V @ 21A
39.0V @ 15A
39.0V @ 15A
57.0V @ 10A
57.0V @ 10A
72.0V @ 7.0A
72.0V @ 7.0A
125
125
20
20
10
10
2
2
2
2
2
2
2
2
MAXIMUM
LEAKAGE
CURRENT
@V
WM
I
D
A
MAXIMUM
CAPACITANCE
@ 0V, 1 MHz
C
pF
15
15
15
15
15
15
15
15
15
15
15
15
15
15
-3
-3
3
3
9
9
16
16
17
17
26
26
36
36
Note 1:
Part numbers with a "C" suffix are bidirectional devices, i.e., SM16LC05C.
Note 2:
Unidirectional Devices Only: Do not surge from pins 16 to 1, 15 to 2, 14 to 3, 13 to 4, 12 to 5, 11 to 6, 10 to 7 and 9 to 8. PIV typically
greater than 100V for each rectifier diode.
Soldering Temperature for 10 seconds
C
265
T
L
3
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GRAPHS
0 5 10 15 20 25 30
t - Time - s
0
20
40
60
80
100
120
I
PP
- Peak Pulse Current - % of I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8s
t
d
= 20s
t
f
Peak Value I
PP
e
-t
t
d
= t
I
PP
/2
FIGURE 2
PULSE WAVE FORM
0.1 1 10 100 1,000 10,000
t
d
- Pulse Duration - s
500W 8/20s Waveform
10
100
1,000
10,000
P
PP
- Peak Pulse Power - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
0 25 50 75 100 125 150
T
L
- Lead Temperature - C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20s
Average Power
FIGURE 3
POWER DERATING CURVE
0
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR SM16LC05
ESD Test Pulse: 25 kilovolt, 1/30ns (waveform)
5
V
olts per Division
0
10
20
30
40
FIGURE 6
RETURN LOSS - SM16LC12
100 MHz per Division
10 db per Division
-50 db
-20 db
Ref 0 db
20 db
FIGURE 5
INSERTION LOSS - SM16LC12
100 MHz per Division
10 db per Division
-50 db
-20 db
Ref 0 db
20 db
4
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APPLICATION NOTE
The SM16LC & SM16LCxxC Series are TVS arrays designed to protect I/O or data lines from the damaging effects of ESD, EFT and other types of
surges. This product series provides both unidiretional and bidirectional protection, with a surge capability of 500 Watts P
PP
per line for an 8/20s
waveform and ESD protection > 40kV.
BIDIRECTIONAL COMMON-MODE CONFIGURATION (Figure 1)
Ideal for RS-485 applications, the SM16LCxxC Series provides up to eight (8) lines of protection in a common-mode configuration as depicted in
Figure 1. This low capacitance series allows the transceiver or telecommunications circuit to operate safely without significant signal distortion.
Circuit connectivity is as follows:
Lines 1 is connected to Pin 9.
Line 2 is connected to Pin 10.
Line 3 is connected to Pin 11.
Line 4 is connected to Pin 12.
Line 5 is connected to Pin 13.
Line 6 is connected to Pin 14.
Line 7 is connected to Pin 15.
Line 8 is connected to Pin 16.
Pins 1-8 are connected to ground.
CIRCUIT BOARD LAYOUT RECOMMENDATIONS
Circuit board layout is critical for Electromagnetic Compatibil-
ity (EMC) protection. The following guidelines are recom-
mended:
The protection device should be placed near the input
terminals or connectors, the device will divert the
transient current immediately before it can be coupled
into the nearby traces.
The path length between the TVS device and the
protected line should be minimized.
All conductive loops including power and ground loops
should be minimized.
The transient current return path to ground should be
kept as short as possible to reduce parasitic inductance.
Ground planes should be used whenever possible. For
multilayer PCBs, use ground vias.
Figure 1. Birectional Common-Mode Protection
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
TRANSCEIVER
D
D
R
R
LINE 1
LINE 2
LINE 3
LINE 4
LINE 5
LINE 6
LINE 7
LINE 8
5
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SM16LC36C
COPYRIGHT ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer's and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
PACKAGE OUTLINE & DIMENSIONS
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail:
sales@protekdevices.com
Web Site:
www.protekdevices.com
A
B
C
D
F
G
J
K
P
R
10.00
4.00
1.75
0.49
1.25
1.27 BSC
0.25
0.25
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.05 BSC
0.008
0.004
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.05 BSC
0.009
0.009
0.244
0.019
9.80
3.80
1.35
0.35
0.40
1.27 BSC
0.19
0.10
5.80
0.25
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES
1. - T - = Seating Plane and Datum Surface.
2. Dimensions "A" and "B" are Datum.
3. Dimensions "A" and "B" do not include mold
protrusions.
4. Maximum mold protrusion is 0.015" (0.380 mm)
per side.
5. Dimensioning and tolerances per ANSI Y14.5M,
1982.
6. Dimensions are exclusive of mold flash and metal
burrs.
PACKAGE OUTLINE
SO-16
MOUNTING PAD
M
-A-
-B- P
D
G
-T-
K
C
J
R X 45
F
0.010" (0.25 MM)
M
B
M
8 PL
0.010" (0.25 MM)
S
B
M
16 PL
T
A
S
16
9
8
1
0
- 7
0.050" TYP
0.030"
0.005"
0.245" MIN
0.160"
0.005"
0.045"
0.005"
TAPE & REEL/BULK ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance
with EIA-481.
2. Suffix-T7 = 7 Inch Reel - 1,000 pieces per 16mm tape,
i.e.,
SM16LC05-T7.
3. Suffix-T13 = 13 Inch Reel - 2,500 pieces per 16mm tape,
i.e.,
SM16LC05-T13.
4. Suffix - LF = Lead-Free, Pure-Tin Plating,
i.e.,
SM16LC05C-LF-T7.
5. No Suffix = Product Shipped in Tubes of 48 pcs per Tube.
Outline & Dimensions: Rev 1 - 11/01, 06007
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