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U0408FC3.3C
thru
U0408FC36C
1
05161.R4 3/05
www.protekdevices.com
UNBUMPED FLIP CHIP ARRAY
Only One Name Means ProTek'TionTM
05161
PIN CONFIGURATION
APPLICATIONS
Cellular Phones
MCM Boards
Wireless Communication Circuits
IR LEDs
SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
61000-4-4 (EFT): 40A - 5/50ns
FEATURES
ESD Protection > 25 kilovolts
Available in Multiple Voltage Types Ranging From 3.3V to 36V
250 Watts Peak Pulse Power per Line (tp = 8/20s)
Bidirectional Configuration & Monolithic Structure
Protects 4 to 7 Lines
RoHS Compliant
MECHANICAL CHARACTERISTICS
Standard EIA Chip Size: 0408
Weight 0.73 milligrams (Approximate)
Solder Reflow Temperature:
Tin-Lead - Sn/Pb: 240-245C
Lead-Free: 260-270C
Flammability Rating UL 94V-0
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
Device Marking On Reel
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U0408FC36C
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25C Unless Otherwise Specified
Operating Temperature
SYMBOL
VALUE
-55
C to 150
C
C
C
-55
C to 150
C
UNITS
T
J
T
STG
PARAMETER
Storage Temperature
Peak Pulse Power (t
p
= 8/20s) - See Figure 1
P
PP
200
Watts
0 5 10 15 20 25 30
t - Time - s
0
20
40
60
80
100
120
I
PP
- Peak Pulse Current - % of I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8s
t
d
= 20s
t
f
Peak Value I
PP
e
-t
t
d
= t
I
PP
/2
FIGURE 2
PULSE WAVE FORM
0.01 1 10 100 1,000 10,000
t
d
- Pulse Duration - s
10
100
1,000
10,000
P
PP
- Peak Pulse Current - Watts
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
250W, 8/20s Waveform
ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20s
V
C
@ I
PP
TYPICAL
CAPACITANCE
@0V, 1 MHz
C
pF
U0408FC3.3C
U0408FC05C
U0408FC08C
U0408FC12C
U0408FC15C
U0408FC24C
U0408FC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
9.8
13.4
19.0
24.0
43.0
64.0
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
150
100
75
50
40
30
25
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
A
75*
10**
10***
1
1
1
1
RATED
STAND-OFF
VOLTAGE
V
WM
VOLTS
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.
3
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U0408FC36C
GRAPHS
0 5 10 15 20
V
C
- Clamping
V
oltage -
V
olts
0
4
8
12
14
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR U0408FC05C
10
6
2
I
PP
- Peak Pulse Current - Amps
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR U0408FC05C
5
V
o
lts per Division
-5
5
15
25
35
0 25 50 75 100 125 150
T
L
- Lead Temperature - C
20
40
60
80
100
% Of Rated Power
Peak Pulse Power
8/20s
Average Power
FIGURE 3
POWER DERATING CURVE
0
4
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U0408FC36C
APPLICATION INFORMATION
Ramp-up
Ramp-down
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
T
S
- Preheat
T
SMAX
T
SMIN
T
L
t 25C to Peak
30-60 seconds
T
emperature - C
T
P
155
140
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
50m
20m
60 Seconds
270C
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Soldering Maximum Temperature
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-265C
T
P
for Tin-Lead: 240-245C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
5
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U0408FC36C
PACKAGE OUTLINE & DIMENSIONS
A
B
C
E
F
I
0.56 NOM
0.86 NOM
0.99 0.0254
0.15 SQ
2.0 0.0254
0.406 NOM
0.022 NOM
0.034 NOM
0.039 0.001
0.006 SQ
0.079 0.001
0.016 NOM
DIM
MILLIMETERS
INCHES
PACKAGE DIMENSIONS
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and
outline: .xxx 0.05mm ( 0.002").
PACKAGE OUTLINE
MOUNTING PAD LAYOUT - Option 1
A
C
D
E
F
G
H
I
0.51
0.30
0.46
0.20
0.15 SQ
0.71
0.99
0.51
NOTE:
1.
Preferred: Using 0.1mm (0.004") stencil.
0.020
0.012
0.018
0.008
0.006 SQ
0.028
0.039
0.020
PAD DIMENSIONS
DIM
MILLIMETERS
INCHES
Outline & Dimensions: Rev 3 - 2/04, 06026
C
SOLDER PRINT 0.010" - 0.012" DIA.
A
H
D
I
SOLDER PADS
F
G
E
SOLDER
MASK
DIE
SOLDER
CONTACT
Metalized Die Contact
E
F
I
SIDE
A
B
C
TOP
END