ChipFind - документация

Электронный компонент: 2SA2081

Скачать:  PDF   ZIP
Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corporation product best suited to the customer's application; they do not convey any
license under any intellectual property rights, or any other rights, belonging to Renesas Technology
Corporation or a third party.
2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any
third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corporation without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corporation
or an authorized Renesas Technology Corporation product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss
rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various
means, including the Renesas Technology Corporation Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams,
charts, programs, and algorithms, please be sure to evaluate all information as a total system before
making a final decision on the applicability of the information and products. Renesas Technology
Corporation assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor
when considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be
exported under a license from the Japanese government and cannot be imported into a country other
than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corporation for further details on these materials or the products
contained therein.
2SA2081
Silicon PNP Epitaxial
ADE-208-1477 (Z)
Rev.0
Feb. 2002
Features
Low frequency amplifier
Outline
1
2
3
1. Emitter
2. Base
3. Collector
CMPAK
2SA2081
Rev.0, Feb. 2002, page 2 of 6
Absolute Maximum Ratings
(Ta = 25
C)
Item Symbol
Ratings
Unit
Collector to base voltage
V
CBO
55
V
Collector to emitter voltage
V
CEO
55
V
Emitter to base voltage
V
EBO
5
V
Collector current
I
C
100 mA
Collector power dissipation
P
C
* 150
mW
Junction temperature
Tj
150
C
Storage temperature
Tstg
55 to +150
C
*Value on the glass epoxy board (10 mm x 10 mm x 0.7 mm)
Electrical Characteristics
(Ta = 25
C)
Item Symbol
Min
Typ
Max
Unit
Test
conditions
Collector to base breakdown
voltage
V
(BR)CBO
55
V
I
C
= 10
A, I
E
= 0
Collector to emitter breakdown
voltage
V
(BR)CEO
55
V I
C
= 1 mA, R
BE
=
Emitter to base breakdown
voltage
V
(BR)EBO
5
V I
E
= 10
A, I
C
= 0
Collector cutoff current
I
CBO
0.5
A V
CB
= 30 V, I
E
= 0
Emitter cutoff current
I
EBO
0.5
A V
EB
= 2 V, I
C
= 0
DC current transfer ratio
h
FE
*
1
160
800
V
CE
= 12 V, I
C
= 2 mA
Collector to emitter saturation
voltage
V
CE(sat)
0.5
V I
C
= 10 mA, I
B
= 1 mA
Base to emitter voltage
V
BE
0.75 V
V
CE
= 12 V, I
C
= 2 mA
Notes: 1. The 2SA2081 is grouped by h
FE
as follows.
Grade
C D E
Mark
CC CD CE
h
FE
160 to 320
250 to 500
400 to 800
2SA2081
Rev.0, Feb. 2002, page 3 of 6
10,000
10
DC Current Transfer Ratio vs.
Collector Current
V
CE
= 12 V
Pulse test
Maximum Collector Dissipation Curve
Collector P
o
w
e
r Dissipation P
C
* (mW)
Ambient Temperature Ta (
C)
150
100
50
0
50
100
150
*Value on the glass epoxy board
(10 mm x 10 mm x 0.7 mm)
10
2
8
6
4
2
0
4
6
8
10
Typical Output Characteristics
Collector to Emitter Voltage V
CE
(V)
Collector Current I
C
(mA)
Pulse test
I
B
= 0
5
A
10
15
20
25
30
100m
0
V
CE
= 12 V
Pulse test
Typical Transfer Characteristics
Base to Emitter Voltage V
BE
(V)
Collector Current I
C
(A)
10m
1m
100
10
0.2
0.4
0.6
1.0
0.8
Collector Current I
C
(A)
DC Current
T
r
ansf
er Ratio h
FE
1,000
100
10
100
1 m
10 m 50 m