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Электронный компонент: H7N0312LS

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Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
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H7N0312LD, H7N0312LS, H7N0312LM
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-1572A(Z)
2nd. Edition
Aug. 2002
Features
Low on-resistance
R
DS(on)
= 2.6 m
typ.
Low drive current
4.5 V gate drive device can be driven from 5 V source
Outline
1. Gate
2. Drain
3. Source
4. Drain
LDPAK
D
G
S
H7N0312LD
H7N0312LS
H7N0312LM
1
2
3
4
1
2
3
4
1
2
3
4
H7N0312LD, H7N0312LS, H7N0312LM
Rev.1, Aug. 2002, page 2 of 11
Absolute Maximum Ratings
(Ta = 25C)
Item Symbol
Ratings
Unit
Drain to source voltage
V
DSS
30 V
Gate to source voltage
V
GSS
20 V
Drain current
I
D
85
A
Drain peak current
I
D(pulse)
Note 1
340
A
Body-drain diode reverse drain current I
DR
85 A
Channel dissipation
Pch
Note 2
125
W
Channel to Case Thermal Impedance
ch-c
1.0
C/W
Channel
temperature Tch 150 C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10s, duty cycle 1 %
2. Value at Tc = 25C
H7N0312LD, H7N0312LS, H7N0312LM
Rev.1, Aug. 2002, page 3 of 11
Electrical Characteristics
(Ta = 25C)
Item Symbol
Min
Typ
Max
Unit
Test
Conditions
Drain to source breakdown voltage V
(BR)DSS
30
--
-- V I
D
= 10 mA, V
GS
= 0
Gate to source breakdown voltage V
(BR)GSS
20 --
-- V I
G
= 100
A, V
DS
= 0
Gate to source leak current
I
GSS
--
-- 10
A V
GS
= 16 V, V
DS
= 0
Zero gate voltage drain current
I
DSS
--
-- 10
A V
DS
= 30 V, V
GS
= 0
Gate to source cutoff voltage
V
GS(off)
1.0 -- 2.5 V I
D
= 1 mA, V
DS
= 10 V
Note1
Static drain to source on state
R
DS(on)
-- 2.6 3.3 m
I
D
= 42.5 A, V
GS
= 10 V
Note1
resistance
-- 4.0 5.8 m
I
D
= 42.5 A, V
GS
= 4.5 V
Note1
Forward transfer admittance
|y
fs
| 75 125
-- S I
D
= 42.5 A, V
DS
= 10 V
Note1
Input capacitance
Ciss
-- 6900
-- pF V
DS
= 10 V
Output capacitance
Coss
-- 1750
-- pF V
GS
= 0
Reverse transfer capacitance
Crss
-- 820
--
pF
f = 1 MHz
Total gate charge
Qg
-- 115
-- nc V
DD
= 10 V
Gate to source charge
Qgs
-- 24 -- nc V
GS
= 10 V
Gate to drain charge
Qgd
-- 24 -- nc I
D
= 85 A
Turn-on delay time
t
d(on)
-- 45 -- ns V
GS
= 10 V, I
D
= 42.5 A
Rise time
t
r
-- 380
-- ns R
L
= 0.24
Turn-off delay time
t
d(off)
-- 125
-- ns R
g
= 4.7
Fall time
t
f
-- 50 -- ns
Bodydrain diode forward voltage
V
DF
-- 0.92
-- V I
F
= 85 A, V
GS
= 0
Bodydrain diode reverse recovery
time
t
rr
-- 75 -- ns I
F
= 85 A, V
GS
= 0
diF/ dt = 50A/
s
Notes: 1. Pulse test