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Электронный компонент: H7N0602LS

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Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better
and more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
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H7N0602LD, H7N0602LS, H7N0602LM
Silicon N Channel MOS FET
High Speed Power Switching
ADE-208-1526C (Z)
4th. Edition
May 2002
Features
Low on-resistance
R
DS(on)
= 4.1 m
typ.
4.5 V gate drive devices
High Speed Switching
Outline
1. Gate
2. Drain
3. Source
4. Drain
1
2
3
4
1
2
3
4
LDPAK
D
G
S
H7N0602LD
H7N0602LS
1
2
3
4
H7N0602LM
H7N0602LD, H7N0602LS, H7N0602LM
Rev.3, May 2002, page 2 of 11
Absolute Maximum Ratings
(Ta = 25
C)
Item Symbol
Ratings
Unit
Drain to source voltage
V
DSS
60 V
Gate to source voltage
V
GSS
20 V
Drain current
I
D
85
A
Drain peak current
I
D
(pulse)
Note
1
340
A
Body-drain diode reverse drain current I
DR
85 A
Avalanche current
I
AP
Note
3
65
A
Avalanche energy
E
AR
Note
3
362 mJ
Channel dissipation
Pch
Note
2
100
W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to +150
C
Notes: 1. PW
10 s, duty cycle 1%
2. Value at Tc = 25
C
3. Value at Tch = 25
C, Rg 50
H7N0602LD, H7N0602LS, H7N0602LM
Rev.3, May 2002, page 3 of 11
Electrical Characteristics
(Ta = 25
C)
Item
Symbol
Min Typ Max Unit Test
Conditions
Drain to source breakdown
voltage
V
(BR)DSS
60
--
-- V I
D
= 10 mA, V
GS
= 0
Gate to source breakdown voltage V
(BR)GSS
20 --
--
V
I
G
= 100
A, V
DS
= 0
Zero gate voltage drain current
I
DSS
--
-- 10
A V
DS
= 60 V, V
GS
= 0
Gate to source leak current
I
GSS
--
-- 10
A V
GS
= 16 V, V
DS
= 0
Gate to source cutoff voltage
V
GS(off)
1.5 -- 2.5 V V
DS
= 10 V, I
D
= 1 mA
Note
1
Forward transfer admittance
|y
fs
| 70 120
-- S I
D
= 45 A, V
DS
= 10 V
Note
1
Static drain to source on state
resistance
R
DS(on)
-- 4.1 5.2 m
I
D
= 45 A, V
GS
= 10 V
note
1
Static drain to source on state
resistance
R
DS(on)
-- 6.2 9.0 m
I
D
= 45 A, V
GS
=4.5 V
Note
1
Input capacitance
Ciss
-- 9000
-- pF V
DS
= 10 V
Output capacitance
Coss
-- 1000
-- pF V
GS
= 0
Reverse transfer capacitance
Crss
-- 470
--
pF
f = 1 MHz
Total gate charge
Qg
-- 140
-- nc V
DD
= 25 V
Gate to source charge
Qgs
-- 30 -- nc V
GS
= 10 V
Gate to drain charge
Qgd
-- 30 -- nc I
D
= 85 A
Turn-on delay time
td(on)
-- 55 -- ns V
GS
= 10 V
Rise time
tr
-- 290
-- ns I
D
= 45 A
Turn-off delay time
td(off)
-- 140
-- ns R
L
= 0.67
Fall time
tf
-- 50 -- ns R
g
= 4.7
Bodydrain diode forward voltage V
DF
-- 0.95
-- V I
F
= 85 A, V
GS
= 0
Bodydrain diode reverse
recovery time
trr
-- 45 -- ns I
F
= 85 A, V
GS
= 0
diF/dt = 100 A/s
Notes: 1. Pulse test