Rev.6.00, Jun.02.2003, page 1 of 10
HAT2168H
Silicon N Channel Power MOS FET
Power Switching
REJ03G0046-0600Z
Rev.6.00
Jun.02.2003
Features
High speed switching
Capable of 4.5 V gate drive
Low drive current
High density mounting
Low on-resistance
R
DS(on)
= 6.0 m
typ. (at V
GS
= 10 V)
Outline
LFPAK
1 2
3
4
5
1, 2, 3 Source
4 Gate
5 Drain
G
D
S S S
4
1 2
3
5
HAT2168H
Rev.6.00, Jun.02.2003, page 2 of 10
Absolute Maximum Ratings
(Ta = 25C)
Item
Symbol
Ratings
Unit
Drain to source voltage
V
DSS
30
V
Gate to source voltage
V
GSS
20
V
Drain current
I
D
30
A
Drain peak current
I
D(pulse)
Note1
120
A
Body-drain diode reverse drain current I
DR
30
A
Avalanche current
I
AP
Note 2
15
A
Avalanche energy
E
AR
Note 2
22
mJ
Channel dissipation
Pch
Note3
15
W
Channel to Case Thermal Resistance
ch-C
8.33
C/W
Channel temperature
Tch
150
C
Storage temperature
Tstg
55 to + 150
C
Notes: 1. PW
10
s, duty cycle
1%
2. Value at Tch = 25C, Rg
50
3. Tc=25C
HAT2168H
Rev.6.00, Jun.02.2003, page 3 of 10
Electrical Characteristics
(Ta = 25C)
Item
Symbol Min
Typ
Max
Unit
Test Conditions
Drain to source breakdown
voltage
V
(BR)DSS
30
--
--
V
I
D
= 10 mA, V
GS
= 0
Gate to source breakdown voltage V
(BR)GSS
20
--
--
V
I
G
= 100
A, V
DS
= 0
Gate to source leak current
I
GSS
--
--
10
A
V
GS
= 16 V, V
DS
= 0
Zero gate voltage drain current
I
DSS
--
--
1
A
V
DS
= 30 V, V
GS
= 0
Gate to source cutoff voltage
V
GS(off)
1.0
--
2.5
V
V
DS
= 10 V,
I
D
= 1 mA
Static drain to source on state
R
DS(on)
--
6.0
7.9
m
I
D
= 15 A, V
GS
= 10 V
Note4
resistance
R
DS(on)
--
8.8
13.5
m
I
D
= 15 A, V
GS
= 4.5 V
Note4
Forward transfer admittance
|y
fs
|
30
50
--
S
I
D
= 15 A, V
DS
= 10 V
Note4
Input capacitance
Ciss
--
1730
--
pF
V
DS
= 10 V
Output capacitance
Coss
--
400
--
pF
V
GS
= 0
Reverse transfer capacitance
Crss
--
130
--
pF
f = 1 MHz
Gate Resistance
Rg
--
0.55
--
Total gate charge
Qg
--
11
--
nc
V
DD
= 10 V
Gate to source charge
Qgs
--
5
--
nc
V
GS
= 4.5 V
Gate to drain charge
Qgd
--
2.4
--
nc
I
D
= 30 A
Turn-on delay time
t
d(on)
--
8
--
ns
V
GS
= 10 V, I
D
= 15 A
Rise time
t
r
--
20
--
ns
V
DD
10 V
Turn-off delay time
t
d(off)
--
40
--
ns
R
L
= 0.67
Fall time
t
f
--
4
--
ns
Rg = 4.7
Bodydrain diode forward voltage V
DF
--
0.85
1.10
V
IF = 30 A, V
GS
= 0
Note4
Bodydrain diode reverse
recovery time
t
rr
--
25
--
ns
IF = 30 A, V
GS
= 0
diF/ dt = 100 A/ s
Notes: 4. Pulse test
HAT2168H
Rev.6.00, Jun.02.2003, page 4 of 10
Main Characteristics
Channel Dissipation Pch (W)
Case Temperature Tc (
C)
Power vs. Temperature Derating
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Maximum Safe Operation Area
Drain to Source Voltage V (V)
DS
Drain Current I (A)
D
Typical Output Characteristics
Gate to Source Voltage V (V)
GS
Drain Current I (A)
D
Typical Transfer Characteristics
50
40
30
20
10
0
2
4
6
8
10
50
40
30
20
10
0
1
2
3
4
5
Tc = 75
C
25
C
-25
C
40
30
20
10
0
50
100
150
200
100
10
1
0.1
0.01
0.1
0.3
1
3
10
30
100
V = 10 V
Pulse Test
DS
500
Ta = 25
C
1 shot Pulse
PW = 10 ms
10
s
100
s
Operation in
this area is
limited by R
DS(on)
DC Operation
Tc = 25
C
1 ms
V = 2.4 V
GS
10 V
4.5 V
Pulse Test
2.6 V
2.8 V
3.0 V
3.2 V
HAT2168H
Rev.6.00, Jun.02.2003, page 5 of 10
Gate to Source Voltage V (V)
GS
Drain to Source Voltage V (mV)
DS(on)
Drain to Source Saturation Voltage vs.
Gate to Source Voltage
Drain Current I (A)
D
Drain to Source On State Resistance
R (m )
DS(on)
Static Drain to Source on State Resistance
vs. Drain Current
Case Temperature Tc (
C)
Static Drain to Source on State Resistance
Static Drain to Source on State Resistance
vs. Temperature
Forward Transfer Admittance |yfs| (S)
Drain Current I (A)
D
Forward Transfer Admittance vs.
Drain Current
20
10
2
5
1
3
30
20
16
12
8
4
-25
0
25
50
75
100 125 150
0
1
10
100
1000
0.3
100
50
V = 4.5 V
GS
10 V
Pulse Test
R (m )
DS(on)
I = 20 A
D
5 A, 10 A, 20 A
V = 4.5 V
GS
10 V
Pulse Test
3
30
0.1
1
10
100
0.3
10
100
30
1
0.3
3
0.1
Tc = -25
C
DS
V = 10 V
Pulse Test
75
C
25
C
250
200
150
100
50
0
4
8
12
16
20
Pulse Test
I = 20 A
D
5 A
10 A
10 A, 5A
PDF 
ZIP