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Электронный компонент: HD40A46612

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Regarding the change of names mentioned in the document, such as Hitachi
Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas
Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.)
Accordingly, although Hitachi, Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand
names are mentioned in the document, these names have in fact all been changed to Renesas
Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and
corporate statement, no changes whatsoever have been made to the contents of the document, and
these changes do not constitute any alteration to the contents of the document itself.
Renesas Technology Home Page: http://www.renesas.com
Renesas Technology Corp.
Customer Support Dept.
April 1, 2003
To all our customers
Cautions
Keep safety first in your circuit designs!
1.
Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but
there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire
or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i)
placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or
mishap.
Notes regarding these materials
1.
These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation
product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any
other rights, belonging to Renesas Technology Corporation or a third party.
2.
Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights,
originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in
these materials.
3.
All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents
information on products at the time of publication of these materials, and are subject to change by Renesas Technology
Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact
Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these
inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corporation by various means, including the
Renesas Technology Corporation Semiconductor home page (http://www.renesas.com).
4.
When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and
algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of
the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other
loss resulting from the information contained herein.
5.
Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used
under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an
authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for
any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
6.
The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these
materials.
7.
If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license
from the Japanese government and cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is
prohibited.
8.
Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.
HD404669 Series
Low-Voltage AS Microcomputers with On-Chip DTMF
Generation Circuit
ADE-202-083B
Rev. 3.0
Sept. 1999
Description
The HD404669 Series microcomputers incorporate a DTMF generation circuit, two comparators, and a
serial interface on chip. They also provide input and output pins with large current handling capacities.
Thus they are 4-bit single-chip microcomputers that are optimal for use in multifunction telephones,
cordless telephones, and other communications equipment.
HD404669 Series microcomputers have a 32.768 kHz sub-oscillator for realtime clock use, providing a
time counting facility, and a variety of power supply modes to reduce current drain.
The HD407A4669 is a ZTATTM microcomputer with on-chip PROM that drastically shortens development
time and ensures a smooth transition from debugging to mass production. (The PROM programming
specifications are the same as for the 27256 type.)
ZTATTM: Zero Turn-Around Time ZTAT is a trademark of Hitachi, Ltd.
Features
1,152-digit
4-bit RAM
I/O pins: 47
High-current I/O pins (source: 10 mA max.): 4
High-current I/O pins (sink: 15 mA max.):
5
Timer counters: 3
Input capture: one 8-bit channel
Timer outputs: 2 (with PWM output capability)
Event input: 1 (edge-programmable)
Clock synchronous 8-bit serial interface: 1
DTMF generation circuit
Comparator: 2 channels
System clock oscillator
Ceramic oscillator, crystal oscillator, or external clock operation possible
HD404669 Series
2
Subsystem clock oscillator
32.768 kHz crystal oscillator for realtime clock use
Interrupts
External: 5 (including 3 edge-programmable)
Internal: 4
Subroutine stack: max. 16 levels including interrupts
Low-power modes: 4
System clock division software switching (1/4, 1/8, 1/16, 1/32)
Instruction execution time
Min. 1
s (f
OSC
= 4 MHz, 1/4 clock division)
Min. 0.5
s (f
OSC
= 8 MHz, 1/4 clock division)
Operating voltage
1.8 V to 5.5 V
2.2 V to 5.5 V (ZTATTM)
Ordering Information
Type
Product Name
Model Name
ROM (Words)
RAM (Digits)
Package
Mask ROM
(standard
version)
HD404668
HD404668H
8,192
1,152
64-pin plastic
QFP
(FP-64A)
HD4046612
HD4046612H
12,288
HD404669
HD404669H
16,384
HCD404669
HCD404669
16,384
Chip
*
1
*
2
Mask ROM
(high-speed
version)
HD40A4668
HD40A4668H
8,192
64-pin plastic
QFP
(FP-64A)
HD40A46612
HD40A46612H
12,288
HD40A4669
HD40A4669H
16,384
ZTATTM
(high-speed
version)
HD407A4669
HD407A4669H
16,384
Note:
1. ZTATTM chip shipment is not supported.
2. The specifications of shipped chips differ from those of the package product. Please contact our
sales staff for details.
Cautions about Operation
The mask ROM and ZTATTM versions have been confirmed as fully meeting the reference values for
electrical characteristics shown in this data sheet. However, actual performance figures, operating margins,
noise margins, and other properties may vary due to differences in the manufacturing process, internal
HD404669 Series
3
wiring patterns, etc. Users are therefore requested to confirm the operation of individual products by
conducting evaluation tests under conditions equivalent to those in the actual application system.
List of Functions
Standard
version
HD404668
HD4046612
HD404669
HCD404669
Product name
High-
speed
version
HD40A4668
HD40A46612
HD40A4669
------
HD407A4669
ROM (Words)
8,192
12,288
16,384
16,384
16,384PROM
RAM (Digits)
1,152
I/O
52 (max)
Large-current I/O
pins
4 ( Source 10mA max), 5 (Sink 15 mA max)
Timer / Counter
3
Input capture
8 bit
1
Timer output
2 (PWM output possible)
Event input
1 (edge selection possible)
Serial interface
1 (8-bit clock syncronous)
DTMF generation circuit
Available
Comparator
2
Interrupt
External
5 (edge selection possible for 3)
Internal
4
Low-Power Dissipation Mode
4
Stop mode
Available
Watch /mode
Available
Standby mode
Available
Subactive mode
Available
Main Oscillator
Ceramic
oscillation
400 kHz, 800 kHz, 2 MHz, 3.58 MHz, 4 MHz, 7.16 MHz
*
, 8 MHz
*
Crystal oscillation
400 kHz, 800 kHz, 2 MHz, 3.58 MHz, 4 Mhz, 7.16 MHz
*
, 8 MHz
*
Sub oscillator
Crystal oscillation
32.768 kHz
Minimum instruction
execution time
Standard version
1
s (f
OSC
= 4 MHz, 1/4 frequency division)
High-speed
version
0.5
s (f
OSC
= 8 MHz, 1/4 frequency division)
Operating voltage (V)
1.8 to 5.5
1.8 to 5.5
2.2 to 5.5
Package
64-pin plastic QFP (FP-64A)
Chip
64-pin plastic
QFP (FP-64A)
Guaranteed operation temperature (C)
20 to +75
+75
C
20 to +75
Note:
*
Applies to high-speed versions (HD40A4668, HD40A46612, HD40A4669, HD407A4669).