Revision Date: Mar. 22, 2004
32
SH7706
Group
Hardware Manual
Renesas 32-Bit RISC Microcomputer
SuperH
RISC engine Family/SH7700 Series
Rev.4.00
REJ09B0146-0400O
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
Rev. 4.00, 03/04, page ii of xlvi
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp.
or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various
means, including the Renesas Technology Corp. Semiconductor home page
(http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from
the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device
or system that is used under circumstances in which human life is potentially at stake. Please
contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor
when considering the use of a product contained herein for any specific purposes, such as
apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea
repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material
or (iii) prevention against any malfunction or mishap.
Keep safety first in your circuit designs!
Notes regarding these materials
Rev. 4.00, 03/04, page iii of xlvi
General Precautions on Handling of Product
1. Treatment of NC Pins
Note:
Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
they are used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note:
Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note:
When power is first supplied, the product's state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note:
Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system's
operation is not guaranteed if they are accessed.
Rev. 4.00, 03/04, page iv of xlvi
Configuration of This Manual
This manual comprises the following items:
1. General Precautions on Handling of Product
2. Configuration of This Manual
3. Preface
4. Contents
5. Overview
6. Description of Functional Modules
CPU and System-Control Modules
On-Chip Peripheral Modules
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
When designing an application system that includes this LSI, take notes into account. Each
section includes notes in relation to the descriptions given, and usage notes are given, as required,
as the final part of each section.
7. List of Registers
8. Electrical Characteristics
9. Appendix
10. Main Revisions and Additions in this Edition (only for revised versions)
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
11. Index
Rev. 4.00, 03/04, page v of xlvi
Preface
The SH7706 RISC (Reduced Instruction Set Computer) microcomputer includes a Renesas
Technology-original RISC CPU as its core, and the peripheral functions required to configure a
system.
Target Users: This manual was written for users who will be using this LSI in the design of
application systems. Users of this manual are expected to understand the
fundamentals of electrical circuits, logical circuits, and microcomputers.
Objective:
This manual was written to explain the hardware functions and electrical
characteristics of this LSI to the above users.
Refer to the SH-3/SH-3E/SH3-DSP Programming Manual for a detailed description
of the instruction set.
Notes on reading this manual:
Product names
The following products are covered in this manual.
Product Classifications and Abbreviations
Basic Classification
Product Code
SH7706 (176-pin plastic LQFP)
HD6417706F133
SH7706 (208-pin plastic TFBGA)
HD6417706BP133V
In order to understand the overall functions of the chip
Read the manual according to the contents. This manual can be roughly categorized into parts
on the CPU, system control functions, peripheral functions and electrical characteristics.
In order to understand the details of the CPU's functions
Read the SH-3/SH-3E/SH3-DSP Programming Manual.
PDF 
ZIP