- 2 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Revision History

Version 0 (July, 2001)
- First version for internal review

Version 0.1 (September, 2001)
- Changed spec to preliminary version

Version 0.2(October,2001)
- Changed final spec from preliminary spec.
- Modificated typo.
- Changed pin # 17 from NC to A13 in Package pinout.
- Revised "Write with autoprecharge" table in page 29.
- Added tIS and tPDEX parameters in "power down" timing of page 31.
- Revised "Absolute maximum rating" table in page 38.
. Changed "Voltage on VDDQ supply relative to VSS" value from -0.5~3.6V to -1~3.6V
. Changed "power dissipation" value from 1.0W to 1.5W.
- Revised AC parameter table

Version 0.3(November,2001)
- Deleted "preliminary"
-

Deleted tHZ/tLZ of DQS

Version 0.31(November,2001)
- Added DDR333 AC timing table

Version 0.4(November,2001)
- Deleted typical current in IDD spec. table
- Updated DDR333 test specification
- Deleted typical current in IDD spec. table
- Included address and control input setup/hold time(tIS/tIH) at slow slew rate in DDR200/266 AC specification
- Deleted Exit self refresh to write command(tXSW) in DDR200/266 AC specification
- Changed unit of tMRD from tCK to ns at DDR333
- Rename tXSA(exit self refresh to bank active command) to tXSNR(exit self refresh to non read command) at DDR200/266
- Rename tXSR(exit self refresh to read command) to tXSRD at DDR200/266
- Rename tWPREH(DQS in hold time) to tWPRE at DDR200/266
- Rename tREF(Refresh interval time) to tREFI at DDR200/266
- Added tDAL(tWR+tRP)
- Updated current value

From

DDR266A

DDR266B

DDR200

DDR266A

DDR266B

DDR200

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

tHZ(DQ)

tACmin

-400ps

tACmax

-400ps

tACmin

-400ps

tACmax

-400ps

tACmin

-400ps

tACmax

-400ps

-0.75

+0.75

-0.75

+0.75

-0.8

+0.8

tLZ(DQ)

tACmin

-400ps

tACmax

-400ps

tACmin

-400ps

tACmax

-400ps

tACmin

-400ps

tACmax

-400ps

-0.75

+0.75

-0.75

+0.75

-0.8

+0.8

tHZ(DQS)

-0.75

+0.75

-0.75

+0.75

-0.8

+0.8

tLZ(DQS)

-0.75

+0.75

-0.75

+0.75

-1.1

-0.8

tWPST

(tCK)

0.25

0.4

0.6

0.4

0.6

0.4

0.6

tPDEX

10ns

7.5ns

10ns

- 4 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Contents

Revision History

General Information

1. Key Features

1.1 Features
1.2 Operating Frequencies

2. Package Pinout & Dimension

2.1 Package Pintout

2.2 Input/Output Function Description

2.3 66 Pin TSOP(II)/MS-024FC Package Physical Dimension

3. Functional Description
3.1 Simplified State Diagram

3.2 Basic Functionality

3.2.1 Power-Up Sequence

3.2.2 Mode Register Definition

3.2.2.1 Mode Register Set(MRS)

3.2.2.2 Extended Mode Register Set(EMRS)

3.2.3 Precharge
3.2.4 No Operation(NOP) & Device Deselect
3.2.5 Row Active

3.2.6 Read Bank
3.2.7 Write Bank

3.3 Essential Functionality for DDR SDRAM

3.3.1 Burst Read Operation

3.3.2 Burst Write Operation

3.3.3 Read Interrupted by a Read
3.3.4 Read Interrupted by a Write & Burst Stop

3.3.5 Read Interrupted by a Precharge
3.3.6 Write Interrupted by a Write

- 5 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

3.3.7 Write Interrupted by a Read & DM

3.3.8 Write Interrupted by a Precharge & DM

3.3.9 Burst Stop

3.3.10 DM masking

3.3.11 Read With Auto Precharge

3.3.12 Write With Auto Precharge
3.3.13 Auto Refresh & Self Refresh

3.3.14 Power Down

4. Command Truth Table

5. Functional Truth Table

6. Absolute Maximum Rating

7. DC Operating Conditions & Specifications

7.1 DC Operating Conditions
7.2 DC Specifications

8. AC Operating Conditions & Timming Specification

8.1 AC Operating Conditions

8.2 AC Overshoot/Undershoot specification
8.1.1 Overshoot/Undershoot specification for Address and Control Pins

8.1.2 Overshoot/Undershoot specification for Data Pins

8.3 AC Timming Parameters & Specification

9. AC Operating Test Conditions

10. Input/Output Capacitance

11. IBIS: I/V Characteristics for Input and Output Buffers

11.1 Normal strength driver

11.2 Half strength driver

Timing Diagram

- 6 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Table 1 : Operating frequency and DLL jitter

Table 2. : Column address configurtion

Table 3 : Input/Output function description

Table 4 : Burst address ordering for burst length

Table 5 : Bank selection for precharge by bank address bits

Table 6 : Operating description when new command asserted while

read with auto precharge is issued

Table 7 : Operating description when new command asserted while
write with auto precharge is issued
Table 8 : Command truth table

Table 9-1 : Functional truth table

Table 9-2 : Functional truth table (contiued)

Table 9-3 : Functional truth table (contiued)

Table 9-4 : Functional truth table (contiued)

Table 9-5 : Functional truth table (cotinued)

Table 10 : Absolute maximum raings
Table 11 : DC operating condtion

Table 12 : DC specification

Table 13 : AC operating condition

Table 14 : Overshoot/Undershoot specification for Address and Control Pins
Table 15 : Overshoot/Undershoot specification for Data Pins
Table 16 : AC timing parameters and specifications

Table 17 : AC operating test conditions

Table 18 : Input/Output capacitance

Table 19 : Pull down and pull up current values(For normal strength driver)

Table 20 : Pull down and pull up current values(For half strength driver)

List of tables

- 7 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Figure 1 : 128Mb Package Pinout
Figure 2 : Package dimension

Figure 3 : State digram

Figure 4 : Power up and initialization sequence

Figure 5 : Mode register set

Figure 6 : Mode register set sequence

Figure 7 : Extend mode register set

Figure 8 : Bank activation command cycle timing

Figure 9 : Burst read operation timing

Figure 10 : Burst write operation timing

Figure 11 : Read interrupted by a read timing

Figure 12 : Read interrupted by a write and burst stop timing

Figure 13 : Read interrupted by a precharge timing

Figure 14 : Write interrupted by a write timing

Figure 15 : Write interrupted by a read and DM timing

Figure 16 : Write interrupted by a precharge and DM timing

Figure 17 : Burst stop timing

Figure 18 : DM masking timing

Figure 19 : Read with auto precharge timing

Figure 20 : Write with auto precharge timing

Figure 21 : Auto refresh timing

Figure 22 : Self refresh timing

Figure 23 : Power down entry and exit timing

Figure 24 : AC overshoot/Undershoot Definition
Figure 25 : AC overshoot/Undershoot Definition
Figure 26 : Output Load Circuit (SSTL_2)

Figure 27 : I / V characteristics for input/output buffers(For normal strength driver):

pull-up(above) and pull-down(below)
Figure 28 : I / V characteristics for input/output buffers(For half strength driver):
pull-up(above) and pull-down(below)

List of figures

- 8 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

General Information

Organization

166Mhz/ CL=2.5

133Mhz w/ CL=2

133Mhz w/ CL=2.5

100Mhz w/ CL=2

8Mx16

K4H281638D-TCB3

K4H281638D-TCA2

K4H281638D-TCB0

K4H281638D-TCA0

K4H281638D-TLB3

K4H281638D-TLA2

K4H281638D-TLB0

K4H281638D-TLA0

: TSOP2 (400mil x 875mil)

: 10ns@CL2

: 7.5ns@CL2

: 7.5ns@CL2.5

B3 : 6ns@CL2.5

C : (Commercial, Normal)
L : (Commercial, Low)

: x4

: x8

: x16

: x32

: 64M 4K/64ms

: 128M 4K/64ms

: 256M 8K/64ms

: 512M 8K/64ms

: 1G 16K/32ms

: DDR SDRAM

: 1st Generation

: 2nd Generation

: 3rd Generation

: 4th Generation

: 5th Generation

: 6th Generation

K 4 H XX XX X X X - X X

Memory

DRAM

Small Classification

Density and Refresh

Temperature & Power

Package

Organization

Version

Interface (VDD & VDDQ)

1. SAMSUNG Memory : K
2. DRAM : 4
3. Small Classification

4. Density & Refresh

5. Organization

8. Version

9. Package

10. Temperature & Power

11. Speed

: 4 Bank

6. Bank

1 2 3 4 5 6 7 8 9 10 11

: SSTL-2(2.5V, 2.5V)

7. Interface (VDD & VDDQ)

Speed

Bank

- 9 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

� Double-data-rate architecture; two data transfers per clock cycle
� Bidirectional data strobe(DQS)
� Four banks operation
� Differential clock inputs(CK and CK)
� DLL aligns DQ and DQS transition with CK transition
� MRS cycle with address key programs

-. Read latency 2, 2.5 (clock)
-. Burst length (2, 4, 8)
-. Burst type (sequential & interleave)

� All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
� Data I/O transactions on both edges of data strobe
� Edge aligned data output, center aligned data input
� LDM,UDM/DM for write masking only
� Auto & Self refresh
� 15.6us refresh interval(4K/64ms refresh)
� Maximum burst refresh cycle : 8
� 66pin TSOP II package

1. Key Features

1.1 Features

1.2 Operating Frequencies

*CL : Cas Latency

Table 1. Operating frequency and DLL jitter

-B3(DDR333)

- A2(DDR266A)

- B0(DDR266B)

- A0(DDR200)

Speed @CL2

133Mhz

133MHz

100MHz

Speed @CL2.5

166Mhz

133MHz

DLL jitter

�0.7ns

�0.75ns

�0.8ns

- 10 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

66 PIN TSOP(II)

(400mil x 875mil)

(0.65 mm PIN PITCH)

Bank Address

BA0-BA1

Row Address

A0-A11

Auto Precharge

A10

MS-024FC

Organization

Column Address

8Mx16

A0-A8

DM is internally loaded to match DQ and DQS identically.

2.1 Package Pinout

FIgure 1. package Pinout

Table 2. Column address configuration

2. Package Pinout & Dimension

D D Q

S S Q

D D Q

S S Q

C S

RAS

CAS

LDM

D D Q

AP/A

1 0

LDQS

S S

1 5

S S Q

1 4

1 3

DDQ

1 2

1 1

S S Q

1 0

DDQ

1 1

CKE

UDM

R E F

S S Q

S S

UDQS

S S

8Mb x 16

- 11 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

2.2 Input/Output Function Description

Table 3. Input/Output Function Description

SYMBOL

TYPE

DESCRIPTION

CK, CK

Input

Clock : CK and CK are differential clock inputs. All address and control input signals are sam-
pled on the positive edge of CK and negative edge of CK . Output (read) data is referenced to
both edges of CK. Internal clock signals are derived from CK/CK.

CKE

Input

Clock Enable : CKE HIGH activates, and CKE LOW deactivates internal clock signals, and
device input buffers and output drivers. Deactivating the clock provides PRECHARGE
POWER-DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER-DOWN
(row ACTIVE in any bank). CKE is synchronous for all functions except for disabling outputs,
which is achieved asynchronously. Input buffers, excluding CK, CK and CKE are disabled
during power-down and self refresh modes, providing low standby power. CKE will recognize
an LVCMOS LOW level prior to VREF being stable on power-up.

Input

Chip Select : CS enables(registered LOW) and disables(registered HIGH) the command
decoder. All commands are masked when CS is registered HIGH. CS provides for external
bank selection on systems with multiple banks. CS is considered part of the command code.

RAS, CAS, WE

Input

Command Inputs : RAS , CAS and WE (along with CS) define the command being entered.

LDM,(U)DM

Input

Input Data Mask : DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH along with that input data during a WRITE access. DM is sampled on both
edges of DQS. DM pins include dummy loading internally, to matches the DQ and DQS load-
ing. For the x16, LDM corresponds to the data on DQ0-DQ7 ; UDM correspons to the data on
DQ8-DQ15.

BA0, BA1

Input

Bank Addres Inputs : BA0 and BA1 define to which bank an ACTIVE, READ, WRITE or PRE-
CHARGE command is being applied.

A [n : 0]

Input

Address Inputs : Provide the row address for ACTIVE commands, and the column address
and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the
memory array in the respective bank. A10 is sampled during a PRECHARGE command to
determine whether the PRECHARGE applies to one bank (A10 LOW) or all banks (A10
HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The address
inputs also provide the op-code during a MODE REGISTER SET command. BA0 and BA1
define which mode register is loaded during the MODE REGISTER SET command (MRS or
EMRS).

I/O

Data Input/Output : Data bus

LDQS,(U)DQS

I/O

Data Strobe : Output with read data, input with write data. Edge-aligned with read data, cen-
tered in write data. Used to capture write data. For the x16, LDQS corresponds to the data on
DQ0-DQ7 ; UDQS corresponds to the data on DQ8-DQ15.

No Connect : No internal electrical connection is present.

Supply

DQ Power Supply : +2.5V

�

0.2V.

Supply

DQ Ground.

Supply

Power Supply : +2.5V

�

0.2V (device specific).

Supply

Ground.

REF

Input

SSTL_2 reference voltage.

*1 : DQ, DQS, DM signals may be floated to V

when no data is being transfened.

- 12 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Units : Millimeters

0.30

�

0.08

0.65TYP

(0.71)

22.22

�

0.10

0.125

(
0

.
8

0
)

1
0

.
1

�

.
1

�

#33

#66

#34

(1.50)

(
1
.
5
0

)

0.65

�

0.08

.
0

�

.
1

1
.
2
0

(
0
.
5
0

)

(
0

.
5

0
)

(
1
0

.
7

)

1
1

.
7

�

.
2

(10

�

)

(10

�

)

+ 0 . 0 7 5

- 0 . 0 3 5

(
0

.
8

0
)

0.10 MAX

0.075 MAX

[

]

0
.
0
5

I
N

(10

�

)

(10

�

)

(R0.1

.
2

�

0
.
0
5

.
6

�

0
.
0
5

)

�

)

0.2

.
4

0
.
7
5

0.25TYP

NOTE

1. ( ) IS REFERENCE
2. [ ] IS ASS

Y OUT QUALITY

2.3 66pin TSOP-II Package Dimension

FIgure 2. package Dimension

- 14 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

3.2.1 Power-Up and Initialization Sequence

The following sequence is required for POWER UP and Initialization.
1. Apply power and attempt to maintain CKE at a low state(all other inputs may be undefined.)
- Apply V

before or at the same time as V

- Apply V

Q before or at the same time as V

& Vref.

No power sequencing is specified during power up or power down given the following criteria:

�

and V

Q are driven from a single power converter output, and

�

is limited to 1.44V (reflecting V

Q(max)/2 + 50mV V

REF

variation +40m V V

variation), and

�

REF

tracks V

Q/2, and

� A minimum resistance of 42 ohms(22 ohm series resistor + 22 ohm parallel resistor 5% tolerance)
limits the input current from the V

supply into any pin.

If the above criteria cannot be met by the system design, the following table must be adhered
to during power up:

2. Start clock and maintain stable condition for a minimum of 200us.
3. The minimum of 200us after stable power and clock(CK, CK), apply NOP & take CKE high.
4. Issue precharge commands for all banks of the device.

5. Issue EMRS to enable DLL.(To issue "DLL Enable" command, provide "Low" to A0, "High" to BA0 and

"Low" to all of the rest address pins, A1~A11 and BA1)
6. Issue a mode register set command for "DLL reset". The additional 200 cycles of clock input is required
to lock the DLL. (To issue DLL reset command, provide "High" to A8 and "Low" to BA0)

7. Issue precharge commands for all banks of the device.

8. Issue 2 or more auto-refresh commands.
9. Issue a mode register set command with low to A8 to initialize device operation.

*1 Sequence of 6 & 7 is regardless of the order.

Voltage Description

Sequencing

Voltage Relationship to avoid latch-up

VDDQ

After or with VDD

<VDD + 0.3V

VTT

After or with VDDQ

< VDDQ +0.3V

VREF

After or with VDDQ

<VDDQ +0.3V

Power up & Initialization Sequence

Command

R P

2 Clock min.

precharge

ALL Banks

2nd Auto

Refresh

M o d e

Any

Command

RFC

1st Auto

Refresh

RFC

min.200 Cycle

E M R S

MRS

2 Clock min.

DLL Reset

2 Clock min.

precharge

ALL Banks

CK
CK

3.2 Basic Functionality

Figure 4. Power up and initialization sequence

- 15 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

3.2.2 Mode Register Definition

3.2.2.1 Mode Register Set(MRS)

The mode register stores the data for controlling the various operating modes of DDR SDRAM. It programs

CAS latency, addressing mode, burst length, test mode, DLL reset and various vendor specific options to make
DDR SDRAM useful for variety of different applications. The default value of the mode register is not defined,
therefore the mode register must be written after EMRS setting for proper DDR SDRAM operation. The mode
register is written by asserting low on CS, RAS, CAS, WE and BA0(The DDR SDRAM should be in all bank pre-
charge with CKE already high prior to writing into the mode register). The states of address pins A0 ~ A11 in
the same cycle as CS, RAS, CAS, WE and BA0 going low are written in the mode register. Two clock cycles
are requested to complete the write operation in the mode register. The mode register contents can be
changed using the same command and clock cycle requirements during operation as long as all banks are in
the idle state. The mode register is divided into various fields depending on functionality. The burst length uses
A0 ~ A2, addressing mode uses A3, CAS latency(read latency from column address) uses A4 ~ A6. A7 is used
for test mode. A8 is used for DLL reset. A7 must be set to low for normal MRS operation. Refer to the table for
specific codes for various burst lengths, addressing modes and CAS latencies.

Address Bus

CAS Latency

Latency

Reserved

2.5

Reserved

Burst Length

Sequential

Interleave

Reserve

mode

Normal

Test

Burst Type

Sequential

Interleave

* RFU(Reserved for future use)

must stay "0" during MRS
cycle.

DLL Reset

Yes

Mode Register

RFU

CAS Latency

Burst Length

RFU

DLL

~ A

(Existing)MRS Cycle

Extended Funtions(EMRS)

Figure 5. Mode Register Set

- 16 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Mode Register Set

*1 : MRS can be issued only at all bank precharge state.
*2 : Minimum

is required to issue MRS command.

Command

2 Clock min.

Precharge

All Banks

Mode

Any

Command

CK
CK

Burst Address Ordering for Burst Length

Burst

Length

Starting

Address(A2, A1, A0)

Sequential Mode

Interleave Mode

xx0

0, 1

xx1

1, 0

x00

0, 1, 2, 3

x01

1, 2, 3, 0

1, 0, 3, 2

x10

2, 3, 0, 1

x11

3, 0, 1, 2

3, 2, 1, 0

000

0, 1, 2, 3, 4, 5, 6, 7

001

1, 2, 3, 4, 5, 6, 7, 0

1, 0, 3, 2, 5, 4, 7, 6

010

2, 3, 4, 5, 6, 7, 0, 1

2, 3, 0, 1, 6, 7, 4, 5

011

3, 4, 5, 6, 7, 0, 1, 2

3, 2, 1, 0, 7, 6, 5, 4

100

4, 5, 6, 7, 0, 1, 2, 3

101

5, 6, 7, 0, 1, 2, 3, 4

5, 4, 7, 6, 1, 0, 3, 2

110

6, 7, 0, 1, 2, 3, 4, 5

6, 7, 4, 5, 2, 3, 0, 1

111

7, 0, 1, 2, 3, 4, 5, 6

7, 6, 5, 4, 3, 2, 1, 0

Table 4. Burst address ordering for burst length

Figure 6. Mode Register Set sequence

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REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

3.2.2.2 Extended Mode Register Set(EMRS)

The extended mode register stores the data for enabling or disabling DLL, QFC and selecting output driver

size. The default value of the extended mode register is not defined, therefore the extened mode register must
be written after power up for enabling or disabling DLL. The extended mode register is written by asserting low
on CS, RAS, CAS, WE and high on BA0(The DDR SDRAM should be in all bank precharge with CKE already
high prior to writing into the extended mode register). The state of address pins A0 ~ A11 and BA1 in the
same cycle as CS, RAS, CAS and WE going low are written in the extended mode register. Two clock cycles
are required to complete the write operation in the extended mode register. The mode register contents can
be changed using the same command and clock cycle requirements during operation as long as all banks are
in the idle state. A0 is used for DLL enable or disable. "High" on BA0 is used for EMRS. All the other address
pins except A0 and BA0 must be set to low for proper EMRS operation. Refer to the table for specific codes.

Address Bus

*RFU

Extended Mode Register

DLL

DLL Enable

Enable

Disable

~ A

(Existing)MRS Cycle

Extended Funtions(EMRS)

Output Driver Impedence Control

Normal

Weak

D.I.C

Figure 7. Extend Mode Register set

DLL Enable/Disable

The DLL must be enabled for normal operation. DLL enable is required during power-up initialization, and

upon returing to normal operation after having disabled the DLL for the purpose of debug or evaluation (upon
exiting Self Refresh Mode, the DLL is enabled automatically). Any time the DLL is enabled, 200 clock cycles
must occur before a READ command can be issued.

Output Drive Strength
The normal drive strength for all outputs is specified to be SSTL_2, Class II. Samsung supports a weak driver
strength option, intended for lighter load and/or point-to-point environments. I-V curves for the normal drive
strength and weak drive strength are included in 11.1~2 of this document.

*RFU : Must be set "0"

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REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

3.2.3 Precharge

3.2.4 No Operation(NOP) & Device Deselect

The precharge command is used to precharge or close a bank that has been activated. The precharge com-

mand is issued when CS, RAS and WE are low and CAS is high at the rising edge of the clock. The precharge
command can be used to precharge each bank respectively or all banks simultaneously. The bank select
addresses(BA0, BA1) are used to define which bank is precharged when the command is initiated. For write
cycle, tWR(min.) must be satisfied until the precharge command can be issued. After tRP from the precharge,
an active command to the same bank can be initiated.

A10/AP

BA1

BA0

Precharge

Bank A Only

Bank B Only

Bank C Only

Bank D Only

All Banks

The device should be deselected by deactivating the CS signal. In this mode DDR SDRAM should ignore

all the control inputs. The DDR SDRAMs are put in NOP mode when CS is active and by deactivating RAS,
CAS and WE. For both Deselect and NOP the device should finish the current operation when this com-
mand is issued.

Bank Selection for Precharge by Bank address bits

Table 5. Bank selection for precharge by Bank address bits

- 19 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

3.2.5 Row Active

The Bank Activation command is issued by holding CAS and WE high with CS and RAS low at the rising

edge of the clock(CK). The DDR SDRAM has four independent banks, so two Bank Select addresses(BA0,
BA1) are required. The Bank Activation command must be applied before any Read or Write operation is exe-
cuted. The delay from the Bank Activation command to the first read or write command must meet or exceed
the minimum of RAS to CAS delay time(tRCD min). Once a bank has been activated, it must be precharged
before another Bank Activation command can be applied to the same bank. The minimum time interval
between interleaved Bank Activation commands(Bank A to Bank B and vice versa) is the Bank to Bank delay
time(tRRD min).

Address

Command

RAS-CAS delay(

RCD

)

Bank Activation Command Cycle

(CAS Latency = 2)

Bank A

Row Addr.

Bank A

Col. Addr.

Bank A

Activate

Write A

with Auto

NOP

Precharge

RAS-RAS delay time(

RRD

)

Bank B

Row Addr.

Bank A

Row. Addr.

Bank B

Activate

Bank A

Activate

NOP

ROW Cycle Time(

)

Tn+1

Tn+2

: Don

t care

CK
CK

3.2.6 Read Bank

3.2.7 Write Bank

This command is used after the row activate command to initiate the burst read of data. The read command

is initiated by activating RAS, CS, CAS, and deasserting WE at the same clock sampling(rising) edge as
described in the command truth table. The length of the burst and the CAS latency time will be determined by
the values programmed during the MRS command.

This command is used after the row activate command to initiate the burst write of data. The write com-

mand is initiated by activating RAS, CS, CAS, and WE at the same clock sampling(rising) edge as described in
the command truth table. The length of the burst will be determined by the values programmed during the
MRS command.

Figure 8. Bank activation command cycle timing

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128Mb D-die(x16) DDR SDRAM

3.3.1 Burst Read Operation

Burst Read operation in DDR SDRAM is in the same manner as the current SDRAM such that the Burst read

command is issued by asserting CS and CAS low while holding RAS and WE high at the rising edge of the
clock(CK) after tRCD from the bank activation. The address inputs (A0~A9) determine the starting address for
the Burst. The Mode Register sets type of burst(Sequential or interleave) and burst length(2, 4, 8). The first
output data is available after the CAS Latency from the READ command, and the consecutive data are pre-
sented on the falling and rising edge of Data Strobe(DQS) adopted by DDR SDRAM until the burst length is
completed.

Command

< Burst Length=4, CAS Latency= 2, 2.5 >

READ A

NOP

DQS

CAS Latency=2

Dout 0 Dout 1 Dout 2 Dout 3

DQS

CAS Latency=2.5

Dout 0 Dout 1 Dout 2 Dout 3

RPRE

RPST

CK
CK

3.3 Essential Functionality for DDR SDRAM

The essential functionality that is required for the DDR SDRAM device is described in this chapter

Figure 9. Burst read operation timing

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3.3.2 Burst Write Operation

The Burst Write command is issued by having CS, CAS, and WE low while holding RAS high at the rising

edge of the clock(CK). The address inputs determine the starting column address. There is no write latency
relative to DQS required for burst write cycle. The first data of a burst write cycle must be applied on the DQ
pins tDS(Data-in setup time) prior to data strobe edge enabled after tDQSS from the rising edge of the
clock(CK) that the write command is issued. The remaining data inputs must be supplied on each subsequent
falling and rising edge of Data Strobe until the burst length is completed. When the burst has been finished, any
additional data supplied to the DQ pins will be ignored.

Figure 10. Burst write operation timing

1. The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown
(DQS going from High_Z to logic Low) applies when no writes were previously in progress on the bus.
If a previous write was in progress, DQS could be High at this time, depending on tDQSS.

Command

< Burst Length=4 >

NOP

WRITE A

NOP

WRITEB

NOP

DQS

Din 3

Din 0 Din 1 Din 2

DQSSmax

WPRES*1

CK
CK

Din 3

Din 0 Din 1 Din 2

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3.3.3 Read Interrupted by a Read

A Burst Read can be interrupted before completion of the burst by new Read command of any bank. When

the previous burst is interrupted, the remaining addresses are overridden by the new address with the full burst
length. The data from the first Read command continues to appear on the outputs until the CAS latency from
the interrupting Read command is satisfied. At this point the data from the interrupting Read command
appears. Read to Read interval is minimum 1 Clock.

Command

< Burst Length=4, CAS Latency=2 >

READ A

READ B

NOP

DQS

CAS Latency=2

out

CK
CK

3.3.4 Read Interrupted by a Write & Burst Stop

To interrupt a burst read with a write command, Burst Stop command must be asserted to avoid data conten-

tion on the I/O bus by placing the DQ

s(Output drivers) in a high impedance state. To insure the DQ

s are tri-

stated one cycle before the beginning the write operation, Burst stop command must be applied at least 2
clock cycles for CL=2 and at least 3 clock cycles for CL=2.5 before the Write command.

Command

< Burst Length=4, CAS Latency=2 >

READ

Burst Stop

NOP

WRITE

NOP

DQS

CAS Latency=2

Dout 0 Dout 1

Din 0

Din 1

Din 2

Din 3

CK
CK

The following functionality establishes how a Write command may interrupt a Read burst.
1. For Write commands interrupting a Read burst, a Burst Terminate command is required to stop the read

burst and tristate the DQ bus prior to valid input write data. Once the Burst Terminate command has been
issued, the minimum delay to a Write command = RU(CL) [CL is the CAS Latency and RU means round up
to the nearest integer].

2. It is illegal for a Write command to interrupt a Read with autoprecharge command.

Figure 11. Read interrupted by a read timing

Figure 12. Read interrupted by a write and burst stop timing.

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3.3.5 Read Interrupted by a Precharge

A Burst Read operation can be interrupted by precharge of the same bank. The minimum 1 clock is required

for the read to precharge intervals. A precharge command to output disable latency is equivalent to the CAS
latency.

Command

< Burst Length=8, CAS Latency=2 >

READ

NOP

Precharge

NOP

DQS

CAS Latency=2

Dout 0 Dout 1 Dout 2 Dout 3

Interrupted by precharge

Dout 4 Dout 5 Dout 6 Dout 7

CK
CK

When a burst Read command is issued to a DDR SDRAM, a Precharge command may be issued to the same
bank before the Read burst is complete. The following functionality determines when a Precharge command
may be given during a Read burst and when a new Bank Activate command may be issued to the same bank.

1. For the earliest possible Precharge command without interrupting a Read burst, the Precharge command

may be given on the rising clock edge which is CL clock cycles before the end of the Read burst where CL
is the CAS Latency. A new Bank Activate command may be issued to the same bank after tRP (RAS
Precharge time).

2. When a Precharge command interrupts a Read burst operation, the Precharge command may be given on

the rising clock edge which is CL clock cycles before the last data from the interrupted Read burst where
CL is the CAS Latency. Once the last data word has been output, the output buffers are tristated. A new
Bank Activate command may be issued to the same bank after tRP.

3. For a Read with autoprecharge command, a new Bank Activate command may be issued to the same

bank after tRP where tRP begins on the rising clock edge which is CL clock cycles before the end of the
Read burst where CL is the CAS Latency. During Read with autoprecharge, the initiation of the internal
precharge occurs at the same time as the earliest possible external Precharge command would initiate a
precharge operation without interrupting the Read burst as described in 1 above.

4. For all cases above, tRP is an analog delay that needs to be converted into clock cycles. The number of

clock cycles between a Precharge command and a new Bank Activate command to the same bank equals
tRP/tCK (where tCK is the clock cycle time) with the result rounded up to the nearest integer number of
clock cycles. (Note that rounding to X.5 is not possible since the Precharge and Bank Activate commands
can only be given on a rising clock edge).

In all cases, a Precharge operation cannot be initiated unless tRAS(min) [minimum Bank Activate to Precharge
time] has been satisfied. This includes Read with autoprecharge commands where tRAS(min) must still be
satisfied such that a Read with autoprecharge command has the same timing as a Read command followed by
the earliest possible Precharge command which does not interrupt the burst.

Figure 13. Read interrupted by a precharge timing

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128Mb D-die(x16) DDR SDRAM

3.3.6 Write Interrupted by a Write

A Burst Write can be interrupted before completion of the burst by a new Write command, with the only restric-

tion that the interval that separates the commands must be at least one clock cycle. When the previous burst
is interrupted, the remaining addresses are overridden by the new address and data will be written into the
device until the programmed burst length is satisfied.

Command

< Burst Length=4 >

NOP

WRITE A

WRITE b

NOP

DQS

Din A

Din B

CK
CK

Figure 14. Write interrupted by a write timing

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128Mb D-die(x16) DDR SDRAM

3.3.7 Write Interrupted by a Read & DM

A burst write can be interrupted by a read command of any bank. The DQ

s must be in the high impedance

state at least one clock cycle before the interrupting read data appear on the outputs to avoid data contention.
When the read command is registered, any residual data from the burst write cycle must be masked by DM.
The delay from the last data to read command (tCDLR) is required to avoid the data contention DRAM inside.
Data that are presented on the DQ pins before the read command is initiated will actually be written to the
memory. Read command interrupting write can not be issued at the next clock edge of that of write command.

Command

< Burst Length=8, CAS Latency=2 >

NOP

WRITE

NOP

READ

NOP

DQS

Din 0

Din 1

Din 2

Din 3

Din 4

Din 5

Dout 0 Dout 1 Dout 2

Din 6

Din 7

WTR

CAS Latency=2

DQSSmax

DQS

WTR

CAS Latency=2

DQSSmin

Din 7

Din 0

Din 1

Din 2

Din 3

Din 4

Din 5

Din 6

Dout 0 Dout 1 Dout 2 Do

WPRES*

CK
CK

The following function established how a Read command may interrupt a Write burst and which input data is
not written into the memory.
1. For Read commands interrupting a Write burst, the minimum Write to Read command delay is 2 clock

cycles. The case where the Write to Read delay is 1 clock cycle is disallowed

2. For Read commands interrupting a Write burst, the DM pin must be used to mask the input data words

whcich immediately precede the interrupting Read operation and the input data word which immediately
follows the interrupting Read operation

3. For all cases of a Read interrupting a Write, the DQ and DQS buses must be released by the driving chip

(i.e., the memory controller) in time to allow the buses to turn around before the DDR SDRAM drives them
during a read operation.

4. If input Write data is masked by the Read command, the DQS input is ignored by the DDR SDRAM.
5. Refer to "3.3.2 Burst write operation"

Figure 15. Write interrupted by a read and DM timing

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128Mb D-die(x16) DDR SDRAM

3.3.8 Write Interrupted by a Precharge & DM

A burst write operation can be interrupted before completion of the burst by a precharge of the same bank.

Random column access is allowed. A write recovery time(tWR) is required from the last data to precharge
command. When precharge command is asserted, any residual data from the burst write cycle must be
masked by DM.

Precharge timing for Write operations in DRAMs requires enough time to allow "write recovery" which is the

time required by a DRAM core to properly store a full "0" or "1" level before a Precharge operation. For DDR
SDRAM, a timing parameter, tWR, is used to indicate the required amount of time between the last valid write
operation and a Precharge command to the same bank.

The precharge timing for writes is a complex definition since the write data is sampled by the data strobe and
the address is sampled by the input clock. Inside the SDRAM, the data path is eventually synchronized with
the address path by switching clock domains from the data strobe clock domain to the input clock domain.
This makes the definition of when a precharge operation can be initiated after a write very complex since the
write recovery parameter must reference only the clock domain that is used to time the internal write operation,
i.e., the input clock domain.

tWR starts on the rising clock edge after the last possible DQS edge that strobed in the last valid data and
ends on the rising clock edge that strobes in the precharge command.
1. For the earliest possible Precharge command following a Write burst without interrupting the burst, the

minimum time for write recovery is defined by tWR.

2. When a precharge command interrupts a Write burst operation, the data mask pin, DM, is used to mask

input data during the time between the last valid write data and the rising clock edge on which the
Precharge command is given. During this time, the DQS input is still required to strobe in the state of DM.
The minimum time for write recovery is defined by tWR.

Figure 16. Write interrupted by a precharge and DM timing

Command

< Burst Length=8 >

NOP

WRITE A

NOP

Precharge

NOP

WRITEB

DQS

Dina

Dinb

Dina

DQS

DQSSmin

Dina

Dinb

DQSSmax

CK
CK

WPRES*

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128Mb D-die(x16) DDR SDRAM

3. For a Write with autoprecharge command, a new Bank Activate command may be issued to the same

bank after tWR+tRP where tWR+tRP starts on the falling DQS edge that strobed in the last valid data and
ends on the rising clock edge that strobes in the Bank Activate command. During write with
autoprecharge, the initiation of the internal precharge occurs at the same time as the earliest possible
external Precharge command without interrupting the Write burst as described in 1 above.

4. In all cases, a Precharge operation cannot be initiated unless tRAS(min) [minimum Bank Activate to

Precharge time] has been satisfied. This includes Write with autoprecharge commands where tRAS(min)
must still be satisfied such that a Write with autoprecharge command has the same timing as a Write
command followed by the earliest possible Precharge command which does not interrupt the burst.

5. Refer to "3.3.2 Burst write operation"

3.3.9 Burst Stop

The burst stop command is initiated by having RAS and CAS high with CS and WE low at the rising edge of

the clock(CK). The burst stop command has the fewest restrictions making it the easiest method to use when
terminating a burst read operation before it has been completed. When the burst stop command is issued dur-
ing a burst read cycle, the pair of data and DQS(Data Strobe) go to a high impedance state after a delay which
is equal to the CAS latency set in the mode register. The burst stop command, however, is not supported dur-
ing a write burst operation.

Command

< Burst Length=4, CAS Latency= 2, 2.5 >

READ A

Burst Stop

NOP

DQS

CAS Latency=2

Dout 0 Dout 1

DQS

CAS Latency=2.5

The burst ends after a delay equal to the CAS latency.

Dout 0 Dout 1

CK
CK

The Burst Stop command is a mandatory feature for DDR SDRAMs. The following functionality is required:
1. The BST command may only be issued on the rising edge of the input clock, CK.
2. BST is only a valid command during Read bursts.
3. BST during a Write burst is undefined and shall not be used.
4. BST applies to all burst lengths.
5. BST is an undefined command during Read with autoprecharge and shall not be used.

Figure 17. Burst stop timing

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128Mb D-die(x16) DDR SDRAM

3.3.10 DM masking

The DDR SDRAM has a data mask function that can be used in conjunction with data write cycle, not read

cycle. When the data mask is activated (DM high) during write operation, DDR SDRAM does not accept the
corresponding data.(DM to data-mask latency is zero).
DM must be issued at the rising or falling edge of data strobe.

6. When terminating a burst Read command, the BST command must be issued L

BST

("BST Latency") clock

cycles before the clock edge at which the output buffers are tristated, where L

BST

equals the CAS latency

for read operations. This is shown in previous page Figure with examples for CAS latency (CL) of 1.5, 2,
2.5, 3 and 3.5 (only selected CAS latencies are required by the DDR SDRAM standards, the others are
optional).

7. When the burst terminates, the DQ and DQS pins are tristated.

The BST command is not byte controllable and applies to all bits in the DQ data word and the(all) DQS pin(s).

Figure 18. DM masking timing

Command

< Burst Length=8 >

WRITE

NOP

DQS

Din 0 Din 1 Din 2 Din 3

DQSS

Din 4 Din 5 Din 6 Din7

masked by DM=H

CK
CK

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128Mb D-die(x16) DDR SDRAM

Command

< Burst Length=4, CAS Latency= 2, 2.5>

BANK A

NOP

READ A

NOP

DQS

CAS Latency=2

Dout 0 Dout 1 Dout 2 Dout 3

ACTIVE

Auto Precharge

* Bank can be reactivated at the

completion of

precharge

Begin Auto-Precharge

DQS

CAS Latency=2.5

Dout 0 Dout 1 Dout 2 Dout 3

When the Read with Auto precharge command is issued, new command can be asserted at 3,4 and 5
respectively as follows,

Asserted

command

For same Bank

For Different Bank

READ

READ +

No AP

READ+

No AP

Illegal

Legal

READ+AP

READ +

Illegal

Legal

Active

Illegal

Legal

Precharge

Legal

Illegal

Legal

: AP = Auto Precharge

RAS(min.)

CK
CK

3.3.11 Read With Auto Precharge

If a read with auto-precharge command is initiated, the DDR SDRAM automatically enters the precharge

operation BL/2 clock later from a read with auto-precharge command when tRAS(min) is satisfied. If not, the
start point of precharge operation will be delayed until tRAS(min) is satisfied. Once the precharge operation
has started the bank cannot be reactivated and the new command can not be asserted until the precharge
time(tRP) has been satisfied.

Figure 19. Read with auto precharge timing

Table 6. Operating description when new command asserted

while read with auto precharge is issued

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128Mb D-die(x16) DDR SDRAM

3.3.12 Write with Auto Precharge

If A10 is high when write command is issued , the write with auto-precharge function is performed. Any new

command to the same bank should not be issued until the internal precharge is completed. The internal pre-
charge begins after keeping tWR(min).

Figure 20. Write with auto precharge timing

Asserted

command

For same Bank

For Different Bank

WRITE

WRITE+

No AP

WRITE+

No AP

Illegal

Legal

WRITE+

Illegal

Legal

READ

Illegal

READ+NO

AP+DM

READ+NO

AP+DM

READ+

NO AP

Illegal

Legal

READ+AP

Illegal

READ +

AP+DM

READ +

AP+DM

READ +

Illegal

Legal

Active

Illegal

Legal

Precharge

Illegal

Legal

: AP = Auto Precharge

: DM : Refer to " 3.3.7 Write Interrupted by a Read & DM " in page 25.

Burst length = 4

Table 7. Operating description when new command asserted

while write with auto precharge is issued

Command

<100Mhz, Burst Length=4 >

BANK A

NOP

WRITE A

NOP

DQS

Din 0 Din 1 Din 2 Din 3

ACTIVE

Auto Precharge

* Bank can be reactivated at

completion of

Internal precharge start

CK
CK

NOP

DAL

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128Mb D-die(x16) DDR SDRAM

3.3.13 Auto Refresh & Self Refresh

Auto Refresh

Command

CKE

PRE

RFC

Auto

= High

Refresh

CMD

An auto refresh command is issued by having CS, RAS and CAS held low with CKE and WE high at the ris-

ing edge of the clock(CK). All banks must be precharged and idle for tRP(min) before the auto refresh com-
mand is applied. No control of the external address pins is required once this cycle has started because of the
internal address counter. When the refresh cycle has completed, all banks will be in the idle state. A delay
between the auto refresh command and the next activate command or subsequent auto refresh command
must be greater than or equal to the tRFC(min).

CK
CK

Self Refresh

A self refresh command is defined by having CS, RAS, CAS and CKE held low with WE high at the rising

edge of the clock(CK). Once the self refresh command is initiated, CKE must be held low to keep the device in
self refresh mode. During the self refresh operation, all inputs except CKE are ignored. The clock is internally
disabled during self refresh operation to reduce power consumption. The self refresh is exited by supplying
stable clock input before returning CKE high, asserting deselect or NOP command and then asserting CKE
high for longer than tXSR for locking of DLL.

Command

CKE

XSNR

* 1

Self

Refresh

CK
CK

Read

XSRD*

Figure 21. Auto refresh timing

Figure 22. Self refresh timing

Active

1. Exit self refresh to bank active command, a write command can be applied as far as tRCD is satisfied after
any bank active command.
2. Exit self refresh to read command

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128Mb D-die(x16) DDR SDRAM

3.3.14 Power down

CKE

Precharge

Active

Read

power

down

Exit

Active

power

down

Entry

power

Entry

down

Precharge

Command

CK
CK

The power down mode is entered when CKE is low and exited when CKE is high. Once the power down

mode is initiated, all of the receiver circuits except clock, CKE and DLL circuit tree are gated off to reduce
power consumption. All banks should be in idle state prior to entering the precharge power down mode and
CKE should be set high at least 1tck+tIS prior to row active command . During power down mode, refresh
operations cannot be performed, therefore the device cannot be remained in power down mode longer than
the refresh period(Data retension time) of the device.

Figure 23. Power down entry and exit timing

PDEX

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128Mb D-die(x16) DDR SDRAM

4. Command Truth Table

(V=Valid, X=Don

t Care, H=Logic High, L=Logic Low)

COMMAND

CKEn-1

CKEn

RAS

CAS

0,1

/AP

11,

~ A

Note

Extended MRS

OP CODE

1, 2

Mode Register Set

OP CODE

1, 2

Refresh

Auto Refresh

Self
Refresh

Entry

Exit

Bank Active & Row Addr.

Row Address

Read &
Column Address

Auto Precharge Disable

Column

Address

)

Auto Precharge Enable

Write &
Column Address

Auto Precharge Disable

Column

Address

)

Auto Precharge Enable

4, 6

Burst Stop

Precharge

Bank Selection

All Banks

Active Power Down

Entry

Exit

Precharge Power Down Mode

Entry

Exit

No operation (NOP) : Not defined

1. OP Code : Operand Code. A

~ A

& BA

~ BA

: Program keys. (@EMRS/MRS)

2.EMRS/ MRS can be issued only at all banks precharge state.
A new command can be issued 2 clock cycles after EMRS or MRS.
3. Auto refresh functions are same as the CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
4. BA

~ BA

: Bank select addresses.

If both BA

and BA

are "Low" at read, write, row active and precharge, bank A is selected.

If BA

is "High" and BA

is "Low" at read, write, row active and precharge, bank B is selected.

If BA

is "Low" and BA

is "High" at read, write, row active and precharge, bank C is selected.

If both BA

and BA

are "High" at read, write, row active and precharge, bank D is selected.

5. If A

/AP is "High" at row precharge, BA

and BA

are ignored and all banks are selected.

6. During burst write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at t

after the end of burst.

7. Burst stop command is valid at every burst length.
8. DM sampled at the rising and falling edges of the DQS and Data-in are masked at the both edges (Write DM latency is 0).
9. This combination is not defined for any function, which means "No Operation(NOP)" in DDR SDRAM.

Table 8. Command truth table

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128Mb D-die(x16) DDR SDRAM

5. Functional Truth Table

Current State

RAS CAS

W E

Address

Command

Action

PRECHARGE

STANDBY

Burst Stop

ILLEGAL*2

BA, CA, A

READ/WRITE

ILLEGAL*2

BA, RA

Active

Bank Active, Latch RA

BA, A

PRE/PREA

ILLEGAL*4

Refresh

AUTO-Refresh*5

Op-Code, Mode-Add

MRS

Mode Register Set*5

ACTIVE

STANDBY

Burst Stop

NOP

BA, CA, A

READ/READA

Begin Read, Latch CA,
Determine Auto-Precharge

BA, CA, A

WRITE/WRITEA Begin Write, Latch CA,

Determine Auto-Precharge

BA, RA

Active

Bank Active/ILLEGAL*2

BA, A

PRE/PREA

Precharge/Precharge All

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

READ

Burst Stop

Terminate Burst

BA, CA, A

READ/READA

Terminate Burst, Latch CA,
Begin New Read, Determine
Auto-Precharge*3

BA, CA, A

WRITE/WRITEA ILLEGAL

BA, RA

Active

Bank Active/ILLEGAL*2

BA, A

PRE/PREA

Terminate Burst, Precharge

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

Table 9-1. Functional truth table

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128Mb D-die(x16) DDR SDRAM

Current State

RAS CAS

W E

Address

Command

Action

WRITE

Burst Stop

ILLEGAL

BA, CA, A

READ/READA

Terminate Burst With DM=High,
Latch CA, Begin Read, Deter-
mine Auto-Precharge*3

BA, CA, A

WRITE/WRITEA

Terminate Burst, Latch CA,
Begin new Write, Determine
Auto-Precharge*3

BA, RA

Active

Bank Active/ILLEGAL*2

BA, A

PRE/PREA

Terminate Burst With DM=High,
Precharge

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

READ with

AUTO

PRECHARGE

(READA)

Burst Stop

ILLEGAL

BA, CA, A

READ/READA

BA, CA, A

WRITE/WRITEA ILLEGAL

BA, RA

Active

BA, A

PRE/PREA

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

WRITE with

AUTO

RECHARGE

(WRITEA)

Burst Stop

ILLEGAL

BA, CA, A

READ/READA

BA, CA, A

WRITE/WRITEA *7

BA, RA

Active

BA, A

PRE/PREA

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

Table 9-2. Functional truth table

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128Mb D-die(x16) DDR SDRAM

Current State

RAS CAS WE

Address

Command

Action

PRECHARG-

ING

(DURING tRP)

Burst Stop

ILLEGAL*2

BA, CA, A

READ/WRITE

ILLEGAL*2

BA, RA

Active

ILLEGAL*2

BA, A

PRE/PREA

NOP*4(Idle after

)

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

ROW

ACTIVATING

(FROM ROW

ACTIVE TO

tRCD)

Burst Stop

ILLEGAL*2

BA, CA, A

READ/WRITE

ILLEGAL*2

BA, RA

Active

ILLEGAL*2

BA, A

PRE/PREA

ILLEGAL*2

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

WRITE

RECOVERING

(DURING tWR

OR tCDLR)

Burst Stop

ILLEGAL*2

BA, CA, A

READ

ILLEGAL*2

BA, CA, A

WRITE

BA, RA

Active

ILLEGAL*2

BA, A

PRE/PREA

ILLEGAL*2

Refresh

ILLEGAL

Op-Code, Mode-Add MRS

ILLEGAL

Table 9-3. Functional truth table

- 37 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Current State

RAS CAS WE

Address

Command

Action

RE-

FRESHING

Burst Stop

ILLEGAL

BA, CA, A

READ/WRITE

ILLEGAL

BA, RA

Active

ILLEGAL

BA, A

PRE/PREA

ILLEGAL

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

MODE

SETTING

Burst Stop

ILLEGAL

BA, CA, A

READ/WRITE

ILLEGAL

BA, RA

Active

ILLEGAL

BA, A

PRE/PREA

ILLEGAL

Refresh

ILLEGAL

Op-Code, Mode-Add

MRS

ILLEGAL

Table 9-4. Functional truth table

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REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

ABBREVIATIONS :

H=High Level, L=Low level, X=Don

t Care

Note :

1. All entries assume that CKE was High during the preceding clock cycle and the current clock cycle.
2. ILLEGAL to bank in specified state ; function may be legal in the bank indicated by BA, depending on the state of that bank.
3. Must satisfy bus contention, bus turn around and write recovery requirements.
4. NOP to bank precharging or in idle sate. May precharge bank indicated by BA.
5. ILLEGAL if any bank is not idle.
6. Refer to "3.3.11 Read with Auto Precharge" in page 29 for detailed information.
7. Refer to "3.3.12 Write with Auto Precharge" in page 30 for detailed information.

8. CKE Low to High transition will re-enable CK, CK and other inputs asynchronously. A minimum setup time must be satisfied

before issuing any command other than EXIT.

9. Power-Down and Self-Refresh can be entered only from All Bank Idle state.

ILLEGAL = Device operation and/or data integrity are not guaranteed.

Current State

CKE

n-1

CKE

RAS

CAS

Add

Action

SELF-

REFRESHING

Exit Self-Refresh

ILLEGAL

NOPeration(Maintain Self-Refresh)

POWER

D O W N

Exit Power Down(Idle after

PDEX

)

NOPeration(Maintain Power Down)

ALL BANKS

IDLE

Refer to Function True Table

Enter Self-Refresh

Enter Power Down

ILLEGAL

Refer to Current State=Power Down

ANY STATE

other than

listed above

Refer to Function Truth Table

Table 9-5. Functional truth table

- 39 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

6. Absolute Maximum Rating

7. DC Operating Conditions & Specifications

7.1 DC Operating Conditions

Parameter

Symbol

Value

Unit

Voltage on any pin relative to V

I N

, V

OUT

-0.5 ~ 3.6

Voltage on V

& V

DDQ

supply relative to V

, V

DDQ

-1.0 ~ 3.6

Storage temperature

STG

-55 ~ +150

�

Power dissipation

1.5

Short circuit current

Note :

Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.

Functional operation should be restricted to recommend operation condition.

Exposure to higher than recommended voltage for extended periods of time could affect device reliability.

Recommended operating conditions(Voltage referenced to V

=0V, T

=0 to 70

�

Parameter

Symbol

Min

Max

Unit

Note

Supply voltage(for device with a nominal V

of 2.5V)

2.3

2.7

I/O Supply voltage

DDQ

2.3

2.7

I/O Reference voltage

REF

VDDQ/2-50mV

VDDQ/2+50mV

I/O Termination voltage(system)

T T

REF

-0.04

REF

+0.04

Input logic high voltage

(DC)

REF

+0.15

DDQ

+0.3

Input logic low voltage

(DC)

-0.3

REF

-0.15

Input Voltage Level, CK and CK inputs

(DC)

-0.3

DDQ

+0.3

Input Differential Voltage, CK and CK inputs

(DC)

0.3

DDQ

+0.6

Input crossing point voltage, CK and CK inputs

(DC)

1.15

1.35

Input leakage current

-2

Output leakage current

-5

Output High Current(Normal strengh driver)
;V

OUT

= V

+ 0.84V

O H

-16.8

Output High Current(Normal strengh driver)
;V

OUT

= V

- 0.84V

16.8

Output High Current(Half strengh driver)
;V

OUT

+ 0.45V

O H

-9

Output High Current(Half strengh driver)
;V

OUT

= V

- 0.45V

Table 10. Absolute maximum ratings

Table 11. DC operating condition

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REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Notes 1. Includes

�

25mV margin for DC offset on V

REF

, and a combined total of

�

50mV margin for all AC noise and DC offset on V

REF

bandwidth limited to 20MHz. The DRAM must accommodate DRAM current spikes on V

REF

and internal DRAM noise coupled

TO V

REF

, both of which may result in V

REF

noise. V

REF

should be de-coupled with an inductance of

3nH.

2.V

is not applied directly to the device. V

is a system supply for signal termination resistors, is expected to be set equal to

REF

, and must track variations in the DC level of V

REF

3. V

is the magnitude of the difference between the input level on CK and the input level on CK.

4. These parameters should be tested at the pin on actual components and may be checked at either the pin or the pad in
simulation. The AC and DC input specifications are relative to a VREF envelop that has been bandwidth limited to 200MHZ.
5. The value of V

is expected to equal 0.5*V

DDQ

of the transmitting device and must track variations in the dc level of the same.

7.2 DDR SDRAM SPEC Items and Test Conditions

Conditions

Symbol

Operating current - One bank Active-Precharge;
tRC=tRCmin;
DQ,DM and DQS inputs changing twice per clock cycle;
address and control inputs changing once per clock cycle

IDD0

Operating current - One bank operation ; One bank open, BL=4, Reads
- Refer to the following page for detailed test condition

IDD1

Percharge power-down standby current; All banks idle; power - down mode;
CKE = <VIL(max); Vin = Vref for DQ,DQS and DM

IDD2P

Precharge Floating standby current; CS# > =VIH(min);All banks idle;
CKE > = VIH(min); Address and other control inputs changing once per clock cycle;
Vin = Vref for DQ,DQS and DM

IDD2F

Precharge Quiet standby current; CS# > = VIH(min); All banks idle;
CKE > = VIH(min);
Address and other control inputs stable with keeping >= VIH(min) or =<VIL(max);
Vin = Vref for DQ ,DQS and DM

IDD2Q

Active power - down standby current ; one bank active; power-down mode;
CKE=< VIL (max); Vin = Vref for DQ,DQS and DM

IDD3P

Active standby current; CS# >= VIH(min); CKE>=VIH(min);
one bank active; active - precharge; tRC=tRASmax;
DQ, DQS and DM inputs changing twice per clock cycle;
address and other control inputs changing once per clock cycle

IDD3N

Operating current - burst read; Burst length = 2; reads; continguous burst;
One bank active; address and control inputs changing once per clock cycle;
50% of data changing at every burst; lout = 0 m A

IDD4R

Operating current - burst write; Burst length = 2; writes; continuous burst;
One bank active address and control inputs changing once per clock cycle;
DQ, DM and DQS inputs changing twice
per clock cycle, 50% of input data changing at every burst

IDD4W

Auto refresh current; tRC = tRFC(min) - 8*tCK for DDR200 at 100Mhz,
10*tCK for DDR266A & DDR266B at 133Mhz and 12*tCK for DDR333; distributed refresh

IDD5

Self refresh current; CKE =< 0.2V; External clock should be on;
tCK = 100Mhz for DDR200, 133Mhz for DDR266A & DDR266B and 166Mhz for DDR333

IDD6

Orerating current - Four bank operation ; Four bank interleaving with BL=4
-Refer to the following page for detailed test condition

IDD7A

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REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Table 12. IDD SPEC Table

Symbol

K4H281638D-

TCB3

(DDR333)

K4H281638D-

TCA2

(DDR266A)

K4H281638D-

TCB0

(DDR266B)

K4H281638D-

TCA0

(DDR200)

Unit

Notes

IDD0

105

IDD1

135

125

115

IDD2P

2.5

IDD2F

IDD2Q

IDD3P

IDD3N

IDD4R

190

172

150

IDD4W

170

150

120

IDD5

190

180

165

IDD6

Normal

Low power

Optional

IDD7A

345

320

255

7.3 IDD spec table

=2.7V, T

= 10

�

)

< Detailed test conditions for DDR SDRAM IDD1 & IDD7 >

IDD1 : Operating current: One bank operation
1. Typical Case : Vdd = 2.5V, T=25' C
2. Worst Case : Vdd = 2.7V, T= 10' C
3. Only one bank is accessed with tRC(min), Burst Mode, Address and Control inputs on NOP edge are changing once
per clock cycle. lout = 0mA
4. Timing patterns
- DDR200(100Mhz, CL=2) : tCK = 10ns, CL2, BL=4, tRCD = 2*tCK, tRAS = 5*tCK
Read : A0 N R0 N N P0 N A0 N - repeat the same timing with random address changing
*50% of data changing at every burst
- DDR266B(133Mhz, CL=2.5) : tCK = 7.5ns, CL=2.5, BL=4, tRCD = 3*tCK, tRC = 9*tCK, tRAS = 5*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat the same timing with random address changing
*50% of data changing at every burst
- DDR266A (133Mhz, CL=2) : tCK = 7.5ns, CL=2, BL=4, tRCD = 3*tCK, tRC = 9*tCK, tRAS = 5*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat the same timing with random address changing
*50% of data changing at every burst
- DDR333(166Mhz, CL=2.5) : tCK=6ns, CL=2.5, BL=4, tRCD=10*tCK, tRAS=7*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat the same timing with random address changing
*50% of data changing at every burst

Legend : A=Activate, R=Read, W=Write, P=Precharge, N=NOP

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REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

8. AC Operating Conditions & Timming Specification

8.1 AC Operating Conditions

Parameter/Condition

Symbol

Min

Max

Unit

Note

Input High (Logic 1) Voltage, DQ, DQS and DM signals

VIH(AC)

VREF + 0.31

Input Low (Logic 0) Voltage, DQ, DQS and DM signals.

VIL(AC)

VREF - 0.31

Input Differential Voltage, CK and CK inputs

VID(AC)

0.7

VDDQ+0.6

Input Crossing Point Voltage, CK and CK inputs

VIX(AC)

0.5*VDDQ-0.2

0.5*VDDQ+0.2

Note 1. VID is the magnitude of the difference between the input level on CK and the input on CK.

2. The value of V

is expected to equal 0.5*V

DDQ

of the transmitting device and must track variations in the DC level of the same.

3. These parameters should be tested at the pim on actual components and may be checked at either the pin or the pad in simula-

tion. the AC and DC input specificatims are refation to a Vref envelope that has been bandwidth limited 20MHz.

Table 13. AC operating conditions

DD7A

: Operating current: Four bank operation

1. Typical Case : Vdd = 2.5V, T=25' C
2. Worst Case : Vdd = 2.7V, T= 10' C
3. Four banks are being interleaved with tRC(min), Burst Mode, Address and Control inputs on NOP edge are not
changing. lout = 0mA
4. Timing patterns
- DDR200(100Mhz, CL=2) : tCK = 10ns, CL2, BL=4, tRRD = 2*tCK, tRCD= 3*tCK, Read with autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 A0 R3 A1 R0 - repeat the same timing with random address changing
*100% of data changing at every burst

- DDR266B(133Mhz, CL=2.5) : tCK = 7.5ns, CL=2.5, BL=4, tRRD = 2*tCK, tRCD = 3*tCK
Read with autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing
*100% of data changing at every burst

- DDR266A (133Mhz, CL=2) : tCK = 7.5ns, CL2=2, BL=4, tRRD = 2*tCK, tRCD = 3*tCK,Read with autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing
*100% of data changing at every burst

-DDR333(166Mhz,CL=2.5) : tCK=6ns, CL=2.5, BL=4, tRRD=2*tCK, tRCD=3*tCK,Read with autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N A1 R0 - repeat the same timing with random address changing
*100% of data changing at every burst

Legend : A=Activate, R=Read, W=Write, P=Precharge, N=NOP

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REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

8.2 AC Overshoot/Undershoot specification

Parameter

Specification

Notes

Maximum peak amplitude allowed for overshoot (See Figure 1):

1.6 V

1,2,3

Maximum peak amplitude allowed for undershoot (See Figure 1):

1.6 V

1,2,3

The area between the overshoot signal and VDD must be less than or
equal to (See Figure 1):

4.5 V-ns

1,2,3

The area between the undershoot signal and GND must be less than or
equal to (See Figure 1):

4.5 V-ns

1,2,3

-1

-2

-3

-4

-5

0.5

0.6875

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

6.3125

6.5

7.0

VDD

Overshoot

Maximum Amplitude = 1.6V

Area = 4.5V-ns

Maximum Amplitude = 1.6V

undershoot

GND

l
t
s

(
V

)

Tims(ns)

8.2.1 Overshoot/Undershoot specification for Address and Control Pins

Table 14. Overshoot/Undershoot specification for Address and Control Pins

Figure 24. AC overshoot/Undershoot Definition

Notes:
1. This specification is intended for only DDR200, DDR266A and DDR266B devices.
2. This specification is intended for only devices with NO clamp protection
3. This compliance is to be verified by design only.

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REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

8.2.2 Overshoot/Undershoot specification for Data Pins

Parameter

Specification

Notes

Maximum peak amplitude allowed for overshoot (See Figure 2):

1.2 V

1,2,3

Maximum peak amplitude allowed for undershoot (See Figure 2):

1.2 V

1,2,3

The area between the overshoot signal and VDD must be less than or
equal to (See Figure 2):

2.5 V-ns

1,2,3

The area between the undershoot signal and GND must be less than or
equal to (See Figure 2):

2.5 V-ns

1,2,3

-1

-2

-3

-4

-5

0 0.5 1.0 1.42 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 5.68 6.0 6.5 7.0

VDDQ

Overshoot

Maximum Amplitude = 1.2V

Area = 2.5V-ns

Maximum Amplitude = 1.2V

undershoot

GND

l
t
s

(
V

)

Tims(ns)

Table 15. Overshoot/Undershoot specification for Data Pins

Figure 25. AC overshoot/Undershoot Definition

- 45 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

AC Timming Parameters & Specifications

Parameter

Symbol

-TCB3

(DDR333)

-TCA2

(DDR266A)

-TCB0

(DDR266B)

-TCA0

(DDR200)

Unit Note

Min

Max

Min

Max

Min

Max

Min

Max

Row cycle time

tRC

Refresh row cycle time

tRFC

Row active time

tRAS

70K

120K

RAS to CAS delay

tRCD

Row precharge time

tRP

Row active to Row active delay

tRRD

Write recovery time

tWR

Last data in to Read command

tWTR

tCK

Col. address to Col. address delay

tCCD

tCK

Clock cycle time

CL=2.0

tCK

7.5

CL=2.5

7.5

Clock high level width

tCH

0.45

0.55

0.45

0.55

0.45

0.55

0.45

0.55

tCK

Clock low level width

tCL

0.45

0.55

0.45

0.55

0.45

0.55

0.45

0.55

tCK

DQS-out access time from CK/CK

tDQSCK

-0.6

+0.6

-0.75

+0.75

-0.75

+0.75

-0.8

+0.8

Output data access time from CK/CK

tAC

-0.7

+0.7

-0.75

+0.75

-0.75

+0.75

-0.8

+0.8

Data strobe edge to ouput data edge

tDQSQ

0.45

0.5

0.6

Read Preamble

tRPRE

0.9

1.1

0.9

1.1

0.9

1.1

0.9

1.1

tCK

Read Postamble

tRPST

0.4

0.6

0.4

0.6

0.4

0.6

0.4

0.6

tCK

CK to valid DQS-in

tDQSS

0.75

1.25

0.75

1.25

0.75

1.25

0.75

1.25

tCK

DQS-in setup time

tWPRES

DQS-in hold time

tWPRE

0.25

tCK

DQS falling edge to CK rising-setup time

tDSS

0.2

tCK

DQS falling edge from CK rising-hold time

tDSH

0.2

tCK

DQS-in high level width

tDQSH

0.35

tCK

DQS-in low level width

tDQSL

0.35

tCK

DQS-in cycle time

tDSC

0.9

1.1

0.9

1.1

0.9

1.1

0.9

1.1

tCK

Address and Control Input setup time(fast)

tIS

0.75

0.9

1.1

Address and Control Input hold time(fast)

tIH

0.75

0.9

1.1

Address and Control Input setup time(slow)

tIS

0.8

1.0

1.1

Address and Control Input hold time(slow)

tIH

0.8

1.0

1.1

Data-out high impedence time from CK/CK

tHZ

-0.7

+0.7

-0.75

+0.75

-0.75

+0.75

-0.8

+0.8

Data-out low impedence time from CK/CK

tLZ

-0.7

+0.7

-0.75

+0.75

-0.75

+0.75

-0.8

+0.8

Input Slew Rate(for input only pins)

tSL(I)

0.5

V/ns

Input Slew Rate(for I/O pins)

tSL(IO)

0.5

V/ns

Output Slew Rate(x4,x8)

tSL(O)

1.0

4.5

1.0

4.5

1.0

4.5

1.0

4.5

V/ns

Output Slew Rate Matching Ratio(rise to fall)

tSLMR

0.67

1.5

0.67

1.5

0.67

1.5

0.67

1.5

- 46 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

1. Maximum burst refresh cycle : 8
2. The specific requirement is that DQS be valid(High or Low) on or before this CK edge. The case shown(DQS going from
High_Z to logic Low) applies when no writes were previously in progress on the bus. If a previous write was in progress,
DQS could be High at this time, depending on tDQSS.
3. The maximum limit for this parameter is not a device limit. The device will operate with a great value for this parameter,
but system performance (bus turnaround) will degrade accordingly.
4. A write command can be applied with t

RCD

satisfied after this command.

5. For registered DIMMs, t

and t

are

45% of the period including both the half period jitter (t

JIT(HP)

) of the PLL and the half period

jitter due to crosstalk (t

JIT

(crosstalk)

) on the DIMM.

6. Input Setup/Hold Slew Rate Derating

This derating table is used to increase t

in the case where the input slew rate is below 0.5V/ns. Input setup/hold slew rate

based on the lesser of AC-AC slew rate and DC-DC slew rate.

7. I/O Setup/Hold Slew Rate Derating

This derating table is used to increase t

D S

in the case where the I/O slew rate is below 0.5V/ns. I/O setup/hold slew rate

based on the lesser of AC-AC slew rate and DC-DC slew rate.

Parameter

Symbol

-TCB3

(DDR333)

-TCA2

(DDR266A)

-TCB0

(DDR266B)

-TCA0

(DDR200)

Unit Note

Min

Max

Min

Max

Min

Max

Min

Max

Mode register set cycle time

tMRD

DQ & DM setup time to DQS

tDS

0.45

0.5

0.6

7,8,9

DQ & DM hold time to DQS

tDH

0.45

0.5

0.6

7,8,9

Control & Address input pulse width

tIPW

2.2

2.5

DQ & DM input pulse width

tDIPW

1.75

Power down exit time

tPDEX

7.5

Exit self refresh to non-Read command

tXSNR

Exit self refresh to read command

tXSRD

200

tCK

Refresh interval time

tREFI

15.6

Output DQS valid window

tQH

tHP

-tQHS

tHP

-tQHS

tHP

-tQHS

tHP

-tQHS

Clock half period

tHP

tCLmin

or tCHmin

tCLmin

or tCHmin

tCLmin

or tCHmin

tCLmin

or tCHmin

Data hold skew factor

tQHS

0.55

0.75

0.8

DQS write postamble time

tWPST

0.4

0.6

0.4

0.6

0.4

0.6

0.4

0.6

tCK

Active to Read with Auto precharge
command

tRAP

Autoprecharge write recovery +
Precharge time

tDAL

(tWR/tCK)

(tRP/tCK)

(tWR/tCK)

(tRP/tCK)

(tWR/tCK)

(tRP/tCK)

(tWR/tCK)

(tRP/tCK)

tCK

Input Setup/Hold Slew Rate

tIS

tIH

(V/ns)

(ps)

0.5

0.4

+50

0.3

+100

I/O Setup/Hold Slew Rate

tDS

tDH

(V/ns)

(ps)

0.5

0.4

+75

0.3

+150

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128Mb D-die(x16) DDR SDRAM

8. I/O Setup/Hold Plateau Derating

This derating table is used to increase tDS/tDH in the case where the input level is flat below VREF

�

310mV for a duration of

up to 2ns.
9. I/O Delta Rise/Fall Rate(1/slew-rate) Derating

This derating table is used to increase t

in the case where the DQ and DQS slew rates differ. The Delta Rise/Fall Rate

is calated as 1/SlewRate1-1/SlewRate2. For example, if slew rate 1 = 5V/ns and slew rate 2 =.4V/ns then the Delta Rise/Fall
Rate =-0/5ns/V. Input S/H slew rate based on larger of AC-AC delta rise/fall rate and DC-DC delta rise/fall rate.
10. This parameter is fir system simulation purpose. It is guranteed by design.
11. For each of the terms, if not already an integer, round to the next highest integer. tCK is actual to the system clock cyc le time.

I/O Input Level

tDS

tDH

(mV)

(ps)

�

280

+50

Delta Rise/Fall Rate

tDS

tDH

(ns/V)

(ps)

�

0.25

+50

�

0.5

+100

The following table specifies derating values for the specifications listed if the single-ended clock skew rate is less than 1.0V/ns.

CK slew rate

(Single ended)

tIH/tIS

(ps)

tDSS/tDSH

(ps)

tAC/tDQSCK

(ps)

tLZ(min)

(ps)

tHZ(max)

(ps)

1.0V/ns

0.75V/ns

+50

-50

+50

0.5V/ns

+100

-100

+100

<Reference>

Table 16. AC timing parameter and specifications

- 48 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

9. AC Operating Test Conditions

=2.5V, V

DDQ

=2.5V, T

= 0 to 70

�

Parameter

Value

Unit

Note

Input reference voltage for Clock

0.5 * V

DDQ

Input signal maximum peak swing

1.5

Input Levels(V

)

REF

+0.31/V

REF

-0.31

Input timing measurement reference level

REF

Output timing measurement reference level

Output load condition

See Load Circuit

10. Input/Output Capacitance

=2.5, V

DDQ

=2.5V, T

= 25

�

f=1MHz)

Parameter

Symbol

Min

Max

Delta Cap(max)

Unit

Input capacitance
(A

~ A

, BA

~ BA

CKE, CS, RAS,CAS, WE)

IN1

3.0

0.5

Input capacitance(

CK, CK )

IN2

3.0

0.25

Data & DQS input/output capacitance

OUT

4.0

5.0

0.5

Input capacitance(DM)

IN3

4.0

5.0

Table 17. AC operating test conditions

Table 18. Input/output capacitance

Figure 26. Output Load Circuit (SSTL_2)

Output

Z0=50

LOAD

=30pF

REF

=0.5*V

DDQ

=50

=0.5*V

DDQ

- 49 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

11. IBIS: I/V Characteristics for Input and Output Buffers

Figure 27. I/V characteristics for input/output buffers:Pull up(above) and pull down(below)

11.1 Normal strength driver

1. The full variation in driver pulldown current from minimum to maximum process, temperature, and voltage will lie within the outer

bounding lines of the V-I curve of Figure a.

2. The full variation in driver pulldown current from minimum to maximum process, temperature and voltage will lie within the outer

bounding lines the of the V-I curve of Figure a.

3. The full variation in driver pullup current from minimum to maximun process, temperature, and voltage will lie within the outer

bounding lines of the V-I curve of Figure b.

4. The variation in the driver pullup current at nominal temperature and voltage is expected, but not guaranteed, to lie within the

inner boungding lines of the V-I curve of Figure b as

5. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1.7, for device drain to source

voltage from 0 to VDDQ/2

6. The Full variation in the ratio of the nominal pullup to pulldown current should be unity �10%, for device drain to source voltages

from 0 to VDDQ/2

Maximum

Typical High

Minumum

Vout(V)

I
o

t
(
m

)

-220

-200

-180

-160

-140

-120

-100

-80

-60

-40

-20

0.0

1.0

2.0

Minimum

Typical Low

Typical High

Maximum

100

120

140

160

0.0

0.5

1.0

1.5

2.0

2.5

I
o

t
(
m

)

Typical Low

Vout(V)

- 50 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Table 19. Pull down and pull up current values

Temperature (Tambient)

Typical 25

�

Minimum 70

�

Maximum 0

�

Vdd/Vddq

Typical

2.5V

Minimum 2.3V
Maximum 2.7V

The above characteristics are specified under best, worst and normal process variation/conditions

Pulldown Current (mA)

pullup Current (mA)

Voltage

(V)

Typical

Low

Typical

High

Minimum

Maximum

Typical

Low

Typical

High

Minimum

Maximum

0.1

6.0

6.8

4.6

9.6

-6.1

-7.6

-4.6

-10.0

0.2

12.2

13.5

9.2

18.2

-12.2

-14.5

-9.2

-20.0

0.3

18.1

20.1

13.8

26.0

-18.1

-21.2

-13.8

-29.8

0.4

24.1

26.6

18.4

33.9

-24.0

-27.7

-18.4

-38.8

0.5

29.8

33.0

23.0

41.8

-29.8

-34.1

-23.0

-46.8

0.6

34.6

39.1

27.7

49.4

-34.3

-40.5

-27.7

-54.4

0.7

39.4

44.2

32.2

56.8

-38.1

-46.9

-32.2

-61.8

0.8

43.7

49.8

36.8

63.2

-41.1

-53.1

-36.0

-69.5

0.9

47.5

55.2

39.6

69.9

-41.8

-59.4

-38.2

-77.3

1.0

51.3

60.3

42.6

76.3

-46.0

-65.5

-38.7

-85.2

1.1

54.1

65.2

44.8

82.5

-47.8

-71.6

-39.0

-93.0

1.2

56.2

69.9

46.2

88.3

-49.2

-77.6

-39.2

-100.6

1.3

57.9

74.2

47.1

93.8

-50.0

-83.6

-39.4

-108.1

1.4

59.3

78.4

47.4

99.1

-50.5

-89.7

-39.6

-115.5

1.5

60.1

82.3

47.7

103.8

-50.7

-95.5

-39.9

-123.0

1.6

60.5

85.9

48.0

108.4

-51.0

-101.3

-40.1

-130.4

1.7

61.0

89.1

48.4

112.1

-51.1

-107.1

-40.2

-136.7

1.8

61.5

92.2

48.9

115.9

-51.3

-112.4

-40.3

-144.2

1.9

62.0

95.3

49.1

119.6

-51.5

-118.7

-40.4

-150.5

2.0

62.5

97.2

49.4

123.3

-51.6

-124.0

-40.5

-156.9

2.1

62.9

99.1

49.6

126.5

-51.8

-129.3

-40.6

-163.2

2.2

63.3

100.9

49.8

129.5

-52.0

-134.6

-40.7

-169.6

2.3

63.8

101.9

49.9

132.4

-52.2

-139.9

-40.8

-176.0

2.4

64.1

102.8

50.0

135.0

-52.3

-145.2

-40.9

-181.3

2.5

64.6

103.8

50.2

137.3

-52.5

-150.5

-41.0

-187.6

2.6

64.8

104.6

50.4

139.2

-52.7

-155.3

-41.1

-192.9

2.7

65.0

105.4

50.5

140.8

-52.8

-160.1

-41.2

-198.2

- 51 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Figure 28. I/V characteristics for input/output buffers:Pull up(above) and pull down(below)

11.2 Weak strength driver

5. The full variation in the ratio of the maximum to minimum pullup and pulldown current will not exceed 1.7, for device drain to source

voltage from 0 to VDDQ/2

6. The Full variation in the ratio of the nominal pullup to pulldown current should be unity �10%, for device drain to source voltages

from 0 to VDDQ/2

Maximum

Typical High

Minumum

Vout(V)

I
o

t
(
m

)

-90

-80

-70

-60

-50

-40

-30

-20

-10

0.0

0.5

1.0

1.5

2.0

2.5

I
o
u

t
(
m

)

Minimum

Typical Low

Typical High

Maximum

0.0

0.5

1.0

1.5

2.0

2.5

I
o

t
(
m

)

Typical Low

1. The nominal pulldown V-I curve for DDR SDRAM devices will be within the inner bounding lines of the V-I curve of Figure a.

2. The full variation in driver pulldown current from minimum to maximum process, temperature and voltage will lie within the outer

bounding lines the of the V-I curve of Figure a.

3. Thenominal pullup V-I curve for DDR SDRAM devices will be within the inner bounding lines of the V-I curve of below Figure b.

4. The Full variation in driver pullup current from minimum to maximum process, temperature and voltage will lie within the outer

bounding lines of the V-I curve of Figrue b.

Vout(V)

- 52 -

REV. 0.6 Oct. 21. 2002

128Mb D-die(x16) DDR SDRAM

Temperature (Tambient)

Typical 25

�

Minimum 70

�

Maximum 0

�

Vdd/Vddq

Typical

2.5V

Minimum 2.3V
Maximum 2.7V

The above characteristics are specified under best, worst and normal process variation/conditions

Pulldown Current (mA)

pullup Current (mA)

Voltage

(V)

Typical

Low

Typical

High

Minimum

Maximum

Typical

Low

Typical

High

Minimum

Maximum

0.1

3.4

3.8

2.6

5.0

-3.5

-4.3

-2.6

-5.0

0.2

6.9

7.6

5.2

9.9

-6.9

-8.2

-5.2

-9.9

0.3

10.3

11.4

7.8

14.6

-10.3

-12.0

-7.8

-14.6

0.4

13.6

15.1

10.4

19.2

-13.6

-15.7

-10.4

-19.2

0.5

16.9

18.7

13.0

23.6

-16.9

-19.3

-13.0

-23.6

0.6

19.6

22.1

15.7

28.0

-19.4

-22.9

-15.7

-28.0

0.7

22.3

25.0

18.2

32.2

-21.5

-26.5

-18.2

-32.2

0.8

24.7

28.2

20.8

35.8

-23.3

-30.1

-20.4

-35.8

0.9

26.9

31.3

22.4

39.5

-24.8

-33.6

-21.6

-39.5

1.0

29.0

34.1

24.1

43.2

-26.0

-37.1

-21.9

-43.2

1.1

30.6

36.9

25.4

46.7

-27.1

-40.3

-22.1

-46.7

1.2

31.8

39.5

26.2

50.0

-27.8

-43.1

-22.2

-50.0

1.3

32.8

42.0

26.6

53.1

-28.3

-45.8

-22.3

-53.1

1.4

33.5

44.4

26.8

56.1

-28.6

-48.4

-22.4

-56.1

1.5

34.0

46.6

27.0

58.7

-28.7

-50.7

-22.6

-58.7

1.6

34.3

48.6

27.2

61.4

-28.9

-52.9

-22.7

-61.4

1.7

34.5

50.5

27.4

63.5

-28.9

-55.0

-22.7

-63.5

1.8

34.8

52.2

27.7

65.6

-29.0

-56.8

-22.8

-65.6

1.9

35.1

53.9

27.8

67.7

-29.2

-58.7

-22.9

-67.7

2.0

35.4

55.0

28.0

69.8

-29.2

-60.0

-22.9

-69.8

2.1

35.6

56.1

28.1

71.6

-29.3

-61.2

-23.0

-71.6

2.2

35.8

57.1

28.2

73.3

-29.5

-62.4

-23.0

-73.3

2.3

36.1

57.7

28.3

74.9

-29.5

-63.1

-23.1

-74.9

2.4

36.3

58.2

28.3

76.4

-29.6

-63.8

-23.2

-76.4

2.5

36.5

58.7

28.4

77.7

-29.7

-64.4

-23.2

-77.7

2.6

36.7

59.2

28.5

78.8

-29.8

-65.1

-23.3

-78.8

2.7

36.8

59.6

28.6

79.7

-29.9

-65.8

-23.3

-79.7

Table 20. Pull down and pull up current values

Электронный компонент: K4H281638D