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Электронный компонент: K4H560438D-NC

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- 1 -
256Mb sTSOPII
DDR SDRAM
Rev.0.0 May. '02
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Four banks operation
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
MRS cycle with address key programs
-. Read latency 2, 2.5 (clock)
-. Burst length (2, 4, 8)
-. Burst type (sequential & interleave)
All inputs except data & DM are sampled at the positive going edge of the system clock(CK)
Data I/O transactions on both edges of data strobe
Edge aligned data output, center aligned data input
DM for write masking only
Auto & Self refresh
7.8us refresh interval(8K/64ms refresh)
Maximum burst refresh cycle : 8
54pin sTSOP II package
Key Features
Operating Frequencies
*CL : Cas Latency
- B3(DDR333)
- A2(DDR266A)
- B0(DDR266B)
- A0(DDR200)
Speed @CL2
133MHz
133MHz
100MHz
100MHz
Speed @CL2.5
166MHz
133MHz
133MHz
-
DLL jitter
0.7ns
0.75ns
0.75ns
0.8ns
Part No.
Org.
Max Freq.
Interface
Package
K4H560438D-NC/LB3
64M x 4
B3(DDR333@CL=2.5)
SSTL2
54pin sTSOP II
K4H560438D-NC/LA2
A2(DDR266@CL=2)
K4H560438D-NC/LB0
B0(DDR266@CL=2.5)
K4H560438D-NC/LA0
A0(DDR200@CL=2)
K4H560838D-NC/LB3
32M x 8
B3(DDR333@CL=2.5)
SSTL2
54pin sTSOP II
K4H560838D-NC/LA2
A2(DDR266@CL=2)
K4H560838D-NC/LB0
B0(DDR266@CL=2.5)
K4H560838D-NC/LA0
A0(DDR200@CL=2)
ORDERING INFORMATION
- 2 -
256Mb sTSOPII
DDR SDRAM
Rev.0.0 May. '02
Package Pinout
54pin sTSOP II
DM is internally loaded to match DQ and DQS identically.
256Mb package Pinout
Column address configuration
VDD
1
54 PIN sTSOP(II)
300mil x 551mil
N C
2
VDDQ
3
DQ0
4
VSSQ
5
N C
6
VDDQ
7
DQ1
8
VSSQ
9
N C
10
VDDQ
11
N C
12
A3
20
A1
19
A0
18
AP/A10
17
BA1
16
BA0
15
WE
14
N C
13
CS
27
26
25
24
23
22
VDD
21
VSS
42
NC
41
VSSQ
40
DQ3
39
VDDQ
38
NC
37
VSSQ
36
DQ2
35
VDDQ
34
NC
33
VSSQ
32
DQS
31
A4
A7
A9
A11
CKE
28
DM
29
VREF
30
43
44
45
46
47
48
VSS
(0.5 mm PIN PITCH)
49
50
51
52
53
54
VDD
CAS
RAS
N C
A2
VSS
CK
CK
A12
A8
A6
A5
64Mb x 4
32Mb x 8
VSS
DQ7
VSSQ
DQ6
VDDQ
DQ5
VSSQ
DQ4
VDDQ
N C
VSSQ
DQS
A4
A7
A9
A11
CKE
D M
VREF
VSS
VSS
C K
C K
A12
A8
A6
A5
VDD
DQ0
VDDQ
DQ1
VSSQ
DQ2
VDDQ
DQ3
VSSQ
N C
VDDQ
N C
A3
A1
A0
AP/A10
BA1
BA0
WE
N C
CS
VDD
VDD
CAS
RAS
N C
A2
Bank Address
BA0-BA1
Row Address
A0-A12
Auto Precharge
A10
Organization
Column Address
64Mx4
A0-A9, A11
32Mx8
A0-A9
(7.62mm x 14.00mm)
- 3 -
256Mb sTSOPII
DDR SDRAM
Rev.0.0 May. '02
Bank Select
Timing Register
A
d
d
r
e
s
s

R
e
g
i
s
t
e
r
R
e
f
r
e
s
h

C
o
u
n
t
e
r
R
o
w

B
u
f
f
e
r
R
o
w

D
e
c
o
d
e
r
C
o
l
.

B
u
f
f
e
r
Data Input Register
Serial to parallel
8Mx8
8Mx8
8Mx8
8Mx8
S
e
n
s
e

A
M
P
2
-
b
i
t

p
r
e
f
e
t
c
h
O
u
t
p
u
t

B
u
f
f
e
r
I
/
O

C
o
n
t
r
o
l
Column Decoder
Latency & Burst Length
Programming Register
D
L
L
S
t
r
o
b
e
G
e
n
.
CK, CK
ADD
LCKE
CK, CK
CKE
CS
RAS
CAS
WE
DM
DM
CK, CK
LCAS
LRAS LCBR LWE
LWCBR
L
R
A
S
L
C
B
R
CK, CK
8
8
4
4
WE
DM
x4
DQi
Data Strobe
Block Diagram (16Mbit x 4 I/O x 4 Banks)
- 4 -
256Mb sTSOPII
DDR SDRAM
Rev.0.0 May. '02
Bank Select
Timing Register
A
d
d
r
e
s
s

R
e
g
i
s
t
e
r
R
e
f
r
e
s
h

C
o
u
n
t
e
r
R
o
w

B
u
f
f
e
r
R
o
w

D
e
c
o
d
e
r
C
o
l
.

B
u
f
f
e
r
Data Input Register
Serial to parallel
4Mx16
4Mx16
4Mx16
4Mx16
S
e
n
s
e

A
M
P
2
-
b
i
t

p
r
e
f
e
t
c
h
O
u
t
p
u
t

B
u
f
f
e
r
I
/
O

C
o
n
t
r
o
l
Column Decoder
Latency & Burst Length
Programming Register
D
L
L
S
t
r
o
b
e
G
e
n
.
CK, CK
ADD
LCKE
CK, CK
CKE
CS
RAS
CAS
WE
DM
DM
CK, CK
LCAS
LRAS LCBR LWE
LWCBR
L
R
A
S
L
C
B
R
CK, CK
16
16
8
8
WE
DM
x8
DQi
Data Strobe
Block Diagram (8Mbit x 8 I/O x 4 Banks)
- 5 -
256Mb sTSOPII
DDR SDRAM
Rev.0.0 May. '02
Input/Output Function Description
SYMBOL
TYPE
DESCRIPTION
CK, CK
Input
Clock : CK and CK are differential clock inputs. All address and control input signals are sam-
pled on the positive edge of CK and negative edge of CK. Output (read) data is referenced to
both edges of CK. Internal clock signals are derived from CK/CK.
CKE
Input
Clock Enable : CKE HIGH activates, and CKE LOW deactivates internal clock signals, and
device input buffers and output drivers. Deactivating the clock provides PRECHARGE
POWER-DOWN and SELF REFRESH operation (all banks idle), or ACTIVE POWER-DOWN
(row ACTIVE in any bank). CKE is synchronous for all functions except for disabling outputs,
which is achieved asynchronously. Input buffers, excluding CK, CK and CKE are disabled
during power-down and self refresh modes, providing low standby power. CKE will recognize
an LVCMOS LOW level prior to VREF being stable on power-up.
CS
Input
Chip Select : CS enables(registered LOW) and disables(registered HIGH) the command
decoder. All commands are masked when CS is registered HIGH. CS provides for external
bank selection on systems with multiple banks. CS is considered part of the command code.
RAS, CAS , WE
Input
Command Inputs : RAS , CAS and WE (along with CS) define the command being entered.
LDM,(U)DM
Input
Input Data Mask : DM is an input mask signal for write data. Input data is masked when DM is
sampled HIGH along with that input data during a WRITE access. DM is sampled on both
edges of DQS. DM pins include dummy loading internally, to matches the DQ and DQS load-
ing. For the x16, LDM corresponds to the data on DQ0-DQ7 ; UDM correspons to the data on
DQ8-DQ15.
BA0, BA1
Input
Bank Addres Inputs : BA0 and BA1 define to which bank an ACTIVE, READ, WRITE or PRE-
CHARGE command is being applied.
A [n : 0]
Input
Address Inputs : Provide the row address for ACTIVE commands, and the column address
and AUTO PRECHARGE bit for READ/WRITE commands, to select one location out of the
memory array in the respective bank. A10 is sampled during a PRECHARGE command to
determine whether the PRECHARGE applies to one bank (A10 LOW) or all banks (A10
HIGH). If only one bank is to be precharged, the bank is selected by BA0, BA1. The address
inputs also provide the op-code during a MODE REGISTER SET command. BA0 and BA1
define which mode register is loaded during the MODE REGISTER SET command (MRS or
EMRS).
DQ
I/O
Data Input/Output : Data bus
LDQS,(U)DQS
I/O
Data Strobe : Output with read data, input with write data. Edge-aligned with read data, cen-
tered in write data. Used to capture write data. For the x16, LDQS corresponds to the data on
DQ0-DQ7 ; UDQS corresponds to the data on DQ8-DQ15.
NC
-
No Connect : No internal electrical connection is present.
V
D D
Q
Supply
DQ Power Supply : +2.5V
0.2V.
V
SS
Q
Supply
DQ Ground.
V
D D
Supply
Power Supply : +2.5V
0.2V (device specific).
V
SS
Supply
Ground.
V
REF
Input
SSTL_2 reference voltage.