K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
3.0V & 3.3V power supply.
LVCMOS compatible with multiplexed address.
Four banks operation.
MRS cycle with address key programs.
-. CAS latency (1, 2 & 3).
-. Burst length (1, 2, 4, 8 & Full page).
-. Burst type (Sequential & Interleave).
EMRS cycle with address key programs.
All inputs are sampled at the positive going edge of the system
clock.
Burst read single-bit write operation.
Special Function Support.
-. PASR (Partial Array Self Refresh).
-. Internal TCSR (Temperature Compensated Self Refresh)
DQM for masking.
Auto refresh.
64ms refresh period (4K cycle).
Commercial Temperature Operation (-25
C ~ 70
C).
Extended Temperature Operation (-25
C ~ 85
C).
90Balls FBGA with 0.8mm ball pitch
( -FXXX : Leaded, -HXXX : Lead Free).
FEATURES
The K4S283233F is 134,217,728 bits synchronous high data
rate Dynamic RAM organized as 4 x 1,048,576 words by 32 bits,
fabricated with SAMSUNG's high performance CMOS technol-
ogy. Synchronous design allows precise cycle control with the
use of system clock and I/O transactions are possible on every
clock cycle. Range of operating frequencies, programmable
burst lengths and programmable latencies allow the same
device to be useful for a variety of high bandwidth and high per-
formance memory system applications.
GENERAL DESCRIPTION
ORDERING INFORMATION
- F(H)E/N/G : Normal / Low/ Low Power, Extended Temperature(-25
C ~ 85
C)
- F(H)C/L/F : Normal / Low / Low Power, Commercial Temperature(-25
C ~ 70
C)
NOTES :
1. In case of 40MHz Frequency, CL1 can be supported.
2. Samsung are not designed or manufactured for use in a device or system that is used under circumstance in which human life is potentially at stake.
Please contact to the memory marketing team in samsung electronics when considering the use of a product contained herein for any specific
purpose, such as medical, aerospace, nuclear, military, vehicular or undersea repeater use.
Part No.
Max Freq.
Interface
Package
K4S283233F-F(H)E/N/G/C/L/F60
166MHz(CL=3)
LVCMOS
90 FBGA
Leaded (Lead Free)
K4S283233F-F(H)E/N/G/C/L/F75
133MHz(CL=3)
K4S283233F-F(H)E/N/G/C/L/F1H
105MHz(CL=2)
K4S283233F-F(H)E/N/G/C/L/F1L
105MHz(CL=3)
*1
1M x 32Bit x 4 Banks Mobile SDRAM in 90FBGA
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
Bank Select
Data Input Register
1M x 32
1M x 32
Sense AMP
Output Buf
f
er
I/O Con
t
rol
Column Decoder
Latency & Burst Length
Programming Register
Addr
ess Re
gister
Ro
w
Bu
f
f
e
r
R
e
fresh Counte
r
Row Deco
der
C
ol.
Buf
f
er
LR
AS
LC
BR
LCKE
LRAS
LCBR
LWE
LDQM
CLK
CKE
CS
RAS
CAS
WE
DQM
LWE
LDQM
DQi
CLK
ADD
LCAS
LWCBR
1M x 32
1M x 32
Timing Register
FUNCTIONAL BLOCK DIAGRAM
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
90Ball(6x15) FBGA
1
2
3
7
8
9
A
DQ26
DQ24
V
SS
V
DD
DQ23
DQ21
B
DQ28
V
DDQ
V
SSQ
V
DDQ
V
SSQ
DQ19
C
V
SSQ
DQ27
DQ25
DQ22
DQ20
V
DDQ
D
V
SSQ
DQ29
DQ30
DQ17
DQ18
V
DDQ
E
V
DDQ
DQ31
NC
NC
DQ16
V
SSQ
F
V
SS
DQM3
A3
A2
DQM2
V
DD
G
A4
A5
A6
A10
A0
A1
H
A7
A8
NC
NC
BA1
A11
J
CLK
CKE
A9
BA0
CS
RAS
K
DQM1
NC
NC
CAS
WE
DQM0
L
V
DDQ
DQ8
V
SS
V
DD
DQ7
V
SSQ
M
V
SSQ
DQ10
DQ9
DQ6
DQ5
V
DDQ
N
V
SSQ
DQ12
DQ14
DQ1
DQ3
V
DDQ
P
DQ11
V
DDQ
V
SSQ
V
DDQ
V
SSQ
DQ4
R
DQ13
DQ15
V
SS
V
DD
DQ0
DQ2
Pin Name
Pin Function
CLK
System Clock
CS
Chip Select
CKE
Clock Enable
A
0
~ A
11
Address
BA
0
~ BA
1
Bank Select Address
RAS
Row Address Strobe
CAS
Column Address Strobe
WE
Write Enable
DQM
0
~ DQM
3
Data Input/Output Mask
DQ
0
~
31
Data Input/Output
V
DD
/V
SS
Power Supply/Ground
V
DDQ
/V
SSQ
Data Output Power/Ground
Package Dimension and Pin Configuration
< Bottom View
*1
>
< Top View
*2
>
< Top View
*2
>
Symbol
Min
Typ
Max
A
-
1.10
1.20
A
1
0.30
0.35
0.40
E
-
8.00
-
E
1
-
6.40
-
D
-
13.00
-
D
1
-
11.20
-
e
-
0.80
-
b
0.40
0.45
0.50
z
-
-
0.10
[Unit:mm]
5
2
1
6
3
4
8
9
7
F
E
D
C
B
J
H
G
A
e
D
D/2
D
1
E
1
E
E/2
z
b
Substrate(2Layer)
#A1 Ball Origin Indicator
M
L
K
R
P
N
K4S283233F-XXXX
SAMSUNG W
eek
A
A1
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
DC OPERATING CONDITIONS
CAPACITANCE
(V
DD
= 3.0V & 3.3V, T
A
= 23
C, f = 1MHz, V
REF
=0.9V
50 mV)
Pin
Symbol
Min
Max
Unit
Note
Clock
C
CLK
-
4.0
pF
RAS, CAS, WE, CS, CKE
C
IN
-
4.0
pF
DQM
C
IN
-
4.0
pF
Address
C
ADD
-
4.0
pF
DQ
0
~ DQ
31
C
OUT
-
6.0
pF
ABSOLUTE MAXIMUM RATINGS
NOTES:
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.
Functional operation should be restricted to recommended operating condition.
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.
Parameter
Symbol
Value
Unit
Voltage on any pin relative to V
ss
V
IN
, V
OUT
-1.0 ~ 4.6
V
Voltage on V
DD
supply relative to V
ss
V
DD
, V
DDQ
-1.0 ~ 4.6
V
Storage temperature
T
STG
-55 ~ +150
C
Power dissipation
P
D
1.0
W
Short circuit current
I
OS
50
mA
Recommended operating conditions (Voltage referenced to V
SS
= 0V, T
A
= -25 to 85
C for Extended, -25 to 70
C for Commercial)
NOTES :
1. VIH (max) = 5.3V AC.The overshoot voltage duration is
3ns.
2. VIL (min) = -2.0V AC. The undershoot voltage duration is
3ns.
3. Any input 0V
VIN
VDDQ.
Input leakage currents include Hi-Z output leakage for all bi-directional buffers with tri-state outputs.
4. Dout is disabled, 0V
VOUT
VDDQ.
Parameter
Symbol
Min
Typ
Max
Unit
Note
Supply voltage
V
DD
2.7
3.0
3.6
V
V
DDQ
2.7
3.0
3.6
V
Input logic high voltage
V
IH
2.2
3.0
V
DDQ
+ 0.3
V
1
Input logic low voltage
V
IL
-0.3
0
0.5
V
2
Output logic high voltage
V
OH
2.4
-
-
V
I
OH
= -2mA
Output logic low voltage
V
OL
-
-
0.4
V
I
OL
= 2mA
Input leakage current
I
LI
-10
-
10
uA
3
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
DC CHARACTERISTICS
Recommended operating conditions (Voltage referenced to V
SS
= 0V, T
A
= -25 to 85
C for Extended, -25 to 70
C for Commercial)
NOTES:
1. Measured with outputs open.
2. Refresh period is 64ms.
3. Internal TCSR can be supported.
In commercial Temp : Max 40
C/Max 70
C, In extended Temp : Max 40
C/Max 85
C
4. K4S283233F-F(H)E/C**
5. K4S283233F-F(H)N/L**
6. K4S283233F-F(H)G/F**
7. Unless otherwise noted, input swing IeveI is CMOS(VIH /VIL=VDDQ/VSSQ).
Parameter
Symbol
Test Condition
Version
Unit
Note
-60
-75
-1H
-1L
Operating Current
(One Bank Active)
I
CC1
Burst length = 1
t
RC
t
RC
(min)
I
O
= 0 mA
100
85
85
80
mA
1
Precharge Standby Current
in power-down mode
I
CC2
P
CKE
V
IL
(max), t
CC
= 10ns
0.5
mA
I
CC2
PS CKE & CLK
V
IL
(max), t
CC
=
0.5
Precharge Standby Current
in non power-down mode
I
CC2
N
CKE
V
IH
(min), CS
V
IH
(min), t
CC
= 10ns
Input signals are changed one time during
20ns
16
mA
I
CC2
NS
CKE
V
IH
(min), CLK
V
IL
(max), t
CC
=
Input signals are stable
8
Active Standby Current
in power-down mode
I
CC3
P
CKE
V
IL
(max), t
CC
= 10ns
5
mA
I
CC3
PS CKE & CLK
V
IL
(max), t
CC
=
5
Active Standby Current
in non power-down mode
(One Bank Active)
I
CC3
N
CKE
V
IH
(min), CS
V
IH
(min), t
CC
= 10ns
Input signals are changed one time during
20ns
26
mA
I
CC3
NS
CKE
V
IH
(min), CLK
V
IL
(max), t
CC
=
Input signals are stable
22
mA
Operating Current
(Burst Mode)
I
CC
4
I
O
= 0 mA
Page burst
4Banks Activated
t
CCD
= 2CLKs
110
85
80
80
mA
1
Refresh Current
I
CC
5
t
RC
t
RC
(min)
180
160
150
130
mA
2
Self Refresh Current
I
CC
6
CKE
0.2V
-E/C
1500
uA
4
-N/L
800
5
-G/F
Internal TCSR
Max 40
Max 85/70
C
3
Full Array
500
800
uA
6
1/2 of Full Array
460
650
1/4 of Full Array
440
550
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
AC OPERATING TEST CONDITIONS
(V
DD
= 2.7V
3.6V, T
A
= -25 to 85
C for Extended, -25 to 70
C for Commercial)
Parameter
Value
Unit
AC input levels (Vih/Vil)
2.4 / 0.4
V
Input timing measurement reference level
1.4
V
Input rise and fall time
tr/tf = 1/1
ns
Output timing measurement reference level
1.4
V
Output load condition
See Figure 2
VDDQ
1200
870
Output
30pF
VOH (DC) = 2.4V, IOH = -2mA
VOL (DC) = 0.4V, IOL = 2mA
Vtt=0.5 x VDDQ
50
Output
30pF
Z0=50
Figure 2. AC Output Load Circuit
Figure 1. DC Output Load Circuit
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
OPERATING AC PARAMETER
(AC operating conditions unless otherwise noted)
NOTES:
1. The minimum number of clock cycles is determined by dividing the minimum time required with clock cycle time and then rounding off to the next
higher integer.
2. Minimum delay is required to complete write.
3. Minimum tRDL=2CLK and tDAL(= tRDL + tRP) is required to complete both of last data write command(tRDL) and precharge command(tRP).
4. All parts allow every cycle column address change.
5. In case of row precharge interrupt, auto precharge and read burst stop.
Parameter
Symbol
Version
Unit
Note
-60
-75
-1H
-1L
Row active to row active delay
t
RRD
(min)
12
15
19
19
ns
1
RAS to CAS delay
t
RCD
(min)
18
19
19
24
ns
1
Row precharge time
t
RP
(min)
18
19
19
24
ns
1
Row active time
t
RAS
(min)
42
45
50
60
ns
1
t
RAS
(max)
100
us
Row cycle time
t
RC
(min)
60
64
69
84
ns
1
Last data in to row precharge
t
RDL
(min)
2
CLK
2
Last data in to Active delay
t
DAL
(min)
tRDL + tRP
-
3
Last data in to new col. address delay
t
CDL
(min)
1
CLK
2
Last data in to burst stop
t
BDL
(min)
1
CLK
2
Col. address to col. address delay
t
CCD
(min)
1
CLK
4
Number of valid output data
CAS latency=3
2
ea
5
Number of valid output data
CAS latency=2
-
1
Number of valid output data
CAS latency=1
-
0
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
AC CHARACTERISTICS
(AC operating conditions unless otherwise noted)
NOTES :
1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf) = 1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
Parameter
Symbol
- 60
- 75
-1H
-1L
Unit
Note
Min
Max
Min
Max
Min
Max
Min
Max
CLK cycle time
CAS latency=3
t
CC
6.0
1000
7.5
1000
9.5
1000
9.5
1000
ns
1
CAS latency=2
t
CC
-
9.5
9.5
12
CAS latency=1
t
CC
-
-
-
25
CLK to valid output delay
CAS latency=3
t
SAC
5.4
6
7
7
ns
1,2
CAS latency=2
t
SAC
-
7
7
8
CAS latency=1
t
SAC
-
-
-
20
Output data hold time
CAS latency=3
t
OH
2.5
2.5
2.5
2.5
ns
2
CAS latency=2
t
OH
-
2.5
2.5
2.5
CAS latency=1
t
OH
-
-
-
2.5
CLK high pulse width
t
CH
2.5
2.5
3
3
ns
3
CLK low pulse width
t
CL
2.5
2.5
3
3
ns
3
Input setup time
t
SS
2.0
2.0
2.5
2.5
ns
3
Input hold time
t
SH
1.0
1.0
1.5
1.5
ns
3
CLK to output in Low-Z
t
SLZ
1
1
1
1
ns
2
CLK to output in Hi-Z
CAS latency=3
t
SHZ
5.4
6
7
7
ns
CAS latency=2
-
7
7
8
CAS latency=1
-
-
-
20
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
SIMPLIFIED TRUTH TABLE
(V=Valid, X=Don
t Care, H=Logic High, L=Logic Low)
NOTES :
1. OP Code : Operand Code
A0 ~ A11 & BA0 ~ BA1 : Program keys. (@MRS)
2. MRS can be issued only at all banks precharge state.
A new command can be issued after 2 CLK cycles of MRS.
3. Auto refresh functions are the same as CBR refresh of DRAM.
The automatical precharge without row precharge command is meant by "Auto".
Auto/self refresh can be issued only at all banks precharge state.
Partial self refresh can be issued only after setting partial self refresh mode of EMRS.
4. BA0 ~ BA1 : Bank select addresses.
5. During burst read or write with auto precharge, new read/write command can not be issued.
Another bank read/write command can be issued after the end of burst.
New row active of the associated bank can be issued at tRP after the end of burst.
6. Burst stop command is valid at every burst length.
7. DQM sampled at the positive going edge of CLK masks the data-in at that same CLK in write operation (Write DQM latency is 0), but in read operation,
it makes the data-out Hi-Z state after 2 CLK cycles. (Read DQM latency is 2).
COMMAND
CKEn-1 CKEn
CS
RAS CAS
WE DQM BA0,1 A10/AP
A11,
A9 ~ A0
Note
Register
Mode Register Set
H
X
L
L
L
L
X
OP CODE
1, 2
Refresh
Auto Refresh
H
H
L
L
L
H
X
X
3
Self
Refresh
Entry
L
3
Exit
L
H
L
H
H
H
X
X
3
H
X
X
X
3
Bank Active & Row Addr.
H
X
L
L
H
H
X
V
Row Address
Read &
Column Address
Auto Precharge Disable
H
X
L
H
L
H
X
V
L
Column
Address
(A0~A7)
4
Auto Precharge Enable
H
4, 5
Write &
Column Address
Auto Precharge Disable
H
X
L
H
L
L
X
V
L
Column
Address
(A0~A7)
4
Auto Precharge Enable
H
4, 5
Burst Stop
H
X
L
H
H
L
X
X
6
Precharge
Bank Selection
H
X
L
L
H
L
X
V
L
X
All Banks
X
H
Clock Suspend or
Active Power Down
Entry
H
L
H
X
X
X
X
X
L
V
V
V
Exit
L
H
X
X
X
X
X
Precharge Power Down
Mode
Entry
H
L
H
X
X
X
X
X
L
H
H
H
Exit
L
H
H
X
X
X
X
L
V
V
V
DQM
H
X
V
X
7
No Operation Command
H
X
H
X
X
X
X
X
L
H
H
H
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
Normal MRS Mode
Test Mode
CAS Latency
Burst Type
Burst Length
A8
A7
Type
A6
A5
A4
Latency
A3
Type
A2
A1
A0
BT=0
BT=1
0
0
Mode Register Set
0
0
0
Reserved
0
Sequential
0
0
0
1
1
0
1
Reserved
0
0
1
1
1
Interleave
0
0
1
2
2
1
0
Reserved
0
1
0
2
Mode Select
0
1
0
4
4
1
1
Reserved
0
1
1
3
BA1 BA0
Mode
0
1
1
8
8
Write Burst Length
1
0
0
Reserved
0
0
Setting
for Nor-
mal MRS
1
0
0
Reserved
Reserved
A9
Length
1
0
1
Reserved
1
0
1
Reserved
Reserved
0
Burst
1
1
0
Reserved
1
1
0
Reserved
Reserved
1
Single Bit
1
1
1
Reserved
1
1
1
Full Page
Reserved
Register Programmed with Normal MRS
Address
BA0 ~ BA1
A11 ~ A10/AP
A9
*2
A8
A7
A6
A5
A4
A3
A2
A1
A0
Function
"0" Setting for
Normal MRS
RFU
*1
W.B.L
Test Mode
CAS Latency
BT
Burst Length
A. MODE REGISTER FIELD TABLE TO PROGRAM MODES
Register Programmed with Extended MRS
Address
BA1
BA0
A11 ~ A10/AP
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
Function
Mode Select
RFU
*1
DS
RFU
*1
PASR
NOTES:
1. RFU(Reserved for future use) should stay "0" during MRS cycle.
2. If A9 is high during MRS cycle, "Burst Read Single Bit Write" function will be enabled.
Mode Select
Driver Strength
PASR
BA1
BA0
Mode
A6
A5
Driver Strength
A2
A1
A0
Size of Refreshed
0
0
Normal MRS
0
0
Full
0
0
0
Full Array
0
1
Reserved
0
1
1/2
0
0
1
1/2 of Full Array
1
0
EMRS for Mobile SDRAM
1
0
Reserved
0
1
0
1/4 of Full Array
1
1
Reserved
1
1
Reserved
0
1
1
Reserved
Reserved Address
1
0
0
Reserved
A11~A10/AP
A9
A8
A7
A4
A3
1
0
1
Reserved
0
0
0
0
0
0
1
1
0
Reserved
1
1
1
Reserved
EMRS for PASR(Partial Array Self Ref.) & DS(Driver Strength)
Full Page Length x32 : 128Mb(256)
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
1. In order to save power consumption, Mobile SDRAM has PASR option.
2. Mobile SDRAM supports 3 kinds of PASR in self refresh mode Full Array, 1/2 of Full Array and 1/4 of Full Array.
BA1=0
Partial Self Refresh Area
1. In order to save power consumption, Mobile-DRAM includes the internal temperature sensor and control units to control the self
refresh cycle automatically according to the two temperature range : Max 40
C and Max 85
C(for Extended), Max 70
C(for
Commercial).
2. If the EMRS for external TCSR is issued by the controller, this EMRS code for TCSR is ignored.
Temperature Range
Self Refresh Current (Icc6)
Unit
- E/C
- N/L
- G/F
Full Array
1/2 of Full Array
1/4 of Full Array
Max 85/70
C
1500
800
800
650
550
uA
Max 40
C
500
460
440
BA0=0
BA1=0
BA0=0
BA1=0
BA0=1
BA1=1
BA0=1
BA1=1
BA0=0
BA1=1
BA0=1
BA1=1
BA0=0
BA1=0
BA0=1
BA1=0
BA0=0
BA1=0
BA0=1
BA1=1
BA0=1
BA1=1
BA0=0
Partial Array Self Refresh
Temperature Compensated Self Refresh
B. POWER UP SEQUENCE
1. Apply power and attempt to maintain CKE at a high state and all other inputs may be undefined.
- Apply VDD before or at the same time as VDDQ.
2. Maintain stable power, stable clock and NOP input condition for a minimum of 200us.
3. Issue precharge commands for all banks of the devices.
4. Issue 2 or more auto-refresh commands.
5. Issue a mode register set command to initialize the mode register.
6. Issue a extended mode register set command to define DS or PASR operating type of the device after normal MRS.
EMRS cycle is not mandatory and the EMRS command needs to be issued only when DS or PASR is used.
The default state without EMRS command issued is the full driver strength and full array refreshed.
The device is now ready for the operation selected by EMRS.
For operating with DS or PASR, set DS or PASR mode in EMRS setting stage.
In order to adjust another mode in the state of DS or PASR mode, additional EMRS set is required but power up sequence is not
needed again at this time. In that case, all banks have to be in idle state prior to adjusting EMRS set.
- Full Array
- 1/2 Array
- 1/4 Array
K4S283233F - F(H)E/N/G/C/L/F
February 2004
Mobile-SDRAM
C. BURST SEQUENCE
1. BURST LENGTH = 4
Initial Address
Sequential
Interleave
A1
A0
0
0
0
1
2
3
0
1
2
3
0
1
1
2
3
0
1
0
3
2
1
0
2
3
0
1
2
3
0
1
1
1
3
0
1
2
3
2
1
0
2. BURST LENGTH = 8
Initial Address
Sequential
Interleave
A2
A1
A0
0
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
0
0
1
1
2
3
4
5
6
7
0
1
0
3
2
5
4
7
6
0
1
0
2
3
4
5
6
7
0
1
2
3
0
1
6
7
4
5
0
1
1
3
4
5
6
7
0
1
2
3
2
1
0
7
6
5
4
1
0
0
4
5
6
7
0
1
2
3
4
5
6
7
0
1
2
3
1
0
1
5
6
7
0
1
2
3
4
5
4
7
6
1
0
3
2
1
1
0
6
7
0
1
2
3
4
5
6
7
4
5
2
3
0
1
1
1
1
7
0
1
2
3
4
5
6
7
6
5
4
3
2
1
0
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