CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
1
Document Title
128Kx8 bit Low Power CMOS Static RAM
Revision History
Revision No.
0.0
0.1
0.2
0.3
1.0
Remark
Preliminary
Preliminary
Preliminary
Preliminary
Final
History
Initial draft
Revised
- Deleted 32-TSOP1-0820R Package Type.
- Added Commercial product.
Revised
- Added Lead Free 32-SOP-525 Product
Revised
- Added Lead Free 32-TSOP1-0820F Product
Finalized
- Changed I
CC
from 10mA to 5mA
- Changed I
CC
2 from 35mA to 25mA
- Changed I
SB
from 3mA to 0.4mA
- Changed I
DR
(industrial)
from 15
A to 10
A
- Changed I
DR
(Automotive)
from 25
A to 20
A
Draft Data
July 15, 2002
December 4, 2002
May 13, 2003
June 21, 2003
September 16, 2003
The attached datasheets are provided by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserves the right to change the specifications and
products. SAMSUNG Electronics will answer to your questions. If you have any questions, please contact the SAMSUNG branch offices.
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
2
128Kx8 bit Low Power full CMOS Static RAM
GENERAL DESCRIPTION
The K6X1008C2D families are fabricated by SAMSUNG
s
advanced CMOS process technology. The families support
verious operating temperature ranges and have various pack-
age types for user flexibility of system design. The families
also support low data retention voltage for battery back-up
operation with low data retention current.
FEATURES
Process Technology: Full CMOS
Organization: 128K x 8
Power Supply Voltage: 4.5~5.5V
Low Data Retention Voltage: 2V(Min)
Three state output and TTL Compatible
Package Type: 32-DIP-600, 32-SOP-525,
32-SOP-525, 32-TSOP1-0820F
PIN DESCRIPTION
Name
Function
CS
1
, CS
2
Chip Select Input
OE
Output Enable Input
WE
Write Enable Input
I/O
1
~I/O
8
Data Inputs/Outputs
A
0
~A
16
Address Inputs
Vcc
Power
Vss
Ground
NC
No Connection
PRODUCT FAMILY
1. The parameters are tested with 50pF test load
Product Family
Operating
Temperature
Vcc Range
Speed
Power Dissipation
PKG Type
Standby
(I
SB1
, Max)
Operating
(I
CC2,
Max)
K6X1008C2D-B
Commercial(0~70
C)
4.5~5.5V
55
1)
/70ns
10
A
25mA
32-DIP-600, 32-SOP-525,
32-SOP-525
32-TSOP1-0820F
K6X1008C2D-F
Industrial(-40~85
C)
15
A
K6X1008C2D-Q
Automotive(-40~125
C)
25
A
32-SOP-525, 32-TSOP1-0820F
FUNCTIONAL BLOCK DIAGRAM
SAMSUNG ELECTRONICS CO., LTD. reserves the right to change products and specifications without notice.
Precharge circuit.
Memory array
I/O Circuit
Column select
Clk gen.
Row
select
I/O
1
Data
cont
Data
cont
I/O
8
CS
1
WE
OE
CS
2
Control
logic
A11
A9
A8
A13
WE
CS2
A15
VCC
NC
A16
A14
A12
A7
A6
A5
A4
OE
A10
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
VSS
I/O3
I/O2
I/O1
A0
A1
A2
A3
Type1-Forward
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NC
A16
A14
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O1
I/O2
I/O3
VSS
VCC
A15
CS2
WE
A13
A8
A9
A11
OE
A10
CS1
I/O8
I/O7
I/O6
I/O5
I/O4
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32-DIP
32-TSOP
32-SOP
Column Addresses
Row
addresses
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
3
PRODUCT LIST
1. Lead Free Product
Commercial Products(0~70
C)
Industrial Products(-40~85
C)
Automotive Products(-40~125
C)
Part Name
Function
Part Name
Function
Part Name
Function
K6X1008C2D-DB55
K6X1008C2D-DB70
K6X1008C2D-GB55
K6X1008C2D-GB70
K6X1008C2D-BB55
1)
K6X1008C2D-BB70
1)
K6X1008C2D-TB55
K6X1008C2D-TB70
K6X1008C2D-PB55
1)
K6X1008C2D-PB70
1)
32-DIP, 55ns, LL
32-DIP, 70ns, LL
32-SOP, 55ns, LL
32-SOP, 70ns, LL
32-SOP, 55ns, LL
32-SOP, 70ns, LL
32-TSOP-F, 55ns, LL
32-TSOP-F, 70ns, LL
32-TSOP-F, 55ns, LL
32-TSOP-F, 70ns, LL
K6X1008C2D-DF55
K6X1008C2D-DF70
K6X1008C2D-GF55
K6X1008C2D-GF70
K6X1008C2D-BF55
1)
K6X1008C2D-BF70
1)
K6X1008C2D-TF55
K6X1008C2D-TF70
K6X1008C2D-PF55
1)
K6X1008C2D-PF70
1)
32-DIP, 55ns, LL
32-DIP, 70ns, LL
32-SOP, 55ns, LL
32-SOP, 70ns, LL
32-SOP, 55ns, LL
32-SOP, 70ns, LL
32-TSOP-F, 55ns, LL
32-TSOP-F, 70ns, LL
32-TSOP-F, 55ns, LL
32-TSOP-F, 70ns, LL
K6X1008C2D-GQ55
K6X1008C2D-GQ70
K6X1008C2D-TQ55
K6X1008C2D-TQ70
32-SOP, 55ns, L
32-SOP, 70ns, L
32-TSOP-F, 55ns, L
32-TSOP-F, 70ns, L
FUNCTIONAL DESCRIPTION
1. X means don
t care (Must be in high or low states)
CS
1
CS
2
OE
WE
I/O
Mode
Power
H
X
1)
X
1)
X
1)
High-Z
Deselected
Standby
X
1)
L
X
1)
X
1)
High-Z
Deselected
Standby
L
H
H
H
High-Z
Output Disabled
Active
L
H
L
H
Dout
Read
Active
L
H
X
1)
L
Din
Write
Active
ABSOLUTE MAXIMUM RATINGS
1)
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation should be
restricted to recommended operating condition. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Item
Symbol
Ratings
Unit
Remark
Voltage on any pin relative to Vss
V
IN
,V
OUT
-0.5 to V
CC+
0.5V(Max. 7.0V)
V
-
Voltage on Vcc supply relative to Vss
V
CC
-0.3 to 7.0
V
-
Power Dissipation
P
D
1.0
W
-
Storage temperature
T
STG
-65 to 150
C
-
Operating Temperature
T
A
0 to 70
C
K6X1008C2D-B
-40 to 85
C
K6X1008C2D-F
-40 to 125
C
K6X1008C2D-Q
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
4
RECOMMENDED DC OPERATING CONDITIONS
1)
Note:
1. Commercial Product: T
A
=0 to 70
C, Otherwise specified
Industrial Product: T
A
=-40 to 85
C, Otherwise specified
Automotive Product: T
A
=-40 to 125
C, Otherwise specified
2. Overshoot: Vcc+3.0V in case of pulse width
30ns.
3. Undershoot: -3.0V in case of pulse width
30ns.
4. Overshoot and undershoot are sampled, not 100% tested.
Item
Symbol
Min
Typ
Max
Unit
Supply voltage
Vcc
4.5
5.0
5.5
V
Ground
Vss
0
0
0
V
Input high voltage
V
IH
2.2
-
Vcc+0.5
2)
V
Input low voltage
V
IL
-0.5
3)
-
0.8
V
CAPACITANCE
1
)
(f=1MHz, TA=25
C)
1. Capacitance is sampled, not 100% tested
Item
Symbol
Test Condition
Min
Max
Unit
Input capacitance
C
IN
V
IN
=0V
-
8
pF
Input/Output capacitance
C
IO
V
IO
=0V
-
10
pF
DC AND OPERATING CHARACTERISTICS
Item
Symbol
Test Conditions
Min Typ Max Unit
Input leakage current
I
LI
V
IN
=Vss to Vcc
-1
-
1
A
Output leakage current
I
LO
CS
1
=V
IH
or CS
2
=V
IL
or OE=V
IH
or WE=V
IL
, V
IO
=Vss to Vcc
-1
-
1
A
Operating power supply current
I
CC
I
IO
=0mA, CS
1
=V
IL
, CS
2
=V
IH,
V
IN
=V
IH
or V
IL
, Read
-
-
5
mA
Average operating current
I
CC1
Cycle time=1
s,
100%duty, I
IO
=0mA, CS
1
0.2V, CS
2
Vcc-0.2V,
V
IN
0.2V or V
IN
V
CC
-0.2V
-
-
7
mA
I
CC2
Cycle time=Min, 100% duty,
I
IO
=0mA, CS
1
=V
IL
, CS
2
=V
IH,
V
IN
=V
IH
or V
IL
-
-
25
mA
Output low voltage
V
OL
I
OL
=2.1mA
-
-
0.4
V
Output high voltage
V
OH
I
OH
=-1.0mA
2.4
-
-
V
Standby Current(TTL)
I
SB
CS
1
=V
IH
, CS2=V
IL
, Other inputs=V
IH
or V
IL
-
-
0.4
mA
Standby Current(CMOS)
I
SB1
CS
1
Vcc-0.2V, CS
2
Vcc-0.2V or
CS
2
0.2V, Other inputs=0~Vcc
K6X1008C2D-B
-
-
10
A
K6X1008C2D-F
-
-
15
A
K6X1008C2D-Q
-
-
25
A
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
5
AC CHARACTERISTICS
(V
CC
=4.5~5.5V, Commercial product: T
A
=0 to 70
C, Industrial product: T
A
=-40 to 85
C, Automotive product: T
A
=-40~125
C
)
Parameter List
Symbol
Speed Bins
Units
55ns
70ns
Min
Max
Min
Max
Read
Read Cycle Time
t
RC
55
-
70
-
ns
Address Access Time
t
AA
-
55
-
70
ns
Chip Select to Output
t
CO
-
55
-
70
ns
Output Enable to Valid Output
t
OE
-
25
-
35
ns
Chip Select to Low-Z Output
t
LZ
10
-
10
-
ns
Output Enable to Low-Z Output
t
OLZ
5
-
5
-
ns
Chip Disable to High-Z Output
t
HZ
0
20
0
25
ns
Output Disable to High-Z Output
t
OHZ
0
20
0
25
ns
Output Hold from Address Change
t
OH
10
-
10
-
ns
Write
Write Cycle Time
t
WC
55
-
70
-
ns
Chip Select to End of Write
t
CW
45
-
60
-
ns
Address Set-up Time
t
AS
0
-
0
-
ns
Address Valid to End of Write
t
AW
45
-
60
-
ns
Write Pulse Width
t
WP
40
-
50
-
ns
Write Recovery Time
t
WR
0
-
0
-
ns
Write to Output High-Z
t
WHZ
0
20
0
25
ns
Data to Write Time Overlap
t
DW
20
-
25
-
ns
Data Hold from Write Time
t
DH
0
-
0
-
ns
End Write to Output Low-Z
t
OW
5
-
5
-
ns
C
L
1)
1. Including scope and jig capacitance
AC OPERATING CONDITIONS
TEST CONDITIONS
( Test Load and Input/Output Reference)
Input pulse level: 0.8 to 2.4V
Input rising and falling time: 5ns
Input and output reference voltage:1.5V
Output load(see right): C
L
=100pF+1TTL
C
L
=50pF+1TTL
DATA RETENTION CHARACTERISTICS
1. CS
1
Vcc-0.2V
,
CS
2
V
CC
-0.2V, or CS
2
0.2V
Item
Symbol
Test Condition
Min
Typ
Max
Unit
Vcc for data retention
V
DR
CS
1
Vcc-0.2V
1)
2.0
-
5.5
V
Data retention current
I
DR
Vcc=3.0V, CS
1
Vcc-0.2V
1)
K6X1008C2D-B
-
-
10
A
K6X1008C2D-F
-
-
10
A
K6X1008C2D-Q
-
-
20
A
Data retention set-up time
t
SDR
See data retention waveform
0
-
-
ms
Recovery time
t
RDR
5
-
-
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
6
Address
Data Out
Previous Data Valid
Data Valid
TIMING DIAGRAMS
TIMING WAVEFORM OF READ CYCLE(1)
(Address Controlled
,
CS1=OE=V
IL
, CS2=WE=V
IH
)
t
AA
t
RC
t
OH
TIMING WAVEFORM OF READ CYCLE(2)
(WE=V
IH
)
Data Valid
High-Z
CS
1
Address
OE
Data out
NOTES (READ CYCLE)
1.
t
HZ
and
t
OHZ
are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage
levels.
2. At any given temperature and voltage condition,
t
HZ
(Max.) is less than
t
LZ
(Min.) both for a given device and from device to device
interconnection.
CS
2
t
OH
t
AA
t
OLZ
t
LZ
t
OHZ
t
HZ(1,2)
t
RC
t
CO2
t
OE
t
CO1
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
7
TIMING WAVEFORM OF WRITE CYCLE(2)
(CS
1
Controlled)
Address
CS
1
t
WC
t
WR(4)
t
AS(3)
t
DW
t
DH
Data Valid
WE
Data in
Data out
High-Z
High-Z
CS
2
t
CW(2)
t
WP(1)
t
AW
TIMING WAVEFORM OF WRITE CYCLE(1)
(WE Controlled)
Address
CS
1
t
CW(2)
t
WR(4)
CS
2
t
CW(2)
t
WP(1)
t
DW
t
DH
t
OW
t
WHZ
Data Undefined
Data Valid
WE
Data in
Data out
t
WC
t
AW
t
AS(3)
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
8
DATA RETENTION WAVE FORM
CS
1
controlled
V
CC
4.5V
2.2V
V
DR
CS
1
GND
Data Retention Mode
CS
V
CC
- 0.2V
t
SDR
t
RDR
TIMING WAVEFORM OF WRITE CYCLE(3)
(CS
2
Controlled)
Address
CS
1
t
AW
NOTES (WRITE CYCLE)
1. A write occurs during the overlap of a low CS
1
, a high CS
2
and a low WE. A write begins at the latest transition among CS
1
goes low,
CS
2
going high and WE going low: A write end at the earliest transition among CS
1
going high, CS
2
going low and WE going high,
t
WP
is measured from the begining of write to the end of write.
2. t
CW
is measured from the CS
1
going low or CS
2
going high to the end of write.
3. t
AS
is measured from the address valid to the beginning of write.
4. t
WR
is measured from the end of write to the address change. t
WR
applied in case a write ends as CS
1
or WE going high t
WR2
applied
in case a write ends as CS
2
going to low.
CS
2
t
CW(2)
WE
Data in
Data Valid
Data out
High-Z
High-Z
t
CW(2)
t
WR(4)
t
WP(1)
t
DW
t
DH
t
AS(3)
t
WC
CS
2
controlled
V
CC
4.5V
0.4V
V
DR
CS
2
GND
Data Retention Mode
t
SDR
t
RDR
CS
2
0.2V
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
9
PACKAGE DIMENSIONS
Units: millimeters(inches)
0~15
1.91
#1
32 DUAL INLINE PACKAGE (600mil)
#32
13.60
0.20
0.535
0.008
41.91
0.20
1.650
0.008
( )
0.075
1
5
.
2
4
0
.
6
0
0
+0.10
MAX
42.31
1.666
0.25
-0.05
+0.004
0.010
-0.002
2.54
0.100
MAX
3.81
0.20
0.150
0.008
5.08
0.200
MIN
0.015
0.38
0.130
0.012
3.30
0.30
#16
#17
1.52
0.10
0.060
0.004
0.46
0.10
0.018
0.004
32 PLASTIC SMALL OUTLINE PACKAGE (525mil)
0~8
#32
20.47
0.20
0.806
0.008
MAX
20.87
0.822
MAX
2.74
0.20
0.108
0.008
3.00
0.118
MIN
0.002
0.05
0.004 MAX
0.10 MAX
#1
0.71
( )
0.028
1
3
.
3
4
0
.
5
2
5
11.43
0.20
0.450
0.008
0.80
0.20
0.031
0.008
+0.10
0.20
-0.05
+0.004
0.008
-0.002
14.12
0.30
0.556
0.012
#17
#16
1.27
0.050
+0.100
0.41
-0.050
+0.004
0.016
-0.002
CMOS SRAM
K6X1008C2D Family
Revision 1.0
September 2003
10
32 PIN THIN SMALL OUTLINE PACKAGE TYPE I (0820F)
#32
1.00
0.10
0.039
0.004
MAX
8.40
0.331
0
.
1
0
M
A
X
0
.
0
0
4
M
A
X
#1
0.50
( )
0.020
18.40
0.10
0.724
0.004
0.45 ~0.75
0.018 ~0.030
20.00
0.20
0.787
0.008
#17
+0.10
0.15
-0.05
+0.004
0.006
-0.002
0~8
+0.10
0.20
-0.05
+0.004
0.008
-0.002
0.50
0.0197
0.25
( )
0.010
MIN
0.05
0.002
MAX
1.20
0.047
8
.
0
0
0
.
3
1
5
TYP
0.25
0.010
#16
PACKAGE DIMENSIONS
Units: millimeters(inches)
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