16COM/80SEG DRIVER & CONTROLLER FOR DOT MATRIX LCD
S6A0070
1
INTRODUCTION
The S6A0070 is a dot matrix LCD driver & controller LSI which is fabricated by low power CMOS technology.
It is capable of displaying 1 or 2 lines with the 5
7 format or 1 line with the 5
10 dots format. The mirror type of
S6A0070: S6A1070
FUNCTION
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Character type dot matrix LCD driver & controller
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Internal driver: 16 common and 80 segment signal output
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Easy Interface with a 4-bit or 8-bit MPU
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Display character pattern: 5
7 dots format (192 kinds), 5
10 dots format (32 kinds)
--
The special character pattern is directly programmable by the Character Generator RAM.
--
A customer character pattern is programmable by mask option.
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It can drive a maximum 80 characters by using the S6A0065 or S6A2067 externally.
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Various instruction functions
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Built-in automatic power on reset
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Driving method is A-type (line inversion)
FEATURES
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Internal Memory
Character Generator ROM: 8320bits (192 cha. X 5 x 7 dots) & (32 cha. X 5 x 10 dots)
Character Generator RAM: 64 x 8 bits (8 cha. X 5 x 7 dots)
Display Data RAM: 80
8 bits for 80 digits (80 characters max.)
--
Power Supply Voltage: 2.7 to 5.5 V (V
DD
)
--
LCD Driving Voltage: 3.0 to 10.0 V (V
DD
- V5)
--
Supply Voltage for display: 0 to -5V (V5)
--
Programmable duty cycle: 1/8 duty, 1/11 duty or 1/16
--
Internal oscillator with an external resistor
--
Bare die or bumped chip available
S6A0070
16COM/80SEG DRIVER & CONTROLLER FOR DOT MATRIX LCD
2
Precautions for Light
Light has characteristics to move electrons in the integrated circuitry of semiconductors, therefore may change
the characteristics of semiconductor devices when irradiated with light. Consequently, the users of the packages
which may expose chips to external light such as COB, COG, TCP and COF must consider effective methods to
block out light from reaching the IC on all parts of the surface area, the top, bottom and the sides of the chip.
Follow the precautions below when using the products.
1. Consider and verify the protection of penetrating light to the IC at substrate (board or glass) or product design
stage.
2. Always test and inspect products under the environment with no penetration of light.
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