32
Chip LEDs
s
SEC1001 series (Unicolor flat type)
Outline drawing A
s
SEC2002 series (Bicolor flat type)
Outline drawing B
Outline drawing C
1.5
3.0
2.0
1.7
1.4
1.6
1.3
Lens
Substrate
s
SEC1003 series (Unicolor inner lens type)
s
SEC2004 series (Bicolor inner lens type)
Outline drawing D
s
External dimensions: Unit: mm Tolerance:
0.2
1.5
3.0
Cathode mark
(Blue)
2.0
1.5
0.9
(0.5)
1.4
Resin
Substrate
1.6
1.3
2.5
Chip
1
Chip
2
3.0
2.0
1.5
0.9
(0.5)
1.4
Resin
Substrate
Cathode
mark
(Blue)
1.0
1.0
0.9
0.6
2.5
3.0
2.0
1.5
1.4
1.0
1.0
0.9
0.6
Lens
1
2
Substrate
34
Reel
0.2
0.05
Cathode
1.5
+0.1
0
1.9
4.0
2.0
0.05
4.0
3.5
0.05
1.75
8.0
0.2
0.05
Cathode
1.5
+0.1
0
1.9
4.0
2.0
0.05
4.0
3.5
0.05
1.75
8.0
Bicolor SEC2002/SEC2004 series
s
Taping specifications
(Unit: mm)
Unicolor SEC1001/ SEC1003 series
s
Moisture-proof packing of chip LEDs
1. Effects of moisture absorption
q
Sanken chip LEDs are designed for surface mounting (SMD).
However, interfacial separation may occur during dip solder-
ing, depending on the moisture absorption of the resin.
This phenomenon is commonly called "Popcorn effect." It is
caused by vaporization of the resin's absorbed moisture due
to sudden thermal change, and cause interfacial separation.
q
Interfacial separation may affect the light transmission effi-
ciency, causing the light intensity to drop.
2. Moisture-proof packing
q
To minimize moisture absorption before use, Sanken bakes
the chip LEDs and packs them in moisture-proof packing.
q
Laminated aluminum, which has high moisture-resistance,
is used for the moisture-proof packing.
q
For additional protection against moisture absorption, silica
gel is added to each packing.
3. Storage period after unpacking
q
The chip LEDs must be dip-soldered within seven days after
opening the moisture-proof packing.
4. Storage of unused chip LEDs
q
Repack unused chip LEDs with their moisture-proof pack-
ing, fold to close any opening and then store in a dry place.
Recommended soldering conditions
2 Dip soldering
3 Manual Soldering:
Not more than 3
seconds at MAX
300
C, under
soldering iron.
1 Reflow soldering
Surface temperature
of components (
C)
Time
120 sec.
5 sec.
150max
240max
Time
120 sec.
Room temperature
30 sec.
Pre-heating
120max
Hardening
of adhesive
150max
260max
Dip
5 sec.
Surface temperature
of components (
C)
Recommended land layout (Unit: mm)
Bicolor SEC
2002
series
2004
Unicolor SEC
1001
series
1003
180
+0
2.0
0.2
Label
60
+1
22
3
0
10
30
P/N, Manufacturing
Date Code No, Q' ty
11.4
1.0
9.0
0.3
Tolerance 0.2
13
0.2
Quantity: 3,000 pcs./reel
1.5min
2.2
2.2
1.7
2.2
2.2
0.9min
1.4
1.4
0.5min
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