SPI-336-99-T1
No.6030 1/6
Features
Infrared LED plus Phototransistor (single)
DIP type
Compact type : 3.4 (L) ! 2.7 (W) ! 1.5 (H) mm
Visible light cut type
Taping type
Absolute Maximum Ratings at Ta=25
C, 65%RH (as per JIS C7032)
Parameter
Symbol
Rating
Unit
Input LED
Forward Current
I
F
50
mA
Reverse Voltage
V
R
5
V
Power Dissipation
P
D
70
mW
Output
Collector-Emitter Voltage
V
CEO
20
V
Phototransistor
Emitter-Collector Voltage
V
ECO
5
V
Collector Curren
I
C
20
mA
Power Dissipation
P
C
70
mW
Operating Temperature
Topr
--20 to +80
C
Storage Temperature
Tstg
--30 to +100
C
Electro-Optical Characteristics at Ta=25
C, 65%RH
Parameter
Symbol
Condition
Min.
Typ.
Max.
Unit
Input
Forward Voltage
V
F
I
F
=10mA
1.0
1.2
1.6
V
Reverse Current
I
R
V
R
=5V
--
--
10
A
Output
Dark Current
I
CEO
I
F
=0mA, V
CE
=10V
--
--
200
nA
Coupled
Collector Output
I
C
I
F
=10mA, V
CE
=5V
*1
80
--
1100
A
Leakage Current
I
LEAK
I
F
=10mA, V
CE
=5V
*2
--
--
1
A
Collector Emitter
V
CE
(sat)
I
F
=10mA, I
C
=50
A
--
--
0.5
V
Rise Time
tr
V
CC
=5V, R
L
=100
--
5
--
s
Fall Time
tf
I
C
=1mA
--
5
--
s
*1
Location of reflector is shown in Fig. 1.
*2
No reflector
*3
Table of Classification of Collector Output
Class
A
B
C
D
Ic (
A)
1100 to 450
600 to 260
350 to 150
200 to 80
SANYO Electric Co.,Ltd. Semiconductor Company
TOKYO OFFICE Tokyo Bldg., 1-10, 1 Chome, Ueno, Taito-ku, TOKYO, 110-8534 JAPAN
SPI-336-99-T1
Infrared LED
Ultraminiature photoreflector supporting reflow soldering
(Single transistor type)
72199 GI, (MI)
AL V.E. film
Glass plate (t=1mm)
Fig. 1 Location of Reflector
Ordering number : EN6030
SPI-336-99-T1
No.6030 2/6
Typical Characteristics
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
CAUTION
Ta=75
C
50
C
25
C
0
C
--25
C
60
50
40
30
20
10
0
--25
0
25
50
75
100
120
100
80
60
40
20
0
--25
0
25
50
75
100
500
100
50
10
5
1
0
0.5
1
1.5
2
0
100
200
300
400
500
0
4
8
12
16
20
VCE=5V
Ta=25
C
0
5
10
40
60
80
100
120
140
0
200
400
600
800
1000
--25
0
25
50
75
100
IF=10mA
VCE=5V
Ta=25
C
IF=20mA
15mA
10mA
5mA
Forward Current vs. Ambient Temperature
Collector Current vs. Collector-emitter Voltage
Ambient Temperature Ta (
C)
Collector-emitter Voltage VCE (V)
F
orw
ard Current I
F
(mA)
Collector Current I
C
(
A)
Forward Current vs. Forward Voltage
Forward Voltage VF (V)
F
orw
ard Current I
F
(mA)
Power Dissipation vs. Ambient Temperature
Relative Collector Current vs. Ambient Temperature
Ambient Temperature Ta (
C)
Ambient Temperature Ta (
C)
Po
wer Dissipation P (mW)
Relati
v
e
Collector Current (%)
Collector vs. Forward Current
Forward Current IF (mA)
Collector Current I
C
(
A)
(Rating)
(Rating)
SPI-336-99-T1
No.6030 3/6
Typical Characteristics
These numerical value show the electrical and optical characteristics of this product, and not assure this contents.
CAUTION
10
-6
5
10
-7
5
10
-8
5
10
-9
10
-10
5
--25
0
25
50
75
100
120
100
80
60
40
20
0
0
1
2
3
4
5
1000
500
100
50
10
5
1
0.1
0.5
1
5
10
50
100
0.14
0.16
0.18
0.20
0.22
0.24
--25
0
25
50
75
100
IF=10mA
IC=50
A
IFP=20mA
VCC=5V
Ta=25
C
IF=10mA
VCE=5V
Ta=25
C
d
tf
tr
120
100
80
60
40
20
0
--4
--2
0
2
4
6
IF=10mA,VCE=5V
Ta=25
C,d=1mm
0
0
+
+
IFP
VCC
RL
Vout
Vout
IFP
RD
10%
90%
tr
tf
1
2
2
1
VCE=10V
Collector-emitter Saturation Voltage vs.
Ambient Temperature
Relative Collector Current vs. Distance
Relative Collector Current vs.
PPC paper Moving Distance
Ambient Temperature Ta (
C)
PPC paper Moving Distance (mm)
Collector
-emitter
Saturation V
oltage V
CE (sat)
(V)
Relati
v
e
Collector Current (%)
Distance between sensor and Al evaporation d (mm)
Relati
v
e
Collector Current (%)
Response Time vs. Load Resistance
Test Circuit for Response Time
Load Resistance RL (k
)
Response (
S
)
Collector Dark Current vs. Ambient Temperature
Ambient Temperature Ta (
C)
Collector Dark Current I
CEO
(A)
SPI-336-99-T1
No.6030 4/6
1.6
2
1
4
Pin No.
0.4
3
0.4
2
0.6
C0.6
Pin connection
1. LED Anode
2. LED Cathode
3 .Ph. Tr Collector
4. Ph. Tr Emitter
3.4
1
0.5
0.2
0.05
4.3
0.5
(3.47)
2.7
+ 0.1
-
-
0.05
Tolerance :
0.2
Unit
: mm
SPI-336-99-T1
No.6030 5/6
Package dimensions and Pin connection
As stated in the sttached paper. (No.6030 4/6)
Soldering conditions
(1) Reflow soldering
The temperature of the reflow furnace is to be set in accordance with the following temperature profile.
Soldering must be done only two time.
Temperature
: On the topsurface of product
Reflow type
: Hot air
(2) Manusl soldering
Temperature
: Max. 290
C (Soldering iron tip temperature)
Time
: Max. 3 sec
Clearance
: Min. 0.5mm from package
(1) Bending a lead should avoid. However, when bending is necessary, take care the next items.
q Bending a lead must be done before soldering.
w Bending a lead must be done in the states of fixing leads and no stress for the regin part. Because it is possible that
stress for the regin part cause troubles such as gold wire breaking and so on.
e A lead must be bend at intervals of 0.5mm from the case edge.
r Do not bend the same position of leads more than twice.
(2) The hole pitch of a circuit board must fit to the lead pitch.
(3) Take core the following when soldering.
q Do not heat a product under any stress (a twist and so on) to leads.
w Do not heat a product in the states of operating force to the regin part.
(4) Use the flux which contain no chlorine, have no corrosion and do not need washing.
(5) Be careful that flux or other chemicals do not attach to the luminous surface and passive surface.
(6) Precautions of the product after the open dry packing
q The product after the open dry packing should be stored in the dry packing again.
The product should be kept under the conditions below, if the product is not stored in the dry paking.
Temperature
: 5 to 30
C
Humidity
: Max 70%RH
Term
: Max 7days
w The product to be out the term without dry packing must be practiced baking.
Baking conditions
: +60
5
C, 10 to 20Hr
(7) The reflow conditions must be confirmed that no problem by your reflow furnace.
PRECAUTIONS
Max 240
C
200
C
Max 165
C
Max 120sec
Max 10sec
Max 60sec
0.5mm
0.5mm
PDF 
ZIP