Board 3s SKYPERTM 32 -

Technical Explanations

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2005-06-08 Rev02

SEMIKRON

Evaluation Board 3s SKYPERTM 32

Technical Explanations

Revision 02

Status:

evaluation board

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This Technical Explanation is valid for the following parts:

part number

type

date code (YYWW)

L6100150

Board 3s SKYPERTM 32

0522

Related documents:

title version

Technical Explanations SKYPERTM 32

Rev04

Prepared by: Markus Hermwille

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Content

Disclaimer................................................................................................................................................................ 2
Application and Handling Instructions...................................................................................................................... 3
Further application support...................................................................................................................................... 3
General Description................................................................................................................................................. 3
Dimensions.............................................................................................................................................................. 4
Component Placement Layout ................................................................................................................................ 4
PIN Array................................................................................................................................................................. 5
Setting Dynamic Short Circuit Protection................................................................................................................. 6
Collector Series Resistance..................................................................................................................................... 6
Adaptation Gate Resistors....................................................................................................................................... 6
Boost Capacitors ..................................................................................................................................................... 7
Temperature Signal ................................................................................................................................................. 7
Mounting Notes ....................................................................................................................................................... 7
Schematics.............................................................................................................................................................. 8
Layouts.................................................................................................................................................................... 9
Parts List ................................................................................................................................................................. 9

Information furnished in this document is believed to be accurate and reliable. However, no representation or warranty is
given and no liability is assumed with respect to the accuracy or use of such information. Furthermore, this technical
information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or
implied is made regarding delivery, performance or suitability. Specifications mentioned in this document are subject to
change without notice. This document supersedes and replaces all information previously supplied and may be supersede
by updates.

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Disclaimer

In accordance with SEMIKRON's quality procedures, we hereby notify you that the Evaluation Board 3s
SKYPERTM 32 should be considered as evaluation products only.

Evaluation products are experimental products and are therefore only intended for device evaluation. SEMIKRON
does not represent or guarantee that a final version will be made available after device evaluation. Evaluation
products are subject to the change service.

Although evaluation products have been manufactured using processes and procedures representative of final
production, they have not been subjected to all of our normal quality audits and controls. Additionally, neither the
product nor the manufacturing processes may have passed our internal qualification procedures.

IMPORTANT:

The evaluation boards are supplied without warranty of any kind, expressed, implied of statutory, including but
not limited to, any implied warranty of merchantability of fitness for a particular purpose. Credit or replacement
for evaluation products that fail to function will not be given nor will a failure analysis be performed. There is no
entitlement to technical support for evaluation products.

Claims for damages and reimbursement of expenses on the part of the undersigned customer shall be
excluded, regardless of the legal cause, especially claims in contract and in tort.

The liability exclusions shall not apply in cases of liability independent of the question of blame or negligence,
especially claims under the German Product Liability Act in cases of wilful intent, gross negligence, or injury to
life, limb or health and on account of a breach of major contractual obligations. Compensation for failure to
comply with major contractual obligations shall be limited, however, to typical, foreseeable damages, unless
wilful intent or gross negligence applies, or on account of liability for injury to life, limb or health. Any change in
the burden of proof to the detriment of the undersigned customer shall not be associated with the aforesaid
rulings

FOR SAFETY REASONS THE CUSTOMER IS NOT ALLOWED TO SELL EVALUATION PRODUCTS TO
ANY END CUSTOMER OR ANY OTHER THIRD PARTY.

If the customer fails not to sell the evaluation products to any end customer or any other third party, then the
customer shall indemnify SEMIKRON against all claims by the concerned end customer or third party in respect
of any loss, damage or injury arising from the aforesaid reason.

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Application and Handling Instructions

Please provide for static discharge protection during handling. As long as the hybrid driver is not completely
assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a
grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during
transportation the input terminals have to be short-circuited using, for example, conductive rubber.
Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.

Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or
RCD-snubber networks between main terminals for PLUS and MINUS of the power module.

When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and
load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the
free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will
be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works
correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector
voltage.

It is important to feed any errors back to the control circuit and to switch off the device immediately in failure
events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.

The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V

+0,3V or below -0,3V

may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be
avoided.

The connecting leads between hybrid driver and the power module should be as short as possible (max.
20cm), the driver leads should be twisted.

Further application support

Latest information is available at

http://www.semikron.com

. For design support please read the SEMIKRON

Application Manual Power Modules available at

http://www.semikron.com

General Description

The Board 3s SKYPERTM 32 is an evaluation board for the IGBT module SEMiX

3s (spring contact version). The

board can be customized allowing adaptation and optimization to the used SEMiX

Module.

The switching characteristic of the IGBT can be influenced through user settings, e.g. changing turn-on and turn-
off speed by variation of R

Gon

and R

Goff

. Furthermore, it is possible to adjust the monitoring level and blanking time

for the DSCP (see Technical Explanations SKYPERTM 32).

Board 3s SKYPERTM 32

Please note:

All values in this technical explanation are typical values. Typical values are the average values expected in large
quantities and are provided for information purposes only. These values can and do vary in different applications. All
operating parameters should be validated by user's technical experts for each application.

Please note:

This technical explanation is based on the Technical Explanations for SKYPERTM 32. Please read the Technical
Explanations SKYPERTM 32 before using the Evaluation Board.

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PIN Array

Connector X20 (ODU FLAKAFIX 511.068.803.014)

Product information of suitable female connectors and
distributor contact information is available at e.g.

http://www.harting.com

(part number 09 18 514 6 813).

PIN

Signal

Function

Specification

X20:01 reserved

X20:02 IF_HB_BOT

Switching signal input (BOTTOM
switch)

Digital 15 V; 10 kOhm impedance;
LOW = BOT switch off; HIGH = BOT
switch on

X20:03 IF_nERROR_OUT

ERROR

output

LOW = NO ERROR; open collector
output; max. 30V / 15mA (external pull
up resistor necessary)

X20:04

IF_HB_TOP

Switching signal input (TOP switch)

Digital 15 V; 10 kOhm impedance;
LOW = TOP switch off; HIGH = TOP
switch on

X20:05 reserved

X20:06 reserved

X20:07 reserved

X20:08

IF_PWR_15P

Drive power supply

Stabilised +15V ±4%

X20:09

IF_PWR_15P

Drive power supply

Stabilised +15V ±4%

X20:10 IF_PWR_GND

GND for power supply and GND for
digital signals

X20:11 IF_PWR_GND

GND for power supply and GND for
digital signals

X20:12 reserved

X20:13 reserved

X20:14 reserved

Please note:

The feature PRIM_ERROR_IN of the driver core is not availble at the interface X20.

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Setting Dynamic Short Circuit Protection

& C

Designation Pattern

Name

Setting

R160 1206

Factory setting: not equipped

TOP

C150 1206

Factory setting: not equipped

TOP

R260 1206

Factory setting: not equipped

BOT

C250 1206

Factory setting: not equipped

BOT

Collector Series Resistance

VCE

Designation Pattern

Name

Setting

R150 MiniMELF

VCE

Factory setting: not equipped

TOP

R250 MiniMELF

VCE

Factory setting: not equipped

BOT

* 1200V IGBT operation: 0

1700V IGBT operation: 1k / 0,4W

Adaptation Gate Resistors

Gon

& R

Goff

Designation Pattern

Name

Setting

R151, R152, R153

(parallel connected)

MiniMELF

Gon

Factory setting: not equipped

TOP

R155, R156, R157

(parallel connected)

MiniMELF

Goff

Factory setting: not equipped

TOP

R251, R252, R253

(parallel connected)

MiniMELF

Gon

Factory setting: not equipped

BOT

R255, R256, R257

(parallel connected)

MiniMELF

Goff

Factory setting: not equipped

BOT

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Boost Capacitors

boost15P

& C

boost8N

Designation Pattern

Name

Setting

C151 1210

boost8N

Factory setting: 4,7µF/16V *

TOP

C152 1210

boost15P

Factory setting: 2,2µF/25V *

TOP

C251 1210

boost8N

Factory setting: 4,7µF/16V *

BOT

C252 1210

boost15P

Factory setting: 2,2µF/25V *

BOT

* output charge pulse: 5µC

Temperature Signal

The temperature sensor inside the SEMiX

module is directly connected to contacting points T1 and T2. For

details to the temperature sensor, see Modules Explanations SEMiX

Mounting Notes

The electrical connections between evaluation board and SEMiX

are realised via spring contacts integrated in

SEMiX

power modules and via landing pads on the bottom side of the evaluation board.

Evaluation Board & Driver Core Mounting

1. Soldering of components (e.g. R

Gon

, R

Goff

, etc.) on

adapter board.

2. Evaluation Board has to be fixed to the SEMiX

module

(see "Mounting Instruction and Application Notes
for SEMiX

IGBT modules" on SEMiX

product overview

page at

http://www.semikron.com

3. Insert driver core into the box connector on evaluation

board.

SKYPERTM 32

Evaluation Board

Support post

The connection between driver core and evaluation board
should be mechanical reinforced by using support posts.
The posts have to be spaced between driver core and
evaluation board.

Product information of suitable support posts and distributor
contact information is available at e.g.

http://www.richco-

inc.com

(part number MSPM-8-01).

Safety Warnings:

The contacting points T1 and T2 are not electrical isolated. Due to high voltage that may be present at the
contacting points T1 and T2, some care must be taken in order to avoid accident. There is no cover or potential
isolation that protect the high voltage sections / wires from accidental human contact.

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