by SEMIKRON
15.07.99
SKiiP 3-phase bridge
Absolute Maximum Ratings
Symbol
Conditions
1)
Values
Units
V
isol
4)
AC, 1min
4000
V
T
op
,T
stg
Operating / stor. temperature
-25...+85
C
IGBT and Diode
V
CES
1700
V
V
CC
5)
Operating DC link voltage
1200
V
I
C
IGBT
A
T
j
3)
IGBT + Diode
-40...+150
C
I
F
Diode
A
I
FM
Diode, t
p
< 1 ms
A
I
FSM
Diode, T
j
= 150 C, 10ms; sin
A
I
2
t (Diode) Diode, T
j
= 150 C, 10ms
10
kAs
2
Driver
V
S1
Stabilized Power Supply
18
V
V
S2
Non-stabilized Power Supply
30
V
f
smax
Switching frequency
20,0
kHz
dV/dt
Primary to secondary side
75
kV/s
Characteristics
Symbol
Conditions
1)
min.
typ.
max.
Units
IGBT
V
(BR)CES
Driver without supply
V
CES
-
-
V
I
CES
V
GE
= 0,
T
j
= 25 C
V
CE
= V
CES
T
j
= 125 C
-
-
1
10
-
-
mA
mA
V
TO
T
j
= 125 C
-
1,77
-
V
r
T
T
j
= 125 C
-
23,6
-
m
V
Cesat
I
C
= 140A,
T
j
= 125 C
-
5,1
-
V
V
Cesat
I
C
= 140A,
T
j
= 25 C
-
3,85
-
V
E
on
+ E
off
V
CC
=900/1200V, I
C
=150A
T
j
= 125 C
-
127/195
-
mJ
C
CHC
per Phase, AC side
-
0,8
-
nF
L
CE
Top, Bottom
-
15
-
nH
Inverse Diode
2)
V
F
= V
EC
I
F
= 140A;
T
j
= 125 C
-
2,60
-
V
V
F
= V
EC
I
F
= 140A;
T
j
= 25 C
-
-
2,90
V
E
on
+ E
off
I
F
= 150A;
T
j
= 125 C
-
18
-
mJ
V
TO
T
j
= 125 C
-
0,90
-
V
r
T
T
j
= 125 C
-
8,1
-
m
Thermal Characteristics
R
thjs
10)
per IGBT
-
-
0,129
C/W
R
thjs
10)
per Diode
-
-
0,375
C/W
R
thsa
6,10)
P16 heatsink; see case
-
-
0,033
C/W
Driver
I
S1
Supply current 15V-supply
340+380*f
s
/f
smax
+3,5*I
AC
/A
mA
I
S2
Supply current 24V-supply
250+260*f
s
/f
smax
+2,6*I
AC
/A
mA
t
interlock-driver
Interlock-time
2,3
s
SKiiPPACK protection
I
TRIPSC
Short circuit protection
188
2%
A
I
TRIPLG
Ground fault protection
43 +/- 2%
A
T
TRIP
Over-temp. protection
115
5%
C
U
DCTRIP
9)
U
DC
-protection
1225
2%
V
Mechanical Data
M1
DC terminals, SI Units
4
-
6
Nm
M2
AC terminals, SI Units
8
-
10
Nm
SKiiPPACK
SK integrated intelligent
Power PACK
3-phase bridge with
brake chopper
SKiiP
192 GDL 170 - 475 CTV
7,9)
Preliminary Data
Case S5GDL
Features
Short circuit protection, due to
evaluation of current sensor
signals
Isolated power supply
Low thermal impedance
Optimal
thermal
management
with integrated heatsink
Pressure contact technology
with increased power cycling
capability, compact design
Low stray inductance
High power, small losses
Over-temperature protection
1)
T
heatsink
= 25 C, unless
otherwise specified
2)
CAL = Controlled Axial Lifetime
Technology (soft and fast)
3)
without driver
4)
Driver Input to DC Link/ AC
Output to heatsink
5)
with Semikron-DC link (low
inductance)
6)
other heatsinks on request
7)
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
9)
options available for driver:
U - DC link voltage sense
F Fiber optic connector
10)
"
s
" referenced to temperature
sensor
15.07.99
by SEMIKRON
SKiiP Brake-chopper
Absolute Maximum Ratings
Symbol
Conditions
1)
Values
Units
V
isol
4)
AC, 1min
4000
V
T
op
,T
stg
Operating / stor. temperature
-25...+85
C
IGBT and Diode
V
CES
1700
V
V
CC
5)
Operating DC link voltage
1200
V
I
C
IGBT
A
T
j
3)
IGBT + Diode
-40...+150
C
I
F
Diode
A
I
FM
Diode, t
p
< 1 ms
A
I
FSM
Diode, T
j
= 150 C, 10ms; sin
A
I
2
t (Diode) Diode, T
j
= 150 C, 10ms
10
kAs
2
Driver
V
S1
Stabilized Power Supply
18
V
V
S2
Non-stabilized Power Supply
30
V
f
smax
Switching frequency
20,0
kHz
dV/dt
Primary to secondary side
50
kV/s
Characteristics
Symbol
Conditions
1)
min.
typ.
max.
Units
IGBT
V
(BR)CES
Driver without supply
V
CES
-
-
V
I
CES
V
GE
= 0,
T
j
= 25 C
V
CE
= V
CES
T
j
= 125 C
-
-
1
10
-
-
mA
mA
V
TO
T
j
= 125 C
-
1,77
-
V
r
T
T
j
= 125 C
-
23,6
-
m
V
Cesat
I
C
= 140A,
T
j
= 125 C
-
5,1
-
V
V
Cesat
I
C
= 140A,
T
j
= 25 C
-
3,85
-
V
E
on
+ E
off
V
CC
=900/1200V, I
C
=150A
T
j
= 125 C
-
127/195
-
mJ
C
CHC
per Phase, AC side
-
0,8
-
nF
L
CE
Top, Bottom
-
15
-
nH
Inverse Diode
2)
V
F
= V
EC
I
F
= 140A;
T
j
= 125 C
-
2,60
-
V
V
F
= V
EC
I
F
= 140A;
T
j
= 25 C
-
-
2,90
V
E
on
+ E
off
I
F
= 150A;
T
j
= 125 C
-
18
-
mJ
V
TO
T
j
= 125 C
-
0,90
-
V
r
T
T
j
= 125 C
-
8,1
-
m
Thermal Characteristics
R
thjs
10)
per IGBT
-
-
0,129
C/W
R
thjs
10)
per Diode
-
-
0,375
C/W
R
thsa
6,10)
P16 heatsink; see case
-
-
0,033
C/W
Driver
I
S1
Supply current 15V-supply
67+10*f
s
/f
smax
+0*I
AC
/A
mA
I
S2
Supply current 24V-supply
67+10*f
s
/f
smax
+0*I
AC
/A
mA
t
interlock-driver
Interlock-time
2,3
s
SKiiPPACK protection
I
TRIPSC
Short circuit protection
VCEsat-protection
2%
A
I
TRIPLG
Ground fault protection
-
A
T
TRIP
Over-temp. protection
115
5%
C
U
DCTRIP
9)
U
DC
-protection
1225
2%
V
Mechanical Data
M1
DC terminals, SI Units
4
-
6
Nm
M2
AC terminals, SI Units
8
-
10
Nm
SKiiPPACK
SK integrated intelligent
Power PACK
3-phase bridge with
brake chopper
SKiiP
192 GDL 170 - 475 CTV
7,9)
Preliminary Data
Case S5GDL
Features
Short circuit protection, due to
evaluation of current sensor
signals
Isolated power supply
Low thermal impedance
Optimal
thermal
management
with integrated heatsink
Pressure contact technology
with increased power cycling
capability, compact design
Low stray inductance
High power, small losses
Over-temperature protection
1)
T
heatsink
= 25 C, unless
otherwise specified
2)
CAL = Controlled Axial Lifetime
Technology (soft and fast)
3)
without driver
4)
Driver Input to DC Link/ AC
Output to heatsink
5)
with Semikron-DC link (low
inductance)
6)
other heatsinks on request
7)
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
9)
options available for driver:
U - DC link voltage sense
F Fiber optic connector
10)
"
s
" referenced to temperature
sensor
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