by SEMIKRON
28.01.99
SKiiP 232 GH 120 - 210 CTV
Absolute Maximum Ratings
Symbol
Conditions
1)
Values
Units
V
isol
4)
AC, 1min
3000
V
T
op
,T
stg
Operating / stor. temperature
-25...+85
C
IGBT and Inverse Diode
V
CES
1200
V
V
CC
5)
Operating DC link voltage
900
V
I
C
IGBT
200
A
T
j
3)
IGBT + Diode
-40...+150
C
I
F
Diode
200
A
I
FM
Diode, t
p
< 1 ms
400
A
I
FSM
Diode, T
j
= 150 C, 10ms; sin
1440
A
I
2
t (Diode) Diode, T
j
= 150 C, 10ms
10
kAs
2
Driver
V
S1
Stabilized Power Supply
18
V
V
S2
Non-stabilized Power Supply
30
V
f
smax
Switching frequency
20
kHz
dV/dt
Primary to secondary side
75
kV/s
Characteristics
Symbol
Conditions
1)
min.
typ.
max.
Units
IGBT
11)
V
(BR)CES
Driver without supply
V
CES
-
-
V
I
CES
V
GE
= 0,
T
j
= 25 C
V
CE
= V
CES
T
j
= 125 C
-
-
-
10
0,4
-
mA
mA
V
TO
T
j
= 125 C
-
-
1,38
V
r
T
T
j
= 125 C
-
-
10,5
m
V
Cesat
I
C
= 175A,
T
j
= 125 C
-
-
3,2
V
V
Cesat
I
C
= 175A,
T
j
= 25 C
-
-
3,05
V
E
on
+ E
off
V
CC
=600/900V,I
C
=200A
T
j
= 125 C
-
-
60/98
mJ
C
CHC
per SkiiP, AC side
-
1,4
-
nF
L
CE
Top, Bottom
-
15
-
nH
Inverse Diode
2)
V
F
= V
EC
I
F
= 175A;
T
j
= 125 C
-
-
2,45
V
V
F
= V
EC
I
F
= 175A;
T
j
= 25 C
-
-
2,55
V
E
on
+ E
off
I
F
= 200A;
T
j
= 125 C
-
-
8
mJ
V
TO
T
j
= 125 C
-
0,91
-
V
r
T
T
j
= 125 C
-
5,7
-
m
Thermal Characteristics
R
thjs
10)
per IGBT
-
-
0,129
C/W
R
thjs
10)
per Diode
-
-
0,375
C/W
R
thsa
6,10)
P16 heatsink; see case S2
-
-
0,044
C/W
Driver
I
S1
Supply current 15V-supply
230+230*f
s
/f
smax
+2,5*I
AC
/A
mA
I
S2
Supply current 24V-supply
170+180*f
s
/f
smax
+1,9*I
AC
/A
mA
t
interlock-driver
Interlock-time
2,3
s
SKiiPPACK protection
I
TRIPSC
Short circuit protection
250
2%
A
I
TRIPLG
Ground fault protection
58 +/- 2%
A
T
TRIP
Over-temp. protection
115
5%
C
U
DCTRIP
9)
U
DC
-protection
920
2%
V
Mechanical Data
M1
DC terminals, SI Units
4
-
6
Nm
M2
AC terminals, SI Units
8
-
10
Nm
SKiiPPACK
SK integrated intelligent
Power PACK
single phase bridge
SKiiP
232 GH 120 - 210 CTV
7,9)
Preliminary Data
Case S2
Features
Short circuit protection, due to
evaluation of current sensor
signals
Isolated power supply
Low thermal impedance
Optimal
thermal
management
with integrated heatsink
Pressure contact technology
with increased power cycling
capability, compact design
Low stray inductance
High power, small losses
Over-temperature protection
1)
T
heatsink
= 25 C, unless
otherwise specified
2)
CAL = Controlled Axial Lifetime
Technology (soft and fast)
3)
without driver
4)
Driver input to DC link/ AC
output to heatsink
5)
with Semikron-DC link (low
inductance)
6)
other heatsinks on request
7)
C - Integrated current sensors
T - Temperature protection
V - 15 V or 24 V power supply
9)
options available for driver:
U - DC link voltage sense
F Fiber optic connector
10)
"
s
" referenced to temperature
sensor
11)
NPT-technology with homo-
genous current-distribution
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